O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 CHIP COILS High-frequency Winding Type LQW2BH/LQW31H Series LQW2BH Series 1.50.2 1.50.2 1.78max The LQW2BH series consists of air-core chip coil using a sub-miniature alumina core as a bobbin. The high Q value at high frequencies and high self-resonant frequencies make this coil perfect for use in the high frequency circuits of communications equipment. 4 2.00.2 1.50.2 Features 1. LQW2BH series covers inductance range from 3.3nH to 470nH. 2. Their high self-resonant frequency characteristic yields a high Q value and highly stable inductance at high frequencies. 3. Low DC resistance design enables to handle higher allowable current. 4. The series has excellent solder heat resistance. Both flow and reflow soldering methods can be employed. * LQW2BHN_J01 Inductance tolerance +-0.5nH (8.2nH max.), +-5% (10nH to 470nH) is realized. The sub miniature dimensions (2.0x1.5mm) allow high density mounting. * LQW2BHN_G01 (Tight inductance tolerance) Tight inductance tolerance of +-2% is available. * LQW2BHN_11 LQW2BHN_11 using thick wire (0.12mm in diameter) has higher Q value than existing LQW2BH series. Low DC resistance design enables to handle higher current. LQW2BHN_11 covers inductance range from 2.7nH to 27nH. 0.5 min 0.5 min 0.5 min (in mm) Applications * High frequency circuit in telecommunication equipment, such as DECT, PHS, PCS, PCN, GSM and CDMA. Impedance Matching -- Power-AMP Module (PA) SAW filter Resonance circuits -- VCO Inductance (nH) Rated Current (mA) Max. of DC resistance (ohm) Q (min.) Self Resonance Frequency (MHz) LQW2BHN2N7D11 2.7 0.5nH 1900 0.02 20 at 250MHz 6000 min. LQW2BHN3N1D11 3.1 0.5nH 1800 0.02 20 at 250MHz 6000 min. LQW2BHN3N3D01 3.3 0.5nH 910 0.05 10 at 250MHz 6000 min. LQW2BHN3N3D11 3.3 0.5nH 1700 0.02 20 at 250MHz 6000 min. LQW2BHN5N6D11 5.6 0.5nH 1500 0.02 35 at 250MHz 6000 min. LQW2BHN6N8D01 6.8 0.5nH 680 0.11 20 at 250MHz 5400 min. LQW2BHN6N8D11 6.8 0.5nH 1400 0.02 35 at 250MHz 5400 min. LQW2BHN8N2D01 8.2 0.5nH 630 0.12 20 at 250MHz 3900 min. LQW2BHN8N6D11 8.6 0.5nH 1300 0.03 35 at 250MHz 3900 min. LQW2BHN33NG01 33 2% 570 0.15 40 at 250MHz 1900 min. LQW2BHN39NG01 39 2% 730 0.09 40 at 250MHz 1700 min. LQW2BHN47NG01 47 2% 450 0.23 40 at 200MHz 1600 min. Part Number Continued on the following page. 15 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Continued from the preceding page. Inductance (nH) Rated Current (mA) Max. of DC resistance (ohm) Q (min.) Self Resonance Frequency (MHz) LQW2BHN56NG01 56 2% 430 0.26 40 at 200MHz 1500 min. LQW2BHN68NG01 68 2% 460 0.23 40 at 200MHz 1200 min. LQW2BHN82NG01 82 2% 320 0.42 40 at 150MHz 1100 min. LQW2BHNR10G01 100 2% 270 0.55 35 at 150MHz 900 min. LQW2BHNR12G01 120 2% 320 0.40 40 at 150MHz 750 min. LQW2BHNR15G01 150 2% 260 0.68 30 at 150MHz 350 min. LQW2BHNR18G01 180 2% 250 0.71 35 at 100MHz 700 min. LQW2BHNR22G01 220 2% 240 0.7 35 at 100MHz 500 min. LQW2BHN10NJ01 10 5% 1320 0.03 30 at 250MHz 3300 min. LQW2BHN10NJ11 10 5% 1320 0.03 35 at 250MHz 3300 min. LQW2BHN12NJ01 12 5% 680 0.11 30 at 250MHz 3200 min. LQW2BHN15NJ01 15 5% 630 0.12 30 at 250MHz 2700 min. LQW2BHN18NJ01 18 5% 690 0.1 30 at 250MHz 2600 min. LQW2BHN22NJ01 22 5% 720 0.09 30 at 250MHz 2100 min. LQW2BHN27NJ01 27 5% 540 0.17 40 at 250MHz 2300 min. LQW2BHN33NJ01 33 5% 570 0.15 40 at 250MHz 1900 min. LQW2BHN39NJ01 39 5% 730 0.09 40 at 250MHz 1700 min. LQW2BHN47NJ01 47 5% 450 0.23 40 at 200MHz 1600 min. LQW2BHN56NJ01 56 5% 430 0.26 40 at 200MHz 1500 min. LQW2BHN68NJ01 68 5% 460 0.23 40 at 200MHz 1200 min. LQW2BHN82NJ01 82 5% 320 0.42 40 at 150MHz 1100 min. LQW2BHNR10J01 100 5% 350 0.38 40 at 150MHz 900 min. LQW2BHNR12J01 120 5% 320 0.40 40 at 150MHz 750 min. LQW2BHNR15J01 150 5% 390 0.47 30 at 150MHz 350 min. LQW2BHNR18J01 180 5% 250 0.71 35 at 100MHz 700 min. LQW2BHNR22J01 220 5% 240 0.7 35 at 100MHz 500 min. LQW2BHN12NK11 12 10% 1100 0.04 40 at 250MHz 3200 min. LQW2BHN15NK11 15 10% 1000 0.04 40 at 250MHz 3100 min. LQW2BHN18NK11 18.8 10% 1000 0.05 40 at 250MHz 2600 min. LQW2BHN21NK11 21 10% 950 0.05 40 at 250MHz 2200 min. LQW2BHN27NK11 27 10% 900 0.06 40 at 250MHz 1800 min. LQW2BHN33NK01 33 10% 570 0.15 40 at 250MHz 1900 min. LQW2BHN39NK01 39 10% 730 0.09 40 at 250MHz 1700 min. LQW2BHN47NK01 47 10% 450 0.23 40 at 200MHz 1600 min. LQW2BHN56NK01 56 10% 430 0.26 40 at 200MHz 1500 min. LQW2BHN68NK01 68 10% 460 0.23 40 at 200MHz 1200 min. LQW2BHN82NK01 82 10% 320 0.42 40 at 150MHz 1100 min. LQW2BHNR10K01 100 10% 350 0.38 40 at 150MHz 900 min. LQW2BHNR12K01 120 10% 320 0.40 40 at 150MHz 750 min. LQW2BHNR15K01 150 10% 390 0.47 30 at 150MHz 350 min. LQW2BHNR18K01 180 10% 250 0.71 35 at 100MHz 700 min. LQW2BHNR22K01 220 10% 240 0.7 35 at 100MHz 500 min. LQW2BHNR27K01 270 10% 190 2.0 15 at 25.2MHz 550 min. LQW2BHNR33K01 330 10% 180 2.2 15 at 25.2MHz 500 min. LQW2BHNR39K01 390 10% 170 2.5 15 at 25.2MHz 400 min. LQW2BHNR47K01 470 10% 160 2.8 15 at 25.2MHz 350 min. Part Number 4 Min. of Operating Temp. : -25C to 85C 16 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Q-Frequency Characteristics LQW2BHN_01 LQW2BHN_11 100 150 80 120 3.3nH 90 60 12nH Q Q 330nH 470nH 40 60 30 20 10nH 220nH 33nH 0 1 10 100 1000 0 10 10000 27nH 100 1000 10000 4 Frequency (MHz) Frequency(MHz) Inductance-Frequency Characteristics LQW2BHN_11 60 27nH Inductance (nH) 50 40 30 20 12nH 10 3.3nH 0 10 100 1000 10000 Frequency (MHz) LQW31H Series 2.30.2 1.60.2 Features 1.80.2 The LQW31H series is alumina-core-type chip inductor for high frequency circuit. Its low dc resistance and high Q due to wound structure are suitable for hand telecommunication equipment. 1.60.2 3.20.3 (in mm) 0.7min 0.7min 0.7min Inductance (nH) Rated Current (mA) Max. of DC resistance (ohm) Q (min.) Self Resonance Frequency (MHz) LQW31HN8N8J01 8.8 5% 750 0.0406 50 at 436MHz 1000 min. LQW31HN15NJ01 14.7 5% 680 0.049 60 at 436MHz 1000 min. LQW31HN17NJ01 17 5% 650 0.0518 60 at 436MHz 1000 min. LQW31HN23NJ01 23 5% 590 0.0644 60 at 436MHz 1000 min. LQW31HN27NJ01 27 5% 560 0.0714 60 at 436MHz 1000 min. LQW31HN33NJ01 33 5% 530 0.0798 60 at 436MHz 1000 min. LQW31HN39NJ01 39 5% 490 0.0938 60 at 436MHz 1000 min. LQW31HN47NJ01 47 5% 380 0.154 60 at 436MHz 1000 min. LQW31HN56NJ01 56 5% 330 0.196 60 at 436MHz 1000 min. LQW31HN64NJ01 64 5% 290 0.252 60 at 436MHz 1000 min. LQW31HN84NJ01 84 5% 240 0.392 60 at 436MHz 1000 min. LQW31HNR10J01 100 5% 230 0.42 60 at 436MHz 900 min. LQW31HN8N8K01 8.8 10% 750 0.0406 50 at 436MHz 1000 min. Part Number Continued on the following page. 17 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Continued from the preceding page. Inductance (nH) Rated Current (mA) Max. of DC resistance (ohm) Q (min.) Self Resonance Frequency (MHz) LQW31HN15NK01 14.7 10% LQW31HN17NK01 17 10% 680 0.049 60 at 436MHz 1000 min. 650 0.0518 60 at 436MHz LQW31HN23NK01 1000 min. 23 10% 590 0.0644 60 at 436MHz 1000 min. LQW31HN27NK01 27 10% 560 0.0714 60 at 436MHz 1000 min. LQW31HN33NK01 33 10% 530 0.0798 60 at 436MHz 1000 min. LQW31HN39NK01 39 10% 490 0.0938 60 at 436MHz 1000 min. LQW31HN47NK01 47 10% 380 0.154 60 at 436MHz 1000 min. LQW31HN56NK01 56 10% 330 0.196 60 at 436MHz 1000 min. LQW31HN64NK01 64 10% 290 0.252 60 at 436MHz 1000 min. LQW31HN84NK01 84 10% 240 0.392 60 at 436MHz 1000 min. LQW31HNR10K01 100 10% 230 0.42 60 at 436MHz 900 min. Part Number 4 Min. of Operating Temp. : -25C to 85C Q-Frequency Characteristics 120 8.8nH 39nH 100 80 Q 60 40 20 100nH 0 10 50 100 500 Frequency (MHz) 18 1000 5000 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 structure of the "Global Part Numbers" that will be adopted from June 2001 and the meaning of each code are described herein. ( The ) If you have any questions about details, inquire at your usual Murata sales office or distributor. o Part Numbering Chip Coils (SMD) (Global Part Number) LQ H q w e 32 M N 331 K r t y 2 1 L u i o !0 tCategory qProduct ID Product ID LQ Chip Coils Category N Standard Type yInductance wStructure Code Structure G Monolithic Type (Air-core Coil) H Winding Type (Ferrite Core) M Monolithic (Ferriet Core) P Film Type W Winding Type (Air-core Coil) eDimension (LgW) Expressed by three figures. The unit is micro-henry (H). The first and second figures are significant digits, and the third figure expresses the number of zero which follow the two figures. If there is a decimal point, it is expressed by capital letter "R". In this case, all figures are significant digits. If inductance is less than 0.1H, the inductance code is expressed by combination of two figures are capital letter "N", and the unit of inductance is nano-henry (nH). Capital letter "N" indicates the unit of "nH", and also expresses a decimal point. In this case, all figure are significant digits. Code Dimension (LgW) 03 0.60g0.30mm 15 1.00g0.50mm Code Inductance Tolerance 18 1.60g0.80mm B 0.1nH 21 2.00g1.25mm C 0.2nH 2B 2.00g1.50mm D 0.5nH 31 3.20g1.60mm G 2% 32 3.20g2.50mm H 3% 3E 3.50g3.20mm J 5% 3K 3.30g3.30mm K 10% 43 4.50g3.20mm M 20% 55 5.70g5.00mm N 30% 66 6.30g6.30mm S 0.3nH rApplications and Characteristics Series Applications and Characteristics H LQG Monolithic Air-core D T A H Expressed by a figure from "0" to "2". Ex.) for Resonant Circuit LQM F M uInductance Tolerance iFeatures Code N LQP LQW for Choke (Low-current DC Power Supplies) Code Fetures 0 Standard Type oElectrode for Choke (DC Power Supplies) Code Electrode Film Type 0 Solder Plating Film Type (Low DC Resistance Type) 1 Sputtering High Q Type (UFH-SHF) 2 Sn Plating High Q Type (VHF-UHF) !0Pakaging N for Resonant Circuit M for Resonant Circuit (Coating Type) Code Pakaging R for Resonant Circuit (Magnetically Shielded Type) K Plastic Taping (o330mm Reel) L Plastic Taping (o180mm Reel) for Choke B Bulk C for Choke (Coating Type) J Paper Taping (o330mm Reel) S for Choke (Magnetically Shielded Type) D Paper Taping (o180mm Reel) H for High-frequency Resonant Circuit D 2 Code LQH O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Monolithic And Film Type Notice(Soldering and Mounting) 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. a Land Pattern Solder Resist c b Part Number a b LQG15H 0.5-0.6 1.4-1.5 0.4 LQG18H 0.6-0.8 1.8-2.2 0.6-0.8 Flow LQM18N 2.2-2.6 0.7 Reflow c 0.7 1.8-2.0 1.0 3.0-4.0 LQM31F 1.2 4.2-5.2 2.0 LQP03T 0.2-0.3 0.8-0.9 0.2-0.3 LQP15M 0.5-0.6 1.4-1.5 0.4 LQM21N/21D/21F 1.2 in mm 2) Soldering Temperature and Time Solder whithin the temperature and time combinations indicated by the slanted lines in the following graphs. If soldering is repeated, please note that the allowed time is the accumulated time. Allowable Flow Soldering Temperature and Time Solder : H60A 280 260 Temperature (C) 2. STANDARD SOLDERING CONDITIONS 1) Soldering method Chip coils can be flow or reflow soldered. Please contact Murata regarding other soldering methods. The volume of solder can cause minor fluctuations in inductance value. Therefore, carefully control the amount of solder when soldering the LQG15H/18H, LQP03T and LQP15M series. 240 220 200 LQM18N LQM21N/21D/21F LQM31F 180 0 10 20 30 Time (sec.) Allowable Reflow Soldering Temperature and Time Solder : H60A 280 LQG18H 260 Temperature (C) 12 Solder : Use H60A,H63A(JIS Z 3282) or equivalent. Use solder paste equivalent to H60A for LQP03T/15M and LQG15H/18H. Flux : Use rosin-based flux, but not strongly acidic flux. (with chlorine content exceeding 0.2wt%) Do not use water-soluble flux. 240 220 LQM21N/21D/21F LQP03T/15M LQG15H, LQM18N LQM31F 200 180 0 20 40 60 80 100 Time (sec.) Continued on the following page. 42 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Monolithic And Film Type Notice(Soldering and Mounting) Continued from the preceding page. Flow Solder Temperature (C) 3) Standard Soldering Conditions Preheating (in air) Soldering Gradual cooling (in air) 240C 200 100 0 One minute min. 3sec.max. Temperature (C) Reflow Solder Preheating (in air) Soldering Gradual cooling (in air) 230C 200 100 0 One minute min. 10sec.max.* LQG15H/18H,LQP03T/15M : 20sec.max 4) Reworking with Soldering Iron Preheating at 150C for 1 minute is required. Do not directry touch the ceramic element with the tip of the soldering iron. The reworking soldering conditions are as follows. Soldering iron power output : 30W Max. Temperature of soldering iron tip : 280C Diameter of soldering iron end : 3.0mm Max. Soldering time : within 3 second 3. MOUNTING INSTRUCTIONS 1) Land Pattern Dimensions Large lands reduce Q of the mounted chip. Also, large protruding land areas (bordered by lines having dimensions 'c' and 'd' shown bellow) cause floating and electrode cracks. Solder Resist Land c d 12 2) Magnetic Coupling Since some chip coils are constructed like an open magnetic circuit, narrow spacing between coils may cause magnetic coupling. The LQG and LQM series have a magnetically shielded structure. The structure makes their coupling coefficient smaller than that of conventional chip coils. Magnetic Coupling Continued on the following page. 43 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Monolithic And Film Type Notice(Soldering and Mounting) Continued from the preceding page. 3) PCB Warping Arrange chip coils to minimize stress caused by PCB warping. The arrangement shown in Fig.2 is more effective in preventing stress than that shown in Fig.1. Fig.2 Fig.1 4) Amount of Solder Paste Excessive solder causes electrode corrosion, while insufficient solder causes low electrode bonding strength. Adjust the amount of solder paste so that solder is applied as shown in the right. Standard thickness of solder paste : 100 to 150m 5) Amount of Adhesive If too much adhesive is applied, then it may overflow into the land or termination areas and yield poor solderabillity. In contrast, if insufficient adhesive is applied, or if the adhesive is not sufficiently hardened, then the chip may become detached during flow soldering. Apply the adhesive in accordance with the following conditions. 12 44 LQP/LQG/LQM Part Number Typical Application Amount (in:mg) MR-8153RA NF-3000 UVS-50R-2 LQM18N 0.05-0.06 0.06-0.07 0.06-0.07 LQM21N/21D/21F 0.15-0.20 0.20-0.25 0.20-0.25 LQM31F 0.20-0.25 0.25-0.30 0.25-0.30 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Winding Type Notice(Soldering and Mounting) 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. Land Pattern Solder Resist c d b c a 2.5min. Part Number LQH31M/31C/31H LQW31H LQW2BH LQW18A LQW15A 2.0 min. (LQW15A/18A) a b c d 1.5 4.5 1.75 1.0 1.2 3.0 1.1 0.8 0.7-1.0 1.8-2.0 0.6-0.7 0.6-0.8 0.65 1.2 0.35 0.50 in mm If mounted at 2.5 (2.0) mm intervals as indicated in the diagram, attention should be paid to potential magnetic coupling effects when using the coil as a resonator. LQH43M LQH43N LQH43C Land Pattern Solder Resist 3.0 1.5 7.5 1.5 1.5 1.5 in mm Continued on the following page. 12 45 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Winding Type Notice(Soldering and Mounting) Continued from the preceding page. 2) Soldering Temperature and Time Solder whithin the temperature and time combinations indicated by the slanted lines in the following graphs. If soldering is repeated, please note that the allowed time is the accumulated time. Solder : Use H60A,H63A(JIS Z 3282) or equivalent. Flux : Use rosin-based flux, but not strongly acidic flux. (with chlorine content exceeding 0.2wt%) Do not use water-soluble flux. Allowable Flow Soldering Temperature and Time Solder : H60A 280 260 Temperature (C) 2. STANDARD SOLDERING CONDITIONS 1) Soldering method Chip coils can be flow or reflow soldered. Please contact Murata regarding other soldering methods. Reflow soldering should be applied for LQW15A/18A. 240 220 200 LQW2BH LQH31M/31C/31H LQH43M/43N/43C LQW31H 180 0 10 20 30 Time (sec.) Allowable Reflow Soldering Temperature and Time Solder : H60A 280 Temperature (C) 260 240 220 LQW2BH/31H LQH31H LQH43N 200 LQW18A 180 0 10 20 LQW15A LQH31M/31C LQH43M/43C 30 40 50 60 Time (sec.) Flow Solder Temperature (C) 3) Standard Soldering Conditions Preheating (in air) Soldering 200 Gradual cooling (in air) 240C 100 0 One minute min. 3sec.max. 12 Temperature (C) Reflow Solder Preheating (in air) Soldering 200 Gradual cooling (in air) 230C 100 0 One minute min. 10sec.max. Continued on the following page. 46 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Winding Type Notice(Soldering and Mounting) Continued from the preceding page. 4) Reworking with Soldering Iron Preheating at 150C for 1 minute is required. Do not directry touch the ceramic element with the tip of the soldering iron. The reworking soldering conditions are as follows. Soldering iron power output : 30W Max. Temperature of soldering iron tip : 280C Diameter of soldering iron end : 3.0mm Max. Soldering time : within 3 second 3. MOUNTING INSTRUCTIONS 1) Land Pattern Dimensions Large lands reduce Q of the mounted chip. Also, large protruding land areas (bordered by lines having dimensions 'c' and 'd' shown bellow) cause floating and electrode cracks. Solder Resist Land c d 2) Magnetic Coupling Since some chip coils are constructed like an open magnetic circuit, narrow spacing between coils may cause magnetic coupling. The LQH series have a magnetically shielded structure. The structure makes their coupling coefficient smaller than that of conventional chip coils. Magnetic Coupling 3) PCB Warping Arrange chip coils to minimize stress caused by PCB warping. The arrangement shown in Fig.2 is more effective in preventing stress than that shown in Fig.1. Fig.1 4) Amount of Solder Paste Excessive solder causes electrode corrosion, while insufficient solder causes low electrode bonding strength. Adjust the amount of solder paste so that solder is applied as shown in the right. Standard thickness of solder paste: 200m to 300m (LQW15A/18A : 100 to 150m) Fig.2 12 LQH_C/H/M/N LQW_H LQW_A Continued on the following page. 47 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Winding Type Notice(Soldering and Mounting) Continued from the preceding page. 5) Amount of Adhesive If too much adhesive is applied, then it may overflow into the land or termination areas and yield poor solderabillity. In contrast, if insufficient adhesive is applied, or if the adhesive is not sufficiently hardened, then the chip may become detached during flow soldering. Apply the adhesive in accordance with the following conditions. Part Number LQW2BH LQH31M/31C/31H LQW31H LQH43M(N) LQH43C 12 48 Typical Application Amount (in:mg) MR-8153RA NF-3000 UVS-50R-2 0.16-0.18 0.20-0.25 0.21-0.23 0.18-0.20 0.20-0.25 0.20-0.25 0.45-0.50 0.60-0.80 0.60-0.80 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Winding And Mgnetic Shielded Type Notice(Soldering and Mounting) 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. LQH32M_11/32C_11 LQH3ER Land Pattern Solder Resist 2.0 1.0 5.5 1.0 1.0 1.0 LQH32M_21/32C_21/32C_51 LQH3KS 2.0 1.0 5.5 1.0 1.3 1.0 in mm 2) Soldering Temperature and Time Solder whithin the temperature and time combinations indicated by the slanted lines in the following graphs. If soldering is repeated, please note that the allowed time is the accumulated time. Allowable Flow Soldering Temperature and Time Solder : H60A 280 260 Temperature (C) 2. STANDARD SOLDERING CONDITIONS 1) Soldering method Chip coils can be flow or reflow soldered. Please contact Murata regarding other soldering methods. Reflow soldering should be applied for LQH3ER/3KS. 240 LQH32M/32C 220 200 180 0 10 20 30 Time (sec.) Allowable Reflow Soldering Temperature and Time 12 Solder : H60A 280 260 Temperature (C) Solder : Use H60A,H63A(JIS Z 3282) or equivalent. Flux : Use rosin-based flux, but not strongly acidic flux. (with chlorine content exceeding 0.2wt%) Do not use water-soluble flux. 240 220 LQH32M/32C LQH3ER/3KS 200 180 0 10 20 30 40 Time (sec.) 50 60 Continued on the following page. 49 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Winding And Mgnetic Shielded Type Notice(Soldering and Mounting) Continued from the preceding page. Flow Solder Temperature (C) 3) Standard Soldering Conditions Preheating (in air) Soldering Gradual cooling (in air) 240C 200 100 0 One minute min. 3sec.max. Temperature (C) Reflow Solder Preheating (in air) Soldering Gradual cooling (in air) 230C 200 100 0 One minute min. 10sec.max. 4) Reworking with Soldering Iron Preheating at 150C for 1 minute is required. Do not directry touch the ceramic element with the tip of the soldering iron. The reworking soldering conditions are as follows. Soldering iron power output : 30W Max. Temperature of soldering iron tip : 280C Diameter of soldering iron end : 3.0mm Max. Soldering time : within 3 second 3. MOUNTING INSTRUCTIONS 1) Land Pattern Dimensions Large lands reduce Q of the mounted chip. Also, large protruding land areas (bordered by lines having dimensions 'c' and 'd' shown bellow) cause floating and electrode cracks. Solder Resist Land c d 12 2) Magnetic Coupling Since some chip coils are constructed like an open magnetic circuit, narrow spacing between coils may cause magnetic coupling. The LQH_R/S series have a magnetically shielded structure. The structure makes their coupling coefficient smaller than that of conventional chip coils. In particular, the LQH3ER series has a very small coupling coefficient. Magnetic Coupling Continued on the following page. 50 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Winding And Mgnetic Shielded Type Notice(Soldering and Mounting) Continued from the preceding page. 3) PCB Warping Arrange chip coils to minimize stress caused by PCB warping. The arrangement shown in Fig.2 is more effective in preventing stress than that shown in Fig.1. Fig.2 Fig.1 4) Amount of Solder Paste Excessive solder causes electrode corrosion, while insufficient solder causes low electrode bonding strength. Adjust the amount of solder paste so that solder is applied as shown in the right. Standard thickness of solder paste: 200m to 300m 5) Amount of Adhesive If too much adhesive is applied, then it may overflow into the land or termination areas and yield poor solderabillity. In contrast, if insufficient adhesive is applied, or if the adhesive is not sufficiently hardened, then the chip may become detached during flow soldering. Apply the adhesive in accordance with the following conditions. LQH_C/D/H/M/N Part Number LQH32M/32C LQH_R/S Typical Application Amount (in:mg) MR-8153RA NF-3000 UVS-50R-2 0.20-0.23 0.27-0.35 0.27-0.35 12 51 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Larege-current Type Notice(Soldering and Mounting) 1. STANDARD LAND DIMENSIONS A high Q value is achieved when the PCB electrode land pattern is designed so that it does not project beyond the chip coil electrode. LQH55D LQH66S Land Pattern Solder Resist 3.5 8.0 3.0 2.0 3.0 in mm 2. STANDARD SOLDERING CONDITIONS 1) Soldering method Reflow soldering should be applied for LQH55D/66S. Allowable Reflow Soldering Temperature and Time Solder : H60A 280 2) Soldering Temperature and Time Solder whithin the temperature and time combinations indicated by the slanted lines in the following graphs. If soldering is repeated, please note that the allowed time is the accumulated time. 260 Temperature (C) LQH66S Solder : Use H60A,H63A(JIS Z 3282) or equivalent. Flux : Use rosin-based flux, but not strongly acidic flux. (with chlorine content exceeding 0.2wt%) Do not use water-soluble flux. 220 200 180 LQH55D 0 20 40 60 80 Time (sec.) 100 Reflow Solder Temperature (C) 3) Standard Soldering Conditions 240 Preheating (in air) Soldering 200 Gradual cooling (in air) 230C 100 0 One minute min. 10sec.max. 12 4) Reworking with Soldering Iron Preheating at 150C for 1 minute is required. Do not directry touch the ceramic element with the tip of the soldering iron. The reworking soldering conditions are as follows. Soldering iron power output : 30W Max. Temperature of soldering iron tip : 280C Diameter of soldering iron end : 3.0mm Max. Soldering time : within 3 second Continued on the following page. 52 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Larege-current Type Notice(Soldering and Mounting) Continued from the preceding page. 3. MOUNTING INSTRUCTIONS 1) Land Pattern Dimensions Large lands reduce Q of the mounted chip. Also, large protruding land areas (bordered by lines having dimensions 'c' and 'd' shown bellow) cause floating and electrode cracks. Solder Resist Land c d 2) Magnetic Coupling Since some chip coils are constructed like an open magnetic circuit, narrow spacing between coils may cause magnetic coupling. The LQH_S series have a magnetically shielded structure. The structure makes their coupling coefficient smaller than that of conventional chip coils. Magnetic Coupling 3) PCB Warping Arrange chip coils to minimize stress caused by PCB warping. The arrangement shown in Fig.2 is more effective in preventing stress than that shown in Fig.1. Fig.1 4) Amount of Solder Paste Excessive solder causes electrode corrosion, while insufficient solder causes low electrode bonding strength. Adjust the amount of solder paste so that solder is applied as shown bellow Standard thickness of solder paste: 200m to 300m LQH_D Fig.2 LQH_S 12 53 This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9 Notice Notice (Storage and Operating Conditions) < OPERATING ENVIRONMENT > Do not use products in chemical atmosphere such as chlorine gas, acid or sulfide gas. < STORAGE REQUIREMENTS > 1. Storage Period Products should be used within 12 months reckon from the date of our out-going inspection. Solderability should be verified if this period is exceeded. (LQH3ER/3KS series should be used within 6 months.) 2. Storage conditions a) Store products in a warehouse in compliance with the following conditions : Temperature : -10 to 40C. Humidity : 30 to 70% (relative humidity) Do not subject products to rapid changes in temperature and humidity. Do not store them in chemical atmosphere such as one containing sulfurous acid gas or alkaline gas. This will prevent electrode oxidation which causes poor solderability and possible corrosion of coils. b) Do not store products in bulk packaging to prevent collision among coils which causes core chipping and wire breakage. c) Store products on pallets to protect from humidity, dust, etc. d) Avoid heat shock, vibration, direct sunlight, etc. Notice (Soldering and Mounting) < CLEANING > The following conditions should be observed when cleaning chip coils. 1. Cleaning Temperature : 60C. max. (40C. max. for CFC alternatives and alcohol cleaning agents) 2. Ultrasonic Output : 20W/l max. Duration : 5 minutes max. Frequency : 28kHz to 40kHz Care should be taken not to cause resonance of the PCB and mounted products. 3. Cleaning agent The following cleaning agents have been tested on individual components. Evaluation in complete assembly should be done prior to production. a) CFC alternatives and alcohol cleaning agents * Isopropyl alcohol ( IPA ) 12 54 * HCFC-225 b) Aqueous cleaning agents * Surface active agent ( Clean Thru 750H ) * High grade alcohol ( Pine Alpha ST-100S ) * Hydrocarbon ( Techno Cleaner 335 ) * Alkaline Saponifier ( Aqua Cleaner 240 -cleaner should be diluted to 20% using deionized water. ) LQH_R/S series : Aqueous agents should not be used because they may cause quality deterioration. LQH series : Surface active agent and high grade alcohol can be used. 4. Ensure that flux residue is completely removed. Component should be thoroughly dried after aqueous agents have been removed with deionized water. For additional cleaning methods, please contact Murata. This is the PDF file of catalog No.O05E-6 O05E6.pdf 01.5.9 Notice Notice (Handling) This item is designed to have sufficient strength, but handle with care not to make it chipped or broken due to its ceramic structure. LQW_A series * Sharp material, such as tweezers, shall not touch to the winding portion to prevent the breaking of wire. * Do not give excessive Mechanical shock should not be applied to the products mounted on the board to prevent thebreaking of the core. * In some mounting machines,when picking up components,support pin pushes up the components from the bottom of base tape. In this case,please remove the support pin. The support pin may damage the components and break wire. LQH_C/D/H/M/N, LQW_H series * Sharp material, such as tweezers, shall not touch to the winding portion to prevent the breaking of wire. * Do not give excessive Mechanical shock should not be applied to the products mounted on the board to prevent thebreaking of the core. LQP series * The pattern of the chip coil is covered with the protection film. But the handling the chip coil shall be taken care so that the chip coil would not be damaged with the pick-up nozzle, the sharp substance and so on. LQM series * There is possibility that the inductance value change due to magnetism. Do not use a magnet or tweezers with magnetism when chip coil are handled. ( The tip of the tweezers should be molded with resin or pottery.) < HANDLING > 1. Avoid applying excessive stress to products to prevent damage. 2. Do not touch winding with sharp objects such as tweezers to prevent wire breakage. 3. Do not apply excessive force to products mounted on boards to prevent core breakage. < TRANSPORTATIONS > Do not apply excessive vibration or mechanical shock to products. < RESIN COATING > When coating products with resin, the relatively high resin curing stress may change inductance values. For exterior coating, select resin carefully so that electrical and mechanical performance of the product is not affected. 12 55 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Packaging Minimum Quantity and 8mm Width Taping Dimension 8.00.3 (2.75) 3.50.05 4.00.1 <Paper> 1 0.2 4.00.1 b , ,,, a 1.750.1 <Plastic> 1.5 +0.1 -0 c c 2.00.1 Direction of feed LQW2BH 1 : 0.3 Paper Tape Part Number Dimensions (in mm) a b c 1.45 2.25 1.1 Minimum QTY. (pcs.) 180mm reel 330mm reel Bulk LQM21NN (0.1-2.2H) LQM21DN (1-10H) LQM21FN (1-2.2H) LQG18H LQM18N LQW18A 1.05 1.85 1.00 1.80 1.0 4000 10000 1000 1.1 0.95 - Plastic Tape Part Number Dimensions (in mm) Minimum QTY. (pcs.) 180mm reel 330mm reel a b c 1.45 2.25 1.3 4000 LQM31F 1.9 3.5 1.3 3000 LQH31M/31C/31H, LQW31H 1.9 3.6 LQW2BH 1.75 2.3 2.9 3.6 Bulk LQM21NN (2.7-4.7H) LQM21DN (22-47H) LQM21FN (4.7-47H) LQH32M/LQH32C LQH32CN_51 10000 1000 7500 - 2.0 2.1 2000 1.7 (in mm) Continued on the following page. 12 56 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Packaging Continued from the preceding page. o1.5 +0.1 -0 4.00.1 b 8.00.2 2.00.05 3.50.05 2.00.05 1.750.1 Minimum Quantity and 8mm Width Taping Dimension c a Direction of feed Paper Tape Dimensions (in mm) Part Number a b LQG15H 0.62 1.12 LQP03T 0.38 0.68 LQP15M 0.70 LQW15A Minimum QTY. (pcs.) 180mm reel 330mm reel c 1.0 1.20 Bulk 1000 50000 - 10000 - 500 0.8 (in mm) 2.00.1 4.00.1 1.5 +0.1 -0 d (4.75) b 12.00.3 , , ,,, 8.00.1 5.50.1 1.750.1 Minimum Quantity and 12mm Width Plastic Taping Dimension a c Direction of feed Part Number Dimensions (in mm) a b c 3.9 3.7 1.9 3.6 4.9 2.7 LQH55D 5.4 6.1 5.0 LQH66S 6.7 6.7 5.6 LQH3ER, LQH3KS LQH43M(N) LQH43C Minimum QTY. (pcs.) d 180mm reel 330mm reel 1000 0.3 0.4 500 350 2500 1500 - 12 (in mm) 57 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Design Kits oEKLM12UB (High-frequency Winding Type) No. Part Number Quantiy (pcs.) Inductance (nH) Inductance Tolerance Rated Current (mA) 1 LQW2BHN3N3D01 20 3.3 T0.5nH 910 2 LQW2BHN6N8D01 20 6.8 T0.5nH 680 3 LQW2BHN8N2D01 20 8.2 T0.5nH 630 4 LQW2BHN10NJ01 20 10 T5% 1320 5 LQW2BHN12NJ01 20 12 T5% 680 6 LQW2BHN15NJ01 20 15 T5% 630 7 LQW2BHN18NJ01 20 18 T5% 690 8 LQW2BHN22NJ01 20 22 T5% 720 9 LQW2BHN27NJ01 20 27 T5% 540 10 LQW2BHN33NJ01 20 33 T5% 570 11 LQW2BHN39NJ01 20 39 T5% 730 12 LQW2BHN47NJ01 20 47 T5% 450 13 LQW2BHN56NJ01 20 56 T5% 430 14 LQW2BHN68NJ01 20 68 T5% 460 15 LQW2BHN82NJ01 20 82 T5% 320 16 LQW2BHNR10J01 20 100 T5% 350 17 LQW2BHNR12J01 20 120 T5% 320 18 LQW2BHNR15J01 20 150 T5% 390 19 LQW2BHNR18J01 20 180 T5% 250 20 LQW2BHNR22J01 20 220 T5% 240 21 LQW2BHNR27K01 20 270 T10% 190 T10% 180 170 22 LQW2BHNR33K01 20 330 23 LQW2BHNR39K01 20 390 T10% 24 LQW2BHNR47K01 20 470 T10% 160 25 LQW2BHN2N7D11 20 2.7 T0.5nH 1900 26 LQW2BHN3N1D11 20 3.1 T0.5nH 1800 27 LQW2BHN3N3D11 20 3.3 T0.5nH 1700 28 LQW2BHN5N6D11 20 5.6 T0.5nH 1500 29 LQW2BHN6N8D11 20 6.8 T0.5nH 1400 30 LQW2BHN8N6D11 20 8.6 T0.5nH 1300 31 LQW2BHN10NJ11 20 10 T5% 1320 32 LQW2BHN12NK11 20 12 T10% 1100 33 LQW2BHN15NK11 20 15 T10% 1000 34 LQW2BHN18NK11 20 18.8 T10% 1000 35 LQW2BHN21NK11 20 21 T10% 950 36 LQW2BHN27NK11 20 27 T10% 900 58 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Design Kits oEKLM13UB (High-frequency Monolithic Type) Quantiy (pcs.) Inductance (nH) Inductance Tolerance Rated Current (mA) LQG18HN1N2S00 20 1.2 T0.3nH 300 2 LQG18HN1N5S00 20 1.5 T0.3nH 300 3 LQG18HN1N8S00 20 1.8 T0.3nH 300 4 LQG18HN2N2S00 20 2.2 T0.3nH 300 5 LQG18HN2N7S00 20 2.7 T0.3nH 300 6 LQG18HN3N3S00 20 3.3 T0.3nH 300 7 LQG18HN3N9S00 20 3.9 T0.3nH 300 8 LQG18HN4N7S00 20 4.7 T0.3nH 300 9 LQG18HN5N6S00 20 5.6 T0.3nH 300 10 LQG18HN6N8J00 20 6.8 T5% 300 11 LQG18HN8N2J00 20 8.2 T5% 300 12 LQG18HN10NJ00 20 10 T5% 300 300 No. 1 Part Number 13 LQG18HN12NJ00 20 12 T5% 14 LQG18HN15NJ00 20 15 T5% 300 15 LQG18HN18NJ00 20 18 T5% 300 16 LQG18HN22NJ00 20 22 T5% 300 17 LQG18HN27NJ00 20 27 T5% 300 18 LQG18HN33NJ00 20 33 T5% 300 19 LQG18HN39NJ00 20 39 T5% 300 20 LQG18HN47NJ00 20 47 T5% 300 21 LQG18HN56NJ00 20 56 T5% 300 22 LQG18HN68NJ00 20 68 T5% 300 23 LQG18HN82NJ00 20 82 T5% 300 24 LQG18HNR10J00 20 100 T5% 300 Rated Current (mA) oEKLM14UC (High-frequency Flim Type) Quantiy (pcs.) Inductance (nH) Inductance Tolerance 1 LQP15MN1N0B00 20 1.0 T0.1nH 400 2 LQP15MN1N1B00 20 1.1 T0.1nH 390 3 LQP15MN1N2B00 20 1.2 T0.1nH 390 4 LQP15MN1N3B00 20 1.3 T0.1nH 280 5 LQP15MN1N5B00 20 1.5 T0.1nH 280 6 LQP15MN1N6B00 20 1.6 T0.1nH 220 7 LQP15MN1N8B00 20 1.8 T0.1nH 280 8 LQP15MN2N0B00 20 2.0 T0.1nH 220 9 LQP15MN2N2B00 20 2.2 T0.1nH 220 10 LQP15MN2N4B00 20 2.4 T0.1nH 220 11 LQP15MN2N7B00 20 2.7 T0.1nH 220 12 LQP15MN3N0B00 20 3.0 T0.1nH 190 13 LQP15MN3N3B00 20 3.3 T0.1nH 190 14 No. Part Number LQP15MN3N6B00 20 3.6 T0.1nH 170 15 LQP15MN3N9B00 20 3.9 T0.1nH 170 16 LQP15MN4N3B00 20 4.3 T0.1nH 160 17 LQP15MN4N7B00 20 4.7 T0.1nH 160 18 LQP15MN5N1B00 20 5.1 T0.1nH 140 19 LQP15MN5N6B00 20 5.6 T0.1nH 140 20 LQP15MN6N2B00 20 6.2 T0.1nH 130 21 LQP15MN6N8B00 20 6.8 T0.1nH 130 22 LQP15MN7N5B00 20 7.5 T0.1nH 110 23 LQP15MN8N2B00 20 8.2 T0.1nH 110 24 LQP15MN9N1B00 20 9.1 T0.1nH 100 Continued on the following page. 59 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Design Kits Continued from the preceding page. No. Part Number Quantiy (pcs.) Inductance (nH) Inductance Tolerance Rated Current (mA) 25 LQP15MN10NG00 20 10 T2% 100 26 LQP15MN12NG00 20 12 T2% 90 27 LQP15MN15NG00 20 15 T2% 90 28 LQP15MN18NG00 20 18 T2% 80 29 LQP15MN22NG00 20 22 T2% 70 30 LQP15MN27NG00 20 27 T2% 70 31 LQP15MN33NG00 20 33 T2% 60 Rated Current (mA) oEKLM15UB (High-frequency Monolithic Type) Quantiy (pcs.) Inductance (nH) Inductance Tolerance 1 LQG15HN1N2S00 20 1.2 T0.3nH 200 2 LQG15HN1N5S00 20 1.5 T0.3nH 200 3 LQG15HN1N8S00 20 1.8 T0.3nH 200 4 LQG15HN2N2S00 20 2.2 T0.3nH 200 5 LQG15HN2N7S00 20 2.7 T0.3nH 200 6 LQG15HN3N3S00 20 3.3 T0.3nH 200 7 LQG15HN3N9S00 20 3.9 T0.3nH 200 8 LQG15HN4N7S00 20 4.7 T0.3nH 200 9 LQG15HN5N6S00 20 5.6 T0.3nH 200 10 LQG15HN6N8J00 20 6.8 T5% 200 11 LQG15HN8N2J00 20 8.2 T5% 200 12 LQG15HN10NJ00 20 10 T5% 200 13 LQG15HN12NJ00 20 12 T5% 200 14 LQG15HN15NJ00 20 15 T5% 200 15 LQG15HN18NJ00 20 18 T5% 200 16 LQG15HN22NJ00 20 22 T5% 200 No. Part Number 17 LQG15HN27NJ00 20 27 T5% 200 18 LQG15HN33NJ00 20 33 T5% 200 Quantiy (pcs.) Inductance (nH) Inductance Tolerance Rated Current (mA) 3.6 T0.2nH 850 oEKLM16UB (High-frequency Winding Type) No. Part Number 1 LQW18AN3N6C00 20 2 LQW18AN3N9C00 20 3.9 T0.2nH 850 3 LQW18AN4N3C00 20 4.3 T0.2nH 850 4 LQW18AN5N6C00 20 5.6 T0.2nH 750 5 LQW18AN6N2C00 20 6.2 T0.2nH 750 6 LQW18AN6N8C00 20 6.8 T0.2nH 750 7 LQW18AN10NG00 20 10 T2% 650 8 LQW18AN11NG00 20 11 T2% 650 9 LQW18AN12NG00 20 12 T2% 600 10 LQW18AN13NG00 20 13 T2% 600 11 LQW18AN15NG00 20 15 T2% 600 12 LQW18AN16NG00 20 16 T2% 550 13 LQW18AN18NG00 20 18 T2% 550 14 LQW18AN20NG00 20 20 T2% 550 15 LQW18AN22NG00 20 22 T2% 500 16 LQW18AN24NG00 20 24 T2% 500 17 LQW18AN27NG00 20 27 T2% 440 18 LQW18AN30NG00 20 30 T2% 420 19 LQW18AN33NG00 20 33 T2% 420 20 LQW18AN36NG00 20 36 T2% 400 Continued on the following page. 60 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Design Kits Continued from the preceding page. Quantiy (pcs.) Inductance (nH) Inductance Tolerance 21 LQW18AN39NG00 20 39 T2% 400 22 LQW18AN43NG00 20 43 T2% 380 23 LQW18AN47NG00 20 47 T2% 380 24 LQW18AN51NG00 20 51 T2% 370 25 LQW18AN56NG00 20 56 T2% 360 26 LQW18AN62NG00 20 62 T2% 280 27 LQW18AN68NG00 20 68 T2% 340 28 LQW18AN72NG00 20 72 T2% 270 29 LQW18AN75NG00 20 75 T2% 270 30 LQW18AN82NG00 20 82 T2% 250 31 LQW18AN91NG00 20 91 T2% 230 32 LQW18ANR10G00 20 100 T2% 220 33 LQW18ANR11G00 20 110 T2% 200 34 LQW18ANR12G00 20 120 T2% 180 170 No. Part Number Rated Current (mA) 35 LQW18ANR13G00 20 130 T2% 36 LQW18ANR15G00 20 150 T2% 160 37 LQW18ANR16G00 20 160 T2% 150 38 LQW18ANR18G00 20 180 T2% 140 39 LQW18ANR20G00 20 200 T2% 120 40 LQW18ANR22G00 20 220 T2% 120 Inductance (nH) Inductance Tolerance Rated Current (mA) oEKLM17UB (High-frequency Winding Type) No. Part Number Quantiy (pcs.) 1 LQW18AN2N2D00 20 2.2 T0.5nH 700 2 LQW18AN3N6D00 20 3.6 T0.5nH 850 3 LQW18AN3N9D00 20 3.9 T0.5nH 850 4 LQW18AN4N3D00 20 4.3 T0.5nH 850 5 LQW18AN4N7D00 20 4.7 T0.5nH 850 6 LQW18AN5N6D00 20 5.6 T0.5nH 750 7 LQW18AN6N2D00 20 6.2 T0.5nH 750 8 LQW18AN6N8D00 20 6.8 T0.5nH 750 9 LQW18AN7N5D00 20 7.5 T0.5nH 750 10 LQW18AN8N2D00 20 8.2 T0.5nH 650 11 LQW18AN8N7D00 20 8.7 T0.5nH 650 12 LQW18AN9N1D00 20 9.1 T0.5nH 650 13 LQW18AN9N5D00 20 9.5 T0.5nH 650 14 LQW18AN10NJ00 20 10 T5% 650 15 LQW18AN11NJ00 20 11 T5% 650 16 LQW18AN12NJ00 20 12 T5% 600 17 LQW18AN13NJ00 20 13 T5% 600 18 LQW18AN15NJ00 20 15 T5% 600 19 LQW18AN16NJ00 20 16 T5% 550 20 LQW18AN18NJ00 20 18 T5% 550 21 LQW18AN20NJ00 20 20 T5% 550 22 LQW18AN22NJ00 20 22 T5% 500 23 LQW18AN24NJ00 20 24 T5% 500 24 LQW18AN27NJ00 20 27 T5% 440 25 LQW18AN30NJ00 20 30 T5% 420 26 LQW18AN33NJ00 20 33 T5% 420 27 LQW18AN36NJ00 20 36 T5% 400 28 LQW18AN39NJ00 20 39 T5% 400 29 LQW18AN43NJ00 20 43 T5% 380 30 LQW18AN47NJ00 20 47 T5% 380 Continued on the following page. 61 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Design Kits Continued from the preceding page. No. Part Number Quantiy (pcs.) Inductance (nH) Inductance Tolerance 31 LQW18AN51NJ00 20 51 T5% Rated Current (mA) 370 32 LQW18AN56NJ00 20 56 T5% 360 33 LQW18AN62NJ00 20 62 T5% 280 34 LQW18AN68NJ00 20 68 T5% 340 35 LQW18AN72NJ00 20 72 T5% 270 36 LQW18AN75NJ00 20 75 T5% 270 37 LQW18AN82NJ00 20 82 T5% 250 38 LQW18AN91NJ00 20 91 T5% 230 39 LQW18ANR10J00 20 100 T5% 220 40 LQW18ANR11J00 20 110 T5% 200 41 LQW18ANR12J00 20 120 T5% 180 42 LQW18ANR13J00 20 130 T5% 170 43 LQW18ANR15J00 20 150 T5% 160 44 LQW18ANR16J00 20 160 T5% 150 45 LQW18ANR18J00 20 180 T5% 140 46 LQW18ANR20J00 20 200 T5% 120 47 LQW18ANR22J00 20 220 T5% 120 oEKLM21UB (for General Use/ for Choke Monolithic Type) Quantiy (pcs.) Inductance (nH) Inductance Tolerance (%) Rated Current (mA) 1 LQM21NNR10K10 20 0.1 T10 250 2 LQM21NNR12K10 20 0.12 T10 250 3 LQM21NNR15K10 20 0.15 T10 250 4 LQM21NNR18K10 20 0.18 T10 250 5 LQM21NNR22K10 20 0.22 T10 250 6 LQM21NNR27K10 20 0.27 T10 250 7 LQM21NNR33K10 20 0.33 T10 250 8 LQM21NNR39K10 20 0.39 T10 200 No. Part Number 9 LQM21NNR47K10 20 0.47 T10 200 10 LQM21NNR56K10 20 0.56 T10 150 11 LQM21NNR68K10 20 0.68 T10 150 12 LQM21NNR82K10 20 0.82 T10 150 13 LQM21NN1R0K10 20 1.0 T10 50 50 14 LQM21NN1R2K10 20 1.2 T10 15 LQM21NN1R5K10 20 1.5 T10 50 16 LQM21NN1R8K10 20 1.8 T10 50 17 LQM21NN2R2K10 20 2.2 T10 30 18 LQM21NN2R7K10 20 2.7 T10 30 19 LQM21NN3R3K10 20 3.3 T10 30 20 LQM21NN3R9K10 20 3.9 T10 30 21 LQM21NN4R7K10 20 4.7 T10 30 22 LQM21DN1R0N00 20 1.0 T30 60 23 LQM21DN2R2N00 20 2.2 T30 40 24 LQM21DN4R7N00 20 4.7 T30 30 25 LQM21DN100N00 20 10 T30 15 26 LQM21DN220N00 20 22 T30 13 27 LQM21DN470N00 20 47 T30 7 28 LQM21FN1R0N00 20 1.0 T30 220 29 LQM21FN2R2N00 20 2.2 T30 150 30 LQM21FN4R7N00 20 4.7 T30 80 31 LQM21FN100N00 20 10 T30 60 32 LQM21FN220N00 20 22 T30 13 33 LQM21FN470N00 20 47 T30 7 62 O05E6.pdf 01.5.9 This is the PDF file of catalog No.O05E-6 Information 1. Land Area and Q-F Characteristics PCB : Ag-Pb printed land formed on 0.6mm-thick alumina plate Solder : H60A Soldering : Reflow soldering Solder layer : Sections shown by oblique lines in figure LQH32MN680K21 100 A : Characteristic of coil itself 1 B: 1 1.3 2 80 Characteristic of chip mounted on land A 1 5.5 2.5 60 C: Characteristic of chip mounted on land Q 2.5 1 2.5 B (in mm) 40 C 20 0 10k 50k 100k 500k 1M 5M Frequency (Hz) 2. Coupling coefficient versus Coil-to-coil Spacing LQH32M Series 14 Coil-to-coil Spacing 12 Coupling Coefficient (%) 10 8 6 4 330H 1H 2 0 0 1 2 3 4 5 6 Coil-to-coil Spacing (mm) 63