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©2011 Littelfuse
PGB1 Series
Specifications are subject to change without notice.
3
Revised: January 11, 2012
PulseGuard® Suppressors
Surface Mount Polymeric ESD Suppressors
Environmental Specifications
Operating Temperature -65°C to +125°C
Moisture Resistance
0402 series:
¡$3)IPVST
0603, ST23:
¡$3)IPVST
Thermal Shock
.*-45%.FUIPE
-65°C to 125°C, 30 min. cycle,
10 cycles
Vibration
.*-45%.FUIPE
to 55 to 10 Hz, 1 min. cycle, 2
hrs each in X-Y-Z)
Chemical Resistance .*-45%.FUIPE
Solder Leach Resistance and
Terminal Adhesion *1$&*"+45%
Physical Specifications
Materials #PEZ(MBTT&QPYZ
5FSNJOBUJPOT$PQQFS/JDLFM5JO
Solderability .*-45%.FUIPE
Soldering
Parameters
8BWFTPMEFS¡$TFDPOETNBYJNVN
3FnPXTPMEFS¡$TFDPOETNBYJNVN
Design Consideration
Because of the fast rise-time of the ESD transient, proper
QMBDFNFOUPG1VMTF(VBSETVQQSFTTPSTBSFBLFZEFTJHO
consideration to achieving optimal ESD suppression. The
devices should be placed on the circuit board as close to the
source of the ESD transient as possible. Install PulseGuard
TVQQSFTTPSTDPOOFDUFEGSPNTJHOBMEBUBMJOFUPHSPVOE
directly behind the connector so that they are the first board-
level circuit component encountered by the ESD transient.
Soldering Parameters
Reflow Condition 1Co'SFFBTTFNCMZ
Pre Heat
- Temperature Min (Ts(min))150°C
- Temperature Max (Ts(max))200°C
- Time (min to max) (ts)oTFDPOET
Average ramp up rate (Liquidus Temp
(TL) to peak ¡$TFDPOENBY
TS(max) to TL - Ramp-up Rate ¡$TFDPOENBY
Reflow - Temperature (TL) (Liquidus) ¡$
- Temperature (tL)60 – 150 seconds
Peak Temperature (TP)260°C
Time within 5°C of actual peak
Temperature (tp)10 – 30 seconds
Ramp-down Rate ¡$TFDPOENBY
Time 25°C to peak Temperature (TP)NJOVUFTNBY
#BTFEPO*1$+&%&$+45%