MBA0204VD3971CC100 - Vishay Presicion Group

Precision Thin Film Leaded Resistors

MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Precision

Vishay Beyschlag

www.vishay.com For technical questions, contact: filmresistorsleaded@vishay.com Document Number: 28767

72 Revision: 02-Mar-10

DESCRIPTION

MBA/SMA 0204, MBB/SMA 0207 and MBE/SMA 0414

precision leaded thin film resistors combine the proven

reliability of the professional products with an advanced level

of precision and stability. Therefore they are perfectly suited

for applications in the fields of test and measuring equipment

along with industrial and medical electronics.

FEATURES

•Approved according to EN 140101-806

•Advanced thin film technology

•Low TCR: ± 15 ppm/K to ± 25 ppm/K

•Precision tolerance of value:

± 0.1 % and ± 0.25 %

•Superior overall stability: Class 0.05

•Wide precision range: 10 Ω to 1.5 MΩ

•Lead (Pb)-free solder contacts

•Pure tin plating provides compatibility with lead (Pb)-free

and lead containing soldering processes

•Compliant to RoHS directive 2002/95/EC

APPLICATIONS

•Test and measuring equipment

•Industrial electronics

•Medical electronics

Notes

• MB_ series has been merged with the related SMA series to form one series “MB_/SMA__”

• These resistors do not feature a limited lifetime when operated within the permissible limits. However, resistance value drift increasing over

operating time may result in exceeding a limit acceptable to the specific application, thereby establishing a functional lifetime.

METRIC SIZE

DIN 0204 0207 0414

CECC ABD

TECHNICAL SPECIFICATIONS

DESCRIPTION MBA/SMA 0204 MBB/SMA 0207 MBE/SMA 0414

CECC Size A B D

Resistance Range 22 Ω to 332 kΩ10 Ω to 1 MΩ22 Ω to 1.5 MΩ

Resistance Tolerance ± 0.25 %; ± 0.1 %

Temperature Coefficient ± 25 ppm/K; ± 15 ppm/K

Operation Mode Precision Standard Precision Standard Precision Standard

Climatic Category (LCT/UCT/Days) 10/85/56 55/125/56 10/85/56 55/125/56 10/85/56 55/125/56

Rated Dissipation, P70 0.07 W 0.25 W 0.11 W 0.40 W 0.17 W 0.65 W

Operating Voltage, Umax. AC/DC 200 V 350 V 500 V

Film Temperature 85 °C 125 °C85°C 125 °C85°C125°C

Max. Resistance Change at P70 for

Resistance Range, ΔR/R max., After: 100 Ωto 100 kΩ100 Ωto 270 kΩ100 Ωto 470 kΩ

1000 h ≤ 0.05 % ≤ 0.25 % ≤ 0.03 % ≤ 0.15 % ≤ 0.05 % ≤ 0.25 %

8000 h ≤ 0.1 % ≤ 0.5 % ≤ 0.1 % ≤ 0.5 % ≤ 0.1 % ≤ 0.5 %

225 000 h ≤ 0.3 % ≤ 1.5 % ≤ 0.3 % ≤ 1.5 % ≤ 0.3 % ≤ 1.5 %

Permissible Voltage Against Ambient

(Insulation):

1 Minute; Uins 300 V 500 V 800 V

Continuous 75 V 75 V 75 V

Failure Rate: FITobserved ≤ 0.1 x 10-9/h

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Notes

• The PART NUMBER shown above is to facilitate the unified part numbering system for ordering products

• Radial version (RB, UB) can not be qualified according to CECC so these can only be ordered with variant = 0

Notes

(1) Please refer to table PACKAGING for complete information

(2) Resistance values to be selected from E96 and E192 series, for other values please contact factory

(3) MBB/SMA 0207: Ohmic range 10 ≤ R < 22R for 0.25 % tolerance and 10 ≤ R < 43R for 0.1 % tolerance can not be qualified according to CECC

so these can only be ordered with variant = 0

• Resistance ranges printed in bold are preferred TCR/tolerance combinations with optimized availability

PART NUMBER AND PRODUCT DESCRIPTION - CECC APPROVED PRODUCTS

PART NUMBER: MBB0207VD1001BCT00

MODEL/SIZE VARIANT TCR/MATERIAL VALUE TOLERANCE PAC K AG I N G (1) SPECIAL

MBA0204 =

MBA/SMA 0204

MBB0207 =

MBB/SMA 0207

MBE0414 =

MBE/SMA 0414

V = CECC 06 E = ± 15 ppm/K

D = ± 25 ppm/K

3 digit value

1 digit multiplier

MULTIPLIER

8 = *10-2 2 = *102

9 = *10-1 3 = *103

0 = *100 4 = *104

1 = *101 5 = *105

B = ± 0.1 %

C = ± 0.25 %

00 = Standard

L0 = Welding joint

not lacquered for

MBB/SMA 0207

KL = Lacquered

welding joint for

MBA/SMA 0204

PRODUCT DESCRIPTION: MBB/SMA 0207-25 0.1 % CECC 06 CT 1K0

MBB/SMA 0207 - 25 0.1 % CECC 06 CT 1K0

MODEL/SIZE TCR TOLERANCE VARIANT PACKAGING (1) RESISTANCE

MBA/SMA 0204

MBB/SMA 0207

MBE/SMA 0414

± 15 ppm/K

± 25 ppm/K

± 0.1 %

± 0.25 %

CECC 06

CECC 06 L0

CECC 06 KL

1K0 = 1 kΩ

51R1 = 51.1 Ω

TEMPERATURE COEFFICIENT AND RESISTANCE RANGE - CECC APPROVED PRODUCTS

DESCRIPTION RESISTANCE VALUE (2)

TCR TOLERANCE MBA/SMA 0204 MBB/SMA 0207 (3) MBE/SMA 0414

± 25 ppm/K

± 0.25 % 22 Ω to 332 kΩ10 Ω to 1 MΩ22 Ω to 1.5 MΩ

± 0.1 % 43 Ω to 332 kΩ10 Ω to 1 MΩ43 Ω to 1 MΩ

± 15 ppm/K

± 0.25 % 22 Ω to 221 kΩ10 Ω to 1 MΩ22 Ω to 1 MΩ

± 0.1 % 43 Ω to 221 kΩ10 Ω to 1 MΩ43 Ω to 1 MΩ

B2 VD10BCT0BM 701000

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MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Precision

Vishay Beyschlag Precision Thin Film Leaded Resistors

DIMENSIONS

Note

(1) For 7.5 ≤ M < 10.0 mm, use version MBB/SMA 0207 ... L0 (welding joint not lacquered)

PACKAGING

MODEL

REEL BOX

PIECES CODE PIECES CODE

MBA/SMA 0204 5000 RP 1000

5000

MBB/SMA 0207 5000 RP 1000

5000

MBE/SMA 0207

Radial version (RB, UB) 4000 R4 4000 N4

MBE/SMA 0414 2500 R2 1000 C1

DIMENSIONS - Leaded resistor types, mass and relevant physical dimensions

TYPE Dmax.

(mm)

Lmax.

(mm)

dnom.

(mm)

Imin.

(mm)

Mmin.

(mm)

MASS

(mg)

MBA/SMA 0204 1.6 3.6 0.5 29.0 5.0 125

MBB/SMA 0207 2.5 6.3 0.6 28.0 10.0 (1) 220

MBE/SMA 0414 4.0 11.9 0.8 31.0 15.0 700

II M

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MBB/SMA 0207 WITH RADIAL TAPING

LEAD SPACING (UB = 2.5 mm), SIZE 0207

LEAD SPACING (RB = 5.0 mm), SIZE 0207

Notes

(1) Test over 10 holes - 9 intervals P0 12 x 9 = 114.3 ± 0.5

(2) Parallelism, < 0.5 mm

(3) Thickness of carrier tape: 0.55 mm ± 0.1

Δh

3 max.

1 max.

Δh1

Insulated

W0W1

Direction of Unreeling

DIMENSIONS in millimeters TOL.

Lead Ø d 0.6 -

Pitch of components P 12.7 ± 1.0

Pitch of sprocket holes (1) P012.7 ± 0.3

Distance between hole

center and lead center P15.1 ± 0.7

Distance between hole

center and resistor center P25.1 ± 0.7

Lead spacing F 2.5 + 0.6, - 0.1

Angle of insertion Δh 1.3 max. -

Angle of insertion Δh1 2 max. -

Width of carrier tape W 18.0 + 1, - 0.5

Width of adhesive tape W06.0 ± 0.5

Position of holes W19.0 + 0.75, - 0.5

Position of adhesive tape W20.5 + 0.5, - 0

Body to hole center (2) H18.0± 2, - 0

Hole Ø D04.0 + 0.2

Thickness of tape (3) t 0.9 max. -

Height for cutting L 11 max. -

Height for bending C 2.5 + 0, - 0.5

Height for insertion H132 max. -

Area “Z”

2 ± 0.5

1.0 + 0.4

16 ± 0.5

3 ± 1

1.5 ± 0.5

1 max.

Δh1

P2P

P1F

P0D0

H0W0

Insulated

3 max.

Δh

“Z”

Direction of Unreeling

DIMENSIONS in millimeters TOL.

Lead Ø d 0.6 -

Pitch of components P 12.7 ± 1.0

Tape pitch P012.7 ± 0.3

Distance between hole

center and lead center P13.85 ± 0.7

Distance between hole

center and resistor center P26.35 ± 0.7

Lead spacing F 5.0 + 0.6, - 0.1

Angle of insertion Δh 1.3 max. -

Angle of insertion Δh1 2 max. -

Width of carrier tape W 18.0 + 1, - 0.5

Width of adhesive tape W06.0 ± 0.5

Position of holes W19.0 + 0.75, - 0.5

Position of adhesive tape W20.5 + 0.5, - 0

Body to hole center (2) H 18.0 + 2, - 0

Lead crimp to hole

center (2) H016.0 ± 0.5

Hole Ø D04.0 ± 0.2

Thickness of tape (3) t 0.9 max. -

Height for cutting L 11 max. -

Height for bending C 2.5 + 0, - 0.5

Height for insertion H132 max. -

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76 Revision: 02-Mar-10

MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Precision

Vishay Beyschlag Precision Thin Film Leaded Resistors

DESCRIPTION

Production is strictly controlled and follows an extensive

set of instructions established for reproducibility. A

homogeneous film of metal alloy is deposited on a high grade

ceramic body and conditioned to achieve the desired

temperature coefficient. Plated steel termination caps are

firmly pressed on the metallized rods. A special laser is used

to achieve the target value by smoothly cutting a helical

groove in the resistive layer without damaging the ceramics.

A further conditioning is applied in order to stabilise the

trimming result. Connecting wires of electrolytic copper

plated with 100 pure tin are welded to the termination caps.

The resistors are covered by protective coating designed for

electrical, mechanical and climatic protection.The

terminations receive a final pure tin on nickel plating. Four or

five color code rings designate the resistance value and

tolerance in accordance with IEC 60062.

The result of the determined production is verified by an

extensive testing procedure performed on 100 of the

individual resistors. Only accepted products are stuck

directly on the adhesive tapes in accordance with

IEC 60286-1; IEC 60286-2.

ASSEMBLY

The resistors are suitable for processing on automatic

insertion equipment and cutting and bending machines.

Excellent solderability is proven, even after extended

storage. They are suitable for automatic soldering using

wave or dipping. The encapsulation is resistant to all

cleaning solvents commonly used in the electronics industry,

including alcohols, esters and aqueous solutions. The

suitability of conformal coatings, if applied, shall be qualified

by appropriate means to ensure the long-term stability of the

whole system. The resistors are completely lead (Pb)-free,

the pure tin plating provides compatibility with lead (Pb)-free

and lead-containing soldering processes. The immunity of

the plating against tin whisker growth has been proven under

extensive testing. All products comply with GADSL (2) and

the CEFIC-EECA-EICTA (3) list of legal restrictions on

hazardous substances. This includes full compliance with

the following directives:

•2000/53/EC End of Vehicle Life Directive (ELV) and

Annex II (ELVII)

•2002/95/EC Restriction of the use of Hazardous

Substances Directive (RoHS)

•2002/96/EC Waste Electrical and Electrical Equipment

Directive (WEEE)

APPROVALS

The resistors are approved within the IECQ-CECC Quality

Assessment System for Electronic Components to the detail

specification EN 140101-806 which refers to EN 60115-1

and EN 140100 and the variety of environmental test

procedures of the IEC 60068 series. Conformity is attested

by the use of the CECC logo ( ) as the Mark of Conformity

on the package label for CECC version.

Vishay BEYSCHLAG has achieved “Approval of

Manufacturer” in accordance with IEC QC 001002-3,

clause 2. The release certificate for “Technology Approval

Schedule” in accordance with CECC 240001 based on

IEC QC 001002-3, clause 6 is granted for the Vishay

BEYSCHLAG manufacturing process.

RELATED PRODUCTS

This product family of leaded thin film resistors for

professional applications is complemented by Zero Ohm

Jumpers.

For a corelated range of precision TCR and tolerance

specifications see the datasheet:

•“Professional Thin Film Leaded Resistors”, document no.

28766

For products approved to EN 140101-806, version E, with

established reliability and failure rate level E7 (Quality factor

πQ = 0.1), see the datasheet:

•“Established Reliability Thin Film Leaded Resistors”,

document no. 28768

Notes

(2) Global Automotive Declarable Substance List, see www.gadsl.org

(3) CEFIC (European Chemical Industry Council), EECA (European Electronic Component Manufacturers Association), EICTA (European

trade organisation representing the information and communications technology and consumer electronics), see

www.eicta.org/index.php?id=1053&id_article=340

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Precision Thin Film Leaded Resistors Vishay Beyschlag

FUNCTIONAL PERFORMANCE

0.5

Power Dissipation

Ambient Temperature

100 150

- 50

°C

MBE/SMA 0414

MBA/SMA 0204

MBB/SMA 0207

amb

Derating - Long Term Operation

Ambient Temperature

100 150

- 50

amb

0.1

0.2

Power Dissipation

MBE/SMA 0414

MBA/SMA 0204

MBB/SMA 0207

Derating - Precision Operation

0.2

00.1 0.3 0.4 0.5 0.6 0.7 0.8

MBE/SMA 0414

MBA/SMA 0204

MBB/SMA 0207

Load

Temperature Rise

Rise of the surface temperature.

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Vishay Beyschlag Precision Thin Film Leaded Resistors

TESTS AND REQUIREMENTS

Essentially all tests are carried out in accordance with the

following specifications:

EN 60115-1, Generic specification (includes tests)

EN 140100, Sectional specification (includes schedule for

qualification approval)

EN 140101-806 (successor of CECC 40101-806), Detail

specification (includes schedule for conformance inspection)

Most of the components are approved in accordance with the

European CECC-system, where applicable. The Test

Procedures and Requirements table contains only the most

important tests. For the full test schedule refer to the

documents listed above. The testing also covers most of the

requirements specified by EIA/IS-703 and JIS-C-5202.

The tests are carried out in accordance with IEC 60068-2-xx

test method and under standard atmospheric conditions in

accordance with IEC 60068-1, 5.3. Climatic category

LCT/UCT/56 (rated temperature range: Lower Category

Temperature, Upper Category Temperature; damp heat,

long term, 56 days) is valid.

Unless otherwise specified the following values apply:

Temperature: 15 °C to 35 °C

Relative humidity: 45 % to 75 %

Air pressure: 86 kPa to 106 kPa (860 mbar to 1060 mbar).

For testing the components are mounted on a test board in

accordance with IEC 60115-1, 4.31 unless otherwise

specified.

In the Test Procedures and Requirements table, only the

tests and requirements are listed with reference to the

relevant clauses of IEC 60115-1 and IEC 60068-2-xx test

methods. A short description of the test procedure is also

given.

0.01

0.1

100 Ω

µV/V

MBE/SMA 0414

MBA/SMA 0204

MBB/SMA 0207

1K 10K 100K 1M 10M

Resistance Value

Current Noise

Current Noise A1 in accordance with IEC 60195

TEST PROCEDURES AND REQUIREMENTS

IEC

60115-1

CLAUSE

IEC

60068-2-

TEST

METHOD

TEST PROCEDURE REQUIREMENTS

PERMISSIBLE CHANGE (ΔR max.)

Stability for product types: STABILITY

CLASS 0.05

STABILITY

CLASS 0.1

STABILITY

CLASS 0.25

MBA/SMA 0204 100 Ω to 100 kΩ43 Ω to < 100 Ω;

> 100 Ω to 221 kΩ22 Ω to 332 kΩ

MBB/SMA 0207 100 Ω to 270 kΩ43 Ω to < 100 Ω;

> 270 kΩ to 510 kΩ22 Ω to 1 MΩ

MBE/SMA 0414 100 Ω to 470 kΩ43 Ω to <100 Ω;

> 470 kΩ to 1 MΩ22 Ω to 1.5 MΩ

4.5 - Resistance - ± 0.25 %; ± 0.1 %

4.8 - Temperature

coefficient

At 20/LCT/20 °C and

20/UCT/20 °C± 25 ppm/K; ± 15 ppm/K

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4.25.1

Endurance

at 70 °C:

Precision

operation

mode

U= or

U = Umax.;

1.5 h ON; 0.5 h OFF

70 °C; 1000 h ± (0.05 % R + 0.01 Ω) (1) ± (0.1 % R + 0.01 Ω) ± (0.25 % R + 0.05 Ω) (2)

70 °C; 8000 h ± (0.1 % R+0.01Ω) ± (0.2 % R+ 0.01 Ω) ± (0.5 % R+0.05 Ω)

Endurance

at 70 °C:

Standard

operation

mode

U= or

U = Umax.;

1.5 h ON; 0.5 h OFF

70 °C; 1000 h ± (0.25 % R + 0.05 Ω) (2) --

70 °C; 8000 h ± (0.5 % R+0.05Ω)- -

4.24 78 (Cab) Damp heat,

steady state

(40 ± 2) °C;

56 days;

(93 ± 3) % RH

± (0.05 % R+0.01 Ω) ± (0.1 % R + 0.01 Ω) ± (0.25 % R+ 0.05 Ω)

4.23 Climatic

sequence:

4.23.2 2 (Ba) Dry heat 125 °C; 16 h

4.23.3 30 (Db) Damp heat,

cyclic

55 °C; 24 h;

90 % to 100 % RH;

1 cycle

4.23.4 1 (Aa) Cold - 55 °C; 2 h

4.23.5 13 (M) Low air

pressure

8.5kPa; 2h;

15 °C to 35 °C

4.23.6 30 (Db) Damp heat,

cyclic

55 °C; 5 days;

95 % to 100 % RH;

5 cycles

± (0.05 % R + 0.01 Ω)

no visible damage

± (0.1 % R + 0.01 Ω)

no visible damage

± (0.25 % R + 0.05 Ω)

no visible damage

4.13 −Short time

overload

Room temperature;

U= 2.5 x or

U = 2 x Umax.; 5 s

± (0.01 % R+0.01 Ω)

no visible damage

± (0.02 % R + 0.01 Ω)

no visible damage

± (0.05 % R + 0.01 Ω)

no visible damage

4.19 14 (Na)

Rapid

change of

temperature

30 min at LCT = - 55 °C

30 min at UCT = 125 °C

5cycles ± (0.01 % R+0.01 Ω)

no visible damage

± (0.02 % R + 0.01 Ω)

no visible damage

± (0.05 % R + 0.01 Ω)

no visible damage

MBA/SMA 0204: 500 cycles

MBB/SMA 0207: 200 cycles

MBE/SMA 0414: 100 cycles

± (0.25 % R+0.05 Ω)

no visible damage

± (0.25 % R + 0.05 Ω)

no visible damage

± (0.25 % R + 0.05 Ω)

no visible damage

TEST PROCEDURES AND REQUIREMENTS

IEC

60115-1

CLAUSE

IEC

60068-2-

TEST

METHOD

TEST PROCEDURE REQUIREMENTS

PERMISSIBLE CHANGE (ΔR max.)

Stability for product types: STABILITY

CLASS 0.05

STABILITY

CLASS 0.1

STABILITY

CLASS 0.25

MBA/SMA 0204 100 Ω to 100 kΩ43 Ω to < 100 Ω;

> 100 Ω to 221 kΩ22 Ω to 332 kΩ

MBB/SMA 0207 100 Ω to 270 kΩ43 Ω to < 100 Ω;

> 270 kΩ to 510 kΩ22 Ω to 1 MΩ

MBE/SMA 0414 100 Ω to 470 kΩ43 Ω to <100 Ω;

> 470 kΩ to 1 MΩ22 Ω to 1.5 MΩ

P70 x R

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MBA/SMA 0204, MBB/SMA 0207, MBE/SMA 0414 - Precision

Vishay Beyschlag Precision Thin Film Leaded Resistors

Notes

(1) ± (0.03 % R + 0.01 Ω) for MBB/SMA 0207

(2) ± (0.15 % R+ 0.05 Ω) for MBB/SMA 0207

4.29 45 (XA)

Component

solvent

resistance

Isopropyl alcohol

+ 23 °C; toothbrush method

Marking legible;

No visible damage

4.18.2 20 (Tb) Resistance to

soldering heat

Unmounted components;

(260 ± 3) °C;

(10 ± 1) s

± (0.01 % R+ 0.01 Ω)

no visible damage

± (0.02 % R+ 0.01 Ω)

no visible damage

± (0.05 % R+0.01 Ω)

no visible damage

4.17 20 (Ta) Solderability

+ 235 °C; 2 s

solder bath method;

SnPb40

Good tinning (≥ 95 % covered, no visible damage)

+ 245 °C; 3 s

solder bath method;

SnAg3Cu0.5

4.22 6 (B4) Vibration

6 h;

10 Hz to 2000 Hz

1.5 mm or 196 m/s2

± (0.01 % R+ 0.01 Ω) ± (0.02 % R + 0.01 Ω) ± (0.05 % R + 0.01 Ω)

4.16

21 (Ua1)

21 (Ub)

21 (Uc)

Robustness of

terminations Tensile, bending and torsion ± (0.01 % R+ 0.01 Ω) ± (0.02 % R + 0.01 Ω) ± (0.05 % R + 0.01 Ω)

4.7 - Voltage proof URMS = Uins; 60 s No flashover or breakdown

4.25.3 -

Endurance at

upper