REVISIONS LTR DESCRIPTION DATE (YR-MO-DA) APPROVED A Changes in accordance with NOR 5962-R106-92. 92-01-09 M. A. FRYE B Add RHA requirements. Add device type 02. Add case outlines E and F. Update boilerplate. - rrp 98-10-09 R. MONNIN C Make changes to 1.5, RHA designators in table I, and table IIA. - rrp 99-07-30 R. MONNIN D Make change to full range current test as specified in table I. Add new footnote to 1.5 and table I. - ro 00-12-22 R. MONNIN E Make correction to the tPLH and tPHL tests conditions column as specified under Table I. Make correction to figure 2. Delete 4.4.4.1.1, Accelerated aging test. - ro 06-06-19 R. MONNIN THE ORIGINAL FIRST PAGE OF THIS DRAWING HAS BEEN REPLACED. REV SHEET REV SHEET REV STATUS REV E E E E E E E E E E E E E OF SHEETS SHEET 1 2 3 4 5 6 7 8 9 10 11 12 13 PMIC N/A PREPARED BY RICK C. OFFICER STANDARD MICROCIRCUIT DRAWING THIS DRAWING IS AVAILABLE FOR USE BY ALL DEPARTMENTS AND AGENCIES OF THE DEPARTMENT OF DEFENSE AMSC N/A DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 http://www.dscc.dla.mil CHECKED BY CHARLES E. BESORE APPROVED BY MICHAEL A. FRYE DRAWING APPROVAL DATE 90-09-07 REVISION LEVEL E MICROCIRCUIT, LINEAR, RADIATION HARDENED, 8-BIT, HIGH SPEED, MULTIPLYING D/A CONVERTER, MONOLITHIC SILICON SIZE CAGE CODE A 67268 SHEET DSCC FORM 2233 APR 97 1 OF 5962-89932 13 5962-E465-06 1. SCOPE 1.1 Scope. This drawing documents two product assurance class levels consisting of high reliability (device classes Q and M) and space application (device class V). A choice of case outlines and lead finishes are available and are reflected in the Part or Identifying Number (PIN). When available, a choice of Radiation Hardness Assurance (RHA) levels is reflected in the PIN. 1.2 PIN. The PIN is as shown in the following examples. For device classes M and Q: 5962 - Federal stock class designator \ RHA designator (see 1.2.1) 89932 01 2 A Device type (see 1.2.2) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number For device class V: 5962 R Federal stock class designator \ RHA designator (see 1.2.1) 89932 01 V 2 A Device type (see 1.2.2) Device class designator (see 1.2.3) Case outline (see 1.2.4) Lead finish (see 1.2.5) / \/ Drawing number 1.2.1 RHA designator. Device classes Q and V RHA marked devices meet the MIL-PRF-38535 specified RHA levels and are marked with the appropriate RHA designator. Device class M RHA marked devices meet the MIL-PRF-38535, appendix A specified RHA levels and are marked with the appropriate RHA designator. A dash (-) indicates a non-RHA device. 1.2.2 Device type(s). The device type(s) identify the circuit function as follows: Device type Generic number 01 02 Circuit function DAC08 DAC08A 8-bit, high-speed, multiplying D/A converter 8-bit, high-speed, multiplying D/A converter 1.2.3 Device class designator. The device class designator is a single letter identifying the product assurance level as listed below. Since the device class designator has been added after the original issuance of this drawing, device classes M and Q designators will not be included in the PIN and will not be marked on the device. Device class M Q or V Device requirements documentation Vendor self-certification to the requirements for MIL-STD-883 compliant, nonJAN class level B microcircuits in accordance with MIL-PRF-38535, appendix A Certification and qualification to MIL-PRF-38535 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89932 A REVISION LEVEL E SHEET 2 1.2.4 Case outlines. The case outlines are as designated in MIL-STD-1835 and as follows: Outline letter E F 2 Descriptive designator GDIP1-T16 or CDIP2-T16 GDFP2-F16 or CDFP3-F16 CQCC1-N20 Terminals 16 16 20 Package style Dual-in-line Flat pack Square leadless chip carrier 1.2.5 Lead finish. The lead finish is as specified in MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. 1.3 Absolute maximum ratings. 1/ Supply voltage (V+ to V-) ........................................................................................... Logic inputs ............................................................................................................... Logic control voltage (VLC) ........................................................................................ Analog current outputs (at V- = 15 V) ........................................................................ Reference input (VREF+ to VREF-) ............................................................................. 36 V dc V- to (V- plus 36 V dc) V- to V+ 4.25 mA V- to V+ Reference input differential voltage (VREF+ to VREF-) ............................................... 18 V dc Reference input current (IVREF+) .............................................................................. 5.0 mA Power dissipation (PD): Cases E, F, and 2 .................................................................................................. Maximum junction temperature (TJ) .......................................................................... Lead temperature (soldering, 60 seconds) ................................................................ Storage temperature .................................................................................................. Thermal resistance, junction-to-case (JC) ................................................................ 500 mW +150C +300C -65C to +125C See MIL-STD-1835 Thermal resistance, junction-to-ambient (JA): Case E ................................................................................................................... 91C/W Case F ................................................................................................................... 120C/W Case 2 .................................................................................................................... 110C/W 1.4 Recommended operating conditions. Supply voltage (VS) ................................................................................................... 15 V dc Input reference current (IREF) .................................................................................... 2.0 mA Ambient operating temperature range (TA) ............................................................... -55C to +125C 1.5 Radiation features. Maximum total dose available (dose rate = 50 - 300 rads(Si) / s) ............................. 100 Krads (Si) 2/ ______ 1/ Stresses above the absolute maximum rating may cause permanent damage to the device. Extended operation at the maximum levels may degrade performance and affect reliability. 2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89932 A REVISION LEVEL E SHEET 3 2. APPLICABLE DOCUMENTS 2.1 Government specification, standards, and handbooks. The following specification, standards, and handbooks form a part of this drawing to the extent specified herein. Unless otherwise specified, the issues of these documents are those cited in the solicitation or contract. DEPARTMENT OF DEFENSE SPECIFICATION MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. DEPARTMENT OF DEFENSE STANDARDS MIL-STD-883 MIL-STD-1835 - Test Method Standard Microcircuits. Interface Standard Electronic Component Case Outlines. DEPARTMENT OF DEFENSE HANDBOOKS MIL-HDBK-103 MIL-HDBK-780 - List of Standard Microcircuit Drawings. Standard Microcircuit Drawings. (Copies of these documents are available online at http://assist.daps.dla.mil/quicksearch/ or http://assist.daps.dla.mil or from the Standardization Document Order Desk, 700 Robbins Avenue, Building 4D, Philadelphia, PA 19111-5094.) 2.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing takes precedence. Nothing in this document, however, supersedes applicable laws and regulations unless a specific exemption has been obtained. 3. REQUIREMENTS 3.1 Item requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. The individual item requirements for device class M shall be in accordance with MIL-PRF-38535, appendix A for non-JAN class level B devices and as specified herein. 3.2 Design, construction, and physical dimensions. The design, construction, and physical dimensions shall be as specified in MIL-PRF-38535 and herein for device classes Q and V or MIL-PRF-38535, appendix A and herein for device class M. 3.2.1 Case outlines. The case outlines shall be in accordance with 1.2.4 herein. 3.2.2 Terminal connections. The terminal connections shall be as specified on figure 1. 3.2.3 Radiation exposure circuit. The radiation exposure circuit shall be as specified on figure 2. 3.3 Electrical performance characteristics and postirradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and postirradiation parameter limits are as specified in table I and shall apply over the full ambient operating temperature range. 3.4 Electrical test requirements. The electrical test requirements shall be the subgroups specified in table IIA. The electrical tests for each subgroup are defined in table I. 3.5 Marking. The part shall be marked with the PIN listed in 1.2 herein. In addition, the manufacturer's PIN may also be marked. For packages where marking of the entire SMD PIN number is not feasible due to space limitations, the manufacturer has the option of not marking the "5962-" on the device. For RHA product using this option, the RHA designator shall still be marked. Marking for device classes Q and V shall be in accordance with MIL-PRF-38535. Marking for device class M shall be in accordance with MIL-PRF-38535, appendix A. 3.5.1 Certification/compliance mark. The certification mark for device classes Q and V shall be a "QML" or "Q" as required in MIL-PRF-38535. The compliance mark for device class M shall be a "C" as required in MIL-PRF-38535, appendix A. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89932 A REVISION LEVEL E SHEET 4 TABLE I. Electrical performance characteristics. Test Symbol Conditions 1/ 2/ -55C TA +125C Group A subgroups VS = 15 V, IREF = 2 mA Device type Limits unless otherwise specified Power supply 3/ I+ Min VS = 15 V or +5 V, -15 V 1, 2, 3 M,D,P,L,R VS = 5 V, IREF = 1 mA M,D,P,L,R I- VS = 15 V or +5 V, -15 V VS = 5 V, IREF = 1 mA M,D,P,L,R Full range current IFR VREF = 10 V, 3.8 1 4 All -7.8 1 -8 1, 2, 3 -5.8 1 -8 01 mA mA 1.94 2.04 1.925 2.04 1.984 2 2, 3 1.94 2.04 1 1.97 2 -10 +18 V 2 A 1 M,D,P,L,R IZS 1, 2, 3 1 VREF+, VREF- = 5 k Zero scale current 4 1, 2, 3 VREF = 10 V, VOC 3.8 mA VREF+, VREF- = 5 k M,D,P,L,R Output voltage compliance Max 1 1, 2, 3 M,D,P,L,R All Unit Full range current change < 1/2 LSB 4/ M,D,P,L,R 02 1, 2, 3 All 1, 2, 3 01 1 1, 2, 3 M,D,P,L,R 2 02 1 1 1 ___ Full range symmetry IFRS 1, 2, 3 IFR - IFR 4/ 01 8 02 4 A See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89932 A REVISION LEVEL E SHEET 5 TABLE I. Electrical performance characteristics - Continued. Test Symbol Conditions 1/ 2/ -55C TA +125C Group A subgroups VS = 15 V, IREF = 2 mA Device type unless otherwise specified Output current range IOR1 IOR2 PSSIFS+ VREF+, VREF- = 5 k All 4/ 1, 2, 3 4/ 1, 2, 3 All Logic input levels VIL Logic "0", VLC = 0 V 1, 2, 3 All M,D,P,L,R 0 1 Logic "1", VLC = 0 V M,D,P,L,R VIN = 18 V, VLC = 0 V M,D,P,L,R -3 A 0.8 V 0.8 1, 2, 3 2 1 2 1, 2, 3 VIN = -10 V, VLC = 0 V M,D,P,L,R IIH %IO _____ %V+ 0.01 V+ = 18 V, IREF = 1 mA 4/ IIL mA 0.01 All IVREF- Logic input current (each bit) 2.1 4.2 Reference bias current VIH Max 4/ V- = -18 V, IREF = 1 mA V- = -4.5 V to -18 V, PSSIFS- 1, 2, 3 Unit 4/ VREF = 25 V, V- = -12 V, V+ = 4.5 V to 18 V, Power supply sensitivity Min VREF = 15 V, V- = -10 V, VREF+, VREF- = 5 k Limits All -10 1 -30 1, 2, 3 10 1 10 A IFR = 1.94 mA (minimum), Logic input swing VIS IFR = 2.04 mA (maximum) 1, 2, 3 All -10 1, 2, 3 All 8 1, 2, 3 01 +18 V 4/ 4/ Monotonicity NL Nonlinearity M,D,P,L,R 0.19 M,D,P,L,R %FS 0.45 1 1, 2, 3 Bits 0.1 02 0.35 1 See footnotes at end of table. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89932 A REVISION LEVEL E SHEET 6 TABLE I. Electrical performance characteristics - Continued. Test Conditions 1/ 2/ -55C TA +125C Symbol Group A subgroups VS = 15 V, IREF = 2 mA Device type unless otherwise specified Power dissipation 5/ PD Min VS = 5 V, IREF = 1 mA 4/ VS = +5 V, -15 V, Limits 1, 2, 3 All Unit Max 48 4/ mW 136 IREF = 2 mA VS = 15 V, IREF = 2 mA 4/ 174 Full scale tempco TCIFS 4/ 8 All 80 ppm/C Settling time ts To 1/2 LSB, TA = +25C 4/ 9 01 150 ns 02 135 Reference input slew rate dl/dt Propagation delay all bits switched tPLH REQ = 200 , CC = 0 pF, RL = 100 , TA = +25C 4/ 9 All 9, 10, 11 All 4 mA/s Low to high transition, 4/ VL = 0.7 V, f = 250 kHz 60 ns High to low transition, 4/ tPHL 60 VL = 2.7 V, f = 250 kHz 1/ Devices supplied to this drawing have been characterized through all levels M, D, P, L, R of irradiation. However, this device is only tested at the "R" level. Pre and Post irradiation values are identical unless otherwise specified in table I. 2/ These parts may be dose rate sensitive in a space environment and may demonstrate enhanced low dose rate effects. Radiation end point limits for the noted parameters are guaranteed only for the conditions specified in MIL-STD-883, method 1019, condition A. 3/ When the device is used in an un-biased state at high temperature only, and subsequently biased, the device supply currents may rise 30% above specification for as long as 30 seconds. 4/ This parameter is not tested post-irradiation. 5/ Power dissipation limits are guaranteed by supply current testing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89932 A REVISION LEVEL E SHEET 7 Device types Case outlines 01 and 02 E and F Terminal number 2 Terminal symbol 1 VLC NC 2 ____ IOUT VLC 3 V- ____ IOUT 4 IOUT V- 5 MSB B1 IOUT 6 B2 NC 7 B3 B1 (MSB) 8 B4 B2 9 B5 B3 10 B6 B4 11 B7 NC 12 B8 LSB B5 13 V+ B6 14 VREF+ B7 15 VREF- B8 (LSB) 16 COMP NC 17 --- V+ 18 --- VREF+ 19 --- VREF- 20 --- COMP FIGURE 1. Terminal connections. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89932 A REVISION LEVEL E SHEET 8 FIGURE 2. Radiation exposure circuit. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89932 A REVISION LEVEL E SHEET 9 3.6 Certificate of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 6.6.1 herein). For device class M, a certificate of compliance shall be required from a manufacturer in order to be listed as an approved source of supply in MIL-HDBK-103 (see 6.6.2 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this drawing shall affirm that the manufacturer's product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and herein or for device class M, the requirements of MIL-PRF-38535, appendix A and herein. 3.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 or for device class M in MIL-PRF-38535, appendix A shall be provided with each lot of microcircuits delivered to this drawing. 3.8 Notification of change for device class M. For device class M, notification to DSCC-VA of change of product (see 6.2 herein) involving devices acquired to this drawing is required for any change that affects this drawing. 3.9 Verification and review for device class M. For device class M, DSCC, DSCC's agent, and the acquiring activity retain the option to review the manufacturer's facility and applicable required documentation. Offshore documentation shall be made available onshore at the option of the reviewer. 3.10 Microcircuit group assignment for device class M. Device class M devices covered by this drawing shall be in microcircuit group number 56 (see MIL-PRF-38535, appendix A). 4. VERIFICATION 4.1 Sampling and inspection. For device classes Q and V, sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer's Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit, or function as described herein. For device class M, sampling and inspection procedures shall be in accordance with MIL-PRF-38535, appendix A. 4.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and shall be conducted on all devices prior to qualification and technology conformance inspection. For device class M, screening shall be in accordance with method 5004 of MIL-STD-883, and shall be conducted on all devices prior to quality conformance inspection. 4.2.1 Additional criteria for device class M. a. Burn-in test, method 1015 of MIL-STD-883. (1) Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015. (2) TA = +125C, minimum. b. Interim and final electrical test parameters shall be as specified in table IIA herein. 4.2.2 Additional criteria for device classes Q and V. a. The burn-in test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The burn-in test circuit shall be maintained under document revision level control of the device manufacturer's Technology Review Board (TRB) in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1015 of MIL-STD-883. b. Interim and final electrical test parameters shall be as specified in table IIA herein. c. Additional screening for device class V beyond the requirements of device class Q shall be as specified in MIL-PRF-38535, appendix B. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89932 A REVISION LEVEL E SHEET 10 TABLE IIA. Electrical test requirements. Test requirements Interim electrical parameters (see 4.2) Final electrical parameters (see 4.2) Group A test requirements (see 4.4) Group C end-point electrical parameters (see 4.4) Group D end-point electrical parameters (see 4.4) Group E end-point electrical parameters (see 4.4) Subgroups (in accordance with MIL-PRF-38535, table III) Subgroups (in accordance with MIL-STD-883, method 5005, table I) Device class M 1 1 1, 2, 3 1, 2, 3 1/ 1, 2, 3, 8, 9, 10, 11 Device class Q Device class V 1 1/ 1, 2, 3 1/ 2/ 1 1, 2, 3, 8, 9, 10, 11 1 1, 2, 3, 8, 9, 10, 11 1 2/ 1 1 1 --- --- 1 1/ PDA applies to subgroup 1. 2/ See table IIB for delta measurement parameters. Table IIB. 240 hour burn-in and group C end-point electrical parameters. Parameter IFS ___ IFS IZS ___ IZS Device type Delta Min Max 01 1.94 mA 2.04 mA 0.01 mA 02 1.984 mA 2.000 mA 0.005 mA 01 1.94 mA 2.04 mA 0.01 mA 02 1.984 mA 2.000 mA 0.005 mA 01 -2.0 A +2.0 A 0.5 A 02 -1.0 A +1.0 A 0.3 A 01 -2.0 A +2.0 A 0.5 A 02 -1.0 A +1.0 A 0.3 A STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 Limit SIZE 5962-89932 A REVISION LEVEL E SHEET 11 4.3 Qualification inspection for device classes Q and V. Qualification inspection for device classes Q and V shall be in accordance with MIL-PRF-38535. Inspections to be performed shall be those specified in MIL-PRF-38535 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4 Conformance inspection. Technology conformance inspection for classes Q and V shall be in accordance with MIL-PRF-38535 including groups A, B, C, D, and E inspections and as specified. Quality conformance inspection for device class M shall be in accordance with MIL-PRF-38535, appendix A and as specified herein. Inspections to be performed for device class M shall be those specified in method 5005 of MIL-STD-883 and herein for groups A, B, C, D, and E inspections (see 4.4.1 through 4.4.4). 4.4.1 Group A inspection. a. Tests shall be as specified in table IIA herein. b. Subgroups 4, 5, 6, and 7 in table I, method 5005 of MIL-STD-883 shall be omitted. 4.4.2 Group C inspection. The group C inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.2.1 Additional criteria for device class M. Steady-state life test conditions, method 1005 of MIL-STD-883: a. Test condition A, B, C, or D. The test circuit shall be maintained by the manufacturer under document revision level control and shall be made available to the preparing or acquiring activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD-883. b. TA = +125C, minimum. c. Test duration: 1,000 hours, except as permitted by method 1005 of MIL-STD-883. 4.4.2.2 Additional criteria for device classes Q and V. The steady-state life test duration, test condition and test temperature, or approved alternatives shall be as specified in the device manufacturer's QM plan in accordance with MIL-PRF-38535. The test circuit shall be maintained under document revision level control by the device manufacturer's TRB in accordance with MIL-PRF-38535 and shall be made available to the acquiring or preparing activity upon request. The test circuit shall specify the inputs, outputs, biases, and power dissipation, as applicable, in accordance with the intent specified in method 1005 of MIL-STD883. 4.4.3 Group D inspection. The group D inspection end-point electrical parameters shall be as specified in table IIA herein. 4.4.4 Group E inspection. Group E inspection is required only for parts intended to be marked as radiation hardness assured (see 3.5 herein). RHA levels for device classes M, Q, and V shall be as specified in MIL-I-38535. End-point electrical parameters shall be as specified in table IIA herein. 4.4.4.1 Total dose irradiation testing. Total dose irradiation testing shall be performed in accordance with MIL-STD-883 method 1019 condition A and as specified herein. 4.4.4.2 Dose rate burnout. When required by the customer test shall be performed on devices, SEC, or approved test structures at technology qualifications and after any design or process changes which may effect the RHA capability of the process. Dose rate burnout shall be performed in accordance with method 1023 of MIL-STD-883 and as specified herein. 5. PACKAGING 5.1 Packaging requirements. The requirements for packaging shall be in accordance with MIL-PRF-38535 for device classes Q and V or MIL-PRF-38535, appendix A for device class M. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89932 A REVISION LEVEL E SHEET 12 6. NOTES 6.1 Intended use. Microcircuits conforming to this drawing are intended for use for Government microcircuit applications (original equipment), design applications, and logistics purposes. 6.1.1 Replaceability. Microcircuits covered by this drawing will replace the same generic device covered by a contractorprepared specification or drawing. 6.2 Configuration control of SMD's. All proposed changes to existing SMD's will be coordinated with the users of record for the individual documents. This coordination will be accomplished using DD Form 1692, Engineering Change Proposal. 6.3 Record of users. Military and industrial users should inform Defense Supply Center Columbus (DSCC) when a system application requires configuration control and which SMD's are applicable to that system. DSCC will maintain a record of users and this list will be used for coordination and distribution of changes to the drawings. Users of drawings covering microelectronic devices (FSC 5962) should contact DSCC-VA, telephone (614) 692-0544. 6.4 Comments. Comments on this drawing should be directed to DSCC-VA, Columbus, Ohio 43218-3990, or telephone (614) 692-0547. 6.5 Abbreviations, symbols, and definitions. The abbreviations, symbols, and definitions used herein are defined in MIL-PRF-38535 and MIL-HDBK-1331. 6.6 Sources of supply. 6.6.1 Sources of supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed in QML-38535 have submitted a certificate of compliance (see 3.6 herein) to DSCC-VA and have agreed to this drawing. 6.6.2 Approved sources of supply for device class M. Approved sources of supply for class M are listed in MIL-HDBK-103. The vendors listed in MIL-HDBK-103 have agreed to this drawing and a certificate of compliance (see 3.6 herein) has been submitted to and accepted by DSCC-VA. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43218-3990 DSCC FORM 2234 APR 97 SIZE 5962-89932 A REVISION LEVEL E SHEET 13 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 06-06-19 Approved sources of supply for SMD 5962-89932 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This information bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. DSCC maintains an online database of all current sources of supply at http://www.dscc.dla.mil/Programs/Smcr/. Standard microcircuit drawing PIN 1/ Vendor CAGE number Vendor similar PIN 2/ 5962-89932012A 24355 DAC08XRC 5962R8993201VEA 24355 DAC08XQ/QMLR 5962R8993201V2A 24355 DAC08XRC/QMLR 5962R8993201VFA 24355 DAC08XF/QMLR 5962R8993202VEA 24355 DAC08AQ/QMLR 5962R8993202V2A 24355 DAC08ARC/QMLR 5962R8993202VFA 24355 DAC08AF/QMLR 1/ The lead finish shown for each PIN representing a hermetic package is the most readily available from the manufacturer listed for that part. If the desired lead finish is not listed contact the vendor to determine its availability. 2/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 24355 Vendor name and address Analog Devices Route 1 Industrial Park P.O. Box 9106 Norwood, MA 02062 Point of contact: 7910 Triad Center Drive Greensboro, NC 27409 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin.