1
Data sheet acquired from Harris Semiconductor
SCHS188A
Features
• Buffered Inputs
• Common Three-State Output-Enable Control
• Three-State Outputs
• Bus Line Driving Capability
• Typical Propagation Delay = 13ns at VCC = 5V,
CL = 15pF, TA = 25oC (Clock to Output)
• Fanout (Over Temperature Range)
- Standard Outputs. . . . . . . . . . . . . . . 10 LSTTL Loads
- Bus Driver Outputs . . . . . . . . . . . . . 15 LSTTL Loads
• Wide Operating T emperature Range . . . -55oC to 125oC
• Balanced Propagation Delay and Transition Times
• Significant Power Reduction Compared to LSTTL
Logic ICs
• HC Types
- 2V to 6V Operation
- High Noise Immunity: NIL = 30%, NIH = 30% of VCC
at VCC = 5V
• HCT Types
- 4.5V to 5.5V Operation
- Direct LSTTL Input Logic Compatibility,
VIL= 0.8V (Max), VIH = 2V (Min)
- CMOS Input Compatibility, Il≤1µA at VOL, VOH
Description
The ’HC534, ’HCT534, ’HC564, and ’HCT564 are high speed
Octal D-Type Flip-Flops manufactured with silicon gate CMOS
technology. They possess the low power consumption of stan-
dard CMOS integrated circuits, as well as the ability to drive
15 LSTTL loads. Due to the large output drive capability and
the three-state feature, these devices are ideally suited for
interfacing with bus lines in a bus organized system. The two
types are functionally identical and differ only in their pinout
arrangements.
The ’HC534, ’HCT534, ’HC564, and ’HCT564 are positive
edge triggered flip-flops. Data at the D inputs, meeting the
setup and hold time requirements, are inverted and trans-
ferred to the Q outputs on the positive going transition of the
CLOCK input. When a high logic level is applied to the OUT-
PUT ENABLE input, all outputs go to a high impedance state,
regardless of what signals are present at the other inputs and
the state of the storage elements.
The HCT logic family is speed, function, and pin compatible
with the standard LS logic family.
Ordering Information
PART NUMBER TEMP. RANGE
(oC) PACKAGE
CD54HC534F3A -55 to 125 20 Ld CERDIP
CD74HC534E -55 to 125 20 Ld PDIP
CD54HCT534F3A -55 to 125 20 Ld CERDIP
CD74HCT534E -55 to 125 20 Ld PDIP
CD54HC564F3A -55 to 125 20 Ld CERDIP
CD74HC564E -55 to 125 20 Ld PDIP
CD74HC564M -55 to 125 20 Ld SOIC
CD54HCT564F3A -55 to 125 20 Ld CERDIP
CD74HCT564E -55 to 125 20 Ld PDIP
CD74HCT564M -55 to 125 20 Ld SOIC
NOTES:
1. When ordering, use the entire part number. Add the suffix 96 to
obtain the variant in the tape and reel.
2. Wafer and die for this part number is available which meets all
electrical specifications. Please contact your local TI sales office
or customer service for ordering information.
January 1998 - Revised May 2000
CAUTION: These devices are sensitive to electrostatic discharge. Users should follow proper IC Handling Procedures.
Copyright © 2000, Texas Instruments Incorporated
CD54/74HC534, CD54/74HCT534,
CD54/74HC564, CD54/74HCT564
High Speed CMOS Logic Octal D-Type Flip-Flop,
Three-State Inverting Positive-Edge Triggered
[ /Title
(CD74
HC534
,
CD74
HCT53
4,
CD74
HC564
,
CD74
HCT56
2
Functional Diagram
Pinouts
CD54HC534, CD54HCT534
(CERDIP)
CD74HC534, CD74HCT534
(PDIP)
TOP VIEW
CD54HC564, CD54HCT564
(CERDIP)
CD74HC564, CD74HCT564
(PDIP, SOIC)
TOP VIEW
TRUTH TABLE
INPUTS OUTPUT
OE CP Dn Qn
L↑HL
L↑LH
L L X No Change
HXXZ
NOTE:
H = High Level (Steady State)
L = Low Level (Steady State)
X = Don’t Care
↑= Transition from Low to High Level
Z = High Impedance State
11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
OE
Q0
D0
D1
Q1
Q2
D3
D2
Q3
GND
VCC
D7
D6
Q6
Q7
Q5
D5
D4
Q4
CP 11
12
13
14
15
16
17
18
20
19
10
9
8
7
6
5
4
3
2
1
OE
D0
D1
D2
D3
D4
D6
D5
D7
GND
VCC
Q1
Q2
Q3
Q0
Q4
Q5
Q6
Q7
CP
Q0
D0
CP
OE
Q1
D1
Q2
D2
Q3
D3
Q4
D4
Q5
D5
Q6
D6
O7
D7
DQDQDQDQDQDQDQDQ
CP CP CP CP CP CP CP CP
CD54/74HC534, CD54/74HCT534, CD54/74HC564, CD54/74HCT564
3
Absolute Maximum Ratings Thermal Information
DC Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to 7V
DC Input Diode Current, IIK
For VI < -0.5V or VI > VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . .±20mA
DC Output Diode Current, IOK
For VO < -0.5V or VO > VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±20mA
DC Drain Current, per Output, IO
For -0.5V < VO < VCC + 0.5V. . . . . . . . . . . . . . . . . . . . . . . . . .±35mA
DC Output Source or Sink Current per Output Pin, IO
For VO > -0.5V or VO < VCC + 0.5V . . . . . . . . . . . . . . . . . . . .±25mA
DC VCC or Ground Current, ICC . . . . . . . . . . . . . . . . . . . . . . . . .±50mA
Operating Conditions
Temperature Range, TA . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Supply Voltage Range, VCC
HC Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2V to 6V
HCT Types . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .4.5V to 5.5V
DC Input or Output Voltage, VI, VO . . . . . . . . . . . . . . . . . 0V to VCC
Input Rise and Fall Time
2V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1000ns (Max)
4.5V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 500ns (Max)
6V . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 400ns (Max)
Thermal Resistance (Typical, Note 3) θJA (oC/W)
PDIP Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 125
SOIC Package. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 120
Maximum Junction Temperature. . . . . . . . . . . . . . . . . . . . . . . 150oC
Maximum Storage Temperature Range . . . . . . . . . .-65oC to 150oC
Maximum Lead Temperature (Soldering 10s). . . . . . . . . . . . .300oC
(SOIC - Lead Tips Only)
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation
of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
3. θJA is measured with the component mounted on an evaluation PC board in free air.
DC Electrical Specifications
PARAMETER SYMBOL
TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
HC TYPES
High Level Input
Voltage VIH - - 2 1.5 - - 1.5 - 1.5 - V
4.5 3.15 - - 3.15 - 3.15 - V
6 4.2 - - 4.2 - 4.2 - V
Low Level Input
Voltage VIL - - 2 - - 0.5 - 0.5 - 0.5 V
4.5 - - 1.35 - 1.35 - 1.35 V
6 - - 1.8 - 1.8 - 1.8 V
High Level Output
Voltage
CMOS Loads
VOH VIH or VIL -0.02 2 1.9 - - 1.9 - 1.9 - V
-0.02 4.5 4.4 - - 4.4 - 4.4 - V
-0.02 6 5.9 - - 5.9 - 5.9 - V
High Level Output
Voltage
TTL Loads
- - ---- - - - V
-6 4.5 3.98 - - 3.84 - 3.7 - V
-7.8 6 5.48 - - 5.34 - 5.2 - V
Low Level Output
Voltage
CMOS Loads
VOL VIH or VIL 0.02 2 - - 0.1 - 0.1 - 0.1 V
0.02 4.5 - - 0.1 - 0.1 - 0.1 V
0.02 6 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage
TTL Loads
- - ---- - - - V
6 4.5 - - 0.26 - 0.33 - 0.4 V
7.8 6 - - 0.26 - 0.33 - 0.4 V
Input Leakage
Current IIVCC or
GND -6--±0.1 - ±1-±1µA
CD54/74HC534, CD54/74HCT534, CD54/74HC564, CD54/74HCT564
4
Quiescent Device
Current ICC VCC or
GND 0 6 - - 8 - 80 - 160 µA
Three-StateLeakage
Current VIL or VIH VO=VCC
or GND -6--±0.5 - ±5.0 - ±10 µA
HCT TYPES
High Level Input
Voltage VIH - - 4.5 to
5.5 2--2 - 2 - V
Low Level Input
Voltage VIL - - 4.5 to
5.5 - - 0.8 - 0.8 - 0.8 V
High Level Output
Voltage
CMOS Loads
VOH VIH or VIL -0.02 4.5 4.4 - - 4.4 - 4.4 - V
High Level Output
Voltage
TTL Loads
-6 4.5 3.98 - - 3.84 - 3.7 - V
Low Level Output
Voltage
CMOS Loads
VOL VIH or VIL 0.02 4.5 - - 0.1 - 0.1 - 0.1 V
Low Level Output
Voltage
TTL Loads
6 4.5 - - 0.26 - 0.33 - 0.4 V
Input Leakage
Current IIVCC and
GND 0 5.5 - ±0.1 - ±1-±1µA
Quiescent Device
Current ICC VCC or
GND 0 5.5 - - 8 - 80 - 160 µA
Three-StateLeakage
Current VIL or VIH VO=VCC
or GND - 5.5 - - ±0.5 - ±5.0 - ±10 µA
Additional Quiescent
Device Current Per
Input Pin: 1 Unit Load
∆ICC VCC
-2.1 - 4.5 to
5.5 - 100 360 - 450 - 490 µA
NOTE: For dual-supply systems theoretical worst case (VI = 2.4V, VCC = 5.5V) specification is 1.8mA.
DC Electrical Specifications (Continued)
PARAMETER SYMBOL
TEST
CONDITIONS VCC
(V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSVI(V) IO(mA) MIN TYP MAX MIN MAX MIN MAX
HCT Input Loading Table
INPUT UNIT LOADS
D0 - D7 0.15
CP 0.30
OE 0.55
NOTE: Unit load is ∆ICC limit specific in DC Electrical Specifications
Table, e.g., 360µA max. at 25oC.
CD54/74HC534, CD54/74HCT534, CD54/74HC564, CD54/74HCT564
5
Prerequisite for Switching Specifications
PARAMETER SYMBOL VCC (V)
25oC -40oC TO 85oC -55oC TO 125oC
UNITSMIN TYP MAX MIN TYP MAX MIN TYP MAX
HC TYPES
Maximum Clock
Frequency fMAX 2 6 - - 5 - - 4 - - MHz
4.5 30 - - 25 - - 20 - - MHz
6 35 - - 29 - - 23 - - MHz
Clock Pulse Width tW2 80 - - 100 - - 120 - - ns
4.5 16 - - 20 - - 24 - - ns
614--17- -20--ns
Setup Time
Data to Clock tSU 260--75- -90--ns
4.5 12 - - 15 - - 18 - - ns
610--13- -15--ns
Hold Time
Data to Clock tH25--5--5--ns
4.5 5 - - 5 - - 5 - - ns
65--5--5--ns
HCT TYPES
Maximum Clock
Frequency fMAX 4.5 25 - - 20 - - 16 - - MHz
Clock Pulse Width tW4.5 20 - - 25 - - 30 - - ns
Setup Time
Data to Clock tSU 4.5 20 - - 25 - - 30 - - ns
Hold Time
Data to Clock (534) tH4.5 5 - - 5 - - 5 - - ns
Hold Time
Data to Clock (564) tH4.5 3 - - 3 - - 3 - - ns
Switching Specifications CL = 50pF, Input tr, tf= 6ns
PARAMETER SYMBOL TEST
CONDITIONS VCC (V)
25oC-40oC TO
85oC-55oC TO
125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
HC TYPES
Propagation Delay tPLH, tPHL CL = 50pF
Clock to Output 2 - - 165 - 205 - 250 ns
4.5 - - 33 - 41 - 50 ns
CL = 15pF 5 - 13 - - - - - ns
CL = 50pF 6 - - 28 - 35 - 43 ns
Output Disable to Q (534) tPLZ,t
PHZ CL = 50pF 2 - - 150 - 190 - 225 ns
4.5 - - 30 - 38 - 45 ns
CL = 15pF 5 - 12 - - - - - ns
CL = 50pF 6 - - 26 - 33 - 38 ns
CD54/74HC534, CD54/74HCT534, CD54/74HC564, CD54/74HCT564
6
Output Disable to Q (564) tPLZ,t
PHZ CL = 50pF 2 - - 135 - 170 - 205 ns
4.5 - - 27 - 34 - 41 ns
CL = 15pF 5 - 12 - - - - - ns
CL = 50pF 6 - - 23 - 29 - 35 ns
Output Enable to Q tPZL,t
PZH CL = 50pF 2 - - 150 - 190 - 225 ns
4.5 - - 30 - 38 - 45 ns
CL = 15pF 5 - 12 - - - - - ns
CL = 50pF 6 - - 26 - 33 - 38 ns
Maximum Clock Frequency fMAX CL = 15pF 5 - 60 - - - - - MHz
Output Transition Time tTHL, tTLH CL = 50pF 2 - - 60 - 75 - 90 ns
4.5 - - 12 - 15 - 18 ns
6 - - 10 - 13 - 15 ns
Input Capacitance CICL = 50pF - 10 - 10 - 10 - 10 pF
Three-State Output
Capacitance CO- - 20 - 20 - 20 - 20 pF
Power Dissipation Capacitance
(Notes 4, 5) CPD -5-32-----pF
HCT TYPES
Propagation Delay tPHL, tPLH
Clock to Output CL = 50pF 4.5 - - 35 - 44 - 53 ns
CL = 15pF 5 - 14 - - - - - ns
Output Disable to Q tPLZ,t
PHZ CL = 50pF 4.5 - - 30 - 38 - 45 ns
CL = 15pF 5 - 12 - - - - - ns
Output Enable to Q tPZL,t
PZH CL = 50pF 4.5 - - 35 - 44 - 53 ns
CL = 15pF 5 - 14 - - - - - ns
Maximum Clock Frequency fMAX CL = 15pF 5 - 50 - - - - - MHz
Output Transition Time tTLH, tTHL CL = 50pF 4.5 - - 12 - 15 - 18 ns
Input Capacitance CICL = 50pF - 10 - 10 - 10 - 10 pF
Three-State Output
Capacitance CO- - 20 - 20 - 20 - 20 pF
Power Dissipation Capacitance
(Notes 4, 5) CPD -5-36-----pF
NOTES:
4. CPD is used to determine the dynamic power consumption, per package.
5. PD=C
PD VCC2fi+∑CLVCC2fOwhere fi= Input Frequency, fO= Output Frequency, CL= Output Load Capacitance, VCC = Supply
Voltage.
Switching Specifications CL = 50pF, Input tr, tf= 6ns (Continued)
PARAMETER SYMBOL TEST
CONDITIONS VCC (V)
25oC-40oC TO
85oC-55oC TO
125oC
UNITSMIN TYP MAX MIN MAX MIN MAX
CD54/74HC534, CD54/74HCT534, CD54/74HC564, CD54/74HCT564
7
Test Circuits and Waveforms
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 1. HC CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
NOTE: Outputs should be switching from 10% VCC to 90% VCC in
accordance with device truth table. For fMAX, input duty cycle = 50%.
FIGURE 2. HCT CLOCK PULSE RISE AND FALL TIMES AND
PULSE WIDTH
FIGURE 3. HC TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC FIGURE 4. HCT TRANSITION TIMES AND PROPAGATION
DELAY TIMES, COMBINATION LOGIC
FIGURE 5. HC SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
FIGURE 6. HCT SETUP TIMES, HOLD TIMES, REMOVAL TIME,
AND PROPAGATION DELAY TIMES FOR EDGE
TRIGGERED SEQUENTIAL LOGIC CIRCUITS
CLOCK 90% 50%
10% GND
VCC
trCLtfCL
50% 50%
tWL tWH
10%
tWL + tWH =fCL
I
CLOCK 2.7V 1.3V
0.3V GND
3V
trCL= 6ns tfCL= 6ns
1.3V 1.3V
tWL tWH
0.3V
tWL + tWH =fCL
I
tPHL tPLH
tTHL tTLH
90%
50%
10%
50%
10%
INVERTING
OUTPUT
INPUT
GND
VCC
tr = 6ns tf = 6ns
90%
tPHL tPLH
tTHL tTLH
2.7V
1.3V
0.3V
1.3V
10%
INVERTING
OUTPUT
INPUT
GND
3V
tr = 6ns tf = 6ns
90%
trCLtfCL
GND
VCC
GND
VCC
50%
90%
10%
GND
CLOCK
INPUT
DATA
INPUT
OUTPUT
SET, RESET
OR PRESET
VCC 50%
50%
90%
10%
50%
90%
tREM
tPLH
tSU(H)
tTLH tTHL
tH(L)
tPHL
IC CL
50pF
tSU(L)
tH(H)
trCLtfCL
GND
3V
GND
3V
1.3V
2.7V
0.3V
GND
CLOCK
INPUT
DATA
INPUT
OUTPUT
SET, RESET
OR PRESET
3V 1.3V
1.3V
1.3V
90%
10%
1.3V
90%
tREM
tPLH
tSU(H)
tTLH tTHL
tH(L)
tPHL
IC CL
50pF
tSU(L)
1.3V
tH(H)
1.3V
CD54/74HC534, CD54/74HCT534, CD54/74HC564, CD54/74HCT564
8
FIGURE 7. HC THREE-STATE PROPAGATION DELAY
WAVEFORM FIGURE 8. HCT THREE-STATE PROPAGATION DELAY
WAVEFORM
NOTE: Open drain waveforms tPLZ and tPZL are the same as those for three-state shown on the left. The test circuit is Output RL=1kΩto
VCC, CL = 50pF. FIGURE 9. HC AND HCT THREE-STATE PROPAGATION DELAY TEST CIRCUIT
Test Circuits and Waveforms
(Continued)
50% 10%
90%
GND
VCC
10%
90% 50%
50%
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
OUTPUTS
ENABLED OUTPUTS
DISABLED OUTPUTS
ENABLED
6ns 6ns
tPZH
tPHZ
tPZL
tPLZ
0.3
2.7
GND
3V
10%
90%
1.3V
1.3V
OUTPUT
DISABLE
OUTPUT LOW
TO OFF
OUTPUT HIGH
TO OFF
OUTPUTS
ENABLED OUTPUTS
DISABLED OUTPUTS
ENABLED
tr6ns
tPZH
tPHZ
tPZL
tPLZ
6ns tf
1.3
IC WITH
THREE-
STATE
OUTPUT
OTHER
INPUTS
TIED HIGH
OR LOW
OUTPUT
DISABLE
VCC FOR tPLZ AND tPZL
GND FOR tPHZ AND tPZH
OUTPUT
RL = 1kΩ
CL
50pF
CD54/74HC534, CD54/74HCT534, CD54/74HC564, CD54/74HCT564
IMPORTANT NOTICE
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any product or service without notice, and advise customers to obtain the latest version of relevant information
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pertaining to warranty, patent infringement, and limitation of liability.
TI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with TI’s standard warranty. Testing and other quality control techniques are utilized to the extent
TI deems necessary to support this warranty . Specific testing of all parameters of each device is not necessarily
performed, except those mandated by government requirements.
Customers are responsible for their applications using TI components.
In order to minimize risks associated with the customer’s applications, adequate design and operating
safeguards must be provided by the customer to minimize inherent or procedural hazards.
TI assumes no liability for applications assistance or customer product design. TI does not warrant or represent
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Copyright 2000, Texas Instruments Incorporated
