LM9036 www.ti.com SNVS140E - AUGUST 2003 - REVISED MARCH 2013 LM9036 Ultra-Low Quiescent Current Voltage Regulator Check for Samples: LM9036 FEATURES DESCRIPTION 1 * 2 * * * * * * * Ultra low Ground Pin Current (IGND 25A for IOUT = 0.1mA) Fixed 5V, 3.3V, 50mA Output Output Tolerance 5% Over Line, Load, and Temperature Dropout Voltage Typically 200mV @ IOUT = 50mA -45V Reverse Transient Protection Internal Short Circuit Current Limit Internal Thermal Shutdown Protection 40V Operating Voltage Limit The LM9036 ultra-low quiescent current regulator features low dropout voltage and low current in the standby mode. With less than 25A Ground Pin current at a 0.1mA load, the LM9036 is ideally suited for automotive and other battery operated systems. The LM9036 retains all of the features that are common to low dropout regulators including a low dropout PNP pass device, short circuit protection, reverse battery protection, and thermal shutdown. The LM9036 has a 40V maximum operating voltage limit, a -40C to +125C operating temperature range, and 5% output voltage tolerance over the entire output current, input voltage, and temperature range. Typical Application * Required if regulator is located more than 2 from power supply filter capacitor. ** Required for stability. Must be rated over intended operating temperature range. Effective series resistance (ESR) is critical, see Electrical Characteristics. Locate capacitor as close as possible to the regulator output and ground pins. Capacitance may be increased without bound. Connection Diagram Figure 1. PFM Top View Order Number LM9036DT-5.0, LM9036DTX-5.0, LM9036DT-3.3, LM9036DTX-3.3 See NS Package Number NDP0003B 1 2 Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. All trademarks are the property of their respective owners. PRODUCTION DATA information is current as of publication date. Products conform to specifications per the terms of the Texas Instruments standard warranty. Production processing does not necessarily include testing of all parameters. Copyright (c) 2003-2013, Texas Instruments Incorporated LM9036 SNVS140E - AUGUST 2003 - REVISED MARCH 2013 www.ti.com Figure 2. 8 Lead VSSOP Top View LM9036MM-3.3, , LM9036MMX-3.3, LM9036MM-5.0, LM9036MMX-5.0 See NS Package Number DGK Figure 3. 8 Lead SOIC Top View LM9036M-3.3, LM9036MX-3.3, LM9036M-5.0, LM9036MX-5.0 See NS Package Number D These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam during storage or handling to prevent electrostatic damage to the MOS gates. Absolute Maximum Ratings (1) (2) +55V, -45V Input Voltage (Survival) ESD Susceptibility (3) 1.9kV Power Dissipation (4) Internally limited Junction Temperature (TJmax) 150C -65C to +150C Storage Temperature Range Lead Temperature (Soldering, 10 sec.) (1) (2) (3) (4) 260C Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not apply when operating the device beyond its specified operating ratings. If Military/Aerospace specified devices are required, please contact the Texas Instruments Sales Office/Distributors for availability and specifications. Human body model, 100pF discharge through a 1.5k resistor. The maximum power dissipation is a function of TJmax, JA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJmax - TA)/JA. If this dissipation is exceeded, the die temperature will rise above 150C and the LM9036 will go into thermal shutdown. Operating Ratings -40C to +125C Operating Temperature Range Maximum Input Voltage (Operational) 40V SOIC-8 (D) JA (1) 140C/W PFM (NDP0003B) JA (1) 125C/W (2) 50C/W PFM (NDP0003B) JA PFM (NDP0003B) JC (1) 11C/W MSO-8 (DGK) JA (1) (1) (2) 2 200C/W Worst case (Free Air) per EIA / JESD51-3. Typical JA with 1 square inch of 2oz copper pad area directly under the ground tab. Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: LM9036 LM9036 www.ti.com SNVS140E - AUGUST 2003 - REVISED MARCH 2013 Electrical Characteristics - LM9036-5.0 VIN = 14V, IOUT = 10 mA, TJ = 25C, unless otherwise specified. Boldface limits apply over entire operating temperature range Min Typical Max 4.80 5.00 5.20 4.75 5.00 5.25 IOUT = 0.1mA, 8V VIN 24V 20 25 IOUT = 1mA, 8V VIN 24V 50 100 IOUT = 10mA, 8V VIN 24V 0.3 0.5 IOUT = 50mA, 8V VIN 24V 2.0 2.5 Line Regulation ( VOUT) 6V VIN 40V, IOUT = 1mA 10 30 mV Load Regulation ( VOUT) 0.1mA IOUT 5mA 10 30 mV 5mA IOUT 50mA 10 30 mV 0.05 0.10 V Parameter Output Voltage (VOUT) Quiescent Current (IGND) Dropout Voltage ( VOUT) Conditions 5.5V VIN 26V, 0.1mA IOUT 50mA (3) (1) IOUT = 0.1mA IOUT = 50mA (2) (1) Units V A mA 0.20 0.40 V Short Circuit Current (ISC) VOUT = 0V 65 120 250 mA Ripple Rejection (PSRR) Vripple = 1Vrms, Fripple = 120Hz -40 -60 dB Output Bypass Capacitance (COUT) 0.3 ESR 8 0.1mA IOUT 50mA 10 22 F (1) (2) (3) Tested limits are specified to TI's AOQL (Average Outgoing Quality Level) and 100% tested. Typicals are at 25C (unless otherwise specified) and represent the most likely parametric norm. To ensure constant junction temperature, pulse testing is used. Electrical Characteristics - LM9036-3.3 VIN = 14V, IOUT = 10 mA, TJ = 25C, unless otherwise specified. Boldface limits apply over entire operating temperature range Min Typical Max 3.168 3.30 3.432 3.135 3.30 3.465 IOUT = 0.1mA, 8V VIN 24V 20 25 IOUT = 1mA, 8V VIN 24V 50 100 IOUT = 10mA, 8V VIN 24V 0.3 0.5 IOUT = 50mA, 8V VIN 24V 2.0 2.5 Line Regulation ( VOUT) 6V VIN 40V, IOUT = 1mA 10 30 mV Load Regulation ( VOUT) 0.1mA IOUT 5mA 10 30 mV 5mA IOUT 50mA 10 30 mV IOUT = 0.1mA 0.05 0.10 V IOUT = 50mA 0.20 0.40 V 250 mA Parameter Output Voltage (VOUT) Quiescent Current (IGND) Dropout Voltage ( VOUT) Conditions 5.5V VIN 26V, 0.1mA IOUT 50mA (3) (1) (2) (1) Units V A mA Short Circuit Current (ISC) VOUT = 0V 65 120 Ripple Rejection (PSRR) Vripple = 1Vrms, Fripple = 120Hz -40 -60 dB Output Bypass Capacitance (COUT) 0.3 ESR 8 0.1mA IOUT 50mA 22 33 F (1) (2) (3) Tested limits are specified to TI's AOQL (Average Outgoing Quality Level) and 100% tested. Typicals are at 25C (unless otherwise specified) and represent the most likely parametric norm. To ensure constant junction temperature, pulse testing is used. Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: LM9036 3 LM9036 SNVS140E - AUGUST 2003 - REVISED MARCH 2013 www.ti.com Typical Performance Characteristics Dropout Voltage Quiescent Current Figure 4. Figure 5. Quiescent Current Quiescent Current Figure 6. Figure 7. Peak Output Current Figure 8. 4 Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: LM9036 LM9036 www.ti.com SNVS140E - AUGUST 2003 - REVISED MARCH 2013 APPLICATIONS INFORMATION Unlike other PNP low dropout regulators, the LM9036 remains fully operational to 40V. Owing to power dissipation characteristics of the package, full output current cannot be ensured for all combinations of ambient temperature and input voltage. The junction to ambient thermal resistance JA rating has two distinct components: the junction to case thermal resistance rating JC; and the case to ambient thermal resistance rating CA. The relationship is defined as: JA = JC + CA. On the PFM package the ground tab is thermally connected to the backside of the die. Adding 1 square inch of 2 oz. copper pad area directly under the ground tab will improve the JA rating to approximately 50C/W. While the LM9036 has an internally set thermal shutdown point of typically 150C, this is intended as a safety feature only. Continuous operation near the thermal shutdown temperature should be avoided as it may have a negative affect on the life of the device. Using the JA for a LM9036DT mounted on a circuit board as defined at, see (1), and using the formula for maximum allowable dissipation given in, see (2), for an ambient temperature (TA) of +85C, we find that PDMAX = 1.3W. Including the small contribution of the quiescent current IQ to the total power dissipation, the maximum input voltage (while still delivering 50mA output current) is 29.5V. The LM9036DT will go into thermal shutdown when attempting to deliver the full output current of 50mA, with an ambient temperature of +85C, and the input voltage is greater than 29.5V. Similarly, with an ambient temperature of 25C the PDMAX = 2.5W, and the LM9036DT can deliver the full output current of 50mA with an input voltage of up to 40V. While the LM9036 maintains regulation to 55V, it will not withstand a short circuit above 40V because of safe operating area limitations in the internal PNP pass device. Above 55V the LM9036 will break down with catastrophic effects on the regulator and possibly the load as well. Do not use this device in a design where the input operating voltage may exceed 40V, or where transients are likely to exceed 55V. (1) (2) Typical JA with 1 square inch of 2oz copper pad area directly under the ground tab. The maximum power dissipation is a function of TJmax, JA, and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJmax - TA)/JA. If this dissipation is exceeded, the die temperature will rise above 150C and the LM9036 will go into thermal shutdown. Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: LM9036 5 LM9036 SNVS140E - AUGUST 2003 - REVISED MARCH 2013 www.ti.com REVISION HISTORY Changes from Revision D (March 2013) to Revision E * 6 Page Changed layout of National Data Sheet to TI format ............................................................................................................ 5 Submit Documentation Feedback Copyright (c) 2003-2013, Texas Instruments Incorporated Product Folder Links: LM9036 PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Pins Package Drawing Qty Eco Plan Lead/Ball Finish MSL Peak Temp (2) (6) (3) Op Temp (C) Device Marking (4/5) LM9036DT-5.0/NOPB ACTIVE TO-252 NDP 3 75 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM9036D T-5.0 LM9036DTX-5.0/NOPB ACTIVE TO-252 NDP 3 2500 Green (RoHS & no Sb/Br) CU SN Level-2-260C-1 YEAR -40 to 125 LM9036D T-5.0 LM9036M-3.3/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM903 6M-3 LM9036M-5.0 NRND SOIC D 8 95 TBD Call TI Call TI -40 to 125 LM903 6M-5 LM9036M-5.0/NOPB ACTIVE SOIC D 8 95 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM903 6M-5 LM9036MM-3.3/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KDB LM9036MM-5.0/NOPB ACTIVE VSSOP DGK 8 1000 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 KDA LM9036MX-3.3/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM903 6M-3 LM9036MX-5.0/NOPB ACTIVE SOIC D 8 2500 Green (RoHS & no Sb/Br) CU SN Level-1-260C-UNLIM -40 to 125 LM903 6M-5 (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) Addendum-Page 1 Samples PACKAGE OPTION ADDENDUM www.ti.com 17-Mar-2017 (3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. (4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device. (5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation of the previous line and the two combined represent the entire Device Marking for that device. (6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish value exceeds the maximum column width. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release. In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis. Addendum-Page 2 PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2015 TAPE AND REEL INFORMATION *All dimensions are nominal Device Package Package Pins Type Drawing SPQ Reel Reel A0 Diameter Width (mm) (mm) W1 (mm) B0 (mm) K0 (mm) P1 (mm) W Pin1 (mm) Quadrant LM9036DTX-5.0/NOPB TO-252 NDP 3 2500 330.0 16.4 6.9 10.5 2.7 8.0 16.0 Q2 LM9036MM-3.3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM9036MM-5.0/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1 LM9036MX-3.3/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 LM9036MX-5.0/NOPB SOIC D 8 2500 330.0 12.4 6.5 5.4 2.0 8.0 12.0 Q1 Pack Materials-Page 1 PACKAGE MATERIALS INFORMATION www.ti.com 2-Sep-2015 *All dimensions are nominal Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm) LM9036DTX-5.0/NOPB TO-252 NDP 3 2500 367.0 367.0 38.0 LM9036MM-3.3/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM9036MM-5.0/NOPB VSSOP DGK 8 1000 210.0 185.0 35.0 LM9036MX-3.3/NOPB SOIC D 8 2500 367.0 367.0 35.0 LM9036MX-5.0/NOPB SOIC D 8 2500 367.0 367.0 35.0 Pack Materials-Page 2 PACKAGE OUTLINE NDP0003B TO-252 - 2.55 mm max height SCALE 1.500 TRANSISTOR OUTLINE 10.42 9.40 6.22 5.97 B 1.27 0.88 A 5.46 4.96 6.73 6.35 (2.345) 1 (2.5) 2.285 2 4.57 3 0.88 3X 0.64 0.25 C A B 1.02 0.64 PKG OPTIONAL 8 TOP & BOTTOM 8 1.14 0.89 C 2.55 MAX SEATING PLANE 0.17 0.88 0.46 0.60 0.46 0.51 MIN 4.32 MIN 3 2 4 1 4219870/A 03/2018 NOTES: 1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing per ASME Y14.5M. 2. This drawing is subject to change without notice. 3. Reference JEDEC registration TO-252. www.ti.com EXAMPLE BOARD LAYOUT NDP0003B TO-252 - 2.55 mm max height TRANSISTOR OUTLINE SEE SOLDER MASK DETAIL 2X (2.15) (5.7) 2X (1.3) 1 4 (4.57) SYMM (5.5) 3 (R0.05) TYP (4.38) (2.285) PKG LAND PATTERN EXAMPLE EXPOSED METAL SHOWN SCALE: 8X 0.07 MAX ALL AROUND 0.07 MIN ALL AROUND METAL EDGE METAL UNDER SOLDER MASK EXPOSED METAL EXPOSED METAL SOLDER MASK OPENING NON SOLDER MASK DEFINED (PREFERRED) SOLDER MASK OPENING SOLDER MASK DEFINED SOLDER MASK DETAIL 4219870/A 03/2018 NOTES: (continued) 4. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature numbers SLMA002(www.ti.com/lit/slm002) and SLMA004 (www.ti.com/lit/slma004). 5. Vias are optional depending on application, refer to device data sheet. It is recommended that vias under paste be filled, plugged or tented. www.ti.com EXAMPLE STENCIL DESIGN NDP0003B TO-252 - 2.55 mm max height TRANSISTOR OUTLINE (1.35) TYP 2X (2.15) 2X (1.3) (0.26) (R0.05) TYP (1.32) TYP (4.57) 16X (1.12) 16X (1.15) (4.38) PKG SOLDER PASTE EXAMPLE BASED ON 0.125 MM THICK STENCIL SCALE: 8X 4219870/A 03/2018 NOTES: (continued) 6. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate design recommendations. 7. Board assembly site may have different recommendations for stencil design. www.ti.com IMPORTANT NOTICE Texas Instruments Incorporated (TI) reserves the right to make corrections, enhancements, improvements and other changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete. TI's published terms of sale for semiconductor products (http://www.ti.com/sc/docs/stdterms.htm) apply to the sale of packaged integrated circuit products that TI has qualified and released to market. Additional terms may apply to the use or sale of other types of TI products and services. Reproduction of significant portions of TI information in TI data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such reproduced documentation. Information of third parties may be subject to additional restrictions. Resale of TI products or services with statements different from or beyond the parameters stated by TI for that product or service voids all express and any implied warranties for the associated TI product or service and is an unfair and deceptive business practice. TI is not responsible or liable for any such statements. Buyers and others who are developing systems that incorporate TI products (collectively, "Designers") understand and agree that Designers remain responsible for using their independent analysis, evaluation and judgment in designing their applications and that Designers have full and exclusive responsibility to assure the safety of Designers' applications and compliance of their applications (and of all TI products used in or for Designers' applications) with all applicable regulations, laws and other applicable requirements. Designer represents that, with respect to their applications, Designer has all the necessary expertise to create and implement safeguards that (1) anticipate dangerous consequences of failures, (2) monitor failures and their consequences, and (3) lessen the likelihood of failures that might cause harm and take appropriate actions. Designer agrees that prior to using or distributing any applications that include TI products, Designer will thoroughly test such applications and the functionality of such TI products as used in such applications. TI's provision of technical, application or other design advice, quality characterization, reliability data or other services or information, including, but not limited to, reference designs and materials relating to evaluation modules, (collectively, "TI Resources") are intended to assist designers who are developing applications that incorporate TI products; by downloading, accessing or using TI Resources in any way, Designer (individually or, if Designer is acting on behalf of a company, Designer's company) agrees to use any particular TI Resource solely for this purpose and subject to the terms of this Notice. TI's provision of TI Resources does not expand or otherwise alter TI's applicable published warranties or warranty disclaimers for TI products, and no additional obligations or liabilities arise from TI providing such TI Resources. TI reserves the right to make corrections, enhancements, improvements and other changes to its TI Resources. TI has not conducted any testing other than that specifically described in the published documentation for a particular TI Resource. Designer is authorized to use, copy and modify any individual TI Resource only in connection with the development of applications that include the TI product(s) identified in such TI Resource. NO OTHER LICENSE, EXPRESS OR IMPLIED, BY ESTOPPEL OR OTHERWISE TO ANY OTHER TI INTELLECTUAL PROPERTY RIGHT, AND NO LICENSE TO ANY TECHNOLOGY OR INTELLECTUAL PROPERTY RIGHT OF TI OR ANY THIRD PARTY IS GRANTED HEREIN, including but not limited to any patent right, copyright, mask work right, or other intellectual property right relating to any combination, machine, or process in which TI products or services are used. Information regarding or referencing third-party products or services does not constitute a license to use such products or services, or a warranty or endorsement thereof. Use of TI Resources may require a license from a third party under the patents or other intellectual property of the third party, or a license from TI under the patents or other intellectual property of TI. TI RESOURCES ARE PROVIDED "AS IS" AND WITH ALL FAULTS. TI DISCLAIMS ALL OTHER WARRANTIES OR REPRESENTATIONS, EXPRESS OR IMPLIED, REGARDING RESOURCES OR USE THEREOF, INCLUDING BUT NOT LIMITED TO ACCURACY OR COMPLETENESS, TITLE, ANY EPIDEMIC FAILURE WARRANTY AND ANY IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF ANY THIRD PARTY INTELLECTUAL PROPERTY RIGHTS. TI SHALL NOT BE LIABLE FOR AND SHALL NOT DEFEND OR INDEMNIFY DESIGNER AGAINST ANY CLAIM, INCLUDING BUT NOT LIMITED TO ANY INFRINGEMENT CLAIM THAT RELATES TO OR IS BASED ON ANY COMBINATION OF PRODUCTS EVEN IF DESCRIBED IN TI RESOURCES OR OTHERWISE. IN NO EVENT SHALL TI BE LIABLE FOR ANY ACTUAL, DIRECT, SPECIAL, COLLATERAL, INDIRECT, PUNITIVE, INCIDENTAL, CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF TI RESOURCES OR USE THEREOF, AND REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES. Unless TI has explicitly designated an individual product as meeting the requirements of a particular industry standard (e.g., ISO/TS 16949 and ISO 26262), TI is not responsible for any failure to meet such industry standard requirements. Where TI specifically promotes products as facilitating functional safety or as compliant with industry functional safety standards, such products are intended to help enable customers to design and create their own applications that meet applicable functional safety standards and requirements. Using products in an application does not by itself establish any safety features in the application. Designers must ensure compliance with safety-related requirements and standards applicable to their applications. Designer may not use any TI products in life-critical medical equipment unless authorized officers of the parties have executed a special contract specifically governing such use. Life-critical medical equipment is medical equipment where failure of such equipment would cause serious bodily injury or death (e.g., life support, pacemakers, defibrillators, heart pumps, neurostimulators, and implantables). Such equipment includes, without limitation, all medical devices identified by the U.S. Food and Drug Administration as Class III devices and equivalent classifications outside the U.S. TI may expressly designate certain products as completing a particular qualification (e.g., Q100, Military Grade, or Enhanced Product). Designers agree that it has the necessary expertise to select the product with the appropriate qualification designation for their applications and that proper product selection is at Designers' own risk. Designers are solely responsible for compliance with all legal and regulatory requirements in connection with such selection. Designer will fully indemnify TI and its representatives against any damages, costs, losses, and/or liabilities arising out of Designer's noncompliance with the terms and provisions of this Notice. Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265 Copyright (c) 2018, Texas Instruments Incorporated Mouser Electronics Authorized Distributor Click to View Pricing, Inventory, Delivery & Lifecycle Information: Texas Instruments: LM9036DT-5.0 LM9036DT-5.0/NOPB LM9036DTX-5.0 LM9036DTX-5.0/NOPB LM9036M-3.3 LM9036M-3.3/NOPB LM9036M-5.0 LM9036M-5.0/NOPB LM9036MM-3.3 LM9036MM-3.3/NOPB LM9036MM-5.0 LM9036MM-5.0/NOPB LM9036MMX-3.3 LM9036MMX-3.3/NOPB LM9036MMX-5.0 LM9036MMX-5.0/NOPB LM9036MX-3.3 LM9036MX3.3/NOPB LM9036MX-5.0 LM9036MX-5.0/NOPB