TLP7820 Photocouplers Optically Isolation Amplifiers TLP7820 1. Applications * Motor phase and rail current sensing * Power inverter current and voltage sensing 2. General The TLP7820 of isolation amplifiers is designed for current sensing in electronic motor drives. In a typical implementation, motor currents flow through an external resistor and the resulting analog voltage drop is sensed by the TLP7820. 3. Features (1) Gain accuracy: 0.5 % (Gain rank B) (2) Gain drift: 0.00012 V/V/% (typ.) (3) Nonlinearity (VIN = 200 mV): 0.02 % (typ.) (4) Input offset voltage: 0.9 mV (typ.) (5) VOUT bandwidth (-3 dB): 230 kHz (typ.) (6) Operating temperature range: -40 to 105 (7) Common-mode transient immunity: 15 kV/s (min) (8) Safety standards UL-approved: UL1577, File No.E67349 cUL-approved: CSA Component Acceptance Service No.5A File No.E67349 VDE-approved: EN60747-5-5, EN60065, EN60950-1, EN 62368-1 (Note 1) CQC-approved: GB4943.1, GB8898 Japan Factory Note 1: When a VDE approved type is needed, please designate the Option (D4) (D4). Start of commercial production (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 1 2015-09 2017-10-18 Rev.7.0 TLP7820 4. Packaging and Pin Assignment 11-6B1A 4.1. Pin Assignment Pin No. Symbol Description 1 VDD1 Input side supply voltage 2 VIN+ Positive input 3 VIN- Negative input 4 GND1 Input side ground 5 GND2 Output side ground 6 VOUT- Negative output 7 VOUT+ Positive output 8 VDD2 Output side supply voltage 5. Internal Circuit (Note) Note: A 0.1-F bypass capacitor must be connected between 1 and 4 pins and between 5 and 8 pins. 6. Principle of Operation 6.1. Mechanical Parameters Characteristics Size Unit Height 2.3 (max) mm Creepage distances 8.0 (min) Clearance 8.0 (min) Internal isolation thickness 0.4 (min) (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 2 2017-10-18 Rev.7.0 TLP7820 7. Absolute Maximum Ratings (Note) (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Supply Voltages Note Rating Unit VDD1, VDD2 -0.5 to 6 V Steady-state input voltages VIN+, VIN- -0.5 to VDD1 + 0.5 V Two-second transient input voltages VIN+, VIN- -6 to VDD1 + 0.5 V PD 72 mW PD/Ta -5.0 mW/ VOUT+, VOUT- -0.5 to VDD2 + 0.5 V Input power dissipation Input power dissipation derating (Ta 110.6 ) Output voltages Output power dissipation PO 60 mW PO/Ta -5.0 mW/ Operating temperature Topr -40 to 105 Storage temperature Tstg -55 to 125 Output power dissipation derating (Ta 113.0 ) Lead soldering temperature Isolation voltage (10 s) Tsol (Note 1) 260 (AC, 60 s, R.H. 60 %) BVS (Note 2) 5000 Vrms Note: Using continuously under heavy loads (e.g. the application of high temperature/current/voltage and the significant change in temperature, etc.) may cause this product to decrease in the reliability significantly even if the operating conditions (i.e. operating temperature/current/voltage, etc.) are within the absolute maximum ratings. Please design the appropriate reliability upon reviewing the Toshiba Semiconductor Reliability Handbook ("Handling Precautions"/"Derating Concept and Methods") and individual reliability data (i.e. reliability test report and estimated failure rate, etc). Note: Ceramic capacitors (0.1 F) should be connected between 1 and 4 pins and between 5 and 8 pins to stabilize the operation. Otherwise, this photocoupler may not switch properly. The bypass capacitors should be placed as close as possible to each pin. Note 1: 2 mm below seating plane. Note 2: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. 8. Recommended Operating Conditions (Note) Characteristics Symbol Note Min Typ. Max Unit V Input side supply voltage VDD1 4.5 5 5.5 Output side supply voltage VDD2 3 5.5 -200 200 mV -40 105 Analog input voltage VIN+, VIN- Ambient temperature Ta (Note 1), (Note 2) Note: The recommended operating conditions are given as a design guide necessary to obtain the intended performance of the device. Each parameter is an independent value. When creating a system design using this device, the electrical characteristics specified in this data sheet should also be considered. Note 1: Full-Scale Differential Voltage Input Range(FSR) = 300 mV (typ.) Note 2: When either VIN+ or VIN- or both are equal to or greater than VDD1 - 2 V (e.g., if VDD1 = 5 V, when VIN+ and/or VIN- are equal to or greater than 5 V - 2 V = 3 V), isolation amplifiers go into one of the test modes. Do not raise either VIN+ or VIN- above this voltage to keep the device in functional mode. (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 3 2017-10-18 Rev.7.0 TLP7820 9. Electrical Characteristics 9.1. DC Characteristics (Unless otherwise specified, Ta = -40 to 105 , VDD1 = 4.5 to 5.5 V, VDD2 = 3 to 5.5 V, VIN+ = -200 to 200 mV, VIN- = 0 V) Characteristics Symbol Input offset voltage Note Test Condition VOS Input offset voltage drift vs ambient temperature Ta = 25 |dVOS/dTa| Input offset voltage drift vs input side |dVOS/dVDD1| supply voltage Min Typ. Max Unit -0.6 0.9 2.4 mV 2 6 V/ 120 V/V V/V Gain (Rank B) G0 (Note 1) Ta = 25 8.16 8.2 8.24 Gain (Rank A) G1 (Note 1) Ta = 25 8.12 8.2 8.28 Gain (None) G3 (Note 1) Ta = 25 7.95 8.2 8.44 0.00012 V/V/ 0.02 0.13 % 0.00007 %/ 0.015 0.06 % V Gain drift vs ambient temperature VOUT non-linearity (200 mV) |dG/dTa| NL200 VOUT non-linearity (200 mV) drift vs ambient temperature VOUT non-linearity (100 mV) |dNL200/dTa| NL100 High-level output voltage Low-level output voltage Input common-mode rejection ratio (Note 2) VIN+ = -200 to 200 mV, Ta = 25 (Note 2) VIN+ = -100 to 100 mV, Ta = 25 VOH VIN+ = 400 mV, Ta = 25 2.497 VOL VIN+ = -400 mV, Ta = 25 0.0009 V 80 dB CMRRIN Equivalent input resistance RIN 80 k Input bias current IIN+ VIN+ = 0 V, Ta = 25 -1 -0.055 A Input side supply current (VDD1) IDD1 VIN+ = 0 V 8.6 12 mA Output side supply current (VDD2) IDD2 VIN+ = 0 V 6.2 10 mA VOUT output resistance ROUT VOUT+ or VOUT- 21 Note 1: See section 9.1.1. for gain rank values. Note 2: The slope of the optimum line is derived by the method of least squares between differential input voltage (VIN+ - VIN-) and differential output voltage (VOUT+ - VOUT-). Nonlinearity is defined as a fraction of the half of the peak-to-peak value of differential output voltage deviation divided by the full-scale differential output voltage (OVR). 9.1.1. Gain Rank (Note) (Unless otherwise specified, Ta = 25 ) Rank None (3 %) Rank A (1 %) Rank B (0.5 %) Note: Note: (Min) Gain (Typ.) (Max) Blank, A, B 7.95 8.2 8.44 A, B 8.12 8.2 8.28 B 8.16 8.2 8.24 Gain Rank Marking Unit V/V The gain is defined as the slope of the optimum line derived by the method of least squares between differential input voltage (VIN+ - VIN-) and differential output voltage (VOUT+ - VOUT-) in the recommended voltage range. Specify both the part number and a rank in this format when ordering. Example: Rank B: TLP7820(B (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 4 2017-10-18 Rev.7.0 TLP7820 10. AC Characteristics (Note) (Unless otherwise specified, Ta = -40 to 105 , VDD1 = 4.5 to 5.5 V, VDD2 = 3 to 5.5 V) Characteristics Symbol Test Condition Min Typ. Max Unit 140 230 kHz 1.9 2.3 s VOUT bandwidth (-3 dB) f-3dB VIN+ = 400 mVp-p , sine wave VIN to VOUT propagation delay time (10 %-10 %) tpD10 VIN+ = 0 to 200 mV/s step CL = 15 pF VIN to VOUT propagation delay time (50 %-50 %) tpD50 2.3 2.6 VIN to VOUT propagation delay time (90 %-90 %) tpD90 2.8 3.3 tr 1.7 VOUT rise time VOUT fall time tf Common-mode transient immunity Note: CMTI 1.7 15 20 kV/s Min Typ. Max Unit 1.0 pF 1014 5000 Vrms AC, 1 s in oil 10000 DC, 60 s in oil 10000 VCM = 1 kV, Ta = 25 All typical values are at Ta = 25 . CL is approximately 15 pF which includes probe and stray wiring capacitance. 11. Isolation Characteristics (Unless otherwise specified, Ta = 25 ) Characteristics Symbol Total capacitance (input to output) CS Isolation resistance Isolation voltage RS BVS Note Test Condition (Note 1) VS = 0 V, f = 1 MHz (Note 1) VS = 500 V, R.H. 60 % (Note 1) AC, 60 s 1x 1012 Vdc Note 1: This device is considered as a two-terminal device: Pins 1, 2, 3 and 4 are shorted together, and pins 5, 6, 7 and 8 are shorted together. (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 5 2017-10-18 Rev.7.0 TLP7820 12. Characteristics Curves (Note) Fig. 12.1 VOS - VDD1 Fig. 12.2 VOS - VDD2 Fig. 12.3 VOS - Ta Fig. 12.4 G - VDD1 Fig. 12.5 G - VDD2 Fig. 12.6 G - Ta (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 6 2017-10-18 Rev.7.0 TLP7820 Fig. 12.7 NL - Ta Fig. 12.8 VOUT - VIN+ Fig. 12.9 IIN+ - VIN+ Fig. 12.10 RIN - Ta Fig. 12.11 G[dB] - f Fig. 12.12 Switching Time - Ta (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 7 2017-10-18 Rev.7.0 TLP7820 Fig. 12.13 IDD - VIN+ Note: The above characteristics curves are presented for reference only and not guaranteed by production test, unless otherwise noted. (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 8 2017-10-18 Rev.7.0 TLP7820 13. Soldering and Storage 13.1. Precautions for Soldering The soldering temperature should be controlled as closely as possible to the conditions shown below, irrespective of whether a soldering iron or a reflow soldering method is used. * When using soldering reflow. The soldering temperature profile is based on the package surface temperature. (See the figure shown below, which is based on the package surface temperature.) Reflow soldering must be performed once or twice. The mounting should be completed with the interval from the first to the last mountings being 2 weeks. An Example of a Temperature Profile When Lead(Pb)-Free Solder Is Used * When using soldering flow Preheat the device at a temperature of 150 (package surface temperature) for 60 to 120 seconds. Mounting condition of 260 within 10 seconds is recommended. Flow soldering must be performed once. * When using soldering Iron Complete soldering within 10 seconds for lead temperature not exceeding 260 or within 3 seconds not exceeding 350 Heating by soldering iron must be done only once per lead. 13.2. Precautions for General Storage * Avoid storage locations where devices may be exposed to moisture or direct sunlight. * Follow the precautions printed on the packing label of the device for transportation and storage. * Keep the storage location temperature and humidity within a range of 5 to 35 and 45 % to 75 %, respectively. * Do not store the products in locations with poisonous gases (especially corrosive gases) or in dusty conditions. * Store the products in locations with minimal temperature fluctuations. Rapid temperature changes during storage can cause condensation, resulting in lead oxidation or corrosion, which will deteriorate the solderability of the leads. * When restoring devices after removal from their packing, use anti-static containers. * Do not allow loads to be applied directly to devices while they are in storage. * If devices have been stored for more than two years under normal storage conditions, it is recommended that you check the leads for ease of soldering prior to use. (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 9 2017-10-18 Rev.7.0 TLP7820 14. Land Pattern Dimensions (for reference only) Unit: mm 15. Marking (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 10 2017-10-18 Rev.7.0 TLP7820 16. EN60747-5-5 Option (D4) Specification * Part number: TLP7820 (Note 1) * The following part naming conventions are used for the devices that have been qualified according to option (D4) of EN60747. Example: TLP7820(D4ATP4,E(O D4 : EN60747 option A : Gain rank TP4 : Tape type E : [[G]]/RoHS COMPATIBLE (Note 2) O : Domestic ID (Country/Region of origin: Japan) Note 1: Use TOSHIBA standard type number for safety standard application. e.g., TLP7820(D4ATP4,E(O TLP7820 Note 2: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. Fig. 16.1 EN60747 Insulation Characteristics (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 11 2017-10-18 Rev.7.0 TLP7820 Fig. 16.2 Insulation Related Specifications (Note) Note: This photocoupler is suitable for safe electrical isolation only within the safety limit data. Maintenance of the safety data shall be ensured by means of protective circuits. Fig. 16.3 Marking on Packing for EN60747 Fig. 16.4 Marking Example (Note) Note: The above marking is applied to the photocouplers that have been qualified according to option (D4) of EN60747. (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 12 2017-10-18 Rev.7.0 TLP7820 Fig. 16.5 Measurement Procedure (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 13 2017-10-18 Rev.7.0 TLP7820 17. Specifications for Embossed-Tape Packing 17.1. Applicable Package Package Name Product Type SO8L(LF4) Long creepage mini flat coupler 17.2. Product Naming Conventions Type of package used for shipment is denoted by a symbol suffix after a part number. The method of classification is as below. Example) TLP7820(A-TP4,E(O Part number: TLP7820 Gain rank: A Tape type: TP4 [[G]]/RoHS COMPATIBLE: E (Note 1) Domestic ID (Country/Region of origin: Japan): O Note 1: Please contact your Toshiba sales representative for details on environmental information such as the product's RoHS compatibility. RoHS is the Directive 2011/65/EU of the European Parliament and of the Council of 8 June 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment. 17.3. Tape Dimensions Specification Tape type Quantity (pcs/reel) TP4 1500 17.3.1. Orientation of Device in Relation to Direction of Feed Device orientation in the carrier cavities as shown in the following figure. Device Orientation 17.3.2. Empty Cavities Characteristics Criterion Occurrences of 2 or more successive empty cavities Single empty cavity Remarks 0 device Within any given 40-mm section of tape, not including leader and trailer 6 devices (max) per reel Not including leader and trailer 17.3.3. Tape Leader and Trailer The start end of the tape has 50 or more empty cavities. The hub end of the tape has 50 or more empty cavities and two empty turns only for a cover tape. (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 14 2017-10-18 Rev.7.0 TLP7820 17.3.4. Tape Dimensions Tape material: Plastic (for protection against static electricity) Table Tape Dimensions (unit: mm, unless otherwise specified : 0.1) Symbol Dimension Remark A 11.55 B 6.35 D 7.5 Center line of embossed cavity and sprocket hole E 1.75 Distance between tape edge and sprocket hole center F 16.0 Cumulative error +0.1/-0.3 (max) per 10 empty cavities holes G 4.0 Cumulative error +0.1/-0.3 (max) per 10 sprocket holes K0 2.4 Internal space (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 15 2017-10-18 Rev.7.0 TLP7820 17.3.5. Reel Specification Material: Plastic (for protection against static electricity) Table Reel Dimensions (unit: mm) Symbol Dimension A 330 2 B 100 1 C 13 0.5 E 2.0 0.5 U 4.0 0.5 W1 17.4 1.0 W2 21.4 1.0 17.4. Packing (Note) 1 reel/carton (unit: mm) Note: Taping reel diameter: 330 mm (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 16 2017-10-18 Rev.7.0 TLP7820 17.5. Label Format (1) Carton: The label provides the part number, quantity, lot number, the Toshiba logo, etc. (2) Reel: The label provides the part number, the taping name, quantity, lot number, etc. (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 17 2017-10-18 Rev.7.0 TLP7820 Package Dimensions Unit: mm Weight: 0.205 g (typ.) Package Name(s) TOSHIBA: 11-6B1A (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 18 2017-10-18 Rev.7.0 TLP7820 RESTRICTIONS ON PRODUCT USE Toshiba Corporation and its subsidiaries and affiliates are collectively referred to as "TOSHIBA". Hardware, software and systems described in this document are collectively referred to as "Product". * TOSHIBA reserves the right to make changes to the information in this document and related Product without notice. * This document and any information herein may not be reproduced without prior written permission from TOSHIBA. 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Please use Product in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances, including without limitation, the EU RoHS Directive. TOSHIBA ASSUMES NO LIABILITY FOR DAMAGES OR LOSSES OCCURRING AS A RESULT OF NONCOMPLIANCE WITH APPLICABLE LAWS AND REGULATIONS. (c)2016-2017 Toshiba Electronic Devices & Storage Corporation 19 2017-10-18 Rev.7.0