VS-12CWQ06FNPbF
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High Performance Schottky Rectifier, 2 x 6 A
FEATURES
• Popular D-PAK outline
• Center tap configuration
• Small foot print, surface mountable
• Low forward voltage drop
• High frequency operation
• Guard ring for enhanced ruggedness and long term
reliability
• Meets MSL level 1, per J-STD-020, LF maximum peak of
260 °C
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
DESCRIPTION
The VS-12CWQ06FNPbF surface mount, center tap,
Schottky rectifier series has been designed for applications
requiring low forward drop and small foot prints on PC
board. Typical applications are in disk drives, switching
power supplies, converters, freewheeling diodes, battery
charging, and reverse battery protection.
PRODUCT SUMMARY
Package D-PAK (TO-252AA)
IF(AV) 2 x 6 A
VR60 V
VF at IF0.57 V
IRM 35 mA at 125 °C
TJ max. 150 °C
Diode variation Common cathode
EAS 7 mJ
Base
common
cathode
Common
cathode
2
4
13
Anode Anode
D-PAK (TO-252AA)
MAJOR RATINGS AND CHARACTERISTICS
SYMBOL CHARACTERISTICS VALUES UNITS
IF(AV) Rectangular waveform 12 A
VRRM 60 V
IFSM tp = 5 μs sine 320 A
VF6 Apk, TJ = 125 °C (per leg) 0.57 V
TJRange -55 to +150 °C
VOLTAGE RATINGS
PARAMETER SYMBOL VS-12CWQ06FNPbF UNITS
Maximum DC reverse voltage VR60 V
Maximum working peak reverse voltage VRWM
ABSOLUTE MAXIMUM RATINGS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum average
forward current
See fig. 5
per leg
IF(AV) 50 % duty cycle at TC = 131 °C, rectangular waveform
6
A
per device 12
Maximum peak one cycle
non-repetitive surge current
See fig. 7
IFSM
5 μs sine or 3 μs rect. pulse Following any rated
load condition and with
rated VRRM applied
320
A
10 ms sine or 6 ms rect. pulse 105
Non-repetitive avalanche energy per leg EAS TJ = 25 °C, IAS = 1.2 A, L = 10 mH 7 mJ
Repetitive avalanche current per leg IAR
Current decaying linearly to zero in 1 μs
Frequency limited by TJ maximum VA = 1.5 x VR typical 0.8 A
VS-12CWQ06FNPbF
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Revision: 14-Jan-11 2Document Number: 94134
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Note
(1) Pulse width < 300 μs, duty cycle < 2 %
Note
(1) thermal runaway condition for a diode on its own heatsink
ELECTRICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum forward
voltage drop per leg
See fig. 1
VFM (1)
6 A TJ = 25 °C 0.61
V
12 A 0.79
6 A TJ = 125 °C 0.57
12 A 0.72
Maximum reverse
leakage current per leg
See fig. 2
IRM (1)
TJ = 25 °C
VR = Rated VR
3
mA
TJ = 125 °C 35
Threshold voltage VF(TO) TJ = TJ maximum 0.36 V
Forward slope resistance rt24.14 m
Typical junction capacitance per leg CTVR = 5 VDC, (test signal range 100 kHz to 1 MHz), 25 °C 360 pF
Typical series inductance per leg LSMeasured lead to lead 5 mm from package body 5.0 nH
THERMAL - MECHANICAL SPECIFICATIONS
PARAMETER SYMBOL TEST CONDITIONS VALUES UNITS
Maximum junction and storage
temperature range TJ (1), TStg -55 to +150 °C
Maximum thermal resistance,
junction to case
per leg RthJC
DC operation
See fig. 4
3.0 °C/W
per device 1.5
Approximate weight 0.3 g
0.01 oz.
Marking device Case style D-PAK (similar to TO-252AA) 12CWQ06FN
dPtot
dTJ
------------- 1
RthJA
--------------<
VS-12CWQ06FNPbF
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Revision: 14-Jan-11 3Document Number: 94134
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Fig. 1 - Maximum Forward Voltage Drop Characteristics
(Per Leg)
Fig. 2 - Typical Values of Reverse Current vs.
Reverse Voltage (Per Leg)
Fig. 3 - Typical Junction Capacitance vs. Reverse Voltage (Per Leg)
Fig. 4 - Maximum Thermal Impedance ZthJC Characteristics (Per Leg)
1
10
100
IF - Instantaneous Forward
Current (A)
VFM - Forward Voltage Drop (V)
0.4 0.8 1.2 2.41.41.00.60.2 1.6 1.8 2.0 2.2
TJ = 150 °C
TJ = 125 °C
TJ = 25 °C
IR - Reverse Current (mA)
VR - Reverse Voltage (V)
0 102030 60
0.001
0.1
1
10
100
40
0.01
TJ = 150 °C
TJ = 125 °C
TJ = 100 °C
TJ = 75 °C
TJ = 50 °C
TJ = 25 °C
50
CT - Junction Capacitance (pF)
VR - Reverse Voltage (V)
02030
40 70
100
1000
10
TJ = 25 °C
10
50 60
ZthJC - Thermal Impedance (°C/W)
0.01
0.1
1
10
t1 - Rectangular Pulse Duration (s)
0.00001 0.0001 0.001 0.01 0.1 1
Single pulse
(thermal resistance)
.
.
PDM
t1
t2
Notes:
1. Duty factor D = t1/t2
2. Peak TJ = PDM x ZthJC + TC
D = 0.75
D = 0.50
D = 0.33
D = 0.25
D = 0.20
VS-12CWQ06FNPbF
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Revision: 14-Jan-11 4Document Number: 94134
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Fig. 5 - Maximum Allowable Case Temperature vs.
Average Forward Current (Per Leg)
Fig. 6 - Forward Power Loss Characteristics (Per Leg)
Fig. 7 - Maximum Non-Repetitive Surge Current (Per Leg)
Note
(1) Formula used: TC = TJ - (Pd + PdREV) x RthJC;
Pd = forward power loss = IF(AV) x VFM at (IF(AV)/D) (see fig. 6);
PdREV = inverse power loss = VR1 x IR (1 - D); IR at VR1 = 80 % rated VR
Allowable Case Temperature (°C)
IF(AV) - Average Forward Current (A)
0894
110
115
125
135
145
155
26
DC
See note (1)
Square wave (D = 0.50)
80 % rated VR applied
150
140
130
120
1357
0
Average Power Loss (W)
IF(AV) - Average Forward Current (A)
046 9
1
2
3
4
5
6
28
D = 0.20
D = 0.25
D = 0.33
D = 0.50
D = 0.75
RMS limit
DC
1357
I
FSM
- Non-Repetitive Surge Current (A)
t
p
- Square Wave Pulse Duration (µs)
100
1000
10 100 1000 10 000
At any rated load condition
and with rated V applied
following surge RRM
10
VS-12CWQ06FNPbF
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Revision: 14-Jan-11 5Document Number: 94134
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
ORDERING INFORMATION TABLE
LINKS TO RELATED DOCUMENTS
Dimensions www.vishay.com/doc?95016
Part marking information www.vishay.com/doc?95059
Packaging information www.vishay.com/doc?95033
SPICE model www.vishay.com/doc?95278
Outline Dimensions
www.vishay.com Vishay Semiconductors
Revision: 05-Dec-12 1Document Number: 95016
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THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
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D-PAK (TO-252AA)
DIMENSIONS in millimeters and inches
Notes
(1) Dimensioning and tolerancing as per ASME Y14.5M-1994
(2) Lead dimension uncontrolled in L5
(3) Dimension D1, E1, L3 and b3 establish a minimum mounting surface for thermal pad
(4) Section C - C dimension apply to the flat section of the lead between 0.13 and 0.25 mm (0.005 and 0.10") from the lead tip
(5) Dimension D, and E do not include mold flash. Mold flash shall not exceed 0.127 mm (0.005") per side. These dimensions are measured at
the outermost extremes of the plastic body
(6) Dimension b1 and c1 applied to base metal only
(7) Datum A and B to be determined at datum plane H
(8) Outline conforms to JEDEC outline TO-252AA
SYMBOL MILLIMETERS INCHES NOTES SYMBOL MILLIMETERS INCHES NOTES
MIN. MAX. MIN. MAX. MIN. MAX. MIN. MAX.
A 2.18 2.39 0.086 0.094 e 2.29 BSC 0.090 BSC
A1 - 0.13 - 0.005 H 9.40 10.41 0.370 0.410
b 0.64 0.89 0.025 0.035 L 1.40 1.78 0.055 0.070
b2 0.76 1.14 0.030 0.045 L1 2.74 BSC 0.108 REF.
b3 4.95 5.46 0.195 0.215 3 L2 0.51 BSC 0.020 BSC
c 0.46 0.61 0.018 0.024 L3 0.89 1.27 0.035 0.050 3
c2 0.46 0.89 0.018 0.035 L4 - 1.02 - 0.040
D 5.97 6.22 0.235 0.245 5 L5 1.14 1.52 0.045 0.060 2
D1 5.21 - 0.205 - 3 Ø 0° 10° 0° 10°
E 6.35 6.73 0.250 0.265 5 Ø1 0° 15° 0° 15°
E1 4.32 - 0.170 - 3 Ø2 25° 35° 25° 35°
Ø 1
E
(5)
b3 (3) 0.010 CAB
L3 (3)
B
AC
H
C
L2
D (5)
L4
b
2 x e
b2
(2) L5
123
4
Ø 2
A
c2 A
A
H
Seating
plane
c
Detail “C”
(7)
Seating
plane
A1
Detail “C”
Rotated 90 °CW
Scale: 20:1
(L1)
C
C
L
Ø
Gauge
plane
Lead tip
M
0.010 CAB
M
32
4
1
E1
D1
MIN.
0.265
(6.74)
MIN.
0.245
(6.23)
MIN.
0.089
(2.28)
MIN.
0.06
(1.524)
0.488 (12.40)
0.409 (10.40)
0.093 (2.38)
0.085 (2.18)
Pad layout
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