PHP Vishay Dale Thin Film High Power Thin Film Wraparound Chip Resistor FEATURES * * * * * * High purity ceramic substrate Power rating to 2.5 W Resistance range 10 to 30 k Resistor tolerance to 0.1 % TCR to 25 ppm/C Flame resistant UL 94 V-0 APPLICATIONS PHP series chip resistors are designed with enlarged backside terminations to reduce the thermal resistance between the topside resistor layer and the solder joint on the end users circuit board. Actual power handling capability is limited by the end user mounting process. As with any high power chip resistor the ability to remove the generated heat is critical to the overall performance of the device. * * * * * Power supplies Power switching Braking system Test and measurement equipment Motor deflection circuits TYPICAL PERFORMANCE ABSOLUTE TCR 25 TOL. 0.1 STANDARD ELECTRICAL SPECIFICATIONS TEST Material Resistance Range TCR: Absolute Tolerance: Absolute Power Rating: Resistor Stability: Absolute Stability: Ratio Voltage Coefficient Working Voltage Operating Temperature Range Storage Temperature Range Noise Shelf Life Stability: Absolute SPECIFICATIONS Nichrome 10 to 30 k 25 ppm/C, 50 ppm/C (stdandard) and, 100 ppm/C 0.1 %, 0.5 %, 1.0 % and, 5.0 % 1206: 1.0 W, 2512: 2.5 W (1) R 0.1 % Not applicable < 0.1 ppm/V 1206: 100 V, 2512: 200 V - 55 C to + 125 C - 55 C to + 150 C < - 30 dB 0.01 % CONDITIONS - 55 C to + 125 C + 25 C Maximum at + 70 C 2000 h at + 70 C 1 year at + 25 C COMPONENT RATINGS CASE SIZE POWER RATING (mW) 1206 1000 (1) 2512 2500 (1) Note (1) Dependent on component mounting by user WORKING VOLTAGE (V) 100 200 RESISTANCE RANGE () 10 to 30K 10 to 30K ENVIRONMENTAL TESTS (Vishay Performance vs. MIL-PRF-55342 Requirements) ENVIRONMENTAL TEST Resistance Temperature Characteristic Maximum Ambient Temperature at Rated Wattage Maximum Ambient Temperature at Power Derating Thermal Shock Low Temperature Operation Short Time Overload High Temperature Exposure Resistance to Soldering Heat Moisture Resistance Life at + 70 C for 2000 h Document Number: 60076 Revision: 02-May-11 LIMITS MIL-PRF-55342 CHARACTERISTIC "E" 25 ppm/C + 70 C + 150 C 0.1 % 0.1 % 0.1 % 0.1 % 0.2 % 0.2 % 0.5 % For technical questions, contact: thinfilm@vishay.com TYPICAL VISHAY PERFORMANCE 15 ppm/C + 70 C + 150 C 0.04 % 0.001 % 0.003 % 0.030 % 0.007 % 0.002 % 0.100 % www.vishay.com 79 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PHP High Power Thin Film Wraparound Chip Resistor Vishay Dale Thin Film DIMENSIONS in inches D W T E L CASE SIZE WIDTH W ( 0.005) LENGTH THICKNESS MIN./MAX. TOP PAD D ( 0.005) BOTTOM PAD E ( 0.005) 1206 0.126 0.008 0.063 0.015/0.033 0.020 + 0.005/- 0.010 0.040 2512 0.259 + 0.009/- 0.015 0.124 0.015/0.033 0.02 0.050 LAND PATTERN DIMENSIONS in inches PHP Land Pattern for 1206 Case Size PHP Land Pattern for 2512 Case Size 0.0710 0.1260 0.0755 0.0910 0.0220 0.1090 STANDARD MATERIAL SPECIFICATIONS Resistive Element Nichrome Substrate Material Alumina (Al2O3) Terminations (Tin/Lead) Tin/lead solder over nickel barrier Terminations (Lead (Pb)-free) Tin/silver/copper (Sn96.5Ag3.0Cu0.5) solder over nickel barrier 5.00 4.50 4.00 3.50 3.00 2.50 2.00 1.50 1.00 0.50 0.00 1206 - 100 1206 - 5 k 1206 - 10 k 70 PHP CHIP TEMP. VS. APPLIED POWER Applied Power (W) Applied Power (W) PHP CHIP TEMP. VS. APPLIED POWER 150 10.00 9.00 8.00 7.00 6.00 5.00 4.00 3.00 2.00 1.00 0.00 200 70 Chip Surface Temperature (C) Notes * Chip surface temperature measured using FLIR A40 thermal imaging system with an approximate test card surface temperature of 25 C. * Thermal imaging was conducted under ambient conditions resulting in a steady state test card surface temperature of 85 C over the full range of power levels. * Thermal imaging and load life testing was conducted mounting one device to 2" x 3" test cards with 2.5 mil copper plating on both surfaces. Thermal vias on 120 mil centers were utilized for heat transfer between surfaces of the test card. www.vishay.com 80 2512 - 10 2512 - 10 k 2512 - 30 k 150 200 Chip Surface Temperature (C) Notes * Chip surface temperature measured using FLIR A40 thermal imaging system with an approximate test card surface temperature of 25 C. Case Size Resistance Value Temperature 2512 2512 2512 Up to 10 Up to 10 k Up to 30 k Power (W) 70 2.44 1.81 1.87 150 6.82 4.89 5.19 200 9.33 6.63 7.09 For technical questions, contact: thinfilm@vishay.com Document Number: 60076 Revision: 02-May-11 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 PHP High Power Thin Film Wraparound Chip Resistor Vishay Dale Thin Film GLOBAL PART NUMBER INFORMATION P H P GLOBAL MODEL SUBSTRATE PHP 0 = Alumina 0 CASE SIZE 1206 2512 1 2 0 6 E 1 0 0 TCR RESISTANCE TOLERANCE TERMINATION E= 25 ppm/C H= 50 ppm/C K= 100 ppm/C The first 3 digits are significant figures and the last digit specifies the number of zeros to follow. "R" designates the decimal point. B = 0.1 % D = 0.5 % F = 1.0 % G = 2.0 % J = 5.0 % B = Wraparound Sn/Pb solder w/nickel barrier B S = Wraparound lead (Pb)-free solder SAC-305 RoHS compliant - e1 Example: 10R0 = 10 1000 = 100 1001 = 1 k Document Number: 60076 Revision: 02-May-11 2 For technical questions, contact: thinfilm@vishay.com B T 1 PACKAGING BS = BULK 100 min., 1 mult WS = WAFFLE 100 min., 1 mult WI = WAFFLE (item single lot day code) 100 min., 1 mult TAPE AND REEL T1 = 1000 min., 1000 mult TF = Full reel TS = 100 min., 1 mult TI = 100 min., 1 mult (item single lot date code) TP = 100 min., 1 mult (package unit single lot date) www.vishay.com 81 This document is subject to change without notice. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000 Legal Disclaimer Notice Vishay Disclaimer ALL PRODUCT, PRODUCT SPECIFICATIONS AND DATA ARE SUBJECT TO CHANGE WITHOUT NOTICE TO IMPROVE RELIABILITY, FUNCTION OR DESIGN OR OTHERWISE. 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Except as expressly indicated in writing, Vishay products are not designed for use in medical, life-saving, or life-sustaining applications or for any other application in which the failure of the Vishay product could result in personal injury or death. Customers using or selling Vishay products not expressly indicated for use in such applications do so at their own risk and agree to fully indemnify and hold Vishay and its distributors harmless from and against any and all claims, liabilities, expenses and damages arising or resulting in connection with such use or sale, including attorneys fees, even if such claim alleges that Vishay or its distributor was negligent regarding the design or manufacture of the part. Please contact authorized Vishay personnel to obtain written terms and conditions regarding products designed for such applications. No license, express or implied, by estoppel or otherwise, to any intellectual property rights is granted by this document or by any conduct of Vishay. Product names and markings noted herein may be trademarks of their respective owners. Document Number: 91000 Revision: 11-Mar-11 www.vishay.com 1