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TM
Innovative Technology
for a Connected World
TflexTM 300 Series
Thermal Gap Filler
UNIQUE SILICONE GEL OFFERS COMPLIANCY, THERMAL RESISTANCE
Tex™ 300, at pressures of 50psi, will deect to over 50% the original thickness. This high
rate of compliancy allows the material to “totally blanket” the component, enhancing
thermal transfer. The material has a very low compression set enabling the pad to be reused
many times.
Tex™ 300, in achieving its stellar compliancy, does not sacrice thermal performance.
With a thermal conductivity of 1.2 W/mK, low thermal resistances can be achieved at low
pressures.
Tex™ 300-H is offered with a hard, metallized liner option for easy handling and improved
rework. The metallized liner’s lower coefcient of friction also allows for easy assembly of
parts that must slide together, such as a card into a chassis.
FEATURES AND BENEFITS
Extreme compliancy allows material to “totally blanket” component(s)
Thermal conductivity of 1.2 W/mK
• Available in thicknesses from 0.020” - 0.200” (.5mm – 5.0mm)
Low compression set enables the pad to be reused many times
APPLICATIONS
Notebook and desktop computers
Telecommunication hardware
Flat panel displays
Memory modules
Power conversion equipment
Set top box
• Lighting ballast
• Automotive electronics
• LED lighting
• Handheld electronics
• Optical disk drives
• Vibration dampening
Americas: +1.888.246.9050
Europe: +49.(0).8031.2460.0
Asia: +86.755.2714.1166
CLV-customerservice@lairdtech.com
www.lairdtech.com/thermal
Innovative Technology
for a Connected World
TflexTM 300 Series
Thermal Gap Filler
THR-DS-TFLEX-300 0612
Any information furnished by Laird Technologies, Inc. and its agents is believed to be accurate and reliable. All specications are subject to change without notice. Respon-
sibility for the use and application of Laird Technologies materials rests with the end user, since Laird Technologies and its agents cannot be aware of all potential uses.
Laird Technologies makes no warranties as to the tness, merchantability or suitability of any Laird Technologies materials or products for any specic or general uses. Laird
Technologies shall not be liable for incidental or consequential damages of any kind. All Laird Technologies products are sold pursuant to the Laird Technologies’ Terms and
Conditions of sale in effect from time to time, a copy of which will be furnished upon request. © Copyright 2011 Laird Technologies, Inc. All Rights Reserved. Laird, Laird
Technologies, the Laird Technologies Logo, and other marks are trade marks or registered trade marks of Laird Technologies, Inc. or an afliate company thereof. Other
product or service names may be the property of third parties. Nothing herein provides a license under any Laird Technologies or any third party intellectual property rights.
Document A15293-00 Rev F, 06/2012.
STANDARD THICKNESSES
0.020 to 0.200-inch (0.5 to 5.0mm)*
0.020 to 0.200-inch thick material available in 0.010-inch (0.25mm) increments
*Inquire about availability of material and options above 0.200-inches
** FG (fiberglass) is standard for thicknesses 0.020” (0.50mm) and 0.030” (0.76mm)
OPTIONS
PET dielectric “H liner available for applications where easy slide assembly is desirable
MATERIAL NAME AND THICKNESS
Tflex™ indicates elastomeric gap filler product line
3xxx indicates high recovery ‘3 series’ 1.2 W/mK material
-DC1 designates proprietary tack eliminated coating
-H indicates hard PET liner option
EXAMPLES
Tex™ 3120 = standard 0.120-inch thick Tex™ 300 material
Tex™ 3120DC1 = 0.120-inch thick material with DC1 coating
Tex™ 3120H = 0.120-inch thick material with hard PET liner
TFLEXTM 300 TEST METHOD
Construction Filled silicone
elastomer NA
Color Light green Visual
Thermal Conductivity 1.2 W/mK ASTM D5470
Hardness (Shore 00) 40
(at 3 second delay) ASTM D2240
Density 1.78 g/cc Helium
Pyncometer
Thickness Range 0.020" - .200"
(0.5 - 5.0mm)*
Thickness Tolerance ±10%
UL Flammability Rating 94 V0 UL
Temperature Range -40ºC to 160ºC NA
Volume Resistivity 10 ^13 ohm-cm ASTM D257
Outgassing TML 0.56% ASTM E595
Outgassing CVCM 0.10% ASTM E595
Coefcient Thermal
Expansion (CTE) 600 ppm/C IPC-TM-650
2.4.24
TFLEXTM 300 TYPICAL PROPERTIES
Pressure vs Deflection (AS TM D575)
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
010 20 30 40 50 60 70 80 90 100 110
Pressure psi
P ercent Deflection
320 330 340 360 380 3100
3150 3200
Pressure vs . thermal resis tance (AS TM
D5470)
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
010 20 30 40 50 60 70 80 90 100 110
Pressure psi
320 330 340 360 380 3100 3150 3200
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