© 2009 Microchip Technology Inc. DS80268F-page 1
PIC12F510
The PIC12F510 device that you have received confor m
functionally to the current Device Data Sheet
(DS41268D), except fo r the anomalies described in thi s
document.
The silicon/specification issues discussed in the
followin g p age s are for al l sil icon revision s. If, ho wever,
questions do arise concerning the silicon revision
received in a particular factory shipment, please
cont act your lo cal Mic rochip sales of fice fo r assist ance.
Silicon Errata
None.
PIC12F510
Silicon Errata and Data Sheet Clarification
PIC12F510
DS80268F-page 2 © 2009 Microchip Technology Inc.
Data Sheet Clarifications
The foll owing ty pographic corrections and clar ification s
are to be note d fo r the latest ve rsi on of th e device da ta
sheet (DS41268D). Changes described in Modules 1,
2, 3, and 4 below apply to the PIC12F510 on ly and n ot
to the PIC1 6F506, whi ch is de scrib ed in the same dat a
sheet (DS41268D):
1. Module: Analog-to-Digital Converter
(ADC)
The specifications listed in Table 1 supersede
Table 13-3 in DS41268D. The PIC12F510 will
meet the performance specifications stated in
Table 1 below if the device is operated as
described in this Errata.
TABLE 1: A/D CONVERTER CHARACTERISTICS
Work around
None.
2. Module: Analog-to-Digital Converter
(ADC)
Section 9.1 “Clock Divisors, paragraph 1
should read as shown in bold.
The ADC has 4 clock source settings,
ADCS<1:0>. There a re 3 divisor v alu es , 16, 8 an d
4. The fou r th se ttin g is INTOSC with a divis or of 4.
Table 9-2 below should replace the current
Table 9-2 in the data sheet.
TABLE 9-2: TAD FOR ADCs SETTINGS WITH VARIOUS OSCILLATORS(1)
Work around None.
Note: Corrections are shown in bold. Where
possible, the original bold text formatting
has been removed for clarity.
Param
No. Sym. Characteristic Min. Typ† Max. Units Conditions
A03 EIL Integral Error ±1.5 LSB VDD = 5.0V
A04 EDL Dif ferenti al Error -1 < EDL +1.5 LSB VDD = 5.0V
A06 EOFF Offset Er ror ±1.5 LSB VDD = 5.0V
A07 EGN Gain Error ±1.5 LSB VDD = 5.0V
Data in “Typ” column is at 5.0V 25°C unless otherwise stated. The typical parameters are for design
guidance only and are not tested.
Source ADCS<1:0> Divisor 8 MHz 4 MHz 1 MHz 500 kHz 350 kHz 200 kHz 100 kHz 32 kHz
INTOSC 11 4.5 μs1 μs
FOSC 10 4.5 μs1 μs4 μs8 μs11 μs20 μs40 μs 125 μs(3)
FOSC 01 81 μs2 μs8 μs16 μs23 μs40 μs 80 μs250 μs
FOSC 00 16 2 μs(2) 4 μs(2) 16 μs 32 μs 46 μs 80 μs160 μs500 μs
Note 1: Operation of the ADC module clock in any of the shaded regions shown in this table (Table 9-2) may result in linearity
errors exceeding the limits stated in Table 1 of this Errata.
2: If the internal oscillator is selected as the main clock source through the Configuration Word register, the divide-by-16
option for the ADC clock should be used.
3: Characterized but not tested.
© 2009 Microchip Technology Inc. DS80268F-page 3
PIC12F510
3. Module: Analog-to-Digital Converter
(ADC)
Section 9.1.5 “Sleep, bullets should read as
follow s (cha ng es in bol d).
For accur ate con ve rsi ons , TAD must meet the
following:
2 μs TAD < 125 μs
•TAD = 1/(FOSC/divisor)
Work around
None.
4. Module: Analog-to-Digital Converter
(ADC)
Examples 9-1 and 9-2 changes shown in bold
below.
EXAMPLE 9-1: PERFORMING AN
ANALOG-TO-DIGITAL
CONVERSION
EXAMPLE 9-2: CHANNEL SELECTION
CHANG E DURI NG
CONVERSION
Work around
None.
;Sample code operates out of BANK0
MOVLW 0xF1 ;configure A/D
MOVWF ADCON0
BSF ADCON0, 1 ;start conversion
loop0 NOP
BTFSC ADCON0, 1;wait for ‘DONE’
GOTO loop0
MOVF ADRES, W ;read result
MOVWF result0 ;save result
BSF ADCON0, 2 ;setup for read of
;channel 1
BSF ADCON0, 1 ;start conversion
loop1 NOP
BTFSC ADCON0, 1;wait for ‘DONE’
GOTO loop1
MOVF ADRES, W ;read result
MOVWF result1 ;save result
BSF ADCON0, 3 ;setup for read of
BCF ADCON0, 2 ;channel 2
BSF ADCON0, 1 ;start conversion
loop2 NOP
BTFSC ADCON0, 1;wait for ‘DONE’
GOTO loop2
MOVF ADRES, W ;read result
MOVWF result2 ;save result
MOVLW 0xF1 ;configure A/D
MOVWF ADCON0
BSF ADCON0, 1 ;start conversion
BSF ADCON0, 2 ;setup for read of
;channel 1
loop0 NOP
BTFSC ADCON0, 1;wait for ‘DONE’
GOTO loop0
MOVF ADRES, W ;read result
MOVWF result0 ;save result
BSF ADCON0, 1 ;start conversion
BSF ADCON0, 3 ;setup for read of
BCF ADCON0, 2 ;channel 2
loop1 NOP
BTFSC ADCON0, 1;wait for ‘DONE’
GOTO loop1
MOVF ADRES, W ;read result
MOVWF result1 ;save result
BSF ADCON0, 1 ;start conversion
loop2 NOP
BTFSC ADCON0, 1;wait for ‘DONE’
GOTO loop2
MOVF ADRES, W ;read result
MOVWF result2 ;save result
CLRF ADCON0 ;optional: returns
;pins to Digital mode and turns off
;the ADC module
PIC12F510
DS80268F-page 4 © 2009 Microchip Technology Inc.
5. Module: Analog-to-Digital Converter
(ADC)
The Reset value for the ADCON0 register is
updated for Resets other than Power-on Reset.
Changes to the tables affected are listed below, in
Table 10-3, and identified in bold and italic text.
TABLE 10-3: RESET CONDITIONS FOR REGISTERS – PIC12F510
Work around
None.
6. Module: Electrical Characteristics
The min . and max. valu es in Table 13 -1 for Internal
Voltage Reference (VIVRF) have been revised.
Changes to the table are listed below and
identified in bold and italic text.
TABLE 13-1: COMPARATOR SPECIFICATIONS
Work around
None.
Register Address Power-o n Reset MCLR Reset, WDT Time-out,
Wake-up On Pin Change, Wake-up on
Comparator Change
W—qqqq qqqu(1) qqqq qqqu(1)
INDF 00h xxxx xxxx uuuu uuuu
TMR0 01h xxxx xxxx uuuu uuuu
PCL 02h 1111 1111 1111 1111
STATUS 03h 0001 1xxx qq0q quuu(2)
FSR 04h 110x xxxx 11uu uuuu
OSCCAL 05h 1111 111- uuuu uuu-
GPIO 06h --xx xxxx --uu uuuu
CM1CON0 07h 1111 1111 uuuu uuuu
ADCON0 08h 1111 1100 1111 1100
ADRES 09h xxxx xxxx uuuu uuuu
OPTION 1111 1111 1111 1111
TRISIO --11 1111 --11 1111
Legend: u = unchanged, x = unknown, – = unimplemented bit, read as ‘0’, q = value depends on condition.
Note 1: Bits <7:1> of W register contain oscillator calibration values due to MOVLW XX instruction at top of memory.
2: See Table 10-5 for Reset value for specific conditions.
Sym. Characteristics Min. Typ. Max. Units Comments
VOS Input Offset Voltage ±3 ±10 mV (VDD - 1.5V)/2
VCM Input Common Mode Voltage 0 VDD – 1.5 V
CMRR Common Mode Rejection Ratio +55* dB
TRT Respons e Time(1) 150 400* ns Internal
VIVRF Internal Voltage Reference 0.500 0.6 0.700 V
* These parameters are characterized but not tested.
Note 1: Response time measured with one comparator input at (VDD – 1.5)/2, while the other input transitions
from VSS to VDD – 1.5V.
© 2009 Microchip Technology Inc. DS80268F-page 5
PIC12F510
7. Module: Electrical Characteristics
The max. values at 2V and 5V VDD for LP
Oscillator IDD at 125°C have been revised as
shown in Table 2 below.
TABLE 2: LP OSCILLATOR 125°C IDD
Work around
None.
8. Module: Electrical Characteristics
The typ. val ue at 5V VDD and the max. value s at
2V and 5V VDD for ICMP have been revised as
shown in Table 3 below.
TABLE 3: ICMP
Work around
None.
DC Characteristics Standard O pe rating Con ditio ns (unl ess otherwise spe cifie d)
Operating Temperature -40°C TA +125°C (extended)
Param
No. Sym. Characteristics Min. Typ(1) Max. Units Conditions
D010 IDD Supply Current(2,3)
11
38
24
110
μA
μAFOSC = 32 kHz, VDD = 2.0V
FOSC = 32 kHz, VDD = 5.0V
Note 1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
guidance only and is not tested.
2: The supply current is mainly a function of the operating voltage and frequency. Other factors such as bus
loading , os ci llator type , bus rate , int erna l c ode exe cu tio n p a ttern and tempera ture als o ha ve an im p a ct on
the current consumption.
3: The test conditions for all IDD measurements in active operation mode are:
OSC1 = external square wave, from rail-to-rail; all I/O pins tri-stated, pulled to VSS, T0CKI = VDD,
MCLR = VDD; WDT disabled unless noted otherwise.
DC Characteristics Standard Operating Conditions (unless otherwise specified)
Operating Temperature -40°C TA +85°C or -40°C TA
+125°C
Param
No. Sym. Characteristic Min. Typ(1) Max. Units Conditions
D023 ICMP Comparator Current(2)
15
60 26
76 μA
μAVDD = 2.0V (per comparator)
VDD = 5.0V ( per comparator)
Note1: Data in the Typical (“Typ”) column is based on characterization results at 25°C. This data is for design
guidance only and is not tested.
2: For standby current measurements, the conditions are the same as IDD, except that the device is in Sleep
mode. If a module current is listed, the current is for that specific module enabled and the device in Sleep.
PIC12F510
DS80268F-page 6 © 2009 Microchip Technology Inc.
APPENDIX A: DOCUMENT
REVISION HISTORY
Rev A Document (03/2006)
First R ev isi on – M odu le 1: An alo g-to - Digi t al C onv erte r.
Rev B Document (08/2006)
Clarifications/Corrections to the Data Sheet: Added
Module 1: Analog-to-Digital Converter: Correction to
Section 9.1 Cl ock Divi sors, p aragra ph 1; Tabl e 9-2, TAD
for ADCS.
Rev C Document (03/2008)
Updated Module 1 by removing 25°C from Conditions
and updated paragraph.
Clarifications/Corrections to the Data Sheet: Updated
Module 1: Analog-to Digital Converter by rewording
and adding Table 9-2 update s. Added Module s 2 and 3
(Analog-to D igital Co nverter).
Rev D Document (9/2008)
Removed Silicon from title; Renumbered Modules;
Update d Modul e 2 by add ing No tes 2 and 3 to Table 9-
2 and removed shading from 125 μs(3) under the 32
kHz column; Added Table 2 to Module 1.
Rev E Document (1/2009)
Added Mo dule 5 : Analog -to-Di git al Conv erter: Upd ates
to Tables 10-3 and 10-4 (Reset Conditions); Added
Module 6: Electrical Characteristic: Updates to Table
13-1 Comparator Specificati ons .
Rev F Document(6/2009)
Updated errata with the new format. Removed part
number PIC16F506 from errata. See DS80475 for
PIC16F5 06 errata items.
Data Sheet Clarifications: Revised Module 1. Added
Modules 7 and 8. Other minor edits.
© 2009 Microchip Technology Inc. DS80268F-page 7
Information contained in this publication regarding device
applications a nd the lik e is p ro vided on ly for yo ur con ve nien ce
and may be supers eded by updates . I t is you r r es ponsibil it y to
ensure that your application meets with your specifications.
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© 2009, Microchip Technology Incorporat ed, Printed in the
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Printed on recycled paper.
Note the following details of the code protection feature on Microchip devices:
Microchip products meet the specification contained in their particular Microchip Data Sheet.
Microchip believes that i t s family of products is one of the most secure families of it s kind on the market today, when used in the
intended manner and under normal conditions.
There are dishonest and possibly illegal methods used to breach the code protection feature. All of these methods, to our
knowledge, require using the Microchip products in a manner outside the operating specifications contained in Microchip’s Data
Sheets. Most likely, the person doing so is engaged in theft of intellectual property.
Microchip is willing to work with the customer who is concerned about the integrity of their code.
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Code protection is c onstantly evolving. We a t Microc hip are co m mitted to continuously improving the code prot ect ion featur es of our
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DS80268F-page 8 © 2009 Microchip Technology Inc.
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