Ultra High Precision Z-Foil Flip Chip Resistor with TCR
of ± 0.05 ppm/°C, 35 % Space Saving vs. Wraparound Design
and PCR of 5 ppm at Rated Power
IMPROVED PRODUCT
VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Vishay Foil Resistors
Document Number: 63106 For any questions, contact: foil@vishaypg.com www.foilresistors.com
Revision: 25-Mar-10 1
INTRODUCTION
One of the most important parameters influencing stability is
the temperature coefficient of resistance (TCR). Although the
TCR of Bulk Metal® Foil resistors is considered extremely
low, this characteristic has been further refined over the
years.
The VFCP Series utilizes ultra precision Bulk Metal® Z-Foil.
The Z-Foil technology provides a significant reduction to the
resistive element’s sensitivity to ambient temperature
variations (TCR) and to self heating when power is applied
(power coefficient).
Along with the inherently low PCR and TCR, Z-Foil
technology also provides remarkably improved load life
stablility, low noise and availability of tight tolerance.
The flip chip configuration provides a substantial PCB space
saving of more than 35 % vs. a surface mount chip with
wraparound terminations. The VFCP is available in any
value within the specified resistance range.
Our application engineering department is available to
advise and make recommendations. For non-standard
technical requirements and special applications, please
contact us.
FEATURES
Temperature coefficient of resistance (TCR):
± 0.05 ppm/°C typical (0 °C to + 60 °C)
± 0.2 ppm/°C typical (- 55 °C to + 125 °C,
+ 25 °C ref.)
Tolerance: to ± 0.01 % (100 ppm)
Power coefficient “R due to self heating”
5 ppm at rated power
Load life stability (70 °C for 2000 h): ± 0.005 % (50 ppm)
Power rating to: 600 mW at + 70 °C
Electrostatic discharge (ESD) up to 25 000 V
Resistance range: 10 to 125 k (for lower and higher
values, please contact us)
Foil resistors are not restricted to standard values; specific
“as required” values can be supplied at no extra cost or
delivery (e.g. 1K2345 vs. 1K)
Non-inductive, non-capacitive design
Short time overload 0.005 % (50 ppm)
Non hot spot design
Rise time: 1 ns effectively no ringing
Current noise: - 40 dB
Voltage coefficient < 0.1 ppm/V
Non-inductive: < 0.08 µH
Terminal finishes available: lead (Pb)-free, tin/lead alloy
Compliant to RoHS directive 2002/95/EC
Matched sets are available per request
Prototype quantities available in just 5 working days
or sooner. For more information, please contact
foil@vishaypg.com
For better performances please contact us
APPLICATIONS
Automatic test equipment (ATE)
High precision instrumentation
Laboratory, industrial and medical
Audio
EB applications (electron beam scanning and recording
equipment, electron microscopes)
Military and space
Airborne
Down hole instrumentation
Communication
* Pb containing terminations are not RoHS compliant, exemptions may apply
TABLE 1 - TOLERANCE AND TCR VS.
RESISTANCE VALUE
RESISTANCE
VALUE
()
TOLERANCE
(%)
TYPICAL TCR AND
MAX. SPREAD
(- 55 °C to + 125 °C,
+ 25 °C Ref.)
250to 125K ± 0.01 ± 0.2 ± 1.6
100to < 250 ± 0.02 ± 0.2 ± 1.6
50to < 100 ± 0.05 ± 0.2 ± 1.8
25to < 50 ± 0.1 ± 0.2 ± 2.8
10to < 25 ± 0.25 ± 0.2 ± 2.8
Bottom View
FIGURE 1 - POWER DERATING CURVE
100
75
50
25
0
- 75 - 50 - 25 0 + 25 + 50 + 75 + 100 + 125 + 150 + 175
Ambient Temperature (°C)
Percent of Rated Power
+ 70 °C
- 55 °C
IMPROVED PRODUCT
VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Vishay Foil Resistors
www.foilresistors.com For any questions, contact: foil@vishaypg.com Document Number: 63106
2Revision: 25-Mar-10
Note
(1) As shown + 0.01 W to allow for measurement errors at low values.
FIGURE 2 - TRIMMING TO VALUES (Conceptual Illustration)
Mutual Inductance
Reduction due
to Change in
Current Direction
Current Path
Before Trimming
Note: Foil shown in black, etched spaces in white
Interloop Capacitance
Reduction in Series
Trimming Process
Removes this Material
from Shorting Strip Area
Changing Current Path
and Increasing
Resistance
Current Path
After Trimming
TABLE 2 - SPECIFICATIONS
CHIP
SIZE
RATED
POWER
(mW)
at + 70 °C
MAXIMUM
VOLTAGE
RATING
()
RESISTANCE
RANGE ()
MAXIMUM
WEIGHT
(mg)
0805 100 mW 28 V 10to 8K 5.2
1206 250 mW 79 V 10to 25K 10.3
1506 300 mW 95 V 10to 30K 12
2010 400 mW 167 V 10to 70K 25
2512 600 mW 220 V 10to 125K 35
PR
TABLE 3 - LOAD LIFE STABILITY
(+ 70 °C for 2000 h)
CHIP SIZE
MAXIMUM
R LIMITS
0805 ± 0.005 % at 50 mW
± 0.01 % at 100 mW
1206 ± 0.005 % at 150 mW
± 0.01 % at 250 mW
1506 ± 0.005 % at 150 mW
± 0.01 % at 300 mW
2010 ± 0.005 % at 200mW
± 0.01 % at 400 mW
2512 ± 0.005 % at 500 mW
± 0.01 % at 600 mW
TABLE 4 - PERFORMANCES
TEST OR CONDITION
MIL-PRF-55342
CHARACTERISTIC E
R LIMITS
TYPICAL
R LIMITS
MAXIMUM
R LIMITS (1)
Thermal Shock ± 0.1 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm)
Low Temperature Operation ± 0.1 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm)
Short Time Overload ± 0.1 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm)
High Temperature Exposure ± 0.1 % ± 0.01 % (100 ppm) ± 0.02 % (200 ppm)
Resistance to Soldering Heat ± 0.2 % ± 0.005 % (50 ppm) ± 0.015 % (150 ppm)
Moisture Resistance ± 0.2 % ± 0.005 % (50 ppm) ± 0.02 % (200 ppm)
Load Life Stability + 70 °C for 2000 hours
at Rated Power
± 0.5 % ± 0.005 % (50 ppm) ± 0.01 % (100 ppm)
IMPROVED PRODUCT
VFCP Series (0805, 1206, 1506, 2010, 2512) (Z-Foil)
Vishay Foil Resistors
Document Number: 63106 For any questions, contact: foil@vishaypg.com www.foilresistors.com
Revision: 25-Mar-10 3
Notes
• Avoid the use of cleaning agents which could attack epoxy resins, which form part of the resistor construction
• Vacuum pick up is recommended for handling
• Soldering iron is not applicable
Note
• The TCR values for < 100 are influenced by the termination
composition and result in deviation from this curve
TABLE 5 - DIMENSIONS AND LAND PATTERN in inches (millimeters)
CHIP
SIZE
L
± 0.005 (0.13)
W
± 0.005 (0.13)
THICKNESS
MAXIMUM
D
± 0.005 (0.13) Z G X
0805 0.079 (2.01) 0.049 (1.24) 0.025 (0.64) 0.010 (0.25) 0.078 (1.98) 0.053 (1.35) 0.049 (1.24)
1206 0.126 (3.20) 0.062 (1.57) 0.025 (0.64) 0.015 (0.38) 0.125 (3.18) 0.090 (2.29) 0.062 (1.57)
1506 0.150 (3.81) 0.062 (1.57) 0.025 (0.64) 0.012 (0.30) 0.150 (3.81) 0.120 (3.05) 0.062 (1.57)
2010 0.200 (5.08) 0.100 (2.54) 0.025 (0.64) 0.020 (0.51) 0.199 (5.05) 0.153 (3.89) 0.100 (2.54)
2512 0.250 (6.35) 0.126 (3.20) 0.025 (0.64) 0.024 (0.61) 0.250 (6.35) 0.196 (4.98) 0.126 (3.20)
D
W
L
L - 0.005 (0.13)
W1 [W - 0.003"]
Solder Terminals
BOTTOM VIEW (showing terminals for mounting)LAND PATTERN
G
Z
X
FIGURE 3 - CHIP CONFIGURATION
Protective Coating
High Purity Alumina Substrate
Resistive
Bulk
®
Metal Foil
Solder
FIGURE 4 - TYPICAL RESISTANCE/
TEMPERATURE CURVE
(for more details, see table 1)
+ 500
+ 200
+ 100
0
- 100
- 200
- 300
- 500
- 55 - 25 + 25 + 60 + 75 + 100 + 125
ΔR
R
(ppm)
0
0.05 ppm/°C
- 0.1 ppm/°C 0.1 ppm/°C
0.14 ppm/°C
0.2 ppm/°C
- 0.16 ppm/°C
- 400
+ 300
+ 400
Ambient Temperature (°C) and TCR Chord Slopes for
Differetn Termperature Ranges
