LMH6654,LMH6655
LMH6654/LMH6655 Single/Dual Low Power, 250 MHz, Low Noise Amplifiers
Literature Number: SNOS956C
LMH6654/LMH6655
June 24, 2009
Single/Dual Low Power, 250 MHz, Low Noise Amplifiers
General Description
The LMH6654/LMH6655 single and dual high speed, voltage
feedback amplifiers are designed to have unity-gain stable
operation with a bandwidth of 250 MHz. They operate from
±2.5V to ±6V and each channel consumes only 4.5 mA. The
amplifiers feature very low voltage noise and wide output
swing to maximize signal-to-noise ratio.
The LMH6654/LMH6655 have a true single supply capability
with input common mode voltage range extending 150 mV
below negative rail and within 1.3V of the positive rail.
LMH6654/LMH6655 high speed and low power combination
make these products an ideal choice for many portable, high
speed application where power is at a premium.
The LMH6654 is packaged in 5-Pin SOT-23 and 8-Pin SOIC.
The LMH6655 is packaged in 8-Pin MSOP and 8-Pin SOIC.
The LMH6654/LMH6655 are built on National’s Advance
VIP10 (Vertically Integrated PNP) complementary bipolar
process.
Features
(VS = ±5V, TJ = 25°C, Typical values unless specified).
Voltage feedback architecture
Unity gain bandwidth 250 MHz
Supply voltage range ±2.5V to ±6V
Slew rate 200 V/µsec
Supply current 4.5 mA/channel
Input common mode voltage −5.15V to +3.7V
Output voltage swing (RL = 100Ω) −3.6V to 3.4V
Input voltage noise 4.5 nV/Hz
Input current noise 1.7 pA/Hz
Settling Time to 0.01% 25 ns
Applications
ADC drivers
Consumer video
Active filters
Pulse delay circuits
xDSL receiver
Pre-amps
Typical Performance Characteristics
Input Voltage Noise vs. Frequency
20016560
Closed Loop Gain vs. Frequency
20016558
VIP10 is a trademark of National Semiconductor Corporation.
© 2009 National Semiconductor Corporation 200165 www.national.com
LMH6654/LMH6655 Single/Dual Low Power, 250 MHz, Low Noise Amplifiers
Absolute Maximum Ratings (Note 1)
If Military/Aerospace specified devices are required,
please contact the National Semiconductor Sales Office/
Distributors for availability and specifications.
ESD Tolerance (Note 2)
Human Body Model 2 kV
Machine Model 200V
VIN Differential ±1.2V
Output Short Circuit Duration (Note 3)
Supply Voltage (V+ − V)13.2V
Voltage at Input pins V+ +0.5V, V −0.5V
Storage Temperature Range −65°C to +150°C
Junction Temperature (Note 4) +150°C
Soldering Information
Infrared or Convection (20 sec.) 235°C
Wave Soldering (10 sec.) 260°C
Operating Ratings (Note 1)
Supply Voltage (V+ - V)±2.5V to ±6.0V
Junction Temperature Range −40°C to +85°C
Thermal Resistance (θJA)
8-Pin SOIC 172°C/W
8-Pin MSOP 235°C/W
5-Pin SOT-23 265°C/W
±5V Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ = 25°C, V+ = +5V, V = −5V, VCM = 0V, AV = +1, RF = 25Ω for gain = +1,
RF = 402Ω for gain = +2, and RL = 100Ω. Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
Dynamic Performance
fCL Close Loop Bandwidth
AV = +1 250
MHz
AV = +2 130
AV = +5 52
AV = +10 26
GBWP Gain Bandwidth Product AV +5 260 MHz
Bandwidth for 0.1 dB Flatness AV +1 18 MHz
φmPhase Margin 50 deg
SR Slew Rate (Note 8) AV = +1, VIN = 2 VPP 200 V/µs
tS
Settling Time
0.01% AV = +1, 2V Step
25 ns
0.1% 15 ns
trRise Time AV = +1, 0.2V Step 1.4 ns
tfFall Time AV = +1, 0.2V Step 1.2 ns
Distortion and Noise Response
enInput Referred Voltage Noise f 0.1 MHz 4.5 nV/
inInput-Referred Current Noise f 0.1 MHz 1.7 pA/
Second Harmonic Distortion AV = +1, f = 5 MHz −80 dBc
Third Harmonic Distortion VO = 2 VPP, RL = 100Ω −85
XtCrosstalk (for LMH6655 only) Input Referred, 5 MHz,
Channel-to-Channel
−80 dB
DG Differential Gain AV = +2, NTSC, RL = 150Ω 0.01 %
DP Differential Phase AV = +2, NTSC, RL = 150Ω 0.025 deg
Input Characteristics
VOS Input Offset Voltage VCM = 0V −3
−4
±1 3
4mV
TC VOS Input Offset Average Drift VCM = 0V (Note 7) 6 µV/°C
IBInput Bias Current VCM = 0V 5 12
18 µA
IOS Input Offset Current VCM = 0V −1
−2
0.3 1
2µA
RIN Input Resistance Common Mode 4 M
Differential Mode 20 k
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LMH6654/LMH6655
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
CIN Input Capacitance Common Mode 1.8 pF
Differential Mode 1
CMRR Common Mode Rejection Ration Input Referred,
VCM = 0V to −5V
70
68
90 dB
CMVR Input Common- Mode Voltage Range CMRR 50 dB −5.15 −5.0 V
3.5 3.7
Transfer Characteristics
AVOL Large Signal Voltage Gain VO = 4 VPP, RL = 100Ω 60
58
67 dB
Output Characteristics
VO
Output Swing High No Load 3.4
3.2
3.6
V
Output Swing Low No Load −3.9 −3.7
−3.5
Output Swing High RL = 100Ω 3.2
3.0
3.4
Output Swing Low RL = 100Ω −3.6 −3.4
−3.2
ISC Short Circuit Current (Note 3)
Sourcing, VO = 0V
ΔVIN = 200 mV
145
130
280
mA
Sinking, VO = 0V
ΔVIN = 200 mV
100
80
185
IOUT Output Current Sourcing, VO = +3V 80 mA
Sinking, VO = −3V 120
ROOutput Resistance AV = +1, f <100 kHz 0.08
Power Supply
PSRR Power Supply Rejection Ratio Input Referred,
VS = ±5V to ±6V
60 76 dB
ISSupply Current (per channel) 4.5 6
7mA
5V Electrical Characteristics
Unless otherwise specified, all limits guaranteed for TJ = 25°C, V+ = +5V, V = −0V, VCM = 2.5V, AV = +1, RF = 25Ω for
gain = +1, RF = 402Ω for gain = +2, and RL = 100Ω to V+/2. Boldface limits apply at the temperature extremes.
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
Dynamic Performance
fCL Close Loop Bandwidth
AV = +1 230
MHz
AV = +2 120
AV = +5 50
AV = +10 25
GBWP Gain Bandwidth Product AV +5 250 MHz
Bandwidth for 0.1 dB Flatness AV = +1 17 MHz
φmPhase Margin 48 deg
SR Slew Rate (Note 8) AV = +1, VIN = 2 VPP 190 V/µs
tS
Settling Time
0.01% AV = +1, 2V Step
30 ns
0.1% 20 ns
trRise Time AV = +1, 0.2V Step 1.5 ns
tfFall Time AV = +1, 0.2V Step 1.35 ns
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LMH6654/LMH6655
Symbol Parameter Conditions Min
(Note 6)
Typ
(Note 5)
Max
(Note 6)
Units
Distortion and Noise Response
enInput Referred Voltage Noise f 0.1 MHz 4.5 nV/
inInput Referred Current Noise f 0.1 MHz 1.7 pA/
Second Harmonic Distortion AV = +1, f = 5 MHz −65 dBc
Third Harmonic Distortion VO = 2 VPP, RL = 100Ω −70
XtCrosstalk (for LMH6655 only) Input Referred, 5 MHz −78 dB
Input Characteristics
VOS Input Offset Voltage VCM = 2.5V −5
−6.5
±2 5
6.5 mV
TC VOS Input Offset Average Drift VCM = 2.5V (Note 7) 6 µV/°C
IBInput Bias Current VCM = 2.5V 6 12
18 µA
IOS Input Offset Current VCM = 2.5V −2
−3
0.5 2
3µA
RIN Input Resistance Common Mode 4 M
Differential Mode 20 k
CIN Input Capacitance Common Mode 1.8 pF
Differential Mode 1
CMRR Common Mode Rejection Ration Input Referred,
VCM = 0V to −2.5V
70
68
90 dB
CMVR Input Common Mode Voltage Range CMRR 50 dB −0.15 0 V
3.5 3.7
Transfer Characteristics
AVOL Large Signal Voltage Gain VO = 1.6 VPP, RL = 100Ω 58
55
64 dB
Output Characteristics
VO
Output Swing High No Load 3.6
3.4
3.75
V
Output Swing Low No Load 0.9 1.1
1.3
Output Swing High RL = 100Ω 3.5
3.35
3.70
Output Swing Low RL = 100Ω 1 1.3
1.45
ISC Short Circuit Current (Note 3)
Sourcing , VO = 2.5V
ΔVIN = 200 mV
90
80
170
mA
Sinking, VO = 2.5V
ΔVIN = 200 mV
70
60
140
IOUT Output Current Sourcing, VO = +3.5V 30 mA
Sinking, VO = 1.5V 60
ROOutput Resistance AV = +1, f <100 kHz .08
Power Supply
PSRR Power Supply Rejection Ratio Input Referred ,
VS = ± 2.5V to ± 3V
60 75 dB
ISSupply Current (per channel) 4.5 6
7mA
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LMH6654/LMH6655
Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. Operating Ratings indicate conditions for which the device is
intended to be functional, but specific performance is not guaranteed. For guaranteed specifications and the test conditions, see the Electrical Characteristics
Table.
Note 2: Human body model, 1.5 k in series with 100 pF. Machine model: 0 in series with 100 pF.
Note 3: Continuous short circuit operation at elevated ambient temperature can result in exceeding the maximum allowed junction temperature at 150°C.
Note 4: The maximum power dissipation is a function of TJ(MAX), θJA and TA. The maximum allowable power dissipation at any ambient temperature is PD = (TJ
(MAX) − TA)/θJA. All numbers apply for packages soldered directly onto a PC board.
Note 5: Typical Values represent the most likely parametric norm.
Note 6: All limits are guaranteed by testing or statistical analysis.
Note 7: Offset voltage average drift is determined by dividing the change in VOS at temperature extremes into the total temperature change.
Note 8: Slew rate is the slower of the rising and falling slew rates. Slew rate is rate of change from 10% to 90% of output voltage step.
Connection Diagrams
8-Pin SOIC (LMH6654)
20016521
Top View
5-Pin SOT-23 (LMH6654)
20016520
Top View
8-Pin SOIC and MSOP (LMH6655)
20016519
Top View
Ordering Information
Package Part Number Package Marking Transport Media NSC Drawing
8-Pin SOIC
LMH6654MA LMH6654MA 95 Units Rails
M08A
LMH6654MAX 2.5k Units Tape and Reel
LMH6655MA LMH6655MA 95 Units Rails
LMH6655MAX 2.5k Units Tape and Reel
5-Pin SOT-23 LMH6654MF A66A 1k Units Tape and Reel MF05A
LMH6654MFX 3K Units Tape and Reel
8-Pin MSOP LMH6655MM A67A 1k Units Tape and Reel MUA08A
LMH6655MMX 3.5k Units Tape and Reel
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LMH6654/LMH6655
Typical Performance Characteristics TJ = 25°C, V+ = ±5V, V = −5, RF = 25Ω for gain = +1,
RF = 402Ω and for gain +2, and RL = 100Ω, unless otherwise specified.
Closed Loop Bandwidth (G = +1)
20016509
Closed Loop Bandwidth (G = +2)
20016510
Closed Loop Bandwidth (G = +5)
20016511
Closed Loop Bandwidth (G = +10)
20016512
Supply Current per Channel vs. Supply Voltage
20016535
Supply Current per Channel vs. Temperature
20016548
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LMH6654/LMH6655
Offset Voltage vs. Supply Voltage (VCM = 0V)
20016549
Offset Voltage vs. Common Mode
20016532
Offset Voltage vs. Common Mode
20016539
Bias Current and Offset Voltage vs. Temperature
20016551
Bias Current vs. Common Mode Voltage
20016537
Bias Current vs. Common Mode Voltage
20016565
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LMH6654/LMH6655
AOL, PSRR and CMRR vs. Temperature
20016550
Inverting Large Signal Pulse Response (VS = 5V)
20016502
Inverting Large Signal Pulse Response (VS = ±5V)
20016504
Non-Inverting Large Signal Pulse Response (VS = 5V)
20016506
Non-Inverting Large Signal Pulse Response (VS = ±5V)
20016508
Non-Inverting Small Signal Pulse Response (VS = 5V)
20016505
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LMH6654/LMH6655
Non-Inverting Small Signal Pulse Response (VS = ±5V)
20016507
Inverting Small Signal Pulse Response (VS = 5V)
20016501
Inverting Small Signal Pulse Response (VS = ±5V)
20016503
Input Voltage and Current Noise vs. Frequency (VS = 5V)
20016513
Input Voltage and Current Noise vs. Frequency
(VS = ±5V)
20016514
Harmonic Distortion vs. Frequency
G = +1, VO = 2 VPP, VS = 5V
20016517
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LMH6654/LMH6655
Harmonic Distortion vs. Frequency
G = +1, VO = 2 VPP, VS = ±5V
20016518
Harmonic Distortion vs. Temperature
VS = 5V, f = 5 MHz, VO = 2 VPP
20016529
Harmonic Distortion vs. Temperature
VS = ±5V, f = 5 MHz, VO = 2 VPP
20016528
Harmonic Distortion vs. Gain
VS = 5V, f = 5 MHz, VO = 2 VPP
20016531
Harmonic Distortion vs. Gain
VS = ±5V, f = 5 MHz, VO = 2 VPP
20016530
Harmonic Distortion vs. Output Swing
(G = +2, VS = 5V, f = 5 MHz)
20016559
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LMH6654/LMH6655
Harmonic Distortion vs. Output Swing
(G = +2, VS = ±5V, f = 5 MHz)
20016522
PSRR vs. Frequency
20016516
CMRR vs. Frequency
20016564
Output Sinking Current
20016546
Output Sourcing Current
20016547
CrossTalk vs. Frequency (LMH6655 only)
20016561
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LMH6654/LMH6655
CrossTalk vs. Frequency (LMH6655 only)
20016562
Isolation Resistance vs. Capacitive Load
20016563
Open Loop Gain and Phase vs. Frequency
20016527
Application Information
GENERAL INFORMATION
The LMH6654 single and LMH6655 dual high speed, voltage
feedback amplifiers are manufactured on National
Semiconductor’s new VIP10 (Vertically Integrated PNP) com-
plementary bipolar process. These amplifiers can operate
from ±2.5V to ±6V power supply. They offer low supply cur-
rent, wide bandwidth, very low voltage noise and large output
swing. Many of the typical performance plots found in the
datasheet can be reproduced if 50 coax and 50 RIN/ROUT
resistors are used.
CIRCUIT LAYOUT CONSIDERATION
With all high frequency devices, board layouts with stray ca-
pacitance have a strong influence on the AC performance.
The LMH6654/LMH6655 are not exception and the inverting
input and output pins are particularly sensitive to the coupling
of parasitic capacitance to AC ground. Parasitic capacitances
on the inverting input and output nodes to ground could cause
frequency response peaking and possible circuit oscillation.
Therefore, the power supply, ground traces and ground plan
should be placed away from the inverting input and output
pins. Also, it is very important to keep the parasitic capaci-
tance across the feedback to an absolute minimum.
The PCB should have a ground plane covering all unused
portion of the component side of the board to provide a low
impedance path. All trace lengths should be minimized to re-
duce series inductance.
Supply bypassing is required for the amplifiers performance.
The bypass capacitors provide a low impedance return cur-
rent path at the supply pins. They also provide high frequency
filtering on the power supply traces. It is recommended that a
ceramic decoupling capacitor 0.1 µF chip should be placed
with one end connected to the ground plane and the other
side as close as possible to the power pins. An additional 10
µF tantalum electrolytic capacitor should be connected in par-
allel, to supply current for fast large signal changes at the
output.
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LMH6654/LMH6655
20016541
FIGURE 1.
EVALUATION BOARDS
National provides the following evaluation boards as a guide
for high frequency layout and as an aid in device testing and
characterization.
Device Package Evalulation
Board PN
LMH6654MF 5-Pin SOT-23 CLC730068
LMH6654MA 8-Pin SOIC CLC730027
LMH6655MA 8-Pin SOIC CLC730036
LMH6655MM 8-Pin MSOP CLC730123
The free evaluation board are shipped automatically when a
device sample request is placed with National Semiconduc-
tor.
The CLC730027 datasheet also contains tables of recom-
mended components to evaluate several of National’s high
speed amplifiers. This table for the LMH6654 is illustrated
below. Refer to the evaluation board datasheet for schemat-
ics and further information.
Components Needed to Evaluate the LMH6654 on the Eval-
uation Board:
RfRg use the datasheet to select values.
RIN, ROUT typically 50Ω (Refer to the Basic Operation
section of the evaluation board datasheet for details)
Rf is an optional resistor for inverting again configurations
(select Rf to yield desired input impedance = Rg||Rf)
C1, C2 use 0.1 µF ceramic capacitors
C3, C4 use 10 µF tantalum capacitors
Components not used:
1. C5, C6, C7, C8
2. R1 thru R8
The evaluation boards are designed to accommodate dual
supplies. The board can be modified to provide single oper-
ation. For best performance;
1) do not connect the unused supply.
2) ground the unused supply pin.
POWER DISSIPATION
The package power dissipation should be taken into account
when operating at high ambient temperature and/or high pow-
er dissipative conditions. In determining maximum operable
temperature of the device, make sure the total power dissi-
pation of the device is considered; this power dissipated in the
device with a load connected to the output as well as the
nominal dissipation of the op amp.
DRIVING CAPACITIVE LOADS
Capacitive loads decrease the phase margin of all op amps.
The output impedance of a feedback amplifier becomes in-
ductive at high frequencies, creating a resonant circuit when
the load is capacitive. This can lead to overshoot, ringing and
oscillation. To eliminate oscillation or reduce ringing, an iso-
lation resistor can be placed as shown in Figure 2 below. At
frequencies above
the load impedance of the Amplifier approaches RISO. The
desired performance depends on the value of the isolation
resistor. The isolation resistance vs. capacitance load graph
in the typical performance characteristics provides the means
for selection of the value of RS that provides 3 dB peaking
in closed loop AV = 1 response. In general, the bigger the
isolation resistor, the more damped the pulse response be-
comes. For initial evaluation, a 50 isolation resistor is rec-
ommended.
20016540
FIGURE 2.
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LMH6654/LMH6655
COMPONENTS SELECTION AND FEEDBACK RESISTOR
It is important in high-speed applications to keep all compo-
nent leads short since wires are inductive at high frequency.
For discrete components, choose carbon composition axially
leaded resistors and micro type capacitors. Surface mount
components are preferred over discrete components for min-
imum inductive effect. Never use wire wound type resistors in
high frequency applications.
Large values of feedback resistors can couple with parasitic
capacitance and cause undesired effects such as ringing or
oscillation in high-speed amplifiers. Keep resistors as low as
possible consistent with output loading consideration. For a
gain of 2 and higher, 402 feedback resistor used for the typ-
ical performance plots gives optimal performance. For unity
gain follower, a 25 feedback resistor is recommended rather
than a direct short. This effectively reduces the Q of what
would otherwise be a parasitic inductance (the feedback wire)
into the parasitic capacitance at the inverting input.
BIAS CURRENT CANCELLATION
In order to cancel the bias current errors of the non-inverting
configuration, the parallel combination of the gain setting Rg
and feedback Rf resistors should equal the equivalent source
resistance Rseq as defined in Figure 3. Combining this con-
straint with the non-inverting gain equation, allows both Rf and
Rg to be determined explicitly from the following equations:
Rf = AVRseq and Rg = Rf/(AV−1)
For inverting configuration, bias current cancellation is ac-
complished by placing a resistor Rb on the non-inverting input
equal in value to the resistance seen by the inverting input
(Rf//(Rg+Rs). The additional noise contribution of Rb can be
minimized through the use of a shunt capacitor.
20016542
FIGURE 3. Non-Inverting Amplifier Configuration
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LMH6654/LMH6655
20016543
FIGURE 4. Inverting Amplifier Configuration
TOTAL INPUT NOISE VS. SOURCE RESISTANCE
The noise model for the non-inverting amplifier configuration
showing all noise sources is described in Figure 5. In addition
to the intrinsic input voltage noise (en) and current
noise (in = in+ = in−) sources, there also exits thermal
voltage noise associated with each of the external
resistors. Equation 1 provides the general form for total equiv-
alent input voltage noise density (eni). Equation 2 is a simpli-
fication of Equation 1 that assumes
20016544
FIGURE 5. Non-Inverting Amplifier Noise Model
(1)
Rf||Rg=Rseq for bias current cancellation. Figure 6 illustrates
the equivalent noise model using this assumption. The total
equivalent output voltage noise (eno) is eni * AV.
20016545
FIGURE 6. Noise Model with Rf||Rg = Rseq
(2)
If bias current cancellation is not a requirement, then Rf||Rg
does not need to equal Rseq. In this case, according to Equa-
tion 1, RfRg should be as low as possible in order to minimize
noise. Results similar to Equation 1 are obtained for the in-
verting configuration on Figure 2 if Rseq is replaced by Rb and
Rg is replaced by Rg + Rs. With these substitutions, Equation
1 will yield an eni referred to the non-inverting input. Referring
to eni to the inverting input is easily accomplished by multi-
plying eni by the ration of non-inverting to inverting gains.
Noise Figure
Noise Figure (NF) is a measure of the noise degradation
caused by an amplifier.
(3)
The noise figure formula is shown is Equation 3. The addition
of a terminating resistor RT, reduces the external thermal
noise but increases the resulting NF.
The NF is increased because the RT reduces the input signal
amplitude thus reducing the input SNR.
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LMH6654/LMH6655
(4)
The noise figure is related to the equivalent source resistance
(Rseq) and the parallel combination of Rf and Rg. To minimize
noise figure, the following steps are recommended:
1. Minimize Rf||Rg
2. Choose the Optimum Rs (ROPT)
ROPT is the point at which the NF curve reaches a minimum
and is approximated by:
ROPT (en/in)
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LMH6654/LMH6655
Physical Dimensions inches (millimeters) unless otherwise noted
8-Pin SOIC
NS Package Number M08A
5-Pin SOT-23
NS Package Number MF05A
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LMH6654/LMH6655
8-Pin MSOP
NS Package Number MUA08A
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LMH6654/LMH6655
Notes
19 www.national.com
LMH6654/LMH6655
Notes
LMH6654/LMH6655 Single/Dual Low Power, 250 MHz, Low Noise Amplifiers
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