ASMT-QTC0-0xxxx
PLCC-4 Black Body Surface Mount Tricolor LED
Data Sheet
CAUTION:LEDs are Class 1C ESD sensitive. Please observe appropriate precautions during
handling and processing. Please refer to Avago Application Note AN-1142 for additional details.
Description
This family of SMT LEDs is packaged in the industry
standard PLCC-4 package with additional heat sinking ca-
pability enabling it to be driven at even higher current.
These SMT LEDs have high brightness and reliability per-
formance and are designed to work under a wide range
of environmental conditions. This high reliability feature
makes them ideally suited to be used under indoor full
color signs application conditions.
To facilitate easy pick & place assembly, the LEDs are
packed in EIA-compliant tape and reel. Every reel will be
shipped in single intensity and color bin; except red color
to provide close uniformity.
These LEDs are compatible with reow soldering process.
Its wide viewing angle at 115° together with the built
in reector pushing up the intensity of the light output
makes these LED suitable to be used in the interior elec-
tronics signs. The full black body of the LED provides
extreme contrast enhancement for ne pitch and short
viewing distance full color display.
Features
x Industry Standard PLCC-4 package (Plastic Leaded
Chip Carrier) with additional heat sinking capability
x High reliability LED package with silicone encapsulation
x Full black LED body
x High brightness using AlInGaP and InGaN dice
technologies
x Wide viewing angle at 115º
x Compatible with reow soldering process
x JEDEC MSL 2a
x Water-Resistant (IPX6*) per IEC 60529:2001
* The test is conducted on component level by mounting the
components on PCB with proper potting to protect the leads. It is
strongly recommended that customers perform necessary tests
on the components for their nal application.
Applications
x Indoor full color display
2
Circuit Diagram
Package Dimensions
2.90
3.40 ± 0.20
Package
Marking
2.50 ± 0.200.80 ± 0.10
3.20 ± 0.20
0.5 ± 0.1
0.80 ± 0.20
3.60 ± 0.20
1.76 ± 0.20
0.15 ± 0.20
2.00 ± 0.20
2.50 ± 0.20
0.70 ± 0.20
1.34 ± 0.200.97 ± 0.20
Table 1. Device Selection Guide
Part Number Color 1 Color 2Color 3
ASMT-QTC0-0xxxx AlInGaP Red InGaN Green InGaN Blue
Part Number
Color 1 - Red Color 2 - Green Color 3 - Blue
Min. Iv @20mA Typ. Iv @20mA Min. Iv @ 20mA Typ. Iv @ 20mA Min. Iv @ 20mA Typ. Iv @ 20mA
Bin ID (mcd) (mcd) Bin ID (mcd) (mcd) Bin ID (mcd) (mcd)
ASMT-QTC0-0AA02 S1 180 315 T1 285 470 R1 112.50 140
Notes:
1. The luminous intensity IV, is measured at the mechanical axis of the LED package. The actual peak of the spatial radiation pattern may not be
aligned with this axis.
2. Tolerance = ± 12 %
Notes:
1. All Dimensions are in millimeters
2. Tolerance = ±0.2 mm unless otherwise specied
3. Terminal Finish: Ag plating
Lead Conguration
1 Cathode Red
2 Common Anode
3 Cathode Blue
4 Cathode Green
Figure 1. Package drawing
3
Part Numbering System
A S M T –Q T C0– X1 X2 X3 X4 X5
Packaging Option
Color Bin Selection
Intensity Bin Limit
Intensity Bin Selection
Device Specication Conguration
Table 2. Absolute Maximum Ratings (TA = 25°C)
Parameter Red Green & Blue Unit
DC forward current [1] 50 30 mA
Peak forward current [2] 100 100 mA
Power dissipation 120 117 mW
Reverse voltage 4V[3] V
Maximum junction temperature Tj max 125 °C
Operating temperature range - 40 to + 110[4] °C
Storage temperature range - 40 to + 110 °C
Note:
1. Derate linearly as shown in Figure 5a & 5b.
2 Duty Factor = 0.5%, Frequency = 500Hz
3. Driving the LED in reverse bias condition is suitable for short term only
4 Refer to Figure 5a and gure 5b for more information
Table 3. Optical Characteristics (TA = 25°C)
Color
Dominant Wavelength,
λd (nm) [1]
Peak
Wavelength,
λp (nm)
Viewing Angle
2θ½[2] (Degrees)
Luminous
Ecacy ηV[3]
(lm/W)
Luminous
Eciency ηe
(lm/W)
Total Flux /
Luminous
Intensity [4]
ΦV / IV (lm/cd)
Min Typ.Max Typ.Typ.Typ.Typ.Typ.
Red 618 621 628 629 115 200 22 2.60
Green 525 528 535 521 115 530 22 2.60
Blue 465 470 475 465 115 70 5 2.60
Notes:
1. The dominant wavelength is derived from the CIE Chromaticity Diagram and represents the perceived color of the device.
2. θ½ is the o axis angle where the luminous intensity is ½ the peak intensity
3. Radiant intensity, Ie in watts / steradian, may be calculated from the equation Ie = IV / ηV, where IV is the luminous intensity in candelas and ηV is
the luminous ecacy in lumens / watt.
4. ΦV is the total luminous ux output as measured with an integrating sphere at mono pulse condition.
4
Table 4. Electrical Characteristics (TA = 25°C)
Color
Forward Voltage,
VF (V) [1]
Reverse Voltage
VR @ 100μA
Reverse Voltage
VR @ 10μA
Thermal Resistance
RθJ-P (°C/W)
Min Typ.Max.Min.Min.Typ.
Red 1.80 2.10 2.40 4 - 95
Green 2.80 3.20 3.90 - 4 70
Blue 2.80 3.20 3.90 - 4 60
Note:
1. Tolerance ± 0.1V
0
5
10
15
20
25
30
35
40
45
50
01234
FORWARD VOLTAGE - V
FORWARD CURRENT - mA
0.0
0.2
0.4
0.6
0.8
1.0
380430480530580630680730780
InGaN Blue InGaN Gr
e
WAVELENGTH - nm
RELATIVE INTENSITY
AlInGaP Red
I
n
G
a
N
AlInGaP
Figure 2. Relative intensity vs. wavelength
0.00
0.50
1.00
1.50
2.00
2.50
3.00
0102030405060
DC FORWARD CURRENT -
m
I
n
G
a
N
AlInGaP
RELATIVE LUMINOUS INTENSITY (NORMALIZATION AT 20 mA)
Figure 3. Forward current vs. forward voltage
Figure 4. Relative Intensity vs. forward current
5
0
10
20
30
40
50
60
020406080100 120
AMBIENT TEMPERATURE (°C)
MAX. ALLOWABLE DC CURRENT (mA)
InGaN
0
10
20
30
40
50
60
020406080100 120
AMBIENT TEMPERATURE (°C)
MAX. ALLOWABLE DC CURRENT (mA)
InGaN
AlInGaPAlInGaP
Figure 5a. Maximum forward current vs. ambient temperature.
Derated based on TJMAX = 125°C.(3 chips)
Figure 5b. Maximum forward current vs. ambient temperature.
Derated based on TJMAX = 125°C. (single chip)
Figure 6. Radiation pattern.Figure 7. Dominant wavelength shift (normalized at 20mA) vs. forward
current
Figure 8. Relative Intensity Shift vs Junction Temperature Figure 9. Forward Voltage Shift vs Junction Temperature
0.1
1
10
-50-25 025 5075 100 125
TJ - JUNCTION TEMPERATURE - °C
NORMALIZED LUMINOUS INTENSITY
Red
Green
Blue
-0.40
-0.30
-0.20
-0.10
0.00
0.10
0.20
0.30
-50-25 025 5075 100 125
TJ - JUNCTION TEMPERATURE - °C
FORWARD VOLTAGE SHIFT - V
Green
Red
Blue
0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1
-90-60-300 306090
ANGULAR DISPLACEMENT - DEGREES
NORMALIZED INTENSITY
-3
-2
-1
0
1
2
3
4
5
6
7
01020304050
DOMINANT WAVELENGTH SHIFT- nm
(NORMALIZED AT 20mA)
Green
Red
Blue
FORWARD CURRENT - mA
6
0.8
1.1
0.80 x 4
0.90 x 4
(2)
1.2 x 2
3.8
0. 4
0.75 x 2
1.2
Package
Marking
0. 4
7. 0
7. 0
(3)
(1)(4)
A
A
C
C
A
C
A
C
Solder Mask
Anode
Cathode
Figure 10. Recommended soldering land pattern.
Figure 11. Recommended leaded reow soldering prole Figure 12. Recommended Pb-free reow soldering prole.
Note: For detail information on reow soldering of Avago surface mount LEDs, do refer to Avago Application Note AN 1060 Surface Mounting SMT
LED Indicator Components
240°C MAX.
20 SEC. MAX.
3°C/SEC.
MAX.
120 SEC. MAX.
TIME
TEMPERATURE
183°C
100-150°C
-6°C/SEC.
MAX.
60-150 SEC.
3°C/SEC. MAX. 217 °C
200 °C
60 - 120 SEC.
6 °C/SEC. MAX.
3 °C/SEC. MAX.
3 °C/SEC. MAX.
150 °C
255 - 260 °C
100 SEC. MAX.
10 to 30 SEC.
TIME
TEMPERATURE
7
Figure 13. Carrier Tape Dimension
Figure 14. Reel Dimension
Figure 15. Reeling Orientation
2.20 ± 0.10
0.279 ± 0.10
2.20 ± 0.10
4.00 ± 0.10
8.00 ± 0.10
2.00 ± 0.05
1.50 ± 0.25
1.75 ± 0.10
5.50 ± 0.05
+ 0.30
- 0.10
12.00
+ 0.10
- 0
1.50
C
C
A
Label Area 13.4 ± 0.5
16.2 ± 0.5
∅ 180 ± 1
∅ 60.0 ± 0.5
1.4
PIN 1
USER FEED DIRECTION
PRINTED LABEL
8
Intensity Bin Select (X2, X3)
Individual reel will contain parts from 1 half bin only
X2
Min Iv Bin (Minimum Intensity Bin)
Red Green Blue
0000
ASIT1R1
X3
Number of Half bin from X2
Red Green Blue
0000
A444
Note: 0 represents no maximum bin limit
Color Bin Select (X4)
Individual Reel will contain part from 1 full bin only
X4
Color Bin Combinations
Red Green Blue
0 Full
distribution
C & D B & C
Intensity Bin Limits
Bin ID Min (mcd) Max (mcd)
R1 112.5 140.0
R2 140.0 180.0
S1 180.0 224.0
S2 224.0 285.0
T1 285.0 355.0
T2 355.0 450.0
U1 450.0 560.0
U2 560.0 715.0
Tolerance of each bin limit ± 12%
Color Bin Limits
Red Min (nm) Max (nm)
Full
distribution
618.0 628.0
Green Min (nm) Max (nm)
C 525.0 530.0
D 530.0 535.0
Blue Min (nm) Max (nm)
B 465.0 470.0
C 470.0 475.0
Tolerance of each bin limit is ± 1 nm
9
Packaging Option (X5)
Option Test Current Package Type Reel Size
2 20mA Top mount 7 inch
CIE 1931 - Chromaticity Diagram
0.00
0.10
0.20
0.30
0.40
0.50
0.60
0.70
0.80
0.90
0.00 0.100.200.300.400.500.600.700.80
X-COORDINATE
Y - COORDINATE
CD
B
C
Red
Green
Blue
For product information and a complete list of distributors, please go to our web site: www.avagotech.com
Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries.
Data subject to change. Copyright © 2005-2010 Avago Technologies. All rights reserved.
AV02 -1038EN - April 15, 2010
Handling Precaution
The encapsulation material of the product is made of
silicone for better reliability of the product. As silicone is
a soft material, please do not press on the silicone or poke
a sharp object onto the silicone. These might damage the
product and cause premature failure. During assembly of
handling, the unit should be held on the body only. Please
refer to Avago Application Note AN 5288 for detail infor-
mation.
Moisture Sensitivity
This product is qualied as Moisture Sensitive Level 2a
per Jedec J-STD-020. Precautions when handling this
moisture sensitive product is important to ensure the reli-
ability of the product. Do refer to Avago Application Note
AN5305 Handling of Moisture Sensitive Surface Mount
Devices for details.
A. Storage before use
x Unopen moisture barrier bag (MBB) can be stored at
<40°C/90%RH for 12 months. If the actual shelf life has
exceeded 12 months and the HIC indicates that baking
is not required, then it is safe to reow the LEDs per the
original MSL rating.
x It is not recommended to open the MBB prior to
assembly (e.g. for IQC).
B. Control after opening the MBB
x The humidity indicator card (HIC) shall be read
immediately upon opening of MBB.
x The LEDs must be kept at <30°C / 60%RH at all time
and all high temperature related process including
soldering, curing or rework need to be completed
within 672 hours.
C. Control for unnished reel
x For any unuse LEDs, they need to be stored in sealed
MBB with desiccant or desiccator at <5%RH.
D. Control of assembled boards
x If the PCB soldered with the LEDs is to be subjected
to other high temperature processes, the PCB need to
be stored in sealed MBB with desiccant or desiccator
at <5%RH to ensure no LEDs have exceeded their oor
life of 672 hours
E. Baking is required if:
x The HIC indicator is not GREEN at 10% and is AZURE at
5%
x The LEDs are exposed to condition of >30°C / 60% RH
at any time.
x The Led oor life exceeded 672hrs.
Recommended baking condition: 60±5ºC for 20hrs