M41T11 Serial real-time clock (RTC) with 56 bytes of NVRAM Datasheet - production data Features Counters for seconds, minutes, hours, day, date, month, years and century 32 KHz crystal oscillator integrating load capacitance (12.5 pF) providing exceptional oscillator stability and high crystal series resistance operation Serial interface supports I2C bus (100 kHz protocol) Ultra-low battery supply current of 0.8 A (typ. at 3 V) 2.0 to 5.5 V clock operating voltage Automatic switchover and deselect circuitry 56 bytes of general purpose RAM Software clock calibration to compensate crystal deviation due to temperature Automatic leap year compensation Operating temperature of -40 to 85C Packaging includes a 28-lead SOIC and SNAPHAT(R) top (to be ordered separately; 3.3 V to 5.0 V supply voltage only) RoHS compliant - Lead-free second level interconnect June 2012 This is information on a product in full production. 8 1 SO8 SNAPHAT(R) battery & crystal 28 Doc ID 6103 Rev 10 1 SOH28 1/30 www.st.com 1 Contents M41T11 Contents 1 Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 2 Operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 3 2-wire bus characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1.1 Bus not busy . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1.2 Start data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1.3 Stop data transfer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1.4 Data valid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.1.5 Acknowledge . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 2.2 Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 2.3 Write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 2.4 Data retention mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Clock operation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14 3.1 Clock calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 3.2 Output driver pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 3.3 Preferred initial power-on defaults . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16 4 Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 5 DC and AC parameters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 6 Package mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 22 7 Part numbering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 8 Environmental information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 9 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 2/30 Doc ID 6103 Rev 10 M41T11 List of tables List of tables Table 1. Table 2. Table 3. Table 4. Table 5. Table 6. Table 7. Table 8. Table 9. Table 10. Table 11. Table 12. Table 13. Table 14. Table 15. Table 16. Table 17. Signal names . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11 Register map . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15 Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18 Operating and AC measurement conditions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Capacitance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 DC characteristics. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Crystal electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Power down/up AC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Power down/up trip points DC characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SO8 - 8-lead plastic small outline (150 mils body width) package mechanical data . . . . . 23 SOH28 - 28-lead plastic small outline, battery SNAPHAT(R) package mechanical data . . . 24 SH - 4-pin SNAPHAT(R) housing for 48 mAh battery & crystal, package mechanical data . 25 SH - 4-pin SNAPHAT(R) housing for 120 mAh battery & crystal, package mech. data . . . . 26 Ordering information scheme . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 SNAPHAT(R) battery table . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 27 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 29 Doc ID 6103 Rev 10 3/30 List of figures M41T11 List of figures Figure 1. Figure 2. Figure 3. Figure 4. Figure 5. Figure 6. Figure 7. Figure 8. Figure 9. Figure 10. Figure 11. Figure 12. Figure 13. Figure 14. Figure 15. Figure 16. Figure 17. Figure 18. Figure 19. Figure 20. 4/30 Logic diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 8-pin SOIC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 28-pin SOIC connections . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7 Serial bus data transfer sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Acknowledgement sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Bus timing requirements sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 Slave address location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Read mode sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Alternate read mode sequence. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12 Write mode sequence . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13 Crystal accuracy across temperature . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Clock calibration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 AC testing input/output waveform . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Power down/up mode AC waveforms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 SO8 - 8-lead plastic small outline package outline . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 SOH28 - 28-lead plastic small outline, battery SNAPHAT(R) package outline. . . . . . . . . . . 24 SH - 4-pin SNAPHAT(R) housing for 48 mAh battery & crystal package outline . . . . . . . . . 25 SH - 4-pin SNAPHAT(R) housing for 120 mAh battery & crystal, package outline. . . . . . . . 26 Recycling symbols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 28 Doc ID 6103 Rev 10 M41T11 1 Description Description The M41T11 is a low-power serial real-time clock (RTC) with 56 bytes of NVRAM. A built-in 32.768 kHz oscillator (external crystal controlled) and the first 8 bytes of the RAM are used for the clock/calendar function and are configured in binary-coded decimal (BCD) format. Addresses and data are transferred serially via a two-line bidirectional bus. The built-in address register is incremented automatically after each write or read data byte. The M41T11 clock has a built-in power sense circuit which detects power failures and automatically switches to the battery supply during power failures. The energy needed to sustain the RAM and clock operations can be supplied from a small lithium coin cell. Typical data retention time is in excess of 5 years with a 50 mA/h, 3 V lithium cell. The M41T11 is supplied in an 8-lead plastic small outline package or 28-lead SNAPHAT(R) package. The 28-pin, 330 mil SOIC provides sockets with gold plated contacts at both ends for direct connection to a separate SNAPHAT housing containing the battery and crystal. The unique design allows the SNAPHAT battery package to be mounted on top of the SOIC package after the completion of the surface mount process. Insertion of the SNAPHAT housing after reflow prevents potential battery and crystal damage due to the high temperatures required for device surface-mounting. The SNAPHAT housing is keyed to prevent reverse insertion. The SOIC and battery/crystal packages are shipped separately. For the 28-lead SOIC, the battery/crystal package (i.e. SNAPHAT) part number is "M4Txx-BR12SH" (see Table 16 on page 27). Caution: Do not place the SNAPHAT battery/crystal package "M4Txx-BR12SH" in conductive foam since this will drain the lithium button-cell battery. Figure 1. Logic diagram VCC VBAT OSCO OSCI SCL M41T11 SDA FT/OUT VSS AI01000 Doc ID 6103 Rev 10 5/30 Description M41T11 Table 1. Signal names OSCI Oscillator input OCSO Oscillator output FT/OUT Figure 2. Frequency test/output driver (open drain) SDA Serial data address input/output SCL Serial clock VBAT Battery supply voltage VCC Supply voltage VSS Ground 8-pin SOIC connections M41T11 OSCI OSCO VBAT VSS 8 7 6 5 1 2 3 4 VCC FT/OUT SCL SDA AI01001 Figure 3. 28-pin SOIC connections NC NC NC NC NC NC NC NC NC NC NC NC NC VSS 28 1 2 27 3 26 4 25 5 24 6 23 7 22 M41T11 8 21 9 20 10 19 11 18 12 17 13 16 14 15 AI03606 6/30 Doc ID 6103 Rev 10 VCC NC FT/OUT NC NC NC NC NC SCL NC NC NC SDA NC M41T11 Description Figure 4. Block diagram 1 Hz OSCI OSCILLATOR 32.768 kHz DIVIDER SECONDS MINUTES CENTURY/HOURS OSCO DAY FT/OUT VCC VSS VBAT SCL SDA DATE VOLTAGE SENSE and SWITCH CIRCUITRY SERIAL BUS INTERFACE MONTH CONTROL LOGIC YEAR CONTROL RAM (56 x 8) ADDRESS REGISTER AI02566 Doc ID 6103 Rev 10 7/30 Operation 2 M41T11 Operation The M41T11 clock operates as a slave device on the serial bus. Access is obtained by implementing a start condition followed by the correct slave address (D0h). The 64 bytes contained in the device can then be accessed sequentially in the following order: 1st byte: seconds register 2nd byte: minutes register 3rd byte: century/hours register 4th byte: day register 5th byte: date register 6th byte: month register 7th byte: years register 8th byte: control register 9th - 64th bytes: RAM The M41T11 clock continually monitors VCC for an out of tolerance condition. Should VCC fall below VSO, the device terminates an access in progress and resets the device address counter. Inputs to the device will not be recognized at this time to prevent erroneous data from being written to the device from an out of tolerance system. When VCC falls below VSO, the device automatically switches over to the battery and powers down into an ultra low current mode of operation to conserve battery life. Upon power-up, the device switches from battery to VCC at VSO and recognizes inputs. 2.1 2-wire bus characteristics This bus is intended for communication between different ICs. It consists of two lines: one bidirectional for data signals (SDA) and one for clock signals (SCL). Both the SDA and the SCL lines must be connected to a positive supply voltage via a pull-up resistor. The following protocol has been defined: Data transfer may be initiated only when the bus is not busy. During data transfer, the data line must remain stable whenever the clock line is high. Changes in the data line while the clock line is high will be interpreted as control signals. Accordingly, the following bus conditions have been defined: 2.1.1 Bus not busy Both data and clock lines remain high. 2.1.2 Start data transfer A change in the state of the data line, from high to low, while the clock is high, defines the START condition. 8/30 Doc ID 6103 Rev 10 M41T11 2.1.3 Operation Stop data transfer A change in the state of the data line, from low to high, while the clock is high, defines the STOP condition. 2.1.4 Data valid The state of the data line represents valid data when after a start condition, the data line is stable for the duration of the high period of the clock signal. The data on the line may be changed during the low period of the clock signal. There is one clock pulse per bit of data. Each data transfer is initiated with a start condition and terminated with a stop condition. The number of data bytes transferred between the start and stop conditions is not limited. The information is transmitted byte-wide and each receiver acknowledges with a ninth bit. By definition, a device that gives out a message is called "transmitter", the receiving device that gets the message is called "receiver". The device that controls the message is called "master". The devices that are controlled by the master are called "slaves". 2.1.5 Acknowledge Each byte of eight bits is followed by one acknowledge bit. This acknowledge bit is a low level put on the bus by the receiver, whereas the master generates an extra acknowledge related clock pulse. A slave receiver which is addressed is obliged to generate an acknowledge after the reception of each byte. Also, a master receiver must generate an acknowledge after the reception of each byte that has been clocked out of the slave transmitter. The device that acknowledges has to pull down the SDA line during the acknowledge clock pulse in such a way that the SDA line is a stable low during the high period of the acknowledge related clock pulse. Of course, setup and hold times must be taken into account. A master receiver must signal an end-of-data to the slave transmitter by not generating an acknowledge on the last byte that has been clocked out of the slave. In this case, the transmitter must leave the data line high to enable the master to generate the STOP condition. Figure 5. Serial bus data transfer sequence DATA LINE STABLE DATA VALID CLOCK DATA START CONDITION CHANGE OF DATA ALLOWED STOP CONDITION AI00587 Doc ID 6103 Rev 10 9/30 Operation Figure 6. M41T11 Acknowledgement sequence CLOCK PULSE FOR ACKNOWLEDGEMENT START SCLK FROM MASTER 1 DATA OUTPUT BY TRANSMITTER 2 8 MSB 9 LSB DATA OUTPUT BY RECEIVER AI00601 Figure 7. Bus timing requirements sequence SDA tBUF tHD:STA tHD:STA tR tF SCL tHIGH P S tLOW tSU:DAT tHD:DAT tSU:STA SR tSU:STO P AI00589 1. P = STOP and S = START 10/30 Doc ID 6103 Rev 10 M41T11 Operation Table 2. AC characteristics Parameter(1) Symbol Min Max Unit 0 100 kHz fSCL SCL clock frequency tLOW Clock low period 4.7 s tHIGH Clock high period 4 s tR SDA and SCL rise time 1 s tF SDA and SCL fall time 300 ns tHD:STA START condition hold time (after this period the first clock pulse is generated) tSU:STA tSU:DAT tHD:DAT (2) tSU:STO tBUF 4 s START condition setup time (only relevant for a repeated start condition) 4.7 s Data setup time 250 ns Data hold time 0 s STOP condition setup time 4.7 s Time the bus must be free before a new transmission can start 4.7 s 1. Valid for ambient operating temperature: TA = -40 to 85C; VCC = 2.0 to 5.5 V (except where noted). 2. Transmitter must internally provide a hold time to bridge the undefined region (300 ns max.) of the falling edge of SCL. 2.2 Read mode In this mode, the master reads the M41T11 slave after setting the slave address (see Figure 8). Following the write mode control bit (R/W = 0) and the acknowledge bit, the word address An is written to the on-chip address pointer. Next the START condition and slave address are repeated, followed by the READ mode control bit (R/W = 1). At this point, the master transmitter becomes the master receiver. The data byte which was addressed will be transmitted and the master receiver will send an acknowledge bit to the slave transmitter (see Figure 9). The address pointer is only incremented on reception of an acknowledge bit. The M41T11 slave transmitter will now place the data byte at address An + 1 on the bus. The master receiver reads and acknowledges the new byte and the address pointer is incremented to An + 2. This cycle of reading consecutive addresses will continue until the master receiver sends a STOP condition to the slave transmitter. An alternate READ mode may also be implemented, whereby the master reads the M41T11 slave without first writing to the (volatile) address pointer. The first address that is read is the last one stored in the pointer (see Figure 10 on page 12). Doc ID 6103 Rev 10 11/30 Operation Figure 8. M41T11 Slave address location R/W SLAVE ADDRESS A 1 LSB MSB START 1 0 1 0 0 0 AI00602 R/W SLAVE ADDRESS DATA n+1 ACK DATA n ACK BUS ACTIVITY: S ACK WORD ADDRESS (An) ACK S R/W SDA LINE ACK BUS ACTIVITY: MASTER START Read mode sequence START Figure 9. STOP SLAVE ADDRESS DATA n+X P NO ACK AI00899 STOP R/W SLAVE ADDRESS 12/30 DATA n+X P NO ACK BUS ACTIVITY: DATA n+1 ACK DATA n ACK S ACK SDA LINE ACK BUS ACTIVITY: MASTER START Figure 10. Alternate read mode sequence AI00895 Doc ID 6103 Rev 10 M41T11 2.3 Operation Write mode In this mode the master transmitter transmits to the M41T11 slave receiver. Bus protocol is shown in Figure 11. Following the START condition and slave address, a logic '0' (R/W = 0) is placed on the bus and indicates to the addressed device that word address An will follow and is to be written to the on-chip address pointer. The data word to be written to the memory is strobed in next and the internal address pointer is incremented to the next memory location within the RAM on the reception of an acknowledge clock. The M41T11 slave receiver will send an acknowledge clock to the master transmitter after it has received the slave address and again after it has received the word address and each data byte. 2.4 Data retention mode With valid VCC applied, the M41T11 can be accessed as described above with read or write cycles. Should the supply voltage decay, the M41T11 will automatically deselect, write protecting itself when VCC falls (see Figure 15). STOP SLAVE ADDRESS DATA n+X P ACK DATA n+1 ACK BUS ACTIVITY: DATA n ACK WORD ADDRESS (An) ACK S R/W SDA LINE ACK BUS ACTIVITY: MASTER START Figure 11. Write mode sequence AI00591 Doc ID 6103 Rev 10 13/30 Clock operation 3 M41T11 Clock operation The eight byte clock register (see Table 3) is used to both set the clock and to read the date and time from the clock, in a binary coded decimal format. Seconds, minutes, and hours are contained within the first three registers. Bits D6 and D7 of clock register 2 (hours register) contain the CENTURY ENABLE bit (CEB) and the CENTURY bit (CB). Setting CEB to a '1' will cause CB to toggle, either from '0' to '1' or from '1' to '0' at the turn of the century (depending upon its initial state). If CEB is set to a '0', CB will not toggle. Bits D0 through D2 of register 3 contain the day (day of week). Registers 4, 5 and 6 contain the date (day of month), month and years. The final register is the control register (this is described in the clock calibration section). Bit D7 of register 0 contains the STOP bit (ST). Setting this bit to a '1' will cause the oscillator to stop. If the device is expected to spend a significant amount of time on the shelf, the oscillator may be stopped to reduce current drain. When reset to a '0' the oscillator restarts within one second. Note: In order to guarantee oscillator startup after the initial power-up, set the ST bit to a '1,' then reset this bit to a '0.' This sequence enables a "kick start" circuit which aids the oscillator startup during worst case conditions of voltage and temperature. The seven clock registers may be read one byte at a time, or in a sequential block. The control register (address location 7) may be accessed independently. Provision has been made to assure that a clock update does not occur while any of the seven clock addresses are being read. If a clock address is being read, an update of the clock registers will be delayed by 250 ms to allow the read to be completed before the update occurs. This will prevent a transition of data during the read. Note: 14/30 This 250 ms delay affects only the clock register update and does not alter the actual clock time. Doc ID 6103 Rev 10 M41T11 Clock operation Table 3. Register map(1) Data Function/range Address D7 D6 D5 D4 D3 D2 D1 D0 BCD format 0 ST 10 seconds Seconds Seconds 00-59 1 X 10 minutes Minutes Minutes 00-59 2 CEB(2) CB 3 X X X 4 X X 10 date 5 X X X 6 7 10 hours X Hours X Day 10 M. 10 years OUT FT S Century/hours 0-1/00-23 Day 01-07 Date Date 01-31 Month Month 01-12 Years Year 00-99 Calibration Control 1. Keys: S = SIGN bit FT = FREQUENCY TEST bit ST = STOP bit OUT = Output level X = Don't care CEB = Century enable bit CB = Century bit 2. When CEB is set to '1', CB will toggle from '0' to '1' or from '1' to '0' every 100 years (dependent upon the initial value set). When CEB is set to '0', CB will not toggle.When CEB is set to '1', CB will toggle from '0' to '1' or from '1' to '0' every 100 years (dependent upon the initial value set). When CEB is set to '0', CB will not toggle. 3.1 Clock calibration The M41T11 is driven by a quartz controlled oscillator with a nominal frequency of 32,768 Hz. The devices are tested not to exceed 35 ppm (parts per million) oscillator frequency error at 25C, which equates to about 1.53 minutes per month. With the calibration bits properly set, the accuracy of each M41T11 improves to better than 2 ppm at 25C. The oscillation rate of any crystal changes with temperature (see Figure 12 on page 17). Most clock chips compensate for crystal frequency and temperature shift error with cumbersome trim capacitors. The M41T11 design, however, employs periodic counter correction. The calibration circuit adds or subtracts counts from the oscillator divider circuit at the divide by 256 stage, as shown in Figure 13 on page 17. The number of times pulses are blanked (subtracted, negative calibration) or split (added, positive calibration) depends upon the value loaded into the five-bit calibration byte found in the control register. Adding counts speeds the clock up, subtracting counts slows the clock down. The calibration byte occupies the five lower order bits (D4-D0) in the control register (addr 7). This byte can be set to represent any value between 0 and 31 in binary form. Bit D5 is a sign bit; '1' indicates positive calibration, '0' indicates negative calibration. Calibration occurs within a 64 minute cycle. The first 62 minutes in the cycle may, once per minute, have one second either shortened by 128 or lengthened by 256 oscillator cycles. If a binary '1' is loaded into the register, only the first 2 minutes in the 64 minute cycle will be modified; if a binary 6 is loaded, the first 12 will be affected, and so on. Therefore, each calibration step has the effect of adding 512 or subtracting 256 oscillator cycles for every 125,829,120 actual oscillator cycles, that is +4.068 or -2.034 ppm of Doc ID 6103 Rev 10 15/30 Clock operation M41T11 adjustment per calibration step in the calibration register. Assuming that the oscillator is in fact running at exactly 32,768 Hz, each of the 31 increments in the calibration byte would represent +10.7 or -5.35 seconds per month which corresponds to a total range of +5.5 or -2.75 minutes per month. Two methods are available for ascertaining how much calibration a given M41T11 may require. The first involves simply setting the clock, letting it run for a month and comparing it to a known accurate reference (like WWV broadcasts). While that may seem crude, it allows the designer to give the end user the ability to calibrate his clock as his environment may require, even after the final product is packaged in a non-user serviceable enclosure. All the designer has to do is provide a simple utility that accessed the calibration byte. The second approach is better suited to a manufacturing environment, and involves the use of some test equipment. When the frequency test (FT) bit, the seventh-most significant bit in the control register, is set to a '1', and the oscillator is running at 32,768 Hz, the FT/OUT pin of the device will toggle at 512 Hz. Any deviation from 512 Hz indicates the degree and direction of oscillator frequency shift at the test temperature. For example, a reading of 512.01024 Hz would indicate a +20 ppm oscillator frequency error, requiring a -10(XX001010) to be loaded into the calibration byte for correction. Note that setting or changing the calibration byte does not affect the frequency test output frequency. 3.2 Output driver pin When the FT bit is not set, the FT/OUT pin becomes an output driver that reflects the contents of D7 of the control register. In other words, when D6 of location 7 is a zero and D7 of location 7 is a zero and then the FT/OUT pin will be driven low. Note: The FT/OUT pin is open drain which requires an external pull-up resistor. 3.3 Preferred initial power-on defaults Upon initial application of power to the device, the FT bit will be set to a '0' and the OUT bit will be set to a '1'. All other register bits will initially power on in a random state. 16/30 Doc ID 6103 Rev 10 M41T11 Clock operation Figure 12. Crystal accuracy across temperature Frequency (ppm) 20 0 -20 -40 -60 -80 F = K x (T -T )2 O F -100 K = -0.036 ppm/C2 0.006 ppm/C2 -120 TO = 25C 5C -140 -160 -40 -30 -20 -10 0 10 20 30 40 50 60 70 80 Temperature C AI00999b Figure 13. Clock calibration NORMAL POSITIVE CALIBRATION NEGATIVE CALIBRATION AI00594B Doc ID 6103 Rev 10 17/30 Maximum ratings 4 M41T11 Maximum ratings Stressing the device above the rating listed in the absolute maximum ratings table may cause permanent damage to the device. These are stress ratings only and operation of the device at these or any other conditions above those indicated in the operating sections of this specification is not implied. Exposure to absolute maximum rating conditions for extended periods may affect device reliability. Table 4. Absolute maximum ratings Symbol TA TSTG TSLD(1) Parameter Ambient operating temperature Storage temperature (VCC off, oscillator off) Value Unit -40 to 85 C SNAPHAT(R) -40 to 85 SOIC -55 to 125 C Lead solder temperature for 10 seconds 260 C VIO Input or output voltages -0.3 to 7 V VCC Supply voltage -0.3 to 7 V IO Output current 20 mA PD Power dissipation 0.25 W 1. Lead-free (Pb-free) lead finish: reflow at peak temperature of 260C (the time above 255C must not exceed 30 seconds). Caution: Negative undershoots below -0.3 V are not allowed on any pin while in the battery backup mode. Caution: Do NOT wave solder SOIC to avoid damaging SNAPHAT(R) sockets. 18/30 Doc ID 6103 Rev 10 M41T11 5 DC and AC parameters DC and AC parameters This section summarizes the operating and measurement conditions, as well as the DC and AC characteristics of the device. The parameters in the following DC and AC characteristic tables are derived from tests performed under the measurement conditions listed in Table 5: Operating and AC measurement conditions. Designers should check that the operating conditions in their projects match the measurement conditions when using the quoted parameters. Table 5. Operating and AC measurement conditions(1) Parameter Supply voltage (VCC) M41T11 2.0 to Ambient operating temperature (TA) 5.5(2) Unit V -40 to 85 C Load capacitance (CL) 100 pF Input rise and fall times 50 ns Input pulse voltages 0.2VCC to 0.8VCC V Input and output timing ref. voltages 0.3VCC to 0.7VCC V 1. Output Hi-Z is defined as the point where data is no longer driven. 2. Supply voltage for SOH28 is 3.3 V to 5.5 V. Figure 14. AC testing input/output waveform 0.8VCC 0.7VCC 0.3VCC 0.2VCC AI02568 Doc ID 6103 Rev 10 19/30 DC and AC parameters Table 6. M41T11 Capacitance Parameter(1)(2) Symbol CIN COUT(3) tLP Min Max Unit Input capacitance (SCL) 7 pF Output capacitance (SDA, FT/OUT) 10 pF 1000 ns Low-pass filter input time constant (SDA and SCL) 250 1. Effective capacitance measured with power supply at 5 V; sampled only, not 100% tested. 2. At 25C, f = 1 MHz. 3. Outputs deselected. Table 7. Symbol DC characteristics Test Condition(1) Parameter Min Typ Max Unit 0V VIN VCC 1 A 0V VOUT VCC 1 A Switch frequency = 100 kHz 300 A SCL, SDA = VCC - 0.3 V 70 A ILI Input leakage current ILO Output leakage current ICC1 Supply current ICC2 Supply current (standby) VIL Input low voltage -0.3 0.3VCC V VIH Input high voltage 0.7VCC VCC + 0.5 V VOL Output low voltage IOL = 3 mA 0.4 V FT/OUT 5.5 V 3 3.5(4) V 0.8 1 A Pull-up supply voltage (open drain) VBAT(2) Battery supply voltage IBAT Battery supply current 2.5(3) TA = 25C, VCC = 0 V, oscillator ON, VBAT = 3 V 1. Valid for ambient operating temperature: TA = -40 to 85C; VCC = 2.0 to 5.5 V (except where noted). 2. STMicroelectronics recommends the RAYOVAC BR1225 or BR1632 (or equivalent) as the battery supply. 3. After switchover (VSO), VBAT(min) can be 2.0 V for crystal with RS = 40 K. 4. For rechargeable back-up, VBAT(max) may be considered VCC. Table 8. Symbol fO Crystal electrical characteristics Parameter(1)(2)(3) Resonant frequency RS Series resistance CL Load capacitance Min Typ Max 32.768 kHz 60(4) 12.5 Unit k pF 1. These values are externally supplied if using the SO8 package. STMicroelectronics recommends the KDS DT-38: 1TA/1TC252E127, Tuning Fork Type (thru-hole) or the DMX-26S: 1TJS125FH2A212, (SMD) quartz crystal for industrial temperature operations. Please refer to the KDS website for further information on this crystal type. 2. Load capacitors are integrated within the M41T11. Circuit board layout considerations for the 32.768 kHz crystal of minimum trace lengths and isolation from RF generating signals should be taken into account. 3. All SNAPHAT(R) battery:crystal tops meet these specifications. 4. 20/30 ESR (max) = 110 k for VCC or VBAT > 2.5 V. Doc ID 6103 Rev 10 M41T11 DC and AC parameters Figure 15. Power down/up mode AC waveforms VCC VSO tPD tREC SDA SCL DON'T CARE AI00596 Table 9. Power down/up AC characteristics Parameter(1)(2) Symbol Min Max Unit tPD SCL and SDA at VIH before power down 0 ns tREC SCL and SDA at VIH after power up 10 s 1. Valid for ambient operating temperature: TA = -40 to 85C; VCC = 2.0 to 5.5 V (except where noted). 2. VCC fall time should not exceed 5 mV/s. Table 10. Power down/up trip points DC characteristics Symbol Parameter(1)(2) Min Typ Max(3) Unit VSO(4) Battery backup switchover voltage VBAT - 0.80 VBAT - 0.50 VBAT - 0.30 V 1. Valid for ambient operating temperature: TA = -40 to 85C; VCC = 2.0 to 5.5 V (except where noted). 2. All voltages referenced to VSS. 3. In 3.3 V application, if initial battery voltage is 3.4 V, it may be necessary to reduce battery voltage (i.e., through wave soldering the battery) in order to avoid inadvertent switchover/deselection for VCC - 10% operation. 4. Switchover and deselect point. Doc ID 6103 Rev 10 21/30 Package mechanical data 6 M41T11 Package mechanical data In order to meet environmental requirements, ST offers these devices in different grades of ECOPACK(R) packages, depending on their level of environmental compliance. ECOPACK(R) specifications, grade definitions and product status are available at: www.st.com. ECOPACK(R) is an ST trademark. 22/30 Doc ID 6103 Rev 10 M41T11 Package mechanical data Figure 16. SO8 - 8-lead plastic small outline package outline h x 45 A2 A c ccc b e 0.25 mm GAUGE PLANE D k 8 E1 E 1 A1 L L1 SO-A 1. Drawing is not to scale. Table 11. SO8 - 8-lead plastic small outline (150 mils body width) package mechanical data millimeters inches Symbol Typ Min A Max Typ Min 1.75 Max 0.069 A1 0.10 A2 1.25 b 0.28 0.48 0.011 0.019 c 0.17 0.23 0.007 0.009 ccc 0.25 0.004 0.010 0.049 0.10 0.004 D 4.90 4.80 5.00 0.193 0.189 0.197 E 6.00 5.80 6.20 0.236 0.228 0.244 E1 3.90 3.80 4.00 0.154 0.150 0.157 e 1.27 - - 0.050 - - h 0.25 0.50 0.010 0.020 k 0 8 0 8 L 0.40 1.27 0.016 0.050 L1 1.04 0.041 Doc ID 6103 Rev 10 23/30 Package mechanical data M41T11 Figure 17. SOH28 - 28-lead plastic small outline, battery SNAPHAT(R) package outline A2 A C B eB e CP D N E H A1 L 1 SOH-A 1. Drawing is not to scale. Table 12. SOH28 - 28-lead plastic small outline, battery SNAPHAT(R) package mechanical data mm inches Symb Typ Min A Typ Min 3.05 Max 0.120 A1 0.05 0.36 0.002 0.014 A2 2.34 2.69 0.092 0.106 B 0.36 0.51 0.014 0.020 C 0.15 0.32 0.006 0.012 D 17.71 18.49 0.697 0.728 E 8.23 8.89 0.324 0.350 - - - - eB 3.20 3.61 0.126 0.142 H 11.51 12.70 0.453 0.500 L 0.41 1.27 0.016 0.050 0 8 0 8 N 28 e CP 24/30 Max 1.27 0.050 28 0.10 Doc ID 6103 Rev 10 0.004 M41T11 Package mechanical data Figure 18. SH - 4-pin SNAPHAT(R) housing for 48 mAh battery & crystal package outline A1 A2 A3 A eA B L eB D E SHTK-A 1. Drawing is not to scale. Table 13. SH - 4-pin SNAPHAT(R) housing for 48 mAh battery & crystal, package mechanical data mm inches Symb Typ Min A Max Typ Min 9.78 Max 0.385 A1 6.73 7.24 0.265 0.285 A2 6.48 6.99 0.255 0.275 A3 0.38 0.015 B 0.46 0.56 0.018 0.022 D 21.21 21.84 0.835 0.860 E 14.22 14.99 0.560 0.590 eA 15.55 15.95 0.612 0.628 eB 3.20 3.61 0.126 0.142 L 2.03 2.29 0.080 0.090 Doc ID 6103 Rev 10 25/30 Package mechanical data M41T11 Figure 19. SH - 4-pin SNAPHAT(R) housing for 120 mAh battery & crystal, package outline A1 A2 A3 A eA B L eB D E SHTK-B 1. Drawing is not to scale. Table 14. SH - 4-pin SNAPHAT(R) housing for 120 mAh battery & crystal, package mech. data mm inches Symb Typ Min A Typ Min 10.54 Max 0.415 A1 8.00 8.51 0.315 0.335 A2 7.24 8.00 0.285 0.315 A3 26/30 Max 0.38 0.015 B 0.46 0.56 0.018 0.022 D 21.21 21.84 0.835 0.860 E 17.27 18.03 0.680 0.710 eA 15.55 15.95 0.612 0.628 eB 3.20 3.61 0.126 0.142 L 2.03 2.29 0.080 0.090 Doc ID 6103 Rev 10 M41T11 7 Part numbering Part numbering Table 15. Ordering information scheme Example: M41T 11 M 6 F Device type M41T Supply voltage 11 = VCC = 2.0 to 5.5 V(1) Package M = SO8 (150 mil width) MH(2) = SOH28 Temperature range 6 = -40 to 85C Shipping method F = ECOPACK(R) package, tape & reel 1. SOH28 supply voltage is 3.3 V to 5.5 V. 2. The SOIC package (SOH28) requires the SNAPHAT(R) battery package which is ordered separately (see Table 16). Caution: Do not place the SNAPHAT battery package "M4TXX-BR12SH" in conductive foam as it will drain the lithium button-cell battery. For other options, or for more information on any aspect of this device, please contact the ST sales office nearest you. Table 16. SNAPHAT(R) battery table Part Number Description Package M4T28-BR12SH Lithium battery (48 mAh) SNAPHAT SH M4T32-BR12SH Lithium battery (120 mAh) SNAPHAT SH Doc ID 6103 Rev 10 27/30 Environmental information 8 M41T11 Environmental information Figure 20. Recycling symbols This product contains a non-rechargeable lithium (lithium carbon monofluoride chemistry) button cell battery fully encapsulated in the final product. Recycle or dispose of batteries in accordance with the battery manufacturer's instructions and local/national disposal and recycling regulations. 28/30 Doc ID 6103 Rev 10 M41T11 Revision history 9 Revision history Table 17. Revision history Date Revision 03-Oct-2007 7 Added lead-free second level interconnect information to cover page and Section 6: Package mechanical data; some text changes; updated Table 4. 02-May-2008 8 Updated Figure 16, Table 11, 15. 08-Jan-2009 9 Updated Table 4, Section 6: Package mechanical data; added Section 8: Environmental information. 10 Added ESR footnote to Table 8: Crystal electrical characteristics Removed shipping method in tubes from Table 15: Ordering information scheme Updated Section 8: Environmental information Minor textual updates 11-Jun-2012 Changes Doc ID 6103 Rev 10 29/30 M41T11 Please Read Carefully: Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries ("ST") reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. 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