PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
5962-8670405PA ACTIVE CDIP JG 8 1 TBD Call TI Call TI
5962-8670405XA ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-8670406PA ACTIVE CDIP JG 8 1 TBD Call TI Call TI
5962-8670406XA ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-8670407PA ACTIVE CDIP JG 8 1 TBD Call TI Call TI
5962-8670407XA ACTIVE LCCC FK 20 1 TBD Call TI Call TI
5962-8670408PA ACTIVE CDIP JG 8 1 TBD Call TI Call TI
5962-8670408XA ACTIVE LCCC FK 20 1 TBD Call TI Call TI
UC1842AJ ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1842AJ883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1842AL883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC1843AJ ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1843AJ883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1843AL883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC1844AJ ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1844AJ883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1844AL883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC1845AJ ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1845AJ883B ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC1845AL883B ACTIVE LCCC FK 20 1 TBD POST-PLATE N / A for Pkg Type
UC2842AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842AD8 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842AD8G4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842AD8TR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
UC2842ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842ADTR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2842ADW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2842ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2842ADWTR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2842ADWTRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2842AJ OBSOLETE CDIP JG 8 TBD Call TI Call TI
UC2842AN ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2842ANG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2843AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843AD8 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843AD8G4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843AD8TR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843ADTR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2843AJ OBSOLETE CDIP JG 8 TBD Call TI Call TI
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
UC2843AN ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2843ANG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2843AQ ACTIVE PLCC FN 20 46 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
UC2843AQG3 ACTIVE PLCC FN 20 46 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR
UC2844AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AD8 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AD8G4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AD8TR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844ADTR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AN ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2844ANG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2844AQD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AQD8 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AQD8R ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2844AQDR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 4
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
UC2845AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845AD8 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845AD8G4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845AD8TR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845ADTR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC2845ADW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2845ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC2845AN ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC2845ANG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3842AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842AD8 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842AD8G4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842AD8TR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 5
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
UC3842ADTR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3842ADW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3842ADWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-2-260C-1 YEAR
UC3842AN ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3842ANG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3842J ACTIVE CDIP JG 8 1 TBD A42 N / A for Pkg Type
UC3843AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3843AD8 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3843AD8G4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3843AD8TR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3843AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3843ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3843ADTR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3843ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3843AN ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3843ANG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3844AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 6
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
UC3844AD8 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844AD8G4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844AD8TR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844ADTR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3844AN ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3844ANG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
UC3845AD ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845AD8 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845AD8G4 ACTIVE SOIC D 8 75 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845AD8TR ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845AD8TRG4 ACTIVE SOIC D 8 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845ADG4 ACTIVE SOIC D 14 50 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845ADTR ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845ADTRG4 ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
UC3845AN ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 7
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
UC3845ANG4 ACTIVE PDIP P 8 50 Green (RoHS
& no Sb/Br) CU NIPDAU N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF UC1842A, UC1843A, UC1844A, UC1845A, UC2843A, UC3842A, UC3842M, UC3843A, UC3844A, UC3845A :
Catalog: UC3842A, UC3843A, UC3844A, UC3845A, UC3842, UC3845AM
Automotive: UC2843A-Q1
Enhanced Product: UC1842A-EP, UC1843A-EP, UC1844A-EP, UC1845A-EP, UC1842A-EP, UC1843A-EP, UC1844A-EP, UC1845A-EP
Military: UC1842A, UC1843A, UC1844A, UC1845A
PACKAGE OPTION ADDENDUM
www.ti.com 5-Sep-2011
Addendum-Page 8
Space: UC1842A-SP, UC1843A-SP, UC1844A-SP, UC1845A-SP, UC1842A-SP, UC1843A-SP, UC1844A-SP, UC1845A-SP
NOTE: Qualified Version Definitions:
Catalog - TI's standard catalog product
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Enhanced Product - Supports Defense, Aerospace and Medical Applications
Military - QML certified for Military and Defense Applications
Space - Radiation tolerant, ceramic packaging and qualified for use in Space-based application
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
UC2842AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC2842ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC2842ADWTR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
UC2843AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC2843ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC2844AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC2844ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC2844AQD8R SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 4.0 12.0 Q1
UC2845AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC2845ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC3842AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC3842ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC3843AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC3843ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC3844AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC3844ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
UC3845AD8TR SOIC D 8 2500 330.0 12.4 6.4 5.2 2.1 8.0 12.0 Q1
UC3845ADTR SOIC D 14 2500 330.0 16.4 6.5 9.0 2.1 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
UC2842AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC2842ADTR SOIC D 14 2500 333.2 345.9 28.6
UC2842ADWTR SOIC DW 16 2000 367.0 367.0 38.0
UC2843AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC2843ADTR SOIC D 14 2500 333.2 345.9 28.6
UC2844AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC2844ADTR SOIC D 14 2500 333.2 345.9 28.6
UC2844AQD8R SOIC D 8 2500 367.0 367.0 35.0
UC2845AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC2845ADTR SOIC D 14 2500 333.2 345.9 28.6
UC3842AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC3842ADTR SOIC D 14 2500 333.2 345.9 28.6
UC3843AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC3843ADTR SOIC D 14 2500 333.2 345.9 28.6
UC3844AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC3844ADTR SOIC D 14 2500 333.2 345.9 28.6
UC3845AD8TR SOIC D 8 2500 340.5 338.1 20.6
UC3845ADTR SOIC D 14 2500 333.2 345.9 28.6
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
MECHANICAL DATA
MCER001A – JANUARY 1995 – REVISED JANUAR Y 1997
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
JG (R-GDIP-T8) CERAMIC DUAL-IN-LINE
0.310 (7,87)
0.290 (7,37)
0.014 (0,36)
0.008 (0,20)
Seating Plane
4040107/C 08/96
5
4
0.065 (1,65)
0.045 (1,14)
8
1
0.020 (0,51) MIN
0.400 (10,16)
0.355 (9,00)
0.015 (0,38)
0.023 (0,58)
0.063 (1,60)
0.015 (0,38)
0.200 (5,08) MAX
0.130 (3,30) MIN
0.245 (6,22)
0.280 (7,11)
0.100 (2,54)
0°–15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. This package can be hermetically sealed with a ceramic lid using glass frit.
D. Index point is provided on cap for terminal identification.
E. Falls within MIL STD 1835 GDIP1-T8
MECHANICAL DATA
MPLC004A – OCTOBER 1994
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
FN (S-PQCC-J**) PLASTIC J-LEADED CHIP CARRIER
4040005/B 03/95
20 PIN SHOWN
0.026 (0,66)
0.032 (0,81)
D2/E2
0.020 (0,51) MIN
0.180 (4,57) MAX
0.120 (3,05)
0.090 (2,29)
D2/E2
0.013 (0,33)
0.021 (0,53)
Seating Plane
MAX
D2/E2
0.219 (5,56)
0.169 (4,29)
0.319 (8,10)
0.469 (11,91)
0.569 (14,45)
0.369 (9,37)
MAX
0.356 (9,04)
0.456 (11,58)
0.656 (16,66)
0.008 (0,20) NOM
1.158 (29,41)
0.958 (24,33)
0.756 (19,20)
0.191 (4,85)
0.141 (3,58)
MIN
0.441 (11,20)
0.541 (13,74)
0.291 (7,39)
0.341 (8,66)
18
19
14
13
D
D1
13
9
E1E
4
8
MINMAXMIN
PINS
**
20
28
44
0.385 (9,78)
0.485 (12,32)
0.685 (17,40)
52
68
84 1.185 (30,10)
0.985 (25,02)
0.785 (19,94)
D/E
0.395 (10,03)
0.495 (12,57)
1.195 (30,35)
0.995 (25,27)
0.695 (17,65)
0.795 (20,19)
NO. OF D1/E1
0.350 (8,89)
0.450 (11,43)
1.150 (29,21)
0.950 (24,13)
0.650 (16,51)
0.750 (19,05)
0.004 (0,10)
M
0.007 (0,18)
0.050 (1,27)
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-018
IMPORTANT NOTICE
Texas Instruments Incorporated and its subsidiaries (TI) reserve the right to make corrections, enhancements, improvements and other
changes to its semiconductor products and services per JESD46, latest issue, and to discontinue any product or service per JESD48, latest
issue. Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and
complete. All semiconductor products (also referred to herein as “components”) are sold subject to TI’s terms and conditions of sale
supplied at the time of order acknowledgment.
TI warrants performance of its components to the specifications applicable at the time of sale, in accordance with the warranty in TI’s terms
and conditions of sale of semiconductor products. Testing and other quality control techniques are used to the extent TI deems necessary
to support this warranty. Except where mandated by applicable law, testing of all parameters of each component is not necessarily
performed.
TI assumes no liability for applications assistance or the design of Buyers’ products. Buyers are responsible for their products and
applications using TI components. To minimize the risks associated with Buyers’ products and applications, Buyers should provide
adequate design and operating safeguards.
TI does not warrant or represent that any license, either express or implied, is granted under any patent right, copyright, mask work right, or
other intellectual property right relating to any combination, machine, or process in which TI components or services are used. Information
published by TI regarding third-party products or services does not constitute a license to use such products or services or a warranty or
endorsement thereof. Use of such information may require a license from a third party under the patents or other intellectual property of the
third party, or a license from TI under the patents or other intellectual property of TI.
Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration
and is accompanied by all associated warranties, conditions, limitations, and notices. TI is not responsible or liable for such altered
documentation. Information of third parties may be subject to additional restrictions.
Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service
voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice.
TI is not responsible or liable for any such statements.
Buyer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related requirements
concerning its products, and any use of TI components in its applications, notwithstanding any applications-related information or support
that may be provided by TI. Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which
anticipate dangerous consequences of failures, monitor failures and their consequences, lessen the likelihood of failures that might cause
harm and take appropriate remedial actions. Buyer will fully indemnify TI and its representatives against any damages arising out of the use
of any TI components in safety-critical applications.
In some cases, TI components may be promoted specifically to facilitate safety-related applications. With such components, TI’s goal is to
help enable customers to design and create their own end-product solutions that meet applicable functional safety standards and
requirements. Nonetheless, such components are subject to these terms.
No TI components are authorized for use in FDA Class III (or similar life-critical medical equipment) unless authorized officers of the parties
have executed a special agreement specifically governing such use.
Only those TI components which TI has specifically designated as military grade or “enhanced plastic” are designed and intended for use in
military/aerospace applications or environments. Buyer acknowledges and agrees that any military or aerospace use of TI components
which have not been so designated is solely at the Buyer's risk, and that Buyer is solely responsible for compliance with all legal and
regulatory requirements in connection with such use.
TI has specifically designated certain components which meet ISO/TS16949 requirements, mainly for automotive use. Components which
have not been so designated are neither designed nor intended for automotive use; and TI will not be responsible for any failure of such
components to meet such requirements.
Products Applications
Audio www.ti.com/audio Automotive and Transportation www.ti.com/automotive
Amplifiers amplifier.ti.com Communications and Telecom www.ti.com/communications
Data Converters dataconverter.ti.com Computers and Peripherals www.ti.com/computers
DLP® Products www.dlp.com Consumer Electronics www.ti.com/consumer-apps
DSP dsp.ti.com Energy and Lighting www.ti.com/energy
Clocks and Timers www.ti.com/clocks Industrial www.ti.com/industrial
Interface interface.ti.com Medical www.ti.com/medical
Logic logic.ti.com Security www.ti.com/security
Power Mgmt power.ti.com Space, Avionics and Defense www.ti.com/space-avionics-defense
Microcontrollers microcontroller.ti.com Video and Imaging www.ti.com/video
RFID www.ti-rfid.com
OMAP Applications Processors www.ti.com/omap TI E2E Community e2e.ti.com
Wireless Connectivity www.ti.com/wirelessconnectivity
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2012, Texas Instruments Incorporated