BZT52C10Q-13-F - DIODES Incorporated

BZT52C2V0 - BZT52C51

Document number: DS18004 Rev. 35 - 2 1 of 5

www.diodes.com May 2012

BZT52C2V0 - BZT52C51

SURFACE MOUNT ZENER DIO DE

Features

• Planar Die Construction

• 500mW Power Dissipation

• General Purpose, Medium Current

• Ideally Suited for Automated Assembly Processes

• Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)

• Halogen and Antimony Free. “Green” Device (Notes 3 & 4)

• Qualified to AEC-Q101 Standards for High Reliability

Mechanical Data

• Case: SOD123

• Case Material: Molded Plastic. UL Flammability Classification

Rating 94V-0

• Moisture Sensitivity: Level 1 per J-STD-020

• Terminals: Matte Tin Finish annealed over Alloy 42 leadframe

(Lead Free Plating). Solderable per MIL-STD-202, Method 208

• Polarity: Cathode Band

• Weight: 0.010 grams (approximate)

Ordering Information (Notes 5 & 6)

Part Number Qualification Case Packaging

(Type Number)-7-F Commercial SOD123 3000/Tape & Reel

(Type Number)Q-7-F Automotive SOD123 3000/Tape & Reel

(Type Number)-13-F Commercial SOD123 10,000/Tape & Reel

(Type Number)Q-13-F Automotive SOD123 10,000/Tape & Reel

Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.

2. See http://www.diodes.com for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and Lead-free.

3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and

<1000ppm antimony compounds.

4. Product manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound. Product manufactured prior to Date

Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire Retardants.

5. For packaging details, go to our website at http://www.diodes.com.

6. For (Type Number), please see the Electrical Characteristics Table. Example: 6.2V Zener = BZT52C6V2Q-13-F.

Marking Information

Date Code Key

Year 2002 2003 2004 2005 2006 2007 2008 2009 2010 2011 2012 2013 2014 2015 2016 2017

Code N P R S T U V W X Y Z A B C D E

Month Jan Feb Mar Apr May Jun Jul Aug Sep Oct Nov Dec

Code 1 2 3 4 5 6 7 8 9 O N D

Top View

xx = Product Type Marking Code

(See Electrical Characteristics Table)

YM = Date Code Marking

Y = Year (ex: N = 2002)

M = Month (ex: 9 = September)

SOD123

BZT52C2V0 - BZT52C51

Document number: DS18004 Rev. 35 - 2 2 of 5

www.diodes.com May 2012

BZT52C2V0 - BZT52C51

Maximum Ratings @TA = 25°C unless otherwise specified

Single phase, half wave, 60Hz, resistive or inductive load.

For capacitance load, derate current by 20%.

Characteristic Symbol Value Unit

Forward Voltage @ IF = 10mA VF 0.9 V

Thermal Characteristics

Characteristic Symbol Value Unit

Power Dissipation (Note 7) @TL = 75°C PD 500 mW

Thermal Resistance, Junction to Ambient Air (Note 7) R

JA 350 °C/W

Thermal Resistance, Junction to Lead (Note 8) R

JL 150 °C/W

Operating and Storage Temperature Range TJ, TSTG -65 to +150 °C

Electrical Characteristics @TA = 25°C unless otherwise specified

Type

Number Marking

Codes

Zener Voltage Range

(Note 9)

Maximum Zener

Impedance

f = 1kHz

Maximum

Reverse

Current

(Note 9)

Temperature

Coefficient

@ IZTC

mV/°C

Test

Current

IZTC

VZ @ IZT IZT Z

ZT @ IZT ZZ

@ IZK IZ

IR @ VR

Nom

(V) Min (V) Max (V) mA Ω mA uA V Min Max mA

BZT52C2V0 WY 2.0 1.91 2.09 5 100 600 1.0 150 1.0 -3.5 0 5

BZT52C2V4 WX 2.4 2.2 2.6 5 100 600 1.0 50 1.0 -3.5 0 5

BZT52C2V7 W1 2.7 2.5 2.9 5 100 600 1.0 20 1.0 -3.5 0 5

BZT52C3V0 W2 3.0 2.8 3.2 5 95 600 1.0 10 1.0 -3.5 0 5

BZT52C3V3 W3 3.3 3.1 3.5 5 95 600 1.0 5.0 1.0 -3.5 0 5

BZT52C3V6 W4 3.6 3.4 3.8 5 90 600 1.0 5.0 1.0 -3.5 0 5

BZT52C3V9 W5 3.9 3.7 4.1 5 90 600 1.0 3.0 1.0 -3.5 0 5

BZT52C4V3 W6 4.3 4.0 4.6 5 90 600 1.0 3.0 1.0 -3.5 0 5

BZT52C4V7 W7 4.7 4.4 5.0 5 80 500 1.0 3.0 2.0 -3.5 0.2 5

BZT52C5V1 W8 5.1 4.8 5.4 5 60 480 1.0 2.0 2.0 -2.7 1.2 5

BZT52C5V6 W9 5.6 5.2 6.0 5 40 400 1.0 1.0 2.0 -2 2.5 5

BZT52C6V2 WA 6.2 5.8 6.6 5 10 150 1.0 3.0 4.0 0.4 3.7 5

BZT52C6V8 WB 6.8 6.4 7.2 5 15 80 1.0 2.0 4.0 1.2 4.5 5

BZT52C7V5 WC 7.5 7.0 7.9 5 15 80 1.0 1.0 5.0 2.5 5.3 5

BZT52C8V2 WD 8.2 7.7 8.7 5 15 80 1.0 0.7 5.0 3.2 6.2 5

BZT52C9V1 WE 9.1 8.5 9.6 5 15 100 1.0 0.5 6.0 3.8 7.0 5

BZT52C10 WF 10 9.4 10.6 5 20 150 1.0 0.2 7.0 4.5 8.0 5

BZT52C11 WG 11 10.4 11.6 5 20 150 1.0 0.1 8.0 5.4 9.0 5

BZT52C12 WH 12 11.4 12.7 5 25 150 1.0 0.1 8.0 6.0 10.0 5

BZT52C13 WI 13 12.4 14.1 5 30 170 1.0 0.1 8.0 7.0 11.0 5

BZT52C15 WJ 15 13.8 15.6 5 30 200 1.0 0.1 10.5 9.2 13.0 5

BZT52C16 WK 16 15.3 17.1 5 40 200 1.0 0.1 11.2 10.4 14.0 5

BZT52C18 WL 18 16.8 19.1 5 45 225 1.0 0.1 12.6 12.4 16.0 5

BZT52C20 WM 20 18.8 21.2 5 55 225 1.0 0.1 14.0 14.4 18.0 5

BZT52C22 WN 22 20.8 23.3 5 55 250 1.0 0.1 15.4 16.4 - 5

BZT52C24 WO 24 22.8 25.6 5 70 250 1.0 0.1 16.8 18.4 - 5

BZT52C27 WP 27 25.1 28.9 2 80 300 0.5 0.1 18.9 21.4 - 2

BZT52C30 WQ 30 28.0 32.0 2 80 300 0.5 0.1 21.0 24.4 - 2

BZT52C33 WR 33 31.0 35.0 2 80 325 0.5 0.1 23.1 27.4 - 2

BZT52C36 WS 36 34.0 38.0 2 90 350 0.5 0.1 25.2 30.4 - 2

BZT52C39 WT 39 37.0 41.0 2 130 350 0.5 0.1 27.3 33.4 - 2

BZT52C43 WU 43 40.0 46.0 5 100 700 1.0 0.1 32.0 37.6 - 5

BZT52C47 WV 47 44.0 50.0 5 100 750 1.0 0.1 35.0 42.0 - 5

BZT52C51 WW 51 48.0 54.0 5 100 750 1.0 0.1 38.0 46.6 - 5

Notes: 7. Device mounted on FR-4 substrate, single-sided PCB with suggested pad layout.

8. Thermal Resistance measurement obtained via infrared scan method. Specification valid for BZT52C2V0 - BZT52C39 devices only.

9. Short duration pulse test used to minimize self-heating effect.

BZT52C2V0 - BZT52C51

Document number: DS18004 Rev. 35 - 2 3 of 5

www.diodes.com May 2012

BZT52C2V0 - BZT52C51

0.1

0.2

0.3

0.4

0.5

25050

75 100 125 150

DISSI

(W)

T , AMBIENT TEMPERA TURE ( C)

Fig. 1 Power Derating Curve

0.6

Note 7

0246810

V , ZENER VOLTAGE (V)

Fig . 2 Typ ical Zene r Bre akd ow n C haracter istics

I, ZENE

(mA)

C2V0

C2V4

C2V7

C3V0

C3V3

C3V6

C3V9 C4V3

C4V7

C5V1

C5V6

C6V2

C6V8

C7V5

I, ZE

(mA)

V , Z ENER VOLTAGE (V)

Fi g. 3 Typi ca l Zener B r ea kdo w n C ha r acter i s t ics

10 20 30 40

T = 25°C

Test Current I

5mA

Test Current I

2mA

C10

C12

C18

C22

C27

C33 C36

C15

020 30 40 50 60 70 80 90 100

I, ZE

(mA)

V , ZENER VOL TAGE (V)

Fig. 4 Typical Zener Breakdown Characteristics

C , TOTAL CAPACITANCE (pF)

100

1,000

10 1001V , NOMINAL ZENER VOLTAGE (V)

Fig. 5 Typical Total Capacitance vs. Nominal Zener Voltage

T = 25 °C

f = 1MHz

V = 1V

V = 2V

V = 1V

V = 2V

BZT52C2V0 - BZT52C51

Document number: DS18004 Rev. 35 - 2 4 of 5

www.diodes.com May 2012

BZT52C2V0 - BZT52C51

Package Outline Dimensions

Suggested Pad Layout

SOD123

Dim Min Max

A 0.55 Typ

B 1.40 1.70

C 3.55 3.85

H 2.55 2.85

J 0.00 0.10

K 1.00 1.35

L 0.25 0.40

M 0.10 0.15

α 0 8°

All Dimensions in mm

Dimensions Value (in mm)

Z 4.9

G 2.5

X 0.7

Y 1.2

C 3.7

BZT52C2V0 - BZT52C51

Document number: DS18004 Rev. 35 - 2 5 of 5

www.diodes.com May 2012

BZT52C2V0 - BZT52C51

IMPORTANT NOTICE

DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,

INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE

(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).

Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes

without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the

application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or

trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume

all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated

website, harmless against all damages.

Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.

Should Customers purchase or use Diodes Incorporated p roducts for any unintended or una uthorized application, Customers shall indemnify and

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indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.

Products described herein may be covered by one or more United States, international or foreign p atents pending. Product names and markings

noted herein may also be covered by one or more United States, international or foreign trademarks.

LIFE SUPPORT

Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express

written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:

A. Life support devices or systems are devices or systems which:

1. are intended to implant into the body, or

2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the

labeling can be reasonably expected to result in significant injury to the user.

B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the

failure of the life support device or to affect its safety or effectiveness.

Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and

acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their pro ducts and an y

use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related

information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its

representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.