INTEGRATED CIRCUITS DIVISION
www.ixysic.com
DS-LAA110-R11 1
LAA110
Dual Single-Pole, Normally Open
OptoMOS® Relay
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Pb
Part # Description
LAA110 8-Pin DIP (50/Tube)
LAA110S 8-Pin Surface Mount (50/Tube)
LAA110STR 8-Pin Surface Mount (1,000/Reel)
LAA110P 8-Pin Flat Pack (50/Tube)
LAA110PTR 8-Pin Flat Pack (1,000/Reel)
Parameter Ratings Units
Blocking Voltage 350 VP
Load Current 120 mArms / mADC
On-Resistance (max) 35
Applications
Features
Description
Approvals
Ordering Information
Pin Configuration
Switching Characteristics of
Normally Open (Form A) Devices
• 3750Vrms Input/Output Isolation
• Low Drive Power Requirements
(TTL/CMOS Compatible)
• Arc-Free With No Snubbing Circuits
• FCC Compatible
• VDE Compatible
• No EMI/RFI Generation
• Machine Insertable, Wave Solderable
• Surface Mount Tape & Reel Packages Available
• Telecom Switching
• Tip/Ring Circuits
• Modem Switching (Laptop, Notebook, Pocket Size)
• Hook Switch
• Dial Pulsing
• Ground Start
• Ringing Injection
• Instrumentation
• Multiplexers
• Data Acquisition
• Electronic Switching
• I/O Subsystems
• Meters (Watt-Hour, Water, Gas)
• Medical Equipment-Patient/Equipment Isolation
• Security
• Aerospace
• Industrial Controls
LAA110 is a dual 1-Form-A Solid State Relay that
has two independently controlled, optically coupled
MOSFET switches. The output MOSFET switches and
photovoltaic die employ optically coupled MOSFET
technology to provide 3750 Vrms of input-to-output
isolation.
The relay outputs, that use patented OptoMOS
architecture, are controlled by a highly efficient
GaAlAS infrared LED.
This dual pole OptoMOS relay provides a more
compact design solution than discrete single-pole
relays in a variety of applications, and saves board
space by incorporating both switches in a single 8-Pin
package.
1
2
3
4
8
7
6
5
+ Control - Switch #1
– Control - Switch #1
+ Control - Switch #2
– Control - Switch #2
Load - Switch #1
Load - Switch #1
Load - Switch #2
Load - Switch #2
Form-A
IF
ILOAD
10%
90%
ton toff
• UL Certified Component: File E76270
• CSA Certified Component: Certificate 1175739
• EN/IEC 60950-1 Certified Component:
TUV Certificate B 10 05 49410 006
INTEGRATED CIRCUITS DIVISION
www.ixysic.com
2R11
LAA110
Absolute Maximum Ratings are stress ratings. Stresses in
excess of these ratings can cause permanent damage to
the device. Functional operation of the device at conditions
beyond those indicated in the operational sections of this
data sheet is not implied.
Parameter Conditions Symbol Min Typ Max Units
Output Characteristics
Load Current, Continuous 1-I
L- - 120 mArms / mADC
Peak Load Current t=10ms ILPK - - ±350 mAP
On-Resistance 2IL=120mA RON -2535
Off-State Leakage Current VL=350VPILEAK --1 A
Switching Speeds
Turn-On IF=5mA, VL=10V ton --3 ms
Turn-Off toff --3 ms
Output Capacitance VL=50V, f=1MHz COUT -25- pF
Input Characteristics
Input Control Current to Activate IL=120mA IF--5 mA
Input Control Current to Deactivate - - 0.4 0.7 - mA
Input Voltage Drop IF=5mA VF0.9 1.2 1.4 V
Reverse Input Current VR=5V IR--10 A
Common Characteristics
Input to Output Capacitance - CI/O -3- pF
1 If both poles operate the load current must be derated so as not to exceed the package power dissipation value.
2 Measurement taken within 1 second of on-time.
Parameter Ratings Units
Blocking Voltage 350 VP
Reverse Input Voltage 5 V
Input Control Current 50 mA
Peak (10ms) 1 A
Input Power Dissipation 1150 mW
Total Power Dissipation 2800 mW
Isolation Voltage, Input to Output 3750 Vrms
Operational Temperature -40 to +85 °C
Storage Temperature -40 to +125 °C
1 Derate linearly 1.33 mW / °C
2 Derate linearly 6.67 mW / °C
Absolute Maximum Ratings @ 25°C
Electrical Characteristics @ 25°C
INTEGRATED CIRCUITS DIVISION
LAA110
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R11
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
35
30
25
20
15
10
5
0
1.17 1.19 1.21 1.23 1.25
LED Forward Voltage Drop (V)
Device Count (N)
Typical LED Forward Voltage Drop
(N=50, IF=5mA)
0.56 0.74 0.92 1.10.65 0.83 1.01
Turn-On (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-On Time
(N=50, IF=5mA, IL=120mADC)
0.04 0.12 0.20 0.280.240.160.08
Turn-Off (ms)
Device Count (N)
25
20
15
10
5
0
Typical Turn-Off Time
(N=50, IF=5mA, IL=120mADC)
0.65 1.17 1.690.39 0.91 1.43 1.95
LED Current (mA)
Device Count (N)
25
20
15
10
5
0
Typical IF for Switch Operation
(N=50, IL=120mADC)
25
20
15
10
5
0
0.65 1.17 1.690.39 0.91 1.43 1.95
LED Current (mA)
Device Count (N)
Typical IF for Switch Dropout
(N=50, IL=120mADC)
35
30
25
20
15
10
5
0
On-Resistance (:)
Device Count (N)
22.9 23.3 23.7 24.1 24.5 24.9 25.3
Typical On-Resistance Distribution
(N=50, IL=120mADC)
35
30
25
20
15
10
5
0
420 430 440 450425 435 445
Blocking Voltage (VP)
Device Count (N)
Typical Blocking Voltage Distribution
(N=50)
LED Forward Voltage Drop (V)
Temperature (ºC)
1.8
1.6
1.4
1.2
1.0
0.8
-40 -20 0 20 40 60 80 120100
I
F
=50mA
I
F
=10mA
I
F
=5mA
Typical LED Forward Voltage Drop
vs. Temperature
LED Forward Current (mA)
Turn-On (ms)
05 1015202530354045
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
50
Typical Turn-On vs. LED Forward Current
(IL=50mADC)
LED Forward Current (mA)
Turn-Off (ms)
05 1015202530354045
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
50
Typical Turn-Off vs. LED Forward Current
(IL=50mADC)
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4R11
LAA110
*The Performance data shown in the graphs above is typical of device performance. For guaranteed parameters not indicated in the written specifications, please contact our application
department.
PERFORMANCE DATA @25ºC (Unless Otherwise Noted)*
On-Resistance (:)
-40
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
Single Pole
Dual Pole
IF=5mA
IF=10mA
IF=5mA
IF=10mA
Temperature (ºC)
Typical On-Resistance vs. Temperature
(IL=120mADC)
IF=5mA
IF=10mA
IF=20mA
Turn-On (ms)
-40
5.0
4.5
4.0
3.5
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Typical Turn-On vs. Temperature
(IL=50mADC)
Temperature (ºC)
Turn-Off (ms)
-40
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
-20 0 20 40 60 80 100 120
I
F
=5mA
Temperature (ºC)
Typical Turn-Off vs. Temperature
(IL=50mADC)
-40
70
60
50
40
30
20
10
0
-20 0 20 40 60 80 100
On-Resistance (:)
Typical On-Resistance vs. Temperature
(IL=50mADC Instantaneous, IF=5mA)
Temperature (ºC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical IF for Switch Operation
vs. Temperature
(IL=50mADC)
LED Current (mA)
-40
3.0
2.5
2.0
1.5
1.0
0.5
0
-20 0 20 40 60 80 100
Temperature (ºC)
Typical IF for Switch Dropout
vs. Temperature
(IL=50mADC)
Load Voltage (V)
Load Current (mA)
150
100
50
0
-50
-100
-150
-3 -2 -1 0 1 2 3
Typical Load Current vs. Load Voltage
(IF=5mA)
Blocking Voltage (VP)
Temperature (ºC)
-40
430
425
420
415
410
405
400
395
-20 0 20 40 60 80 100
Typical Blocking Voltage
vs. Temperature
435
Leakage (PA)
-40
0.016
0.014
0.012
0.010
0.008
0.006
0.004
0.002
0
-20 0 20 40 60 80 100
Typical Leakage vs. Temperature
Measured Across Pins 5&6 or 7&8
(VL=350V)
Temperature (ºC) Time
Load Current (A)
10Ps
1.0
0.9
0.8
0.7
0.6
0.5
0.4
0.3
0.2
0.1
0
1ms100Ps 100ms 1s
10ms 10s 100s
Energy Rating Curve
Load Current (mA)
180
160
140
120
100
80
60
40
20
0
Temperature (ºC)
-40 -20 0 20 40 60 80 120100
I
F
=10mA
I
F
=5mA
I
F
=10mA
I
F
=5mA
Single Pole
Dual Pole
Maximum Load Current
vs. Temperature
INTEGRATED CIRCUITS DIVISION
LAA110
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R11
Manufacturing Information
Moisture Sensitivity
All plastic encapsulated semiconductor packages are susceptible to moisture ingression. IXYS Integrated
Circuits Division classified all of its plastic encapsulated devices for moisture sensitivity according to
the latest version of the joint industry standard, IPC/JEDEC J-STD-020, in force at the time of product
evaluation. We test all of our products to the maximum conditions set forth in the standard, and guarantee proper
operation of our devices when handled according to the limitations and information in that standard as well as to any
limitations set forth in the information or standards referenced below.
Failure to adhere to the warnings or limitations as established by the listed specifications could result in reduced
product performance, reduction of operable life, and/or reduction of overall reliability.
This product carries a Moisture Sensitivity Level (MSL) rating as shown below, and should be handled according
to the requirements of the latest version of the joint industry standard IPC/JEDEC J-STD-033.
Device Moisture Sensitivity Level (MSL) Rating
LAA110 / LAA110S / LAA110P MSL 1
ESD Sensitivity
This product is ESD Sensitive, and should be handled according to the industry standard JESD-625.
Reflow Profile
This product has a maximum body temperature and time rating as shown below. All other guidelines of J-STD-020
must be observed.
Device Maximum Temperature x Time
LAA110 / LAA110S 250ºC for 30 seconds
LAA110P 260ºC for 30 seconds
Board Wash
IXYS Integrated Circuits Division recommends the use of no-clean flux formulations. However, board washing to
remove flux residue is acceptable. Since IXYS Integrated Circuits Division employs the use of silicone coating as
an optical waveguide in many of its optically isolated products, the use of a short drying bake could be necessary
if a wash is used after solder reflow processes. Chlorine- or Fluorine-based solvents or fluxes should not be used.
Cleaning methods that employ ultrasonic energy should not be used.
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INTEGRATED CIRCUITS DIVISION
www.ixysic.com
6R11
LAA110
MECHANICAL DIMENSIONS
LAA110
LAA110S
LAA110P
Dimensions
mm
(inches)
PCB Hole Pattern
2.540 ± 0.127
(0.100 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
9.144 ± 0.508
(0.360 ± 0.020)
0.457 ± 0.076
(0.018 ± 0.003)
9.652 ± 0.381
(0.380 ± 0.015)
7.239 TYP.
(0.285)
7.620 ± 0.254
(0.300 ± 0.010)
4.064 TYP
(0.160)
0.813 ± 0.102
(0.032 ± 0.004)
8-0.800 DIA.
(8-0.031 DIA.) 2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
7.620 ± 0.127
(0.300 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
0.254 ± 0.0127
(0.010 ± 0.0005)
Dimensions
mm
(inches)
PCB Land Pattern
9.398 ± 0.127
(0.370 ± 0.005)
6.350 ± 0.127
(0.250 ± 0.005)
2.540 ± 0.127
(0.100 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0 MIN / 0.102 MAX
(0 MIN / 0.004 MAX)
2.286 MAX.
(0.090 MAX.)
0.203 ± 0.013
(0.008 ± 0.0005)
0.635 ± 0.127
(0.025 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
0.457 ± 0.076
(0.018 ± 0.003)
2.159 ± 0.025
(0.085 ± 0.001)
2.54
(0.10)
8.70
(0.3425)
1.55
(0.0610)
0.65
(0.0255)
0.864 ± 0.120
(0.034 ± 0.004)
Pin 1
Dimensions
mm
(inches)
PCB Land Pattern
2.540 ± 0.127
(0.100 ± 0.005)
9.652 ± 0.381
(0.380 ± 0.015)
6.350 ± 0.127
(0.250 ± 0.005)
9.525 ± 0.254
(0.375 ± 0.010)
0.457 ± 0.076
(0.018 ± 0.003)
0.813 ± 0.102
(0.032 ± 0.004)
4.445 ± 0.127
(0.175 ± 0.005)
7.620 ± 0.254
(0.300 ± 0.010)
0.635 ± 0.127
(0.025 ± 0.005)
0.254 ± 0.0127
(0.010 ± 0.0005)
2.54
(0.10)
8.90
(0.3503)
1.65
(0.0649)
0.65
(0.0255)
3.302 ± 0.051
(0.130 ± 0.002)
Pin 1
INTEGRATED CIRCUITS DIVISION
For additional information please visit our website at: www.ixysic.com
7
LAA110
IXYS Integrated Circuits Division makes no representations or warranties with respect to the accuracy or completeness of the contents of this publication and reserves the right to make
changes to specifications and product descriptions at any time without notice. Neither circuit patent licenses nor indemnity are expressed or implied. Except as set forth in IXYS Integrated
Circuits Division’s Standard Terms and Conditions of Sale, IXYS Integrated Circuits Division assumes no liability whatsoever, and disclaims any express or implied warranty, relating to its
products including, but not limited to, the implied warranty of merchantability, fitness for a particular purpose, or infringement of any intellectual property right.
The products described in this document are not designed, intended, authorized or warranted for use as components in systems intended for surgical implant into the body, or in other
applications intended to support or sustain life, or where malfunction of IXYS Integrated Circuits Division’s product may result in direct physical harm, injury, or death to a person or severe
property or environmental damage. IXYS Integrated Circuits Division reserves the right to discontinue or make changes to its products at any time without notice.
Specification: DS-LAA110-R11
©Copyright 2012, IXYS Integrated Circuits Division
OptoMOS® is a registered trademark of IXYS Integrated Circuits Division
All rights reserved. Printed in USA.
12/19/2012
MECHANICAL DIMENSIONS
LAA110STR Tape & Reel
LAA110PTR Tape & Reel
Dimensions
mm
(inches)
User Direction of Feed
NOTES:
1. Dimensions carry tolerances of EIA Standard 481-2
2. Tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
K1
=4.20
(0.165)
0
K =4.90
(0.193)
P=12.00
(0.472)
W=16.00
(0.63)
Bo=10.30
(0.406)
Ao=10.30
(0.406)
Dimensions
mm
(inches)
NOTES:
1. All dimensions carry tolerances of EIA Standard 481-2
2. The tape complies with all “Notes” for constant dimensions listed on page 5 of EIA-481-2
Embossment
Embossed Carrier
Top Cover
Tape Thickness
0.102 MAX.
(0.004 MAX.)
330.2 DIA.
(13.00 DIA.)
User Direction of Feed
P = 12.00
(0.472)
W = 16.00
(0.63)
Bo = 10.30
(0.406)
Ao = 10.30
(0.406)
K1 = 2.00
(0.079)
K0 = 2.70
(0.106)
7.50
(0.295)
2.00
(0.079)
4.00
(0.157)
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Authorized Distributor
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