LP5900 LP5900 Ultra Low Noise, 150 mA Linear Regulator for RF/Analog Circuits Requires No Bypass Capacitor Literature Number: SNVS358M LP5900 Ultra Low Noise, 150 mA Linear Regulator for RF/Analog Circuits Requires No Bypass Capacitor General Description Key Specifications The LP5900 is a linear regulator capable of supplying 150 mA output current. Designed to meet the requirements of RF/ Analog circuits, the LP5900 device provides low noise, high PSRR, low quiescent current, and low line transient response figures. Using new innovative design techniques the LP5900 offers class-leading device noise performance without a noise bypass capacitor. The device is designed to work with 0.47 F input and output ceramic capacitors. (No Bypass Capacitor is required) The device is available in micro SMD package and LLP package. Also available in Exteme Thin micro SMD package. For all other package options contact your local NSC sales office. This device is available with 1.5V,1.575V, 1.8V, 1.9V, 2.0V, 2.1V, 2.2V, 2.3V, 2.5V, 2.6V, 2.65V, 2.7V, 2.75V 2.8V, 2.85V 3.0V, 3.3V and 4.5V outputs. Please contact your local sales office for any other voltage options. Features Stable with 0.47 F Ceramic Input and Output Capacitors No Noise Bypass Capacitor Required Logic Controlled Enable Thermal-overload and short-circuit protection -40C to +125C junction temperature range for operation Input voltage range Output voltage range Output current Low output voltage noise PSRR Output voltage tolerance Virtually zero IQ (disabled) Very low IQ (enabled) Start-up time Low dropout 2.5V to 5.5V 1.5V to 4.5V 150 mA 6.5 VRMS 75 dB at 1 kHz 2% <1 A 25 A 150 s 80 mV typ. Package 4-Bump micro SMD (lead free) Extreme 4-Bump micro SMD (lead free) 6 Pin LLP (SC-70 footprint) 1.057 mm x 1.083 mm x 0.600mm 1.067 mm x 1.092 mm x 0.250mm 2.2 mm x 2.5 mm x Applications Cellular phones PDA handsets Wireless LAN devices Typical Application Circuit 20144101 (c) 2010 National Semiconductor Corporation 201441 www.national.com LP5900 Ultra Low Noise, 150 mA Linear Regulator for RF/Analog Circuits Requires No Bypass Capacitor July 23, 2010 LP5900 Connection Diagrams 4-Bump Thin micro SMD Package and Extreme Thin micro SMD Package, Large Bump NS Package Number TLA04/XRA04 20144102 The actual physical placement of the package marking will vary from part to part. LLP-6 Package NS Package Number SDB06A 20144106 Pin Descriptions Pin No. micro SMD LLP A1 4 Symbol VEN Name and Function Enable input; disables the regulator when 0.4V. Enables the regulator when 1.2V. An internal 1 M pulldown resistor connects this input to ground. www.national.com B1 3 GND Common ground B2 1 VOUT Output voltage. A 0.47 F Low ESR capacitor should be connected to this Pin. Connect this output to the load circuit. A2 6 VIN Input voltage supply. A 0.47 F capacitor should be connected at this input. Pad GND Common Ground. Connect to Pin 3. 2 LP5900 Ordering Information micro SMD Package (Lead Free) Output Voltage (V) Supplied As 250 Units Tape and Reel Package Marking 3k Units Tape and Reel 1.5 LP5900TL-1.5/NOPB LP5900TLX-1.5/NOPB 1.575 LP5900TL-1.575/NOPB LP5900TLX-1.575/NOPB 1.8 LP5900TL-1.8/NOPB LP5900TLX-1.8/NOPB 1.9 LP5900TL-1.9/NOPB LP5900TLX-1.9/NOPB 2.0 LP5900TL-2.0/NOPB LP5900TLX-2.0/NOPB 2.1 LP5900TL-2.1/NOPB LP5900TLX-2.1/NOPB 2.2 LP5900TL-2.2/NOPB LP5900TLX-2.2/NOPB 2.3 LP5900TL-2.3/NOPB LP5900TLX-2.3/NOPB 2.5 LP5900TL-2.5/NOPB LP5900TLX-2.5/NOPB 2.6 LP5900TL-2.6/NOPB LP5900TLX-2.6/NOPB 2.65 LP5900TL-2.65/NOPB LP5900TLX-2.65/NOPB 2.7 LP5900TL-2.7/NOPB LP5900TLX-2.7/NOPB 2.75 LP5900TL-2.75/NOPB LP5900TLX-2.75/NOPB 2.8 LP5900TL-2.8/NOPB LP5900TLX-2.8/NOPB 2.85 LP5900TL-2.85/NOPB LP5900TLX-2.85/NOPB 3.0 LP5900TL-3.0/NOPB LP5900TLX-3.0/NOPB 3.3 LP5900TL-3.3/NOPB LP5900TLX-3.3/NOPB 4.5 LP5900TL-4.5/NOPB LP5900TLX-4.5/NOPB Extreme Thin Micro SMD (Lead Free) Output Voltage (V) Supplied As Package Marking 250 Units Tape and Reel 3k Units Tape and Reel 1.8 LP5900XR-1.8/NOPB LP5900XRX-1.8/NOPB 2.8 LP5900XR-2.8/NOPB LP5900XRX-2.8/NOPB For LLP-6 Package (Lead Free) Output Voltage (V) Supplied As Package Marking 250 Units Tape and Reel 3k Units Tape and Reel 1.5 LP5900SD-1.5/NOPB LP5900SDX-1.5/NOPB L15 1.8 LP5900SD-1.8/NOPB LP5900SDX-1.8/NOPB L17 2.0 LP5900SD-2.0/NOPB LP5900SDX-2.0/NOPB L18 2.2 LP5900SD-2.2/NOPB LP5900SDX-2.2/NOPB L19 2.5 LP5900SD-2.5/NOPB LP5900SDX-2.5/NOPB L13 2.7 LP5900SD-2.7/NOPB LP5900SDX-2.7/NOPB L14 2.8 LP5900SD-2.8/NOPB LP5900SDX-2.8/NOPB L12 3.0 LP5900SD-3.0/NOPB LP5900SDX-3.0/NOPB L20 3.3 LP5900SD-3.3/NOPB LP5900SDX-3.3/NOPB L16 3 www.national.com LP5900 Absolute Maximum Ratings (Note 1, Note Operating Ratings 2) VIN: Input Voltage Range VEN: Enable Voltage Range If Military/Aerospace specified devices are required, please contact the National Semiconductor Sales Office/ Distributors for availability and specifications. VIN Pin: Input Voltage VOUT Pin: Output Voltage VEN Pin: Enable Input Voltage 2.5V to 5.5V 0 to (VIN + 0.3V) to 5.5V (max) 0 to 150 mA Recommended Load Current (Note 5) Junction Temperature Range (TJ) Ambient Temperature Range (TA) (Note 5) -0.3 to 6.0V -0.3 to (VIN + 0.3V) to 6.0V (max) -0.3 to (VIN + 0.3V) to 6.0V (max) Continuous Power Dissipation (Note 3) Junction Temperature (TJMAX) Storage Temperature Range Maximum Lead Temperature (Soldering, 10 sec.) ESD Rating (Note 4) Human Body Model Machine Model (Note 1), (Note 2) -40C to +125C -40C to +85C Thermal Properties Junction to Ambient Thermal Resistance JA (Note 6) JEDEC Board (microSMD) (Note 16) 88C/W 4L Cellphone Board (microSMD) 157.4C/W JEDEC Board (LLP-6)(Note 16) 77.3C/W Internally Limited 150C -65 to 150C 260C 2 kV 200V Electrical Characteristics Limits in standard typeface are for TA = 25C. Limits in boldface type apply over the full operating junction temperature range (-40C TJ +125C). Unless otherwise noted, specifications apply to the LP5900 Typical Application Circuit (pg. 1) with: VIN = VOUT (NOM) + 1.0V, VEN = 1.2V, CIN = COUT = 0.47 F, IOUT = 1.0 mA. (Note 2), (Note 7) Symbol Parameter Conditions Min Max Units 2.5 Typ 5.5 V -2 2 VIN Input Voltage VOUT Output Voltage Tolerance VIN = (VOUT(NOM) + 1.0V) to 5.5V, IOUT = 1 mA to 150mA Line Regulation VIN = (VOUT(NOM) + 1.0V) to 5.5V, IOUT = 1 mA 0.05 %/V Load Regulation IOUT = 1 mA to 150 mA 0.001 %/mA Load Current (Note 9) ILOAD 0 Maximum Output Current IQ Quiescent Current (Note 11) mA 150 VEN = 1.2V, IOUT = 0 mA VEN = 1.2V, IOUT = 150 mA VEN = 0.3V (Disabled) 25 50 160 230 0.003 1.0 IG Ground Current (Note 13) IOUT = 0 mA (VOUT = 2.5V) 30 VDO Dropout Voltage(Note 10) IOUT = 150 mA 80 ISC Short Circuit Current Limit (Note 12) 300 PSRR Power Supply Rejection Ratio (Note 15) f = 100 Hz, IOUT = 150 mA 85 f = 1 kHz, IOUT = 150 mA 75 f = 10 kHz, IOUT = 150 mA 65 f = 50 kHz, IOUT = 150 mA 52 f = 100 kHz, IOUT = 150 mA 40 Output Noise Voltage (Note 15) BW = 10 Hz to 100 kHz, IOUT = 0 mA VIN = 4.2V IOUT = 1 mA 10 Thermal Shutdown Temperature 160 Hysteresis 20 en IOUT = 150 mA TSHUTDOWN www.national.com 4 % 7 A A 150 mV mA dB VRMS 6.5 C Parameter Conditions Min Typ Max Units 0.4 V Login Input Thresholds VIL Low Input Threshold (VEN) VIN = 2.5V to 5.5V VIH High Input Threshold (VEN) VIN = 2.5V to 5.5V IEN Input Current at VEN Pin (Note 14) VEN = 5.5V and VIN = 5.5V 5.5 VEN = 0.0V and VIN = 5.5V 0.001 1.2 V A Transient Characteristics VOUT Line Transient (Note 15) VIN = (VOUT(NOM) + 1.0V) to (VOUT(NOM) + -2 1.6V) in 30 s, IOUT = 1 mA mV VIN = (VOUT(NOM) + 1.6V) to (VOUT(NOM) + 2 1.0V) in 30 s, IOUT = 1 mA Load Transient (Note 15) IOUT = 1 mA to 150 mA in 10 s -110 IOUT = 150 mA to 1 mA in 10 s Overshoot on Startup (Note 15) Turn on Time mV 50 To 95% of VOUT(NOM) 150 20 mV 300 s Note 1: Absolute Maximum Ratings indicate limits beyond which damage to the component may occur. Operating Ratings are conditions under which operation of the device is guaranteed. Operating Ratings do not imply guaranteed performance limits. For guaranteed performance limits and associated test conditions, see the Electrical Characteristics tables. Note 2: All voltages are with respect to the potential at the GND pin. Note 3: Internal thermal shutdown circuitry protects the device from permanent damage. Note 4: The Human body model is a 100 pF capacitor discharged through a 1.5 k resistor into each pin. The machine model is a 200 pF capacitor discharged directly into each pin. MIL-STD-883 3015.7 Note 5: In applications where high power dissipation and/or poor package thermal resistance is present, the maximum ambient temperature may have to be derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125C), the maximum power dissipation of the device in the application (PD-MAX), and the junction-to ambient thermal resistance of the part/package in the application (JA), as given by the following equation: TA-MAX = TJ-MAX-OP - (JA x PD-MAX). See applications section. Note 6: Junction-to-ambient thermal resistance is highly application and board-layout dependent. In applications where high maximum power dissipation exists, special care must be paid to thermal dissipation issues in board design. Note 7: Min and Max limits are guaranteed by design, test, or statistical analysis. Typical numbers are not guaranteed, but do represent the most likely norm. Note 8: CIN, COUT: Low-ESR Surface-Mount Ceramic Capacitors (MLCCs) used in setting electrical characteristics. Note 9: The device maintains a stable, regulated output voltage without a load current. Note 10: Dropout voltage is the voltage difference between the input and the output at which the output voltage drops to 100 mV below its nominal value. This parameter only applies to output voltages above 2.5V. Note 11: Quiescent current is defined here as the difference in current between the input voltage source and the load at VOUT. Note 12: Short Circuit Current is measured with VOUT pulled to 0v and VIN worst case = 6.0V. Note 13: Ground current is defined here as the total current flowing to ground as a result of all input voltages applied to the device. Note 14: There is a 1 M resistor between VEN and ground on the device. Note 15: This specification is guaranteed by design. Note 16: Detailed description of the board can be found in JESD51-7 Output & Input Capacitor, Recommended Specifications Symbol Parameter CIN Input Capacitance COUT Output Capacitance ESR Output/Input Capacitance Conditions Min Nom Capacitance for stability 0.33 0.47 0.33 0.47 5 Max Units F 10 500 m Note: The minimum capacitance should be greater than 0.33 F over the full range of operating conditions. The capacitor tolerance should be 30% or better over the full temperature range. The full range of operating conditions for the capacitor in the application should be considered during device selection to ensure this minimum capacitance specification is met. X7R capacitors are recommended however capacitor types X5R, Y5V and Z5U may be used with consideration of the application and conditions. 5 www.national.com LP5900 Symbol LP5900 Typical Performance Characteristics. Unless otherwise specified,CIN = COUT = 0.47F, VIN = VOUT (NOM) + 1.0V, VEN = 1.2V, IOUT = 1mA , T A = 25C. Output Noise Density Power Supply Rejection Ratio 20144158 20144157 Power Supply Rejection Ratio Output Voltage Change vs Temperature 20144159 20144154 Ground Current vs VIN, I LOAD = 0mA Ground Current vs VIN, I LOAD = 1mA 20144151 www.national.com 20144152 6 LP5900 Ground Current vs VIN, I LOAD = 100mA Ground Current vs Load Current 20144150 20144153 Short Circuit Current Load Transient 20144149 20144148 Line Transient Enable Start-up Time, (I L= 1mA, VOUT = 2.8V) 20144144 20144155 7 www.national.com LP5900 Enable Start-up Time, (I L= 100mA, VOUT = 2.8V) Enable Start-up Time, (I L= 1mA, VOUT = 2.8V) 20144145 20144146 Enable Start-up Time, (I L= 100mA, VOUT = 2.8V) Dropout Over Temperature (100mA) 20144105 20144147 Application Hints device. These two equations should be used to determine the optimum operating conditions for the device in the application. POWER DISSIPATION AND DEVICE OPERATION The permissible power dissipation for any package is a measure of the capability of the device to pass heat from the power source, the junctions of the IC, to the ultimate heat sink, the ambient environment. Thus the power dissipation is dependent on the ambient temperature and the thermal resistance across the various interfaces between the die and ambient air. As stated in (Note 5) of the electrical characteristics, the allowable power dissipation for the device in a given package can be calculated using the equation: EXTERNAL CAPACITORS Like any low-dropout regulator, the LP5900 requires external capacitors for regulator stability. The LP5900 is specifically designed for portable applications requiring minimum board space and smallest components. These capacitors must be correctly selected for good performance. INPUT CAPACITOR An input capacitor is required for stability. The input capacitor should be at least equal to or greater than the output capacitor. It is recommended that a 0.47 F capacitor be connected between the LP5900 input pin and ground. This capacitor must be located a distance of not more than 1 cm from the input pin and returned to a clean analogue ground. Any good quality ceramic, tantalum, or film capacitor may be used at the input. Important: To ensure stable operation it is essential that good PCB practices are employed to minimize ground impedance and keep input inductance low. If these conditions cannot be met, or if long leads are to be used to connect the battery or other power source to the LP5900, then it is recommended to increase the input capacitor to at least 2.2F. The actual power dissipation across the device can be represented by the following equation: PD = (VIN - VOUT) x IOUT This establishes the relationship between the power dissipation allowed due to thermal consideration, the voltage drop across the device, and the continuous current capability of the www.national.com 8 means that while it may be possible to find a tantalum capacitor with an ESR value within the stable range, it would have to be larger in capacitance (which means bigger and more costly) than a ceramic capacitor with the same ESR value. It should also be noted that the ESR of a typical tantalum will increase about 2:1 as the temperature goes from 25C down to -40C, so some guard band must be allowed. NO-LOAD STABILITY The LP5900 will remain stable and in regulation with no external load. OUTPUT CAPACITOR The LP5900 is designed specifically to work with very small ceramic output capacitors. A ceramic capacitor (dielectric types X5R or X7R) in the 0.47 F to 10 F range, and with ESR between 5 m to 500 m, is suitable in the LP5900 application circuit. For this device the output capacitor should be connected between the VOUT pin and a good ground connection and should be mounted within 1 cm of the device. It may also be possible to use tantalum or film capacitors at the device output, VOUT, but these are not as attractive for reasons of size and cost (see the section Capacitor Characteristics). The output capacitor must meet the requirement for the minimum value of capacitance and have an ESR value that is within the range 5 m to 500 m for stability. ENABLE CONTROL The LP5900 may be switched ON or OFF by a logic input at the ENABLE pin. A high voltage at this pin will turn the device on. When the enable pin is low, the regulator output is off and the device typically consumes 3nA. However if the application does not require the shutdown feature, the VEN pin can be tied to VIN to keep the regulator output permanently on. In this case the supply voltage must be fully established 500s or less to ensure correct operation of the start-up circuit. Failure to comply with this condition may cause a delayed start-up time of several seconds. A 1M pulldown resistor ties the VEN input to ground, this ensures that the device will remain off when the enable pin is left open circuit. To ensure proper operation, the signal source used to drive the VEN input must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH. CAPACITOR CHARACTERISTICS The LP5900 is designed to work with ceramic capacitors on the input and output to take advantage of the benefits they offer. For capacitance values in the range of 0.47 F to 4.7 F, ceramic capacitors are the smallest, least expensive and have the lowest ESR values, thus making them best for eliminating high frequency noise. The ESR of a typical 0.47 F ceramic capacitor is in the range of 20 m to 40 m, which easily meets the ESR requirement for stability for the LP5900. The temperature performance of ceramic capacitors varies by type and manufacturer. Most large value ceramic capacitors (2.2 F) are manufactured with Z5U or Y5V temperature characteristics, which results in the capacitance dropping by more than 50% as the temperature goes from 25C to 85C. A better choice for temperature coefficient in a ceramic capacitor is X7R. This type of capacitor is the most stable and holds the capacitance within 15% over the temperature range. Tantalum capacitors are less desirable than ceramic for use as output capacitors because they are more expensive when comparing equivalent capacitance and voltage ratings in the 0.47 F to 4.7 F range. Another important consideration is that tantalum capacitors have higher ESR values than equivalent size ceramics. This micro SMD MOUNTING The micro SMD package requires specific mounting techniques, which are detailed in National Semiconductor Application Note AN-1112. For best results during assembly, alignment ordinals on the PC board may be used to facilitate placement of the micro SMD device. micro SMD LIGHT SENSITIVITY Exposing the micro SMD device to direct light may cause incorrect operation of the device. Light sources such as halogen lamps can affect electrical performance if they are situated in proximity to the device. Light with wavelengths in the red and infra-red part of the spectrum have the most detrimental effect thus the fluorescent lighting used inside most buildings has very little effect on performance. 9 www.national.com LP5900 Also, tantalum capacitors can suffer catastrophic failures due to surge current when connected to a low-impedance source of power (like a battery or a very large capacitor). If a tantalum capacitor is used at the input, it must be guaranteed by the manufacturer to have a surge current rating sufficient for the application. There are no requirements for the ESR (Equivalent Series Resistance) on the input capacitor, but tolerance and temperature coefficient must be considered when selecting the capacitor to ensure the capacitance will remain 0.47 F 30% over the entire operating temperature range. LP5900 Physical Dimensions inches (millimeters) unless otherwise noted 4-Bump Thin micro SMD NS Package Number TLA04CDA The dimensions for X1, X2 and X3 are given as: X1 = 1.065 mm 0.030 mm X2 = 1.090 mm 0.030 mm X3 = 0.600 mm 0.075 mm www.national.com 10 LP5900 4-Bump ExtremeThin micro SMD NS Package Number XRA04EFA The dimensions for X1, X2 and X3 are given as: X1 = 1.077 mm 0.030 mm X2 = 1.102 mm 0.030 mm X3 = 0.250 mm 0.075 mm LLP, 6Lead Package (SC70 Land) NS Package Number SDB06A 11 www.national.com LP5900 Ultra Low Noise, 150 mA Linear Regulator for RF/Analog Circuits Requires No Bypass Capacitor Notes For more National Semiconductor product information and proven design tools, visit the following Web sites at: www.national.com Products Design Support Amplifiers www.national.com/amplifiers WEBENCH(R) Tools www.national.com/webench Audio www.national.com/audio App Notes www.national.com/appnotes Clock and Timing www.national.com/timing Reference Designs www.national.com/refdesigns Data Converters www.national.com/adc Samples www.national.com/samples Interface www.national.com/interface Eval Boards www.national.com/evalboards LVDS www.national.com/lvds Packaging www.national.com/packaging Power Management www.national.com/power Green Compliance www.national.com/quality/green Switching Regulators www.national.com/switchers Distributors www.national.com/contacts LDOs www.national.com/ldo Quality and Reliability www.national.com/quality LED Lighting www.national.com/led Feedback/Support www.national.com/feedback Voltage References www.national.com/vref Design Made Easy www.national.com/easy www.national.com/powerwise Applications & Markets www.national.com/solutions Mil/Aero www.national.com/milaero PowerWise(R) Solutions Serial Digital Interface (SDI) www.national.com/sdi Temperature Sensors www.national.com/tempsensors SolarMagicTM www.national.com/solarmagic PLL/VCO www.national.com/wireless www.national.com/training PowerWise(R) Design University THE CONTENTS OF THIS DOCUMENT ARE PROVIDED IN CONNECTION WITH NATIONAL SEMICONDUCTOR CORPORATION ("NATIONAL") PRODUCTS. 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