DIM200MBS12-A000
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 1/10
www.dynexsemi.com
FEATURES
■10µs Short Circuit Withstand
■Non Punch Through Silicon
APPLICATIONS
■Matrix Converters
■Brushless Motor Controllers
■Frequency Converters
The Powerline range of modules includes half bridge, dual,
chopper, bi-directional and single switch configurations covering
voltages from 600V to 3300V and currents up to 2400A.
The DIM200MBS12-A000 is a bi-directional 1200V, n
channel enhancement mode, insulated gate bipolar transistor
(IGBT) module. The IGBT has a wide reverse bias safe
operating area (RBSOA) plus full 10µs short circuit withstand.
The module incorporates an electrically isolated base plate
and low inductance construction enabling circuit designers to
optimise circuit layouts and utilise grounded heat sinks for safety.
ORDERING INFORMATION
Order As:
DIM200MBS12-A000
Note: When ordering, please use the whole part number.
KEY PARAMETERS
VDRM ±1200V
VT(typ) 4.3V
IC(max) 200A
IC(PK) (max) 400A
DIM200MBS12-A000
IGBT Bi-Directional Switch Module
Preliminary Information
DS5545-1.3 May 2002
Fig. 1 Bi-directional switch circuit diagram
Fig. 2 Electrical connections - (not to scale)
Outline type code: M
(See package details for further information)
3(C1)
1(C2)
2(E1E2)
11(C
2
)
9(C
1
)
6(G
2
)
7(E
2
)
5(E
1
)
4(G
1
)
123
11
10
8
95
4
6
7
DIM200MBS12-A000
2/10 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
Test Conditions
VGE = 0V
-
Tcase = 80˚C
1ms, Tcase = 110˚C
Tcase = 25˚C, Tj = 150˚C
VR = 0, tp = 10ms, Tvj = 125˚C
Commoned terminals to base plate. AC RMS, 1 min, 50Hz
IEC1287. V1 = 1200V, V2 = 900V, 50Hz RMS
Symbol
VDRM
VGES
IC
IC(PK)
Pmax
I2t
Visol
QPD
ABSOLUTE MAXIMUM RATINGS - PER ARM
Stresses above those listed under 'Absolute Maximum Ratings' may cause permanent damage to the device. In extreme
conditions, as with all semiconductors, this may include potentially hazardous rupture of the package. Appropriate safety precautions
should always be followed. Exposure to Absolute Maximum Ratings may affect device reliability.
Tcase = 25˚C unless stated otherwise
Units
V
V
A
A
W
kA2s
V
PC
Max.
1200
±20
200
400
1480
6.25
2500
10
Parameter
Collector-emitter voltage
(measured across terminals 2 and 3)
Gate-emitter voltage
Continuous collector current
Peak collector current
Max. transistor power dissipation
Diode I2t value
Isolation voltage - per module
Partial discharge - per module
DIM200MBS12-A000
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 3/10
www.dynexsemi.com
Test Conditions
Continuous dissipation -
junction to case
Continuous dissipation -
junction to case
Mounting torque 5Nm
(with mounting grease)
Transistor
Diode
-
Mounting - M6
Electrical connections - M4
Parameter
Thermal resistance - transistor (per arm)
Thermal resistance - diode (per arm)
Thermal resistance - case to heatsink
(per module)
Junction temperature
Storage temperature range
Screw torque
THERMAL AND MECHANICAL RATINGS
Internal insulation: Al2O3
Baseplate material: Cu
Creepage distance: 22mm
Clearance: 12mm
CTI (Critical Tracking Index): 175
Symbol
Rth(j-c)
Rth(j-c)
Rth(c-h)
Tj
Tstg
-
Units
˚C/kW
˚C/kW
˚C/kW
˚C
˚C
˚C
Nm
Nm
Max.
84
160
15
150
125
125
5
2
Typ.
-
-
-
-
-
-
-
-
Min.
-
-
-
-
-
–40
-
-
DIM200MBS12-A000
4/10 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
Test Conditions
VGE = 0V, VCE = VCES
VGE = 0V, VCE = VCES, Tcase = 125˚C
VGE = ±20V, VCE = 0V
IC = 10mA, VGE = VCE
VGE = 15V, IC = 200A
VGE = 15V, IC = 200A, , Tcase = 125˚C
VGE = 15V, IC = 200A
VGE = 15V, IC = 200A, Tcase = 125˚C
DC
tp = 1ms
IF = 200A
IF = 200A, Tcase = 125˚C
VCE = 25V, VGE = 0V, f = 1MHz
-
-
T
j
= 125˚C, V
CC
= 900V,
I1
t
p
≤ 10µs,
V
CE(max)
= V
CES
– L*. di/dt
I2
IEC 60747-9
Parameter
Collector cut-off current
Gate leakage current
Gate threshold voltage
Collector-emitter saturation voltage
On-state voltage
(measured across terminals 2 and 3)
Diode forward current
Diode maximum forward current
Diode forward voltage
Input capacitance
Module inductance - per arm
Internal transistor resistance - per arm
Short circuit. ISC
ELECTRICAL CHARACTERISTICS
Tcase = 25˚C unless stated otherwise.
Symbol
ICES
IGES
VGE(TH)
VCE(sat)†
VT
IF
IFM
VF†
Cies
LM
RINT
SCData
Units
mA
mA
µA
V
V
V
V
V
A
A
V
V
nF
nH
mΩ
A
A
Max.
0.25
6
1
6.5
2.6
3.0
5.0
5.4
200
400
2.4
2.4
-
-
-
-
-
Typ.
-
-
-
5.5
2.2
2.6
4.3
4.7
-
-
2.1
2.1
23
30
0.27
1375
1125
Min.
-
-
-
4.5
-
-
-
-
-
-
-
-
-
-
-
Note:
† Measured at the power busbars and not the auxiliary terminals)
L* is the circuit inductance + LM
DIM200MBS12-A000
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 5/10
www.dynexsemi.com
Units
ns
ns
mJ
ns
ns
mJ
µC
µC
A
mJ
Max.
-
-
-
-
-
-
-
-
-
-
Typ.
600
50
20
240
95
25
2
30
125
13
Min.
-
-
-
-
-
-
-
-
-
-
Test Conditions
IC = 200A
VGE = ±15V
VCE = 600V
RG(ON) = RG(OFF) = 4.7Ω
L ~ 100nH
IF = 200A, VR = 600V,
dIF/dt = 2100A/µs
Parameter
Turn-off delay time
Fall time
Turn-off energy loss
Turn-on delay time
Rise time
Turn-on energy loss
Gate charge
Diode reverse recovery charge
Diode reverse current
Diode reverse recovery energy
ELECTRICAL CHARACTERISTICS
Tcase = 25˚C unless stated otherwise
Symbol
td(off)
tf
EOFF
td(on)
tr
EON
Qg
Qrr
Irr
EREC
Tcase = 125˚C unless stated otherwise
Units
ns
ns
mJ
ns
ns
mJ
µC
A
mJ
Max.
-
-
-
-
-
-
-
-
-
Typ.
800
70
27
385
110
40
50
140
20
Min.
-
-
-
-
-
-
-
-
-
Test Conditions
IC = 200A
VGE = ±15V
VCE = 600V
RG(ON) = RG(OFF) = 4.7Ω
L ~ 100nH
IF = 200A, VR = 600V,
dIF/dt = 1900A/µs
Parameter
Turn-off delay time
Fall time
Turn-off energy loss
Turn-on delay time
Rise time
Turn-on energy loss
Diode reverse recovery charge
Diode reverse current
Diode reverse recovery energy
Symbol
td(off)
tf
EOFF
td(on)
tr
EON
Qrr
Irr
EREC
DIM200MBS12-A000
6/10 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
TYPICAL CHARACTERISTICS
Fig. 3 Typical output characteristics Fig. 4 Typical output characteristics
Fig. 5 Typical switching energy vs collector current Fig. 6 Typical switching energy vs gate resistance
0
5
10
15
20
25
30
35
40
45
0 50 100 150 200
Collector current, I
C
- (A)
Switching energy, E
sw
- (mJ)
E
on
E
off
E
rec
T
c
= 125˚C,
V
cc
= 600V,
R
g
= 4.7 Ohms
0
5
10
15
20
25
30
35
40
45
50
55
41012
Gate resistance, R
g
- (Ohms)
Switching energy, E
sw
- (mJ)
86
E
on
E
off
E
rec
T
c
= 125˚C,
V
cc
= 600V,
I
C
= 200A
0
50
100
150
200
250
300
350
400
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
Collector-emitter voltage, V
ce
- (V)
Collector current, I
C
- (A)
V
GE
= 10V
V
GE
= 12V
V
GE
= 15V
V
GE
= 20V
Common emitter
T
case
= 25˚C
V
ce
is measured at power busbars
and not the auxiliary terminals
0
50
100
150
200
250
300
350
400
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0
Collector-emitter voltage, Vce - (V)
Collector current, IC - (A)
VGE = 10V
VGE = 12V
VGE = 15V
VGE = 20V
Common emitter
Tcase = 125˚C
V
ce
is measured at power busbars
and not the auxiliary terminals
DIM200MBS12-A000
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 7/10
www.dynexsemi.com
Fig. 7 Diode typical forward characteristics Fig. 8 Reverse bias safe operating area
Fig. 9 Diode reverse bias safe operating area
0
50
100
150
200
250
300
350
400
0 0.5 1.0 1.5 2.0 2.5 3.0 3.5
Forward voltage, V
F
- (V)
Forward current, I
F
- (A)
T
j
= 25˚C
T
j
= 125˚C
V
F
is measured at power busbars
and not the auxiliary terminals
0
50
100
150
200
250
300
350
400
450
0 200 400 600 800 1000 1200 1400
Collector emitter voltage, Vce - (V)
Collector current, IC - (A)
Tcase = 125˚C
Vge = 15V
Rg = 4.7 Ohms
Module IC
Chip IC
0
25
50
75
100
125
150
175
0 200 400 600 800 1000 1200 1400
Reverse voltage, V
R
- (V)
Reverse recovery current, I
rr
- (A)
T
case
=125˚C
Fig. 10 Forward bias safe operating area
0.1
1
10
100
1000
1 10 100 1000 10000
Collector emitter voltage, V
ce
- (V)
Collector current, I
C
- (A)
I
C(max)
DC
t
p
= 1 ms
t
p
= 100µs
T
vj
= 125˚C - T
c
= 80˚C
t
p
= 50µs
DIM200MBS12-A000
8/10 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
Fig. 12 DC current rating vs case temperature
0
50
100
150
200
250
300
350
020406080100120140
Case temperature, T
case
- (˚C)
Collector current, IC - (A)
T
j
= 125˚C
V
ge
= 15V
Fig. 11 Transient thermal impedance
1
10
100
1000
0.001 0.01 10.1 10
Pulse width, t
p
- (s)
Transient thermal impedance, Z
th (j-c
) - (°C/kW )
Diode
Transistor
IGBT R
i
(˚C/KW)
τ
i
(ms)
Diode R
i
(˚C/KW)
τ
i
(ms)
1
1.9448
0.1596
6.1216
0.0064351
2
8.7614
2.2324
19.4376
1.3234
3
46.2922
39.8386
74.0454
31.1756
4
77.0166
176.9288
76.4438
97.9395
DIM200MBS12-A000
Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures. 9/10
www.dynexsemi.com
23
8
106 ± 0.8
108 ± 0.8
3x M6
93 ± 0.3
1
48 ± 0.3
62 ± 0.8
4x Fast on
tabs
28 ± 0.5 28 ± 0.5
31 ± 0.8
23
10
11
9
84
5
7
6
Nominal weight: 270g
Recommeded fixings for mounting: M6
Recommended mounting torque: 5Nm (44lbs.ins)
Recommended torque for electrical connections (M6): 5Nm (44lbs.ins)
Module outline type code: M
PACKAGE DETAILS
For further package information please visit our website or contact Customer Services. All dimensions in mm, unless stated otherwise.
DO NOT SCALE.
DIM200MBS12-A000
10/10 Caution: This device is sensitive to electrostatic discharge. Users should follow ESD handling procedures.
www.dynexsemi.com
POWER ASSEMBLY CAPABILITY
The Power Assembly group was set up to provide a support service for those customers requiring more than the basic
semiconductor, and has developed a flexible range of heatsink and clamping systems in line with advances in device voltages and
current capability of our semiconductors.
We offer an extensive range of air and liquid cooled assemblies covering the full range of circuit designs in general use today. The
Assembly group continues to offer high quality engineering support dedicated to designing new units to satisfy the growing needs of
our customers.
Using the latest CAD methods our team of design and applications engineers aim to provide the Power Assembly Complete
Solution (PACs).
HEATSINKS
The Power Assembly group has its own proprietary range of extruded aluminium heatsinks. They have been designed to optimise
the performance of Dynex semiconductors. Data with respect to air natural, forced air and liquid cooling (with flow rates) is
available on request.
For further information on device clamps, heatsinks and assemblies, please contact your nearest sales representative or customer
service office.
CUSTOMER SERVICE
Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020
SALES OFFICES
Benelux, Italy & Switzerland: Tel: +33 (0)1 64 66 42 17. Fax: +33 (0)1 64 66 42 19.
France & Spain: Tel: +33 (0)2 47 55 75 52. Fax: +33 (0)2 47 55 75 59.
Germany, Northern Europe & Rest Of World: Tel: +44 (0)1522 502753 / 502901. Fax: +44 (0)1522 500020
North America: Tel: (613) 723-7035. Fax: (613) 723-1518. Toll Free: 1.888.33.DYNEX (39639) /
Tel: (949) 733-3005. Fax: (949) 733-2986.
These offices are supported by Representatives and Distributors in many countries world-wide.
© Dynex Semiconductor 2002 Publication No. DS5545-1 Issue No. 1.3 May 2002
TECHNICAL DOCUMENTATION – NOT FOR RESALE. PRODUCED IN UNITED KINGDOM
HEADQUARTERS OPERATIONS
DYNEX SEMICONDUCTOR LTD
Doddington Road, Lincoln.
Lincolnshire. LN6 3LF. United Kingdom.
Tel: 00-44-(0)1522-500500
Fax: 00-44-(0)1522-500550
This publication is issued to provide information only which (unless agreed by the Company in writing) may not be used, applied or reproduced for any purpose nor form part of any order or contract nor to be regarded as
a representation relating to the products or services concerned. No warranty or guarantee express or implied is made regarding the capability, performance or suitability of any product or service. The Company reserves
the right to alter without prior notice the specification, design or price of any product or service. Information concerning possible methods of use is provided as a guide only and does not constitute any guarantee that such
methods of use will be satisfactory in a specific piece of equipment. It is the user's responsibility to fully determine the performance and suitability of any equipment using such information and to ensure that any publication
or data used is up to date and has not been superseded. These products are not suitable for use in any medical products whose failure to perform may result in significant injury
or death to the user. All products and materials are sold and services provided subject to the Company's conditions of sale, which are available on request.
All brand names and product names used in this publication are trademarks, registered trademarks or trade names of their respective owners.
http://www.dynexsemi.com
e-mail: power_solutions@dynexsemi.com
Datasheet Annotations:
Dynex Semiconductor annotate datasheets in the top right hard corner of the front page, to indicate product status. The annotations are as follows:-
Target Information: This is the most tentative form of information and represents a very preliminary specification. No actual design work on the product has been started.
Preliminary Information: The product is in design and development. The datasheet represents the product as it is understood but details may change.
Advance Information: The product design is complete and final characterisation for volume production is well in hand.
No Annotation: The product parameters are fixed and the product is available to datasheet specification.
