SPECIFICATION
(Reference sheet)
·
Supplier : Samsung electro-mechanics · Samsung P/N : CL05A106MP5NUNC
·
Product : Multi-layer Ceramic Capacitor ·
Description : CAP, 10
㎌
, 10V, ±20%, X5R, 0402
CL 05 A 106 M P 5 N U N C
①
②
③
④
⑤
⑥
⑦
⑧
⑨
⑩
⑪
①Series Samsung Multi-layer Ceramic Capacitor
②Size 0402 (inch code) L :
1.00±0.20
㎜
W :
0.50±0.20
㎜
③Dielectric X5R ⑧Inner electrode
④Capacitance 10㎌Termination
⑤Capacitance ±20% Plating (Pb Free)
tolerance ⑨Product Size control code
⑥Rated Voltage 10V ⑩Special Reserved for future use
⑦Thickness
0.50±0.20
㎜
⑪
Packaging
B. Structure & Dimension
10㎌
Ni
A. Samsung Part Number
0.25±0.10
Cu
Ni/Sn 100%
Samsung P/N
Dimension(㎜)
L W T BW
Cardboard Type, 7" Reel
CL05A106MP5NUNC 1.00±0.20 0.50±0.20 0.50±0.20
C. Samsung Reliablility Test and Judgement Condition
Capacitance Within specified tolerance 1㎑±10% / 0.5±0.1Vrms
Tan δ (DF)
Insulation
Resistance Whichever is smaller
Appearance No abnormal exterior appearance Microscope (×10)
Withstanding No dielectric breakdown or 250% of the rated voltage
Voltage mechanical breakdown
Temperature
Characteristics
Adhesive Strength No peeling shall be occur on the
of Termination terminal electrode
Bending Strength
Solderability SnAg3.0Cu0.5 solder
is to be soldered newly 245±5
℃
, 3±0.3sec.
(preheating : 80~120
℃
for 10~30sec.)
Resistance to Solder pot : 270±5
℃
, 10±1sec.
Soldering Heat Tan δ, IR : initial spec.
Vibration Test Amplitude : 1.5mm
Tan δ, IR : initial spec. From 10
㎐
to 55
㎐
(return : 1min.)
2hours × 3 direction (x, y, z)
Moisture With rated voltage
Resistance
Whichever is smaller
High Temperature
Resistance Max. operating temperature
1,000+48/-0hrs
Whichever is smaller
Temperature 1 cycle condition
Cycling Tan δ, IR : initial spec. Min. operating temperature
→
25
℃
→
Max. operating temperature
→
25
℃
5 cycle test
※ The reliability test condition can be replaced by the corresponding accelerated test condition.
D. Recommended Soldering method :
Reflow ( Reflow Peak Temperature : 260±5℃, 30sec. )
Product specifications included in the specifications are effective as of March 1, 2013.
Please be advised that they are standard product specifications for reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.
This MLCC with the test voltage at 100% of the rated voltage in the high temperature resistance
test should be applied with the derating voltage and temperature according to 3-1 derating guide
Tan δ : 0.25 max.
IR : 1,000Mohm or 7Mohm×
㎌
Capacitance change : within ±15%
Capacitance change : within ±12.5%
Tan δ : 0.25 max.
IR : 500Mohm or 3.5Mohm×
㎌
40±2
℃
,90~95%RH, 500hrs+12/-0hrs
With 100% of the rated voltageCapacitance change : within ±12.5%
Bending to the limit (1mm)Capacitance change : within ±10%
with 1.0mm/sec.
More than 75% of terminal surface
Capacitance change : within ±7.5%
Capacitance change : within ±5%
(From -55
℃
to 85
℃
, Capacitance change should be within ±15%)
X5R
500g·f, for 10±1 sec.
Judgement Test condition
*A capacitor prior to measuring the capacitance is heat
treated at 150℃+0/-10℃ for 1hour and maintained in
ambient air for 24±2 hours.
0.125 max.
Rated Voltage 60~120 sec
10,000Mohm or 50Mohm×
㎌
D. Recommended TEST PCB
( Adhesive strength of termination)
Size code
Size (mm)
a
b
c
02
0.4 × 0.2
0.17
0.20
0.26
03
0.6 × 0.3
0.30
0.30
0.30
05
1.0. × 0.5
0.55
0.40
0.50
10
1.6 × 0.8
1.00
1.00
1.20
21
2.0 × 1.25
1.40
1.20
1.65
31
3.2 × 1.6
1.40
2.20
2.00
32
3.2 × 2.5
1.40
2.20
2.90
43
4.5 × 3.2
1.75
3.50
3.70
55
5.7 × 5.0
1.75
4.50
5.60
(Substrate for bending strength test) (Substrate for Reliability test)
Size code
Size (mm)
a
b
c
d
e
02
0.4 × 0.2
0.2
0.6
0.2
5.0
5.5
03
0.6 × 0.3
0.3
0.9
0.3
5.0
5.5
05
1.0 × 0.5
0.4
1.5
0.5
5.0
5.5
10
1.6 × 0.8
1.0
3.0
1.2
5.0
5.5
21
2.0 × 1.25
1.2
4.0
1.65
5.0
5.5
31
3.2 × 1.6
2.2
5.0
2.0
5.0
5.5
32
3.2 × 2.5
2.2
5.0
2.9
5.0
5.5
43
4.5 × 3.2
3.5
7.0
3.7
5.0
5.5
55
5.7 × 5.0
4.5
8.0
5.6
5.0
5.5
☞ Material : Glass epoxy substrate ☞ Thickness : T=1.6 ㎜ (T= 0.8 ㎜ for 03/05)
☞ : Copper foil (T=0.035 ㎜) ☞ : Solder resist
☞ Caution : Abnormality can occur if lead-based solder (KSD 6704) with 3% silver is used.
d
e
a
c
b
MLCC Product Manual
1. Packaging
This specification applies to taping of MLCC
When customers require, the specification may be changed under the agreement.
1-1. Figure
1-2. Quantity
[unit:pcs]
Type
Size Code
Inch(mm)
Chip
Thickness
Taping Type
Pitch
Plastic
7 inches reel
Plastic
10 inches reel
Plastic
13 inches reel
MLCC
0402 (01005)
0.2 mm
PAPER
2mm
20k
-
100K
0603 (0201)
0.3 mm
PAPER
2mm
10K
-
50K
1005 (0402)
0.5 mm
PAPER
2mm
10K
-
50K
1608 (0603)
0.8 mm
PAPER
4mm
4K
10K
15K / 10K
2012 (0805)
T≤0.85 mm
PAPER
4mm
4K
10K
15K / 10K
T≥1.0 mm
EMBOSSED
4mm
2K
6K
10K
3216 (1206)
T≤0.85 mm
PAPER
4mm
4K
10K
10K
T≥1.0 mm
EMBOSSED
4mm
2K
4K
10K
3225 (1210)
T≤1.6 mm
EMBOSSED
4mm
2K
4K
10K
T≥2.0 mm
EMBOSSED
4mm
1K
4K
4K
4520 (1808)
T≤1.6 mm
EMBOSSED
8mm
2k
-
8k
T≥2.0 mm
EMBOSSED
8mm
1k
-
4k
4532 (1812)
T≤2.0 mm
EMBOSSED
8mm
-
-
4K
T>2.0 mm
EMBOSSED
8mm
-
-
2K
5750 (2220)
T≥2.5 mm
EMBOSSED
8mm
-
-
2K
Empty section 200mm
Chip mounting section
Empty section 280mm
Leading 240mm
Paper or Embossed tape
Cover tape
Reel
Start
END
Unreeling
MLCC Product Manual
1-3. Tape Size
1-3-1. Cardboard(Paper) tape : 4mm pitch
[unit:mm]
Size
Inch(mm)
A
B
W
F
E
P1
P2
P0
D
t
0603
(1608)
1.00
±0.10
1.90
±0.10
8.00
±0.30
3.50
±0.05
1.75
±0.10
4.00
±0.10
2.00
±0.05
4.00
±0.10
φ1.50
+0.10/-0
1.1
Below
0805
(2012)
1.55
±0.10
2.30
±0.10
1206
(3216)
2.05
±0.10
3.60
±0.10
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
1-3-2. Cardboard(Paper) tape : 2mm pitch
[unit:mm]
Size
Inch(mm)
A
B
W
F
E
P1
P2
P0
D
t
01005
(0402)
0.25
±0.02
0.46
±0.02
8.00
±0.30
3.50
±0.05
1.75
±0.10
2.00
±0.05
2.00
±0.05
4.00
±0.10
φ1.50
+0.10
/-0.03
0.25
±0.02
0201
(0603)
0.38
±0.03
0.68
±0.03
0.35
±0.03
0402
(1005)
0.62
±0.05
1.12
±0.05
0.60
±0.05
0204
(0510)
0.62
+0.05
/-0.10
1.12
+0.05
/-0.10
0.37
±0.03
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
MLCC Product Manual
1-3-3. Embossed(Plastic) tape
[unit:mm]
Size
Inch(mm)
A
B
W
F
E
P1
P2
P0
D
t1
t0
01005
(0402)
0.23
±0.02
0.45
±0.02
4.00
±0.05
1.80
±0.02
0.90
±0.05
1.00
±0.02
1.00
±0.02
2.00
±0.03
φ0.80
±0.04
0.35
Below
0.50
Below
015008
(05025)
0.32
±0.03
0.58
±0.03
8.00
±0.30
3.50
±0.05
1.75
±0.10
2.00
±0.05
2.00
±0.05
4.00
±0.10
φ1.50
+0.10
/-0.03
0603
(1608)
1.05
±0.15
1.90
±0.15
4.00
±0.10
φ1.50
+0.10
/-0
2.92
Below
0.60
Below
0805
(2012)
1.45
±0.20
2.30
±0.20
1206
(3216)
1.90
±0.20
3.50
±0.20
1210
(3225)
2.80
±0.20
3.60
±0.20
1808
(4520)
2.30
±0.20
4.90
±0.20
12.0
±0.30
5.60
±0.05
8.00
±0.10
3.80
Below
1812
(4532)
3.60
±0.20
4.90
±0.20
2220
(5750)
5.50
±0.20
6.20
±0.20
0204
(0510)
0.62
+0.05
/-0.10
1.12
+0.05
/-0.10
8.00
±0.30
3.50
±0.05
4.00
±0.10
2.50
Below
0306
(0816)
1.10
±0.20
1.90
±0.20
※ The A, B in the table above are based on normal dimensions. The data may be changed
with the special size tolerances.
MLCC Product Manual
1-3-4. Reel Size
[unit:mm]
Symbol
Tape Width
A
B
C
D
E
W
t
7”Reel
4mm
φ178±2.0
MINφ50
φ13±0.5
21±0.8
2.0±0.5
5±0.5
1.2±0.2
8mm
φ178±2.0
MINφ50
φ13±0.5
21±0.8
2.0±0.5
10±1.5
0.9±0.2
12mm
φ178±2.0
MINφ50
φ13±0.5
21±0.8
2.0±0.5
13±0.5
1.2±0.2
10”Reel
8mm
φ258±2.0
MINφ70
φ13±0.5
21±0.8
2.0±0.5
10±1.5
1.8±0.2
13”Reel
8mm
φ330±2.0
MINφ70
φ13±0.5
21±0.8
2.0±0.5
10±1.5
1.8±0.2
12mm
φ330±2.0
MINφ70
φ13±0.5
21±0.8
2.0±0.5
13±0.5
2.2±0.2
1-4. Cover tape peel-off force
1-4-1. Peel-off force
10 g.f ≤ peel-off force ≤ 70 g.f
1-4-2. Measurement Method
-Taping Packaging design : Packaging design follows IEC 60286-3 standard.
(IEC 60286-3 Packaging of components for automatic handling - parts 3)
* If the static electricity of SMT process causes any problems, please contact us.
MLCC Product Manual
1-5. BOX package
1-5-1. Packaging Label
REEL & Box Type
Label includes the information as below.
1) Chip size
2) Temperature Characteristics
3) Nominal Capacitance
4) Model Name
5) LOT Number & Reel Number
6) Q’ty
1-5-2. Box Packaging
1) Double packaging with the paper type of inner box and outer box.
2) Avoid any damages during transportation by car, airplane and ship.
3) Remark information of contents on inner box and outer box
※ If special packaging is required, please contact us.
1-5-3. 7" Box packaging
[ Unit : mm ]
- Inner Box (7" x 5 REEL ) - Inner Box (7" x 10 REEL)
- Outer Box (7" x 20 REEL) - Outer Box (7" x 60 REEL)
MLCC Product Manual
1-5-4. 13” Box packaging
- Inner Box (13" x 4 REEL) - Outer Box (13" x 20 REEL)
1-6. Chip Weight
Size(L/W)
Inch(mm)
Size(T)
(mm)
Temp.
Weight
(mg/pc)
Size(L/W)
Inch(mm)
Size(T)
(mm)
Temp.
Weight
(mg/pc)
01005
(0402)
0.20
C0G
0.082
0201
(0603)
0.30
C0G
0.233
0.20
X7R
0.083
0.30
X7R
0.285
0.20
X5R
0.093
0.30
X5R
0.317
0402
(1005)
0.50
C0G
1.182
0603
(1608)
0.80
C0G
4.615
0.50
X7R
1.559
0.80
X7R
5.522
0.50
X5R
1.560
0.80
X5R
5.932
0805
(2012)
0.65
C0G
7.192
1206
(3216)
1.25
C0G
28.086
1.25
X7R
16.523
1.60
X7R
54.050
1.25
X5R
16.408
1.60
X5R
45.600
1210
(3225)
2.50
X7R
116.197
1808
(4520)
1.25
C0G
47.382
2.50
X5R
121.253
1.25
X7R
63.136
1812
(4532)
1.25
X7R
96.697
2220
(5750)
1.60
X7R
260.897
The weight of product is typical value per size, for more details, please contact us.
MLCC Product Manual
2. Product Characteristic data
2-1. Capacitance
The capacitance is the ratio of the change in an electric charge according to voltage change.
Due to the fact that the capacitance may be subject to change with the measured voltage and
frequency, it is highly recommended to measure the capacitance based on the following
conditions.
2-1-1. Measure capacitance with voltage and frequency specified in this document.
Regarding the voltage/frequency condition for capacitance measurement of each MLCC model,
please make sure to follow a section “C. Reliability test Condition - Capacitance” in this document.
The following table shows the voltage and frequency condition according to the capacitance
range.
[The voltage and frequency condition according to MLCC the capacitance range]
◆ Class I
Capacitance
Frequency
Voltage
≤ 1,000 pF
1 MHz ± 10%
0.5 ~ 5 Vrms
> 1,000 pF
1 kHz ± 10%
◆ Class II
Capacitance
Frequency
Voltage
≤ 10 ㎌
1 kHz ± 10%
1.0 ± 0.2 Vrms
> 10 ㎌
120 Hz ± 20%
0.5 ± 0.1 Vrms
Exception*
1 kHz ± 10%
0.5 ± 0.1 Vrms
Capacitance shall be measured after the heat treatment of 150+0/-10℃
for 1hr, leaving at room temperature for 24±2hr. (Class II)
2-1-2. It is recommended to use measurement equipment with the ALC (Auto Level Control) option.
The reason is that when capacitance or measurement frequency is high, the output voltage of
measurement equipment can be lower than the setting voltage due to the equipment limitation.
Note that when capacitance or measurement frequency is excessively high, the measurement
equipment may show ALC off warning and provide a lower output voltage than the setting
voltage even with ALC option selected. It is necessary to ensure the output voltage of
measurement equipment is the same as the setting voltage before measuring capacitance.
MLCC Product Manual
2-1-3. Capacitance value of high dielectric constant (Class II) MLCC changes with applied AC and DC
voltage. Therefore, it is necessary to take into account MLCC’s AC voltage characteristics and DC-
bias voltage characteristics when applying MLCC to the actual circuit.
2-1-4. The capacitance is in compliance with the EIA RS-198-1-F-2002.
2-2. Tan δ (DF)
2-2-1. An ideal MLCC’s energy loss is zero, but real MLCC has dielectric loss and resistance loss of
electrode. DF (Dissipation Factor) is defined as the ratio of loss energy to stored energy and
typically being calculated as percentage.
2-2-2. Quality factor (Q factor) is defined as the ratio of stored energy to loss energy.
The equation can be described as 1/DF. Normally the loss characteristic of Class I MLCC is
presented in Q, since the DF value is so small whereas the loss characteristic of Class II MLCC is
presented in DF.
2-2-3. It is recommended to use Class I MLCC for applications to require good linearity and low loss
such as coupling circuit, filter circuit and time constant circuit.
2-3. Insulation Resistance
Ceramic dielectric has a low leakage current with DC voltage due to the high insulating properties.
Insulation resistance is defined as the ratio of a leakage current to DC voltage.
2-3-1. When applying DC voltage to MLCC, a charging current and a leakage current flow together at
the initial stage of measurement. While the charging current decreases, and insulation resistance
(IR) in MLCC is saturated by time. Therefore, insulation resistance shall be measured 1 minute after
applying the rated voltage.
2-4. Capacitance Aging
The aging characteristic is that the high dielectric (Class II) MLCC decreases capacitance
value over time. It is also necessary to consider the aging characteristic with voltage and
temperature characteristics when Class II MLCC is used in circuitry.
MLCC Product Manual
2-4-1. In general, aging causes capacitance to decrease linearly with the log of time as shown in the
following graph. Please check with SEMCO for more details, since the value may vary between
different models.
2-4-2. After heat treatment (150 °C, 1hour), the capacitance decreased by aging is recovered, so aging
should be considered again from the time of heat treatment.
[ Example of Capacitance Aging ]
* Sample : C0G, X7R, X5R
2-5. Temperature Characteristics of Capacitance (TCC)
Please consider temperature characteristics of capacitance since the electrical characteristics such as
capacitance changes which is caused by a change in ceramic dielectric constant by temperature.
2-5-1. It is necessary to check the values specified in section “C. Reliability test Condition–Temperature
Characteristics” for the temperature and capacitance change range of MLCC.
[ Example of Temperature Characteristics (X5R) ] [ Example of Bias TCC ]
* Sample : 10uF, Rated voltage 6.3V * Sample : 10uF, Rated voltage 6.3V
MLCC Product Manual
2-5-2. When selecting MLCC, it is necessary to consider the heat characteristics of a system, room
temperature and TCC of MLCC, since the applied temperature may change the capacitance of
MLCC.
2-5-3. In addition, Bias TCC of MLCC should be taken into account when DC voltage is applied to MLCC.
2-6. Self-heating Temperature
It is necessary to design the system, with considering self-heating generated by the ESR
(Equivalent Series Resistance) of MLCC when AC voltage or pulse voltage is applied to MLCC.
2-6-1. When MLCC is used in an AC voltage or pulse voltage circuit, self-heating is generated when AC
or pulse current flows through MLCC. Short-circuit may be occurred by the degradation of MLCC’s
insulating properties.
2-6-2. The reliability of MLCC may be affected by MLCC being used in an AC voltage or pulse voltage
circuit, even the AC voltage or the pulse voltage is within the range of rated voltage.
Therefore, make sure to check the following conditions.
1) The surface temperature of MLCC must stay within the maximum operating temperature after
AC or Pulse voltage is applied.
2) The rise in increase by self-heating of MLCC must not exceed 20℃
[ Example of Ripple current ]
* Sample : X5R 10uF, Rated voltage 6.3V
MLCC Product Manual
2-7. DC & AC Voltage Characteristics
It is required to consider voltage characteristics in the circuit since the capacitance value of high
dielectric constant MLCC(Class II) is changed by applied DC & AC voltage.
2-7-1. Please ensure the capacitance change is within the allowed operating range of a system. In
particular, when high dielectric constant type MLCC (Class II) is used in circuit with narrow allowed
capacitance tolerance, a system should be designed with considering DC voltage, temperature
characteristics and aging characteristics of MLCC.
[ Example of DC Bias characteristics ]
* Sample : X5R 10uF, Rated voltage 6.3V
2-7-2. It is necessary to consider the AC voltage characteristics of MLCC and the AC voltage of a system,
since the capacitance value of high dielectric constant type MLCC (Class II) varies with the applied
AC voltage.
[ Example of AC voltage characteristics ]
* Sample : X5R 10uF, Rated voltage 6.3V
MLCC Product Manual
2-8. Impedance Characteristic
Electrical impedance (Z) of MLCC is the measurement of the opposition that MLCC presents to a
current (I) when a voltage (V) is applied. It is defined as the ratio of the voltage to the current
(Z=V/I). Impedance extends the concept of resistance to AC circuits and is a complex number
consisting of the real part of resistance (R) and the imaginary part of reactance (X) as Z=R+jX.
Therefore, it is required to design circuit with consideration of the impedance characteristics of
MLCC based on the frequency ( Z = R + jX )
2-8-1. MLCC operates as a capacitor in the low frequency and its reactance (XC) decreases as frequency
increases ( X_C=1/j2πfC ) where f is frequency and C is capacitance.
The resistance (ESR; Equivalent Series Resistance) of MLCC in the low frequency mainly comes
from the loss of its dielectric material.
2-8-2. MLCC operates as an inductor in the high frequency and the inductance of MLCC is called ESL
(Equivalent Series Inductance). The reactance (XL) of MLCC in the high frequency increases as
frequency increases ( X_L=j2πf∙ESL ). The resistance (ESR) of MLCC in the high frequency mainly
comes from the loss of its electrode metal.
2-8-3. SRF (Self Resonant Frequency) of MLCC is the frequency where its capacitive reactance (XC) and
inductive reactance(XL) cancel each other and the impedance of MLCC has only ESR at SRF.
2-8-4. The impedance of MLCC can be measured by a network analyzer or an impedance analyzer.
When using the network analyzer, please note that the small-signal input may lead to the
impedance of low capacitance caused by the AC voltage characteristic of MLCC.
[ Example of Impedance characteristics ]
* Sample : X5R 1uF, Rated voltage 6.3V
MLCC Product Manual
3. Electrical & Mechanical Caution
3-1. Derating
MLCC with the test voltage at 100% of the rated voltage in the high temperature resistance test
are labeled as “derated MLCC.” For this type of MLCC, the voltage and temperature should be
derated as shown in the following graph for the equivalent life time of a normal MLCC with the
test voltage at 150% of the rated voltage in the high temperature resistance test.
3-1-1. The derated MLCC should be applied with the derating voltage and temperature as shown in the
following graph.
3-1-2. The “Temperature of MLCC” in the x-axis of the graph below indicates the surface temperature of
MLCC including self-heating effect. The “Voltage Derating Ratio” in the y-axis of the graph below
gives the maximum operating voltage of MLCC with reference to the maximum voltage (Vmax) as
defined in section “3-2. Applied Voltage.”
[Example of derating graph for derated MLCC]
* Vmax ≤ Derated Voltage
* Only the Derating marked models
MLCC Product Manual
3-2. Applied Voltage
The actual applied voltage on MLCC should not exceed the rated voltage set in the specifications.
3-2-1. Cautions by types of voltage applied to MLCC
· For DC voltage or DC+AC voltage, DC voltage or the maximum value of DC + AC voltage should
not exceed the rated voltage of MLCC.
· For AC voltage or pulse voltage, the peak-to-peak value of AC voltage or pulse voltage
should not exceed the rated voltage of MLCC.
· Abnormal voltage such as surge voltage, static electricity should not exceed the rated voltage of
MLCC.
[Types of Voltage Applied to the Capacitor]
DC Voltage
AC Voltage
DC+AC Voltage 1
DC+AC Voltage 2
DC+Pulse Voltage
3-2-2. Effect of EOS (Electrical Overstress)
· Electrical Overstress such as a surge voltage or EOS can cause damages to MLCC, resulting in
the electrical short failure caused by the dielectric breakdown in MLCC.
· Down time of MLCC is varied with the applied voltage and the room temperature and a
dielectric shock caused by EOS can accelerate heating on the dielectric. Therefore, it can bring
about a failure of MLCC in a market at the early stage.
· Please use caution not to apply excessive electrical overstress including spike voltage MLCC when
preparing MLCC for testing or evaluating.
(1) Surge
When the overcurrent caused by surge is applied to MLCC, the influx of current into MLCC can
induce the overshooting phenomenon of voltage as shown in the graph below and result in the
electrical short failure in MLCC. Therefore, it is necessary to be careful to prevent the influx of
surge current into MLCC.
(2) ESD (Electrostatic Discharge)
Since the voltage of the static electricity is very high but the quantity of electric charge is small
compared to the surge, ESD can cause damage to MLCC with low capacitance as shown in the
MLCC Product Manual
following graph, whereas surge with lots of electric charge quantity can cause damages to even
high capacitance MLCC.
[ Example of Surge applied to MLCC ] [ Example of ESD applied to MLCC ]
* Simulation for ESD 8kV
3-3. Vibration
Please check the types of vibration and shock, and the status of resonance.
Manage MLCC not to generate resonance and avoid any kind of impact to terminals.
When MLCC is used in a vibration environment, please make sure to contact us for the situation
and consider special MLCC such as Soft-term, etc.
3-4. Shock
Mechanical stress caused by a drop may cause damages to a dielectric or a crack in MLCC
Do not use a dropped MLCC to avoid any quality and reliability deterioration.
When piling up or handling printed circuit boards, do not hit MLCC with the corners of a PCB to
prevent cracks or any other damages to the MLCC.
3-5. Piezo-electric Phenomenon
MLCC may generate a noise due to vibration at specific frequency when using the high dielectric
constant MLCC (Class Ⅱ) at AC or Pulse circuits.
MLCC may cause a noise if MLCC is affected by any mechanical vibrations or shocks.
MLCC Product Manual
4. Process of Mounting and Soldering
4-1. Mounting
4-1-1. Mounting position
It is recommended to locate the major axis of MLCC in parallel to the direction in which the stress
is applied.
Not recommended Recommended
4-1-2. Cautions during mounting near the cutout
Please take the following measures to effectively reduce the stress generated from the cutting of
PCB. Select the mounting location shown below, since the mechanical stress is affected by a
location and a direction of MLCC mounted near the cutting line.
4-1-3. Cautions during mounting near screw
If MLCC is mounted near a screw hole, the board deflection may be occurred by screw torque.
Mount MLCC as far from the screw holes as possible.
Not recommended Recommended
MLCC Product Manual
4-2. Caution before Mounting
4-2-1. It is recommended to store and use MLCC in a reel. Do not re-use MLCC that was isolated from
the reel.
4-2-2. Check the capacitance characteristics under actual applied voltage.
4-2-3. Check the mechanical stress when actual process and equipment is in use.
4-2-4. Check the rated capacitance, rated voltage and other electrical characteristics before assembly.
Heat treatment must be done prior to measurement of capacitance.
4-2-5. Check the solderability of MLCC that has passed shelf life before use.
4-2-6. The use of Sn-Zn based solder may deteriorate the reliability of MLCC.
4-3. Cautions during Mounting with Mounting (pick-and-place) Machines
4-3-1. Mounting Head Pressure
Excessive pressure may cause cracks in MLCC.
It is recommended to adjust the nozzle pressure within the maximum value of 300g.f.
Additional conditions must be set for both thin film and special purpose MLCC.
4-3-2. Bending Stress
When using a two-sided substrate, it is required to mount MLCC on one side first before
mounting on the other side due to the bending of the substrate caused by the mounting head.
Support the substrate as shown in the picture below when MLCC is mounted on the other side.
If the substrate is not supported, bending of the substrate may cause cracks in MLCC.
4-3-3. Suction nozzle
Dust accumulated in a suction nozzle and suction mechanism can impede a smooth movement of
the nozzle. This may cause cracks in MLCC due to the excessive force during mounting.
If the mounting claw is worn out, it may cause cracks in MLCC due to the uneven force during
positioning.
A regular inspection such as maintenance, monitor and replacement for the suction nozzle and
mounting claw should be conducted.
MLCC Product Manual
4-4. Reflow soldering
MLCC is in a direct contact with the dissolved solder during soldering, which may be exposed to
potential mechanical stress caused by the sudden temperature change.
Therefore, MLCC may be contaminated by the location movement and flux.
For the reason, the mounting process must be closely monitored.
Method
Classification
Reflow soldering
Overall heating
Infrared rays
Hot plate
VPS(Vapor phase)
Local heating
Air heater
Laser
Light beam
4-4-1. Reflow Profile
[Reflow Soldering Conditions]
Use caution not to exceed the peak temperature (260℃) and time (30sec) as shown.
Pre-heating is necessary for all constituents including the PCB to prevent the mechanical damages
on MLCC. The temperature difference between the PCB and the component surface must be kept
to the minimum.
As for reflow soldering, it is recommended to keep the number of reflow soldering to less than
three times. Please check with us when the number of reflow soldering needs to exceed three
times. Care must be exercised especially for the ultra-small size, thin film and high capacitance
MLCC as they can be affected by thermal stress more easily.
MLCC Product Manual
4-4-2. Reflow temperature
The following quality problem may occur when MLCC is mounted with a lower temperature than
the reflow temperature recommended by a solder manufacturer. The specified peak temperature
must be maintained after taking into consideration the factors such as the placement of
peripheral constituent and the reflow temperature.
･Drop in solder wettability
･Solder voids
･Potential occurrence of whisker
･Drop in adhesive strength
･Drop in self-alignment properties
･Potential occurrence of tombstones
4-4-3. Cooling
Natural cooling with air is recommended.
4-4-4. Optimum solder flux for reflow soldering
· Overly the thick application of solder pastes results in an excessive solder fillet height.
This makes MLCC more vulnerable to the mechanical and thermal stress from the board, which
may cause cracks in MLCC.
· Too little solder paste results in a lack of the adhesive strength, which may cause MLCC to
isolate from PCB
· Check if solder has been applied uniformly after soldering is completed.
· It is required to design a PCB with consideration of a solder land pattern and its size to apply an
appropriate amount of solder to MLCC. The amount of the solder at the edge may impact
directly on cracks in MLCC.
· The design of a suitable solder land is necessary since the more the solder amount is,
the larger the force MLCC experiences and the higher the chance MLCC cracks.
Too Much Solder
large stress may cause cracks
Not enough solder
Weak holding force may cause bad
connections or detaching of the capacitor
MLCC Product Manual
4-5. Flow soldering
4-5-1. Flow profile
[Flow Soldering Conditions]
Take caution not to exceed peak temperature (260℃) and time (5sec) as shown.
Please contact us before use the type of high capacitance and thin film MLCC for some
exceptions that may be caused.
4-5-2. Caution before Flow soldering
· When a sudden heat is applied to MLCC, the mechanical rigidity of MLCC is deteriorated by the
internal deformation of MLCC. Preheating all the constituents including PCB is required to prevent
the mechanical damages on MLCC. The temperature difference between the solder and the
surface of MLCC must be kept to the minimum.
· If the flow time is too long or the flow temperature is too high, the adhesive strength with PCB
may be deteriorated by the leaching phenomenon of the outer termination, or the capacitance
value may be dropped by weak adhesion between the internal termination and the outer
termination.
MLCC Product Manual
4-6. Soldering Iron
Manual soldering can pose a great risk on creating thermal cracks in MLCC. The high temperature
soldering iron tip may come into a direct contact with the ceramic body of MLCC due to the
carelessness of an operator. Therefore, the soldering iron must be handled carefully, and close
attention must be paid to the selection of the soldering iron tip and to temperature control of the
tip.
4-6-1. How to use a soldering Iron
· In order to minimize damages on MLCC, preheating MLCC and PCB is necessary.
A hot plate and a hot air type preheater should be used for preheating
. Do not cool down MLCC and PCB rapidly after soldering.
· Keep the contact time between the outer termination of MLCC and the soldering iron as short as
possible. Long soldering time may cause problems such as adhesion deterioration by the
leaching phenomenon of the outer termination.
Variation of
Temp.
Soldering
Temp.(℃)
Pre-heating
Time(sec)
Soldering
Time(sec)
Cooling
Time(sec)
ΔT ≤ 130
300±10℃ max
≥60
≤4
-
* Control Δ T in the solder iron and preheating temperature.
Condition of Iron facilities
Wattage
Tip diameter
Soldering time
20W max
3㎜ max
4sec max
* Caution - Iron tip should not contact with ceramic body directly
Lead-free solder: Sn-3.0Ag-0.5CU
4-6-2. How to use a spot heater
· Compared to local heating using a solder iron, heat by a spot heater heats the overall MLCC and
the PCB, which is likely to lessen the thermal shocks.
For a high density PCB, a spot heater can prevent the problem to connect between a solder iron
and MLCC directly.
· If the distance from the air nozzle outlet to MLCC is too close, MLCC may be cracked due to the
thermal stress. Follow the conditions set in the table below to prevent this problem.
The spot heater application angle as shown in the figure is recommended to create a suitable
solder fillet shape.
· In case that heat of higher than 350℃ is applied to MLCC containing epoxy material,
the epoxy material in MLCC may be damaged by heat.
MLCC Product Manual
4-6-3. Cautions for re-work
· Too much solder amount will increase the risk of PCB bending or cause other damages.
· Too little solder amount will result in MLCC breaking loose from the PCB due to the
inadequate adhesive strength.
· Check if the solder has been applied properly and ensure the solder fillet has a proper shape.
* Soldering wire below ø0.5mm is required for soldering.
4-7. Cleaning
4-7-1. In general, cleaning is unnecessary if rosin flux is used.
When acidic flux is used strongly, chlorine in the flux may dissolve into some types of cleaning
fluids, thereby affecting the performance of MLCC.
This means that the cleansing solution must be carefully selected and should always be new.
4-7-2. Cautions for cleaning
MLCC or solder joint may be cracked with the vibration of PCB, if ultrasonic vibration is too strong
during cleaning. When high pressure cleaning equipment is used, test should be done for the
cleaning equipment and its process before the cleaning in order to avoid damages on MLCC.
Distance
≥ 5 ㎜
Hot Air Application angle
45℃
Hot Air Temperature Nozzle Outlet
≤ 400℃
Application Time
≤ 10s
MLCC Product Manual
4-8. Cautions for using electrical measuring probes
· Confirm the position of the support pin or jig when checking the electrical performance of MLCC
after mounting on the PCB.
· Watch for PCB bending caused by the pressure of a test-probe or other equipment.
· If the PCB is bent by the force from the test probe, MLCC may be cracked or the solder joint may
be damaged.
· Avoid PCB flexing by using the support pin on the back side of the PCB.
· Place equipment with the support pin as close to the test-probe as possible.
· Prevent shock vibrations of the board when the test-probe contacts a PCB.
Not recommended Recommended
4-9. Printed Circuit Board Cropping
· Do not apply any stress to MLCC such as bending or twisting the board after mounting MLCC
on the PCB.
· The stress as shown may cause cracks in MLCC when cutting the board.
· Cracked MLCC may cause degradation to the insulation resistance, thereby causing short circuit.
· Avoid these types of stresses applied to MLCC.
[Bending] [Twisting]
4-9-1. Cautions for cutting PCB
Check a cutting method of PCB in advance.
The high density board is separated into many individual boards after the completion of soldering.
If the board is bent or deformed during separation, MLCC may be cracked.
Carefully select a separation method that minimizes the deformation of the PCB.
MLCC Product Manual
4-10. Assembly Handling
4-10-1. Cautions for PCB handling
Hold the edges of the board mounted with MLCC with both hands since holding with one hand
may bend the board.
Do not use dropped boards, which may degrade the quality of MLCC.
4-10-2. Mounting other components
Pay attention to the following conditions when mounting other components on the back side of
The board after MLCC has been mounted on the front side.
When the suction nozzle is placed too close to the board, board deflection stress may be
applied to MLCC on the back side, resulting in cracks in MLCC.
Check if proper value is set on each chip mounter for a suction location, a mounting gap and a
suction gap by the thickness of components.
4-10-3. Board mounting components with leads
If the board is bent when inserting components (transformer, IC, etc.) into it, MLCC or solder
joint may be cracked.
Pay attention to the following:
· Reduce the stress on the board during insertion by increasing the size of the lead insertion
hole.
· Insert components with leads into the board after fixing the board with support pins or a
dedicated jig.
· Support the bottom side of the board to avoid bending the board.
· Check the status of the height of each support pin regularly when the support pins are used.
Not recommended Recommended
MLCC Product Manual
4-10-4. Socket and / or connector attach / detach
Since the insertion or removal from sockets and connectors may cause the board to bent, make
sure that MLCC mounted on the board should not be damaged in this process.
4-10-5. Fastening screw
When attaching a shield on a board, the board may be bent during a screw tightening work
Pay attention to the following conditions before performing the work.
· Plan the work to prevent the board from bending
· Use a torque driver to prevent over-tightening of the screw.
· Since the board may be bent by soldering, use caution in tightening the screw.
4-11. Adhesive selection
Pay attention to the following if an adhesive is used to position MLCC on the board before
soldering.
4-11-1. Requirements for Adhesives
· They must have enough adhesive strength to prevent MLCC from slipping or moving during
the handling the board.
· They must maintain their adhesive strength when exposed to soldering temperatures.
· They should not spread when applied to the PCB.
· They should have a long pot life.
· They should hardened quickly.
· They should not corrode the board or MLCC materials.
· They should be an insulator type that does not affect the characteristic of MLCC.
· They should be non-toxic, not harmful, and particularly safe when workers touch theadhesives.
4-11-2. Caution before Applying Adhesive
Check the correct application conditions before attaching MLCC to the board with an adhesive.
If the dimension of land, the type of adhesives, the amount of coating, the contact surface areas,
the curing temperature, or other conditions are not appropriate, it may degrade the MLCC
performance.
MLCC Product Manual
4-11-3. Cautions for selecting Adhesive
Depending on the type of the chosen adhesive, MLCC insulation resistance may be degraded.
In addition, MLCC may be cracked by the difference in contractile stress caused by the different
contraction rate between MLCC and the adhesive.
4-11-4. Cautions for the amount of applied adhesive and curing temperature
· The inappropriate amount of the adhesive cause the weak adhesive strength, resulting in the a
mounting defect in MLCC
· Excessive use of the adhesive may cause a soldering defect, loss of electrical connection,
incorrect curing, or slippage of a mounting position, thereby an inflow of the adhesive onto a
land section should be avoided.
· If the curing temperature is too high or the curing time is too long, the adhesive strength will
be degraded. In addition, oxidation both on the outer termination (Sn) of MLCC and the
surface of the board may deteriorate the solderability.
4-12. Flux
4-12-1. The excessive amount of flux generates excessive flux gases which may deteriorate solderability.
Therefore, apply the flux thin and evenly as a whole.
4-12-2. Flux with a high ratio of halogen may oxidize the outer termination of MLCC, if cleaning is not
done properly. Therefore, use flux with a halogen content of 0.1% max.
4-12-3. Strong acidic flux can degrade the MLCC performance
4-12-4. Check the solder quality of MLCC and the amount of remaining flux surrounding MLCC after the
mounting process.
4-13. Coating
4-13-1. Crack caused by Coating
A crack may be caused in the MLCC due to amount of the resin and stress of thermal
contraction of the resin during coating process.
During the coating process, the amount of resin and the stress of thermal contraction of the
resin may cause cracks in MLCC
The difference of thermal expansion coefficient between the coating, or a molding resin may
cause destruction, deterioration of insulation resistance or dielectric breakdown of MLCC such
as cracks or detachment, etc.
MLCC Product Manual
4-13-2. Recommended Coating material
· A thermal expansion coefficient should be as close to that of MLCC as possible.
· A silicone resin can be used as an under-coating to buffer the stress.
· The resin should have a minimum curing contraction rate.
· The resin should have a minimum sensitivity (ex. Epoxy resin).
· The insulation resistance of MLCC can be deteriorated if a high hygroscopic property resin is
used in a high humidity condition.
· Do not use strong acid substances due to the fact that coating materials inducing a family of
halogen substances and organic acid may corrode MLCC.
MLCC Product Manual
5. Design
5-1. Circuit design
When the board is dropped or bent, MLCC mounted on the board may be short-circuited by the
drop in insulation resistance. Therefore, it is required to install safety equipment such as a fuse to
prevent additional accidents when MLCC is short-circuited, otherwise, electric short and fire may
occur. This product is not a safety guaranteed product..
5-2. PCB Design
5-2-1. Unlike lead type components, SMD type components that are designed to be mounted directly
on the board are fragile to the stress. In addition, they are more sensitive to mechanical and
thermal stress than lead type components.
5-2-2. MLCC crack by PCB material type
A great difference of the thermal expansion coefficient between PCB and MLCC causes thermal
expansion and contraction, resulting in cracks in MLCC. Even though MLCC is mounted on a
board with a fluorine resin or on a single-layered glass epoxy, cracks in MLCC may occur.
5-3. Design system evaluation
5-3-1. Evaluate the actual design with MLCC to make sure there is no functional issue or violation of
specifications of the finished goods.
5-3-2. Please note that the capacitance may differ based on the operating condition of the actual system
since Class 2 MLCC capacitance varies with applied voltage and temperature.
5-3-3. Surge resistance must be evaluated since the excessive surge caused by the inductance of the
actual system may apply to MLCC.
5-3-4. Note the actual MLCC size and the termination shape.
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한 요약을 입력하십시오. 문서의 원하
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변경하려면 [그리기 도구] 탭을 사용
하십시오.]
MLCC Product Manual
5-4 Land dimension
The recommended land dimension is determined by evaluating the actual SET and a board.
Reflow Footprint
Chip Size
Chip Tol.
a
b
c
(a+2b)
(a+2b)
max
[mm]
[mm]
[mm]
[mm]
[mm]
min
0402
± 0.02
0.14~0.20
0.14~0.22
0.20~0.26
0.42
0.64
0603
± 0.03
0.16~0.20
0.24~0.32
0.30~0.35
0.64
0.84
± 0.05
0.18~0.26
0.24~0.32
0.32~0.37
0.66
0.9
± 0.07
0.20~0.28
0.25~0.35
0.35~0.39
0.7
0.98
± 0.09
0.22~0.30
0.25~0.35
0.35~0.39
0.72
1
1005
± 0.05
0.35~0.40
0.37~0.47
0.50~0.55
1.09
1.34
± 0.07
0.37~0.42
0.37~0.47
0.52~0.58
1.11
1.36
± 0.10
0.40~0.45
0.37~0.47
0.55~0.60
1.14
1.39
± 0.15
0.40~0.45
0.40~0.50
0.60~0.65
1.2
1.45
± 0.20
0.45~0.50
0.40~0.50
0.65~0.70
1.25
1.5
± 0.30
0.45~0.50
0.42~0.52
0.70~0.75
1.29
1.54
± 0.40
0.50~0.55
0.45~0.55
0.75~0.80
1.4
1.65
1608
± 0.10
0.50~0.55
0.60~0.65
0.80~0.85
1.7
1.85
± 0.15
0.55~0.60
0.62~0.67
0.85~0.90
1.79
1.94
± 0.20
0.60~0.65
0.65~0.70
0.90~0.95
1.9
2.05
± 0.25
0.65~0.70
0.70~0.75
0.95~1.00
2.05
2.2
± 0.30
0.70~0.75
0.75~0.80
1.00~1.05
2.2
2.35
2012
±0.10
0.70~0.75
0.75~0.80
1.25~1.30
2.2
2.35
±0.15
0.75~0.80
0.80~0.85
1.30~1.35
2.35
2.5
±0.20
0.80~0.85
0.85~0.90
1.35~1.40
2.5
2.65
±0.25
0.85~0.90
0.95~1.00
1.40~1.45
2.75
2.9
±0.30
0.90~0.95
1.05~1.10
1.45~1.50
3
3.15
3216
±0.20
1.70~1.90
0.85~1.00
1.60~1.80
3.4
3.9
±0.30
1.80~2.00
0.95~1.10
1.70~1.90
3.7
4.2
3225
-
2.00~2.40
1.00~1.40
1.80~2.20
4
5.2
4532
-
2.80~3.20
1.40~1.80
2.40~3.00
5.6
6.8
5750
-
4.00~4.60
1.70~2.30
4.10~4.90
7.4
9.2
Flow Footprint
Chip Size
Chip Tol.
a
b
c
(a+2b)
(a+2b)
[mm]
[mm]
[mm]
[mm]
[mm]
min
max
1608
-
0.60~1.00
0.60~0.80
0.60~0.80
1.8
2.6
2012
-
1.00~1.20
0.80~1.20
0.80~1.20
2.6
3.6
3216
-
2.00~2.40
1.00~1.20
1.00~1.40
4.0
4.8
MLCC Product Manual
6. Others
6-1. Storage environment
6-1-1. Recommendation for temperature/humidity
Even taping and packaging materials are designed to endure a long-term storage, they should
be stored with a temperature of 0~40°C and an RH of 0~70% otherwise, too high temperatures
or humidity may deteriorate the quality of the product rapidly.
As oxidization is accelerated when relative humidity is above 70%RH, the lower the humidity is,
the better the solderability is.
As the temperature difference may cause dew condensation during the storage of the product,
it is a must to maintain a temperature control environment
6-1-2. Shelf Life
An allowable storage period should be within 6 months from the outgoing date of delivery in
consideration of solderability. As for products in storage over 6 months, please check solderability
before use.
6-2. Caution for corrosive environment
As corrosive gases may deteriorate the solderability of MLCC outer termination, it is a must to
store MLCC in an environment without gases. MLCC that is exposed to corrosive gases may cause
its quality issues due to the corrosion of plating layers and the penetration of moisture.
6-3. Equipment in operation
6-3-1. Do not touch MLCC directly with bare hands to prevent an electric shock or damage.
6-3-2. The termination of MLCC shall not be contacted with a conductive object (short –circuit).
Do not expose MLCC to conductive liquid containing acidic or alkaline material.
6-3-3. Do not use the equipment in the following conditions.
(1) Exposure to water or oil
MLCC Product Manual
(2) Exposure to direct sunlight
(3) Exposure to Ozone or ultra-violet radiation.
(4) Exposure to corrosive gas (e.g. hydrogen sulfide, sulfur dioxide, chlorine, ammonia gas)
(5) Exposure to vibration or mechanical shock exceeding specified limit
(6) Exposure to high humidity
6-3-4. If the equipment starts generating any smoke, fire or smell, immediately switch it off or unplug
from the power source.
If the equipment is not switched off or unplugged, serious damage may occur due to the
continuous power supply. Please be careful with the high temperature in this condition.
6-4. Waste treatment
In case of scrapping MLCC, it is incinerated or buried by a licensed industrial waste company.
When scrapping MLCC, it is recommended to incinerate or bury the scrappage by a licensed
industrial waste company.
6-5. Operating temperature
The operating temperature limit is determined by the specification of each models.
6-5-1. Do not use MLCC over the maximum operating temperature.
Pay attention to equipment’s temperature distribution and the seasonal fluctuation of ambient
temperature.
6-5-2. The surface temperature of MLCC cannot exceed the maximum operating temperature including
self-heating effects.
6-6. Transportation
The performance of MLCC may be affected by transportation conditions.
MLCC Product Manual
6-6-1. MLCC shall be protected from excessive temperature, humidity and a mechanical force during
transportation.
During transportation, the cartons shall not be deformed and the inner packaging shall be
protected from excessive external forces.
6-6-2. Do not apply excessive vibrations, shocks or excessive forces to MLCC.
· If excessive mechanical shock or stress are applied, MLCC’s ceramic body may crack.
· When the surface of MLCC is hit with the sharp edge of an air driver, a soldering iron, or a
tweezer, etc, MLCC may crack or become short-circuited.
6-6-3. MLCC may crack and become non-functional due to the excessive shocks or dropping during
transportation.
6-7. Notice
Some special products are excluded from this document.
Please be advised that this is a standard product specification for a reference only.
We may change, modify or discontinue the product specifications without notice at any time.
So, you need to approve the product specifications before placing an order.
Should you have any question regarding the product specifications,
please contact our sales personnel or application engineers.
MLCC Product Manual
Caution of Application
Disclaimer
The products listed as follows are NOT designed and manufactured for any use and applications set
forth below.
Please note that any misuse of the products deviating from products specifications or information
provided in this Spec sheet may cause serious property damages or personal injury.
① Aerospace/Aviation equipment
② Automotive of Transportation equipment (vehicles，trains，ships，etc)
③ Military equipment
④ Atomic energy-related equipment
⑤ Undersea equipment
⑥ Any other applications with the same as or similar complexity or reliability to the applications
Limitation
Please contact us with usage environment information such as voltage, current, temperature, or other
special conditions before using our products for the applications listed below. The below application
conditions require especially high reliability products to prevent defects that may directly cause damages
or loss to third party's life, body or property.
If you have any questions regarding this 'Limitation'，you should first contact our sales
personnel or application engineers.
① Medical equipment
② Disaster prevention/crime prevention equipment
③ Power plant control equipment
④ Traffic signal equipment
⑤ Data-processing equipment
⑥ Electric heating apparatus，burning equipment
⑦ Safety equipment
⑧ Any other applications with the same as or similar complexity or reliability to the applications
