2
93C46/56/57/66/86
Doc. No. 25056-00 2/98 M-1
ABSOLUTE MAXIMUM RATINGS*
Temperature Under Bias ................. –55°C to +125°C
Storage Temperature....................... –65°C to +150°C
Voltage on any Pin with
Respect to Ground(1) ............ –2.0V to +VCC +2.0V
VCC with Respect to Ground ............... –2.0V to +7.0V
Package Power Dissipation
Capability (Ta = 25°C)................................... 1.0W
Lead Soldering Temperature (10 secs) ............ 300°C
Output Short Circuit Current(2) ........................ 100 mA
*COMMENT
Stresses above those listed under “Absolute Maximum
Ratings” may cause permanent damage to the device.
These are stress ratings only, and functional operation of
the device at these or any other conditions outside of those
listed in the operational sections of this specification is not
implied. Exposure to any absolute maximum rating for
extended periods may affect device performance and
reliability.
RELIABILITY CHARACTERISTICS
Symbol Parameter Min. Max. Units Reference Test Method
NEND(3) Endurance 1,000,000 Cycles/Byte MIL-STD-883, Test Method 1033
TDR(3) Data Retention 100 Years MIL-STD-883, Test Method 1008
VZAP(3) ESD Susceptibility 2000 Volts MIL-STD-883, Test Method 3015
ILTH(3)(4) Latch-Up 100 mA JEDEC Standard 17
Note:
(1) The minimum DC input voltage is –0.5V. During transitions, inputs may undershoot to –2.0V for periods of less than 20 ns. Maximum DC
voltage on output pins is VCC +0.5V, which may overshoot to VCC +2.0V for periods of less than 20 ns.
(2) Output shorted for no more than one second. No more than one output shorted at a time.
(3) This parameter is tested initially and after a design or process change that affects the parameter.
(4) Latch-up protection is provided for stresses up to 100 mA on address and data pins from –1V to VCC +1V.
(5) Standby Current (ISB2)=0µA (<900nA) for 93C46/56/57/66, (ISB2)=2µA for 93C86.
D.C. OPERATING CHARACTERISTICS
VCC = +1.8V to +6.0V, unless otherwise specified.
Limits
Symbol Parameter Min. Typ. Max. Units Test Conditions
ICC1 Power Supply Current 3 mA fSK = 1MHz
(Operating Write) VCC = 5.0V
ICC2 Power Supply Current 500 µAf
SK = 1MHz
(Operating Read) VCC = 5.0V
ISB1 Power Supply Current 10 µA CS = 0V
(Standby) (x8 Mode) ORG=GND
ISB2(5) Power Supply Current 0 µA CS=0V
(Standby) (x16Mode) ORG=Float or VCC
ILI Input Leakage Current 1 µAV
IN = 0V to VCC
ILO Output Leakage Current 1 µAV
OUT = 0V to VCC,
(Including ORG pin) CS = 0V
VIL1 Input Low Voltage -0.1 0.8 4.5V≤VCC<5.5V
VIH1 Input High Voltage 2 VCC+1
VIL2 Input Low Voltage 0 VCCX0.2 1.8V≤VCC<2.7V
VIH2 Input High Voltage VCCX0.7 VCC+1
VOL1 Output Low Voltage 0.4 4.5V≤VCC<5.5V
VOH1 Output High Voltage 2.4 IOL = 2.1mA
IOH = -400µA
VOL2 Output Low Voltage 0.2 1.8V≤VCC<2.7V
VOH2 Output High Voltage VCC-0.2 IOL = 1mA
IOH = -100µA
V
V
V
V
V
V
V