LITE-ON DCC
RELEASE
LITE-ON Technology Corp. / Optoelectronics
No.90,Chien 1 Road, Chung Ho, New Taipei City 23585, Taiwan, R.O.C.
Tel: 886-2-2222-6181 Fax: 886-2-2221-1948 / 886-2-2221-0660
http://www.liteon.com/opto
Photocoupler
Product Data Sheet
LTV-817
(M, S, S-TA, S-TA1, S-TP)
Series
Spec No.: DS70-2012-0050
Effective Date: 12/20/2014
Revision: C
BNS-OD-FC001/A4
BNS-OD-FC001/A4
BNS-OD-FC001/A4
BNS-OD-FC001/A4
1/12
Photocouplers
LTV-817 series
1. DESCRIPTION
1.1 Features
Current transfer ratio ( CTR : MIN. 50% at IF = 5mA, VCE = 5V )
High input-output isolation voltage ( Viso = 5,000Vrms )
Response time ( tr : TYP. 4s at VCE = 2V, IC = 2mA, RL = 100 )
Dual-in-line package :
LTV-817 : 1-channel type
Wide lead spacing package :
LTV-817M : 1-channel type
Surface mounting package :
LTV-817S : 1-channel type
Tape and reel packaging :
LTV-817S-TA : 1-channel type
LTV-817S-TA1 : 1-channel type
LTV-817S-TP : 1-channel type
Safety approval
UL 1577
VDE DIN EN60747-5-5 (VDE 0884-5)
CSA CA5A
CQC GB4943.1-2011/ GB8898-2011 (meet Altitude up to 5000m)
Nordic Safety ( FIMKO/NEMKO/SEMKO/DEMKO)
BSI Halogen Free
RoHS Compliance
All materials be used in device are followed EU RoHS directive (No.2002/95/EC).
ESD pass HBM 8000V/MM2000V
MSL class1
1.2 Applications
Hybrid substrates that require high density mounting.
Programmable controllers
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Photocouplers
LTV-817 series
2. PACKAGE DIMENSIONS
2.1 LTV-817 2.2 LTV-817M
2.3 LTV-817S
Notes :
1. Year date code.
2. 2-digit work week.
3. Factory identification mark shall be marked
(W: China-CZ, Y: Thailand)
4. Rank shall be or shall not be marked.
5. for halogen free option.
6. 4orV for VDE option.
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Photocouplers
LTV-817 series
3. TAPING DIMENSIONS
3.1 P/N : LTV-817S-TA1:
Description
Symbol
Dimension in mm (inch)
Tape wide
W
16±0.3 (0.63)
Pitch of sprocket holes
P0
0.1 (0.15)
Distance of compartment
F
7.5±0.1 (0.295)
P2
0.1 (0.079)
Distance of compartment to
compartment
P1
12±0.1 (0.472)
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Photocouplers
LTV-817 series
3.2 P/N : LTV-817S-TA:
3.3 P/N : LTV-817S-TP:
Description
Symbol
Dimension in mm (inch)
Tape wide
W
16±0.3 (0.63)
Pitch of sprocket holes
P0
0.1 (0.15)
Distance of compartment
F
7.5±0.1 (0.295)
P2
0.1 (0.079)
Distance of compartment to
compartment
P1
12±0.1 (0.472)
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Photocouplers
LTV-817 series
4. RATING AND CHARACTERISTICS
4.1 Absolute Maximum Ratings at Ta=2C
Parameter
Symbol
Rating
Unit
Input
Forward Current
IF
50
mA
Reverse Voltage
VR
6
V
Power Dissipation
P
70
mW
Output
Collector - Emitter Voltage
VCEO
35
V
Emitter - Collector Voltage
VECO
6
V
Collector Current
IC
50
mA
Collector Power Dissipation
PC
150
mW
Total Power Dissipation
Ptot
200
mW
1.
Isolation Voltage
Viso
5000
Vrms
Operating Temperature
Topr
-50 ~ +110
oC
Storage Temperature
Tstg
-55 ~ +125
oC
2.
Soldering Temperature
Tsol
260
oC
1. AC For 1 Minute, R.H. = 40 ~ 60%
Isolation voltage shall be measured using the following method.
(1) Short between anode and cathode on the primary side and between collector and emitter on the
secondary side.
(2) The isolation voltage tester with zero-cross circuit shall be used.
(3) The waveform of applied voltage shall be a sine wave.
2. For 10 Seconds
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Photocouplers
LTV-817 series
4.2 ELECTRICAL OPTICAL CHARACTERISTICS at Ta=25°C
Parameter
Symbol
Min.
Typ.
Max.
Unit
Test Condition
Input
Forward Voltage
VF
1.2
1.4
V
IF=20mA
Reverse Current
IR
10
A
VR=4V
Terminal Capacitance
Ct
30
250
pF
V=0, f=1KHz
Output
Collector Dark Current
ICEO
100
nA
VCE=20V, IF=0
Collector-Emitter
Breakdown Voltage
BVCEO
35
V
IC=0.1mA, IF=0
Emitter-Collector
Breakdown Voltage
BVECO
6
V
IE=10A, IF=0
TRANSFER
CHARACTERISTICS
Collector Current
IC
2.5
30
mA
IF=5mA
VCE=5V
1.
Current Transfer Ratio
CTR
50
600
%
Collector-Emitter
Saturation Voltage
VCE(sat)
0.1
0.2
V
IF=20mA
IC=1mA
Isolation Resistance
Riso
51010
11011
DC500V,
40 ~ 60% R.H.
40 ~ 60% R.H.
Floating Capacitance
Cf
0.6
1
pF
V=0, f=1MHz
Cut-off Frequency
fc
80
kHz
VCE=5V, IC=2mA
RL=100,-3dB
Response Time (Rise)
tr
4
18
s
VCE=2V,
IC=2mA
RL=100,
Response Time (Fall)
tf
3
18
s
1.
100%
I
I
CTR
F
C
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Photocouplers
LTV-817 series
5. RANK TABLE OF CURRENT TRANSFER RATIO CTR
CTR Rank
Min
Max
Condition
L
50
100
IF=5mA, VCE=5V, Ta=25oC
A
80
160
B
130
260
C
200
400
D
300
600
L or A or B or C or D
50
600
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Photocouplers
LTV-817 series
6. CHARACTERISTICS CURVES
Fig.1 Forword Current Fig.2 Collector Power Dissiption
vs. Ambient Temperature
Fig.4 Forward Current vs. Forward
Fig.5 Current Transfer Ratio vs.
Forward Current Fig.6 Collector Current vs.
Collector-emitter Voltage
F
FCE
F
F
0-30
Ta= 75 C
50 C 25 C
0 C
-25 C
V =5V
Ta= 25 C
CE Ta= 25 C
I = 30mA
Pc(MAX.)
5mA
F
10mA
20mA
vs. Ambient Temperatute
Collector-emitter voltage V (V)
Forward voltage V (V)
Ambient temperature Ta ( C)Ambient temperature Ta ( C)
Forward current I (mA)
Forward current I (mA)
Collector Power dissipation Pc (mW)
Forward current I (mA)
Current transfer ratio CTR (%)
Collector current Ic (mA)
Fig.3 Collector-emitter Saturation
Voltage vs. Forward Current
F
CE
Ic= 0.5mA
1mA
3mA
7mA
5mA
Ta= 25 C
Collecotr-emitter saturation voltage
V (sat) (V)
Forward current I (mA)
Voltage
o
o
o
O
o
o
oo
o
o
025 50 75 100 125 0-30 12525 50 75 100
10
20
30
40
50
60
0
50
100
150
200
0
1
0
015
1
2
3
4
5
6
0.5 1.0 1.5 2.0 2.5 3.0
2
5
10
20
50
100
200
500
01002 5 10 20 50
20
40
60
80
100
120
140
160
180
200
1 2 3 4 5 6 7 8 9
10
20
30
105
5
15
25
10
100
1000
0.1 1 10 100
CTR - Current Transfer Ratio - %
IF- Forward Current - mA
VCE = 5V
VCE = 0.4V
TA= 25oC
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Photocouplers
LTV-817 series
R = 10k
L1k 100
tr
tf
td
ts
Fig.8 Collector-emitter Saturation Voltage
Fig.9 Collector Dark Current vs.
Ambient Temperature Fig.10 Response Time vs. Load
Fig.11 Frequency Response
L
CEO
0-30
CE
V = 2V
Ic= 2mA
Ta= 25 C
CE
I = 5mA
V = 5V
CE
FF
Ic= 1mA
I = 20mA
CE
V = 2V
Ic= 2mA
Ta= 25 C
vs. Ambient Temperature
Ambient temperature Ta ( C)
Load resistance R (k )
Ambient temperature Ta ( C)
Ambient temperature Ta ( C)
Frequency f (kHz)
Response time ( s)
Relative current transfer ratio (%)
Collector dark current I (A)
Voltage gain Av (dB)
Collector-emitter saturation voltage
V (sat) (V)
-10
o
o
oo
o
025 50 75 100
50
100
150
-25
0 025 50 75 100
10 -25 0.2
0.050 25 50 75 100
10
10
10
10
10
10
-9
-8
-7
-6
-5
-11
0.1 0.2 0.5 1 2 5 10
0.5
1
2
5
10
20
50
100
200
500
0.5
20
10
0
210 100 500
Resistance
Fig.7 Relative Current Transfer Ratio
vs. Ambient Temperature
0.02
0.04
0.06
0.08
0.10
0.12
0.14
0.16
1 5 20 50
CE
V = 20V
125 125
125
Test Circuit for Frequency Response
Test Circuit for Response Time
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Photocouplers
LTV-817 series
7. TEMPERATURE PROFILE OF SOLDERING
7.1 IR Reflow soldering (JEDEC-STD-020C compliant)
One time soldering reflow is recommended within the condition of temperature and time profile shown below. Do not solder more than three
times.
Profile item
Conditions
Preheat
- Temperature Min (TSmin)
- Temperature Max (TSmax)
- Time (min to max) (ts)
150˚C
200˚C
90±30 sec
Soldering zone
- Temperature (TL)
- Time (tL)
217˚C
60 sec
Peak Temperature (TP)
260˚C
Ramp-up rate
3˚C / sec max.
Ramp-down rate
3~6˚C / sec
60 ~ 120 sec
25 C
150 C
200 C
260 C
217 C
60 sec
Time (sec)
Temperature ( C)
20 sec
Tsmax
ts (Preheat)
tL (Soldering)
Tsmin
TL
TP
Ramp-down
Ramp-up
35~70 sec
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Photocouplers
LTV-817 series
7.2 Wave soldering (JEDEC22A111 compliant)
One time soldering is recommended within the condition of temperature.
Temperature: 260+0/-5˚C
Time: 10 sec.
Preheat temperature:25 to 140˚C
Preheat time: 30 to 80 sec.
7.3 Hand soldering by soldering iron
Allow single lead soldering in every single process. One time soldering is recommended.
Temperature: 380+0/-5˚C
Time: 3 sec max.
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Photocouplers
LTV-817 series
8. RRECOMMENDED FOOT PRINT PATTERNS (MOUNT PAD)
Unit: mm
10. Notes:
LiteOn is continually improving the quality, reliability, function or design and LiteOn reserves the right to make changes
without further notices.
The products shown in this publication are designed for the general use in electronic applications such as office automation
equipment, communications devices, audio/visual equipment, electrical application and instrumentation.
For equipment/devices where high reliability or safety is required, such as space applications, nuclear power control
equipment, medical equipment, etc, please contact our sales representatives.
When requiring a device for any ”specific” application, please contact our sales in advice.
If there are any questions about the contents of this publication, please contact us at your convenience.
The contents described herein are subject to change without prior notice.
Immerge units body in solder paste is not recommended.