DDZ5V1B - DDZ43
Document number: DS30407 Rev. 20 - 2
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DDZ5V1B - DDZ43
SURFACE MOUNT PRECISION ZENER DIODE
Features
Very Tight Tolerance on VZ
Ideally Suited for Automated Assembly Processes
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
PPAP Capable (Note 4)
Mechanical Data
Case: SOD123
Case Material: Molded Plastic, “Green Molding Compound”.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminal Connections: Cathode Band
Terminals: Finish - Matte Tin Annealed over Alloy 42
Leadframe. Solderable per MIL-STD-202, Method 208
Weight: 0.01 grams (Approximate)
Ordering Information (Notes 4 & 5)
Part Number
Case
Packaging
DDZ(VZ Rank)-7*
SOD123
3,000/Tape & Reel
DDZ(VZ Rank)Q-7*
SOD123
3,000/Tape & Reel
* Example: The part number for the 6.2 Volt device would be DDZ6V2B-7.
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS) & 2011/65/EU (RoHS 2) compliant.
2. See http://www.diodes.com/quality/lead_free.html for more information about Diodes Incorporated‟s definitions of Halogen- and Antimony-free, "Green"
and Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. Automotive products are AEC-Q101 qualified and are PPAP capable. Automotive, AEC-Q101 and standard products are electrically and thermally the
same, except where specified. For more information, please refer to http://www.diodes.com/quality/product_compliance_definitions/.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year
2003
2004
…
2012
2013
2014
2015
2016
2017
2018
2019
2020
Code
P
R
…
Z
A
B
C
D
E
F
G
H
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
Top View
xx = Product Type Marking Code
(See Electrical Characteristics Table)
YM = Date Code Marking
Y = Year (ex: E = 2017)
M = Month (ex: 9 = September)
xx
YM
SOD123
xx
YM
DDZ5V1B - DDZ43
Document number: DS30407 Rev. 20 - 2
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December 2017
© Diodes Incorporated
DDZ5V1B - DDZ43
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Forward Voltage @ IF = 10mA
VF
0.9
V
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 6) @TL = +75°C
PD
500
mW
Power Dissipation (Note 7) @TA = +25°C
PD
470
mW
Power Dissipation (Note 8) @TA = +25°C
PD
294
mW
Thermal Resistance, Junction to Ambient Air (Note 7)
RθJA
266
°C/W
Thermal Resistance, Junction to Ambient Air (Note 8)
RθJA
425
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Type Number
Marking Code
Zener Voltage Range
(Note 9)
Maximum Zener Impedance
f = 1kHz
Maximum Reverse
Current (Note 9)
VZ @ IZT
IZT
ZZT @ IZT
ZZK @ IZK
IZK
IR
@ VR
Min (V)
Max (V)
mA
Ω
mA
µA
V
DDZ5V1B
KM
4.94
5.20
20
17
480
1
5
1.5
DDZ5V6B
KN
5.45
5.73
20
11
400
1
0.5
2.5
DDZ6V2B
KO
5.96
6.27
20
7
150
1
0.5
4.0
DDZ6V8B
KP
6.49
6.83
20
5
150
0.5
0.5
5.0
DDZ6V8C
YP
6.66
7.01
20
5
150
0.5
0.5
5.0
DDZ7V5B
KQ
7.07
7.45
20
6
120
0.5
0.5
6.0
DDZ7V5C
YQ
7.29
7.67
20
6
120
0.5
0.5
6.0
DDZ8V2B
KR
7.78
8.19
20
8
120
0.5
0.5
6.5
DDZ8V2C
YR
8.03
8.45
20
8
120
0.5
0.5
6.5
DDZ9V1B
KS
8.57
9.01
20
8
120
0.5
0.5
7.0
DDZ9V1C
YS
8.83
9.30
20
8
120
0.5
0.5
7.0
DDZ10B
KT
9.41
9.90
20
8
120
0.5
0.1
8.0
DDZ10C
YT
9.70
10.20
20
8
120
0.5
0.1
8.0
DDZ11B
KU
10.50
11.05
10
10
120
0.5
0.1
8.4
DDZ11C
YU
10.82
11.38
10
10
120
0.5
0.1
8.4
DDZ12B
KV
11.44
12.03
10
12
110
0.5
0.1
9.1
DDZ12C
YV
11.74
12.35
10
12
110
0.5
0.1
9.1
DDZ13B
KW
12.55
13.21
10
14
110
0.5
0.1
10.0
DDZ14
GX
13.65
14.35
10
16
110
0.5
0.05
11.0
DDZ14B
KX
13.89
14.62
10
16
110
0.5
0.05
11.0
DDZ15
GY
14.80
15.57
10
18
150
0.5
0.05
12.0
DDZ16B
KY
15.25
16.04
10
18
150
0.5
0.05
12.0
DDZ16
YY
15.69
16.51
10
18
150
0.5
0.05
12.0
DDZ17
KZ
16.82
17.70
10
23
150
0.5
0.05
14.0
DDZ18C
YZ
17.42
18.33
10
23
150
0.5
0.05
14.0
DDZ19
ZJ
18.63
19.59
10
28
200
0.5
0.05
15.0
DDZ20C
PJ
19.23
20.22
10
28
200
0.5
0.05
15.0
DDZ21
ZK
20.64
21.71
5
30
200
0.5
0.05
17.0
DDZ22D
2K
21.52
22.63
5
30
200
0.5
0.05
17.0
DDZ23
ZL
22.61
23.77
5
35
200
0.5
0.05
19.0
DDZ24C
PL
23.12
24.31
5
35
200
0.5
0.05
19.0
DDZ26
ZM
24.97
26.26
5
45
250
0.5
0.05
21.0
DDZ27D
2M
26.29
27.64
5
45
250
0.5
0.05
21.0
DDZ28
ZN
27.70
29.13
5
55
250
0.5
0.05
23.0
DDZ30D
2N
29.02
30.51
5
55
250
0.5
0.05
23.0
DDZ31
ZO
30.32
31.88
5
65
250
0.5
0.05
25.0
DDZ33
RP
32.14
33.79
5
75
250
0.5
0.05
27.0
DDZ34
ZP
32.79
34.49
5
75
250
0.5
0.05
27.0
DDZ36
ZQ
35.36
37.19
5
85
250
0.5
0.05
30.0
DDZ39F
5Q
38.02
39.98
5
85
250
0.5
0.05
30.0
DDZ43
ZR
42.14
43.86
5
90
0.05
33.0
Notes: 6. RΘJL = 132°C/W
7. Device mounted on FR-4 PC board, single-sided, 25mm x 25mm x 1.6mm, 2oz copper traces, with copper pad area 1in2.
8. Device mounted on FR-4 PC board, single-sided, 25mm x 25mm x 1.6mm, 2oz copper traces with 1x minimum recommended pad layout.
9. Short duration pulse test used to minimize self-heating effect.
DDZ5V1B - DDZ43
Document number: DS30407 Rev. 20 - 2
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© Diodes Incorporated
DDZ5V1B - DDZ43
P , POWER DISSIPATION (W)
D
Figure 1 Power Derating Curve
T , AMBIENT TEMPERATURE (°C)
A
Note 7
Note 8
0
0.05
0.1
0.15
0.2
0.25
0.3
0.35
0.4
0.45
025 50 75 100 125 150
00.2 0.4 0.6 0.8 1.2
1.0
I , INSTANTANEOUS FORWARD CURRENT (mA)
F
V , INSTANTANEOUS FORWARD VOLTAGE (V)
Fig. 2 Typical Forward Characteristics
F
100
10
1.0
0.1
0.01
1,000
10n
100n
1m
0 5
I , ZENER CURRENT (A)
Z
V , ZENER VOLTAGE (V)
Fig. 3 Typical Zener Breakdown Characteristics
Z
10m
100m
10 15 20 25 30 35 40 45
5V6B
8V2C
9V1C
10C
11C
12C
13B
6V2B
6V8C
7V5C
14
15
16
20C
18C
22D
24C
27D
33
36
43
5V1B
DDZ5V1B - DDZ43
Document number: DS30407 Rev. 20 - 2
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DDZ5V1B - DDZ43
1m
100n
10m
100m
4.0 6.0 8.0 10.0
I , ZENER CURRENT (A)
Z
V , ZENER VOLTAGE (V)
Fig. 4 Typical Zener Breakdown Characteristics,
DDZ5V1B - DDZ9V1C
Z
5.0 7.0 9.0
8.0 11.0 13.0 15.0
I , ZENER CURRENT (A)
Z
V , ZENER VOLTAGE (V)
Fig. 5 Typical Zener Breakdown Characteristics,
DDZ10C - DDZ14
Z
10.0 12.0 14.0
1m
100n
10m
100m
14 16 18 20
I , ZENER CURRENT (A)
Z
V , ZENER VOLTAGE (V)
Fig. 6 Typical Zener Breakdown Characteristics,
DDZ15 - DDZ18C
Z
15 17 19
1m
100n
10m
100m
19 21 23 25
I , ZENER CURRENT (A)
Z
V , ZENER VOLTAGE (V)
Fig. 7 Typical Zener Breakdown Characteristics,
DDZ20C - DDZ24C
Z
20 22 24
1m
100n
10m
100m
26 30 34 38
I , ZENER CURRENT (A)
Z
V , ZENER VOLTAGE (V)
Fig. 8 Typical Zener Breakdown Characteristics,
DDZ27D - DDZ36
Z
28 32 36
1m
100n
10m
100m
38 42 46 50
I , ZENER CURRENT (A)
Z
V , ZENER VOLTAGE (V)
Fig. 9 Typical Zener Breakdown Characteristics, DDZ43
Z
40 44 48
1m
100n
10m
100m
DDZ5V1B - DDZ43
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DDZ5V1B - DDZ43
C , TOTAL CAPACITANCE (pF)
T
1
10
100
10 100
1V , NOMINAL ZENER VOLTAGE (V)
Fig. 10 Typical Total Capacitance vs. Nominal Zener Voltage
Z
T = 25
癈
f = 1MHz
J
V = 2V
R
V =1V
R
0.1
10
100
1
1,000
10,000
5.0 6.0 7.0 8.0 9.0 10.0 11.0 12
V , ZENER VOLTAGE (V)
Fig. 11 Typical Zener Impedance Characteristics,
DDZ5V6B - DDZ12C
Z
0.1
10
100
1
1,000
10,000
12 13 14 15 16 17 18
V , ZENER VOLTAGE (V)
Fig. 12 Typical Zener Impedance Characteristics,
DDZ12C - DDZ18C
Z
0.1
10
100
1
1,000
10,000
18 19 20 21 22 23 24
V , ZENER VOLTAGE (V)
Fig. 13 Typical Zener Impedance Characteristics,
DDZ18C - DDZ24C
Z
0.1
10
100
1
1,000
10,000
24 26 28 30 32 34
V , ZENER VOLTAGE (V)
Fig. 14 Typical Zener Impedance Characteristics,
DDZ24C - DDZ33
Z
0.1
10
100
1
1,000
10,000
36 38 40 42 44 46 48
V , ZENER VOLTAGE (V)
Fig. 15 Typical Zener Impedance Characteristics,
DDZ36 - DDZ43
Z
°C
DDZ5V1B - DDZ43
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DDZ5V1B - DDZ43
-0.08
0.12
-0.04
-0.06
0 6 10
TC of V , TEMPERATURE COEFFICIENT
OF ZENER VOLTAGE (%/°C)
Z
V , ZENER VOLTAGE (V)
Fig. 16 Typical Temperature Coefficient of
Zener Voltage vs. Zener Voltage, DDZ5V1B-DDZ10C
Z
42 8
-0.02
0
0.02
0.04
0.06
0.08
0.10
-0.08
0.12
-0.04
-0.06
10 16 20
TC of V , TEMPERATURE COEFFICIENT
OF ZENER VOLTAGE (%/°C)
Z
V , ZENER VOLTAGE (V)
Fig. 17 Typical Temperature Coefficient of
Zener Voltage vs. Zener Voltage, DDZ10C-DDZ20C
Z14
12 18
-0.02
0
0.02
0.04
0.06
0.08
0.10
-0.08
0.12
-0.04
-0.06
20 26 30
TC of V , TEMPERATURE COEFFICIENT
OF ZENER VOLTAGE (%/°C)
Z
V , ZENER VOLTAGE (V)
Fig. 18 Typical Temperature Coefficient of
Zener Voltage vs. Zener Voltage, DDZ20C-DDZ30D
Z
24
22 28
-0.02
0
0.02
0.04
0.06
0.08
0.10
-0.08
0.12
-0.04
-0.06
30 42 50
TC of V , TEMPERATURE COEFFICIENT
OF ZENER VOLTAGE (%/°C)
Z
V , ZENER VOLTAGE (V)
Fig. 19 Typical Temperature Coefficient of
Zener Voltage vs. Zener Voltage, DDZ30D-DDZ43
Z
38
34 46
-0.02
0
0.02
0.04
0.06
0.08
0.10
TC
TC
TC
TC
DDZ5V1B - DDZ43
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DDZ5V1B - DDZ43
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOD123
c
He
E
bD
All 7°
All R0.100
a
L
A
A1
All R0.100
All 7°
SOD123
Dim
Min
Max
Typ
A
1.00
1.35
1.05
A1
0.00
0.10
0.05
b
0.52
0.62
0.57
c
0.10
0.15
0.11
D
1.40
1.70
1.55
E
2.55
2.85
2.65
He
3.55
3.85
3.65
L
0.25
0.40
0.30
a
0º
8º
--
All Dimensions in mm
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
SOD123
Y
X
X1
Dimensions
Value (in mm)
X
0.900
X1
4.050
Y
0.950
Note: The suggested land pattern dimensions have been provided for reference only, as actual pad layouts may vary depending on application. These
dimensions may be modified based on user equipment capability or fabrication criteria. A more robust pattern may be desired for wave soldering
and is calculated by adding 0.2 mm to the „Z‟ dimension. For further information, please reference document IPC-7351A, Naming Convention for
Standard SMT Land Patterns, and for International grid details, please see document IEC, Publication 97.
Note: For high voltage applications, the appropriate industry sector guidelines should be considered with regards to creepage and clearance distances
between device Terminals and PCB tracking.
DDZ5V1B - DDZ43
Document number: DS30407 Rev. 20 - 2
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DDZ5V1B - DDZ43
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
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