Document Number: 60076 For technical questions, contact: thinfilm@vishay.com www.vishay.com
Revision: 02-May-11 79
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
High Power Thin Film Wraparound Chip Resistor
PHP
Vishay Dale Thin Film
PHP series chip resistors are designed with enlarged
backside terminations to reduce the thermal resistance
between the topside resistor layer and the solder joint on the
end users circuit board.
Actual power handling capability is limited by the end user
mounting process. As with any high power chip resistor the
ability to remove the generated heat is critical to the overall
performance of the device.
FEATURES
High purity ceramic substrate
Power rating to 2.5 W
Resistance range 10 to 30 k
Resistor tolerance to ± 0.1 %
TCR to ± 25 ppm/°C
Flame resistant UL 94 V-0
APPLICATIONS
Power supplies
Power switching
Braking system
Test and measurement equipment
Motor deflection circuits
TYPICAL PERFORMANCE
Note
(1) Dependent on component mounting by user
ABSOLUTE
TCR 25
TOL. 0.1
STANDARD ELECTRICAL SPECIFICATIONS
TEST SPECIFICATIONS CONDITIONS
Material Nichrome -
Resistance Range 10 to 30 k-
TCR: Absolute 25 ppm/°C, 50 ppm/°C (stdandard)
and, 100 ppm/°C - 55 °C to + 125 °C
Tolerance: Absolute 0.1 %, 0.5 %, 1.0 % and, 5.0 % + 25 °C
Power Rating: Resistor 1206: 1.0 W, 2512: 2.5 W (1) Maximum at + 70 °C
Stability: Absolute R 0.1 % 2000 h at + 70 °C
Stability: Ratio Not applicable -
Voltage Coefficient < 0.1 ppm/V -
Working Voltage 1206: 100 V, 2512: 200 V -
Operating Temperature Range - 55 °C to + 125 °C -
Storage Temperature Range - 55 °C to + 150 °C -
Noise < - 30 dB -
Shelf Life Stability: Absolute ± 0.01 % 1 year at + 25 °C
COMPONENT RATINGS
CASE SIZE POWER RATING (mW) WORKING VOLTAGE (V) RESISTANCE RANGE ()
1206 1000 (1) 100 10 to 30K
2512 2500 (1) 200 10 to 30K
ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 Requirements)
ENVIRONMENTAL TEST LIMITS MIL-PRF-55342
CHARACTERISTIC “E” TYPICAL VISHAY PERFORMANCE
Resistance Temperature Characteristic ± 25 ppm/°C ± 15 ppm/°C
Maximum Ambient Temperature at Rated Wattage + 70 °C + 70 °C
Maximum Ambient Temperature at Power Derating + 150 °C + 150 °C
Thermal Shock ± 0.1 % ± 0.04 %
Low Temperature Operation ± 0.1 % ± 0.001 %
Short Time Overload ± 0.1 % ± 0.003 %
High Temperature Exposure ± 0.1 % ± 0.030 %
Resistance to Soldering Heat ± 0.2 % ± 0.007 %
Moisture Resistance ± 0.2 % ± 0.002 %
Life at + 70 °C for 2000 h ± 0.5 % ± 0.100 %
www.vishay.com For technical questions, contact: thinfilm@vishay.com Document Number: 60076
80 Revision: 02-May-11
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PHP
Vishay Dale Thin Film High Power Thin Film Wraparound
Chip Resistor
Notes
Chip surface temperature measured using FLIR A40 thermal
imaging system with an approximate test card surface
temperature of 25 °C.
Thermal imaging was conducted under ambient conditions
resulting in a steady state test card surface temperature of 85 °C
over the full range of power levels.
Thermal imaging and load life testing was conducted mounting
one device to 2" x 3" test cards with 2.5 mil copper plating on
both surfaces. Thermal vias on 120 mil centers were utilized for
heat transfer between surfaces of the test card.
Notes
Chip surface temperature measured using FLIR A40 thermal
imaging system with an approximate test card surface
temperature of 25 °C.
DIMENSIONS in inches
CASE SIZE LENGTH WIDTH
W (± 0.005)
THICKNESS
MIN./MAX.
TOP PAD
D (± 0.005)
BOTTOM PAD
E (± 0.005)
1206 0.126 ± 0.008 0.063 0.015/0.033 0.020 + 0.005/- 0.010 0.040
2512 0.259 + 0.009/- 0.015 0.124 0.015/0.033 0.02 0.050
LAND PATTERN DIMENSIONS in inches
STANDARD MATERIAL SPECIFICATIONS
Resistive Element Nichrome
Substrate Material Alumina (Al2O3)
Terminations (Tin/Lead) Tin/lead solder over nickel barrier
Terminations (Lead (Pb)-free) Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier
D
W
T
L
E
PHP Land Pattern for 1206 Case Size PHP Land Pattern for 2512 Case Size
0.0710
0.0755
0.0220
0.1260
0.0910
0.1090
PHP CHIP TEMP. VS. APPLIED POWER
Chip Surface Temperature (°C)
70 200
0.00
0.50
1.00
1.50
2.00
5.00
Applied Power (W)
2.50
3.00
3.50
4.00
4.50
150
1206 - 100 Ω
1206 - 5 kΩ
1206 - 10 kΩ
PHP CHIP TEMP. VS. APPLIED POWER
Case Size 2512 2512 2512
Resistance
Value Up to 10 Up to 10 kUp to 30 k
Temperature Power (W)
70 2.44 1.81 1.87
150 6.82 4.89 5.19
200 9.33 6.63 7.09
Chip Surface Temperature (°C)
70 200
0.00
1.00
2.00
3.00
4.00
10.00
Applied Power (W)
5.00
6.00
7.00
8.00
9.00
150
2512 - 10 Ω
2512 - 10 kΩ
2512 - 30 kΩ
Document Number: 60076 For technical questions, contact: thinfilm@vishay.com www.vishay.com
Revision: 02-May-11 81
This document is subject to change without notice.
THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PHP
High Power Thin Film Wraparound
Chip Resistor Vishay Dale Thin Film
GLOBAL PART NUMBER INFORMATION
GLOBAL
MODEL SUBSTRATE CASE
SIZE TCR RESISTANCE TOLERANCE TERMINATION PACKAGING
PHP 0 = Alumina 1206
2512
E =
± 25 ppm/°C
H =
± 50 ppm/°C
K =
± 100 ppm/°C
The first 3 digits
are significant
figures and the
last digit
specifies the
number of
zeros to follow.
“R” designates
the decimal
point.
Example:
10R0 = 10
1000 = 100
1001 = 1 k
B = ± 0.1 %
D = ± 0.5 %
F = ± 1.0 %
G = ± 2.0 %
J = ± 5.0 %
B = Wraparound
Sn/Pb solder
w/nickel barrier
S = Wraparound
lead (Pb)-free solder
SAC-305
RoHS compliant - e1
BS = BULK
100 min., 1 mult
WS = WAFFLE
100 min., 1 mult
WI = WAFFLE
(item single lot
day code)
100 min., 1 mult
TAPE AND REEL
T1 = 1000 min.,
1000 mult
TF = Full reel
TS = 100 min., 1 mult
TI = 100 min., 1 mult
(item single lot
date code)
TP = 100 min., 1 mult
(package unit
single lot date)
06E1 02B01 BT10PP 2H
Document Number: 91000 www.vishay.com
Revision: 11-Mar-11 1
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