 
  
SOES019A − OC TOBER 1995 − REVISED JULY 1996
1
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
Dac or dc Signal Coupling
DWide Bandwidth ...>ā200 kHz
DHigh Transfer-Gain Stability . . . ±0.05%/°C
D3500 V Peak Isolation
DUL Approval Pending
DApplications
Power-Supply Feedback
Medical-Sensor Isolation
Opto Direct-Access Arrangement (DAA)
Isolated Process-Control Transducers
description
The TIL300 precision linear optocoupler consists of an infrared LED irradiating an isolated feedback photodiode
and an output photodiode in a bifurcated arrangement. The feedback photodiode captures a percentage of the
flux of the LED and generates a control signal that can be used to regulate the LED drive current. This technique
is used to compensate for the nonlinear time and temperature characteristics of the LED. The output-side
photodiode produces an output signal that is linearly proportional to the servo-optical flux emitted from the LED.
A typical application circuit (shown in Figure 1) uses an operational amplifier as the input to drive the LED. The
feedback photodiode sources current through R1, which is connected to the inverting input of the input
operational amplifier. The photocurrent IP1 assumes a magnitude that satisfies the relationship IP1 = VI/R1. Th e
magnitude of the current is directly proportional to the LED current through the feedback transfer gain
K1(VI/R1 = K1 ×IF). The operational amplifier supplies LED current to produce sufficient photocurrent to keep
the node voltage Vb equal to node voltage Va.
_
+
+
IP2
2VCC+
2VCC−
VO = K3(R2/R1) VI
2VCC+
6
5
TIL300
1
2
3
4
R3
1VCC+
IF
1VCC−
1VCC+
P
R1
+
VI
K2
K1
IP1
Va
Vb
P
R2
NOTES: A. K1 is servo current gain, the ratio of the feedback photodiode current (IP1) to the input LED current (IF), i.e. K1 = IP1/IF.
B. K2 is forward gain, the ratio of the output photodiode current (IP2) to the input LED current (IF), i.e. K2 = IP2/IF.
C. K3 is transfer gain, the ratio of the forward gain to the servo gain, i.e. K3 = K2/K1.
Figure 1. Typical Application Circuit
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications o
f
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
Copyright 1996, Texas Instruments Incorporated
        !"
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1
2
3
4
8
7
6
5
LEDK
LEDA
PDK1
PDA1
NC
NC
PDK2
PDA2
P PACKAGE
(TOP VIEW)
NC − No internal connection
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  
SOES019A − OC TOBER 1995 − REVISED JULY 1996
2POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
Terminal Functions
TERMINAL
I/O
DESCRIPTION
NAME NO.
I/O
DESCRIPTION
LEDK 1 LED cathode
LEDA 2 LED anode
PDK1 3 Photodiode 1 cathode
PDA1 4 Photodiode 1 anode
PDA2 5 Photodiode 2 anode
PDK2 6 Photodiode 2 cathode
NC 7 No internal connection
NC 8 No internal connection
absolute maximum ratings over operating free-air temperature range (unless otherwise noted)
Emitter
Continuous total power dissipation (see Note 1) 160 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input LED forward current, IF 60 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Surge current with pulse width < 10 µs 250 mA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reverse voltage, VR 5 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reverse current, IR 10 µA. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Detector
Continuous power dissipation (see Note 2) 50 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Reverse voltage, VR 50 V. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Coupler
Continuous total power dissipation (see Note 3) 210 mW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Storage temperature, Tstg −55°C to 150°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Operating temperature, TA −55°C to 100°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Input-to-output voltage 3535 Vpeak. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds 260°C. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings only, and
functional operation of the device at these or any other conditions beyond those indicated under “recommended operating conditions” is not
implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
NOTES: 1. Derate linearly from 25°C at a rate of 2.66 mW/°C.
2. Derate linearly from 25°C at a rate of 0.66 mW/°C.
3. Derate linearly from 25°C at a rate of 3.33 mW/°C.
 
  
SOES019A − OC TOBER 1995 − REVISED JULY 1996
3
POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
electrical characteristics at TA = 25°C
Emitter
PARAMETER CONDITIONS MIN TYPMAX UNIT
VFForward voltage IF = 10 mA 1.25 1.50 V
Temperature coefficient of VF−2.2 mV/°C
IRReverse current VR = 5 V 10 µA
trRise time IF = 10 mA, IF = 2 mA 1µs
tfFall time IF = 10 mA, IF = 2 mA 1µs
CjJunction capacitance VF = 0, f = 1 MHz 15 pF
Detector
PARAMETER CONDITIONS MIN TYPMAX UNIT
IDKDark current VR = 15 V, IF = 0 25 nA
Open circuit voltage IF = 10 mA 0.5 V
IOS Short circuit current limit IF = 10 mA 80 µA
CjJunction capacitance VF = 0, f = 1 MHz 12 pF
Coupler
PARAMETER CONDITIONS MIN TYPMAX UNIT
K1
Servo current gain
IF = 1 mA 0.3% 0.7% 1.5%
K1
Servo current gain IF = 10 mA 0.5% 1.25% 2%
K2§
Forward current gain
IF = 1 mA 0.3% 0.7% 1.5%
K2
§
Forward current gain
Detector bias
IF = 10 mA 0.5% 1.25% 2%
TIL300
Detector bias
voltage = −15 V IF = 1 mA 0.75 1 1.25
K3
Transfer gain
TIL300
voltage = −15 V
IF = 10 mA 0.75 1 1.25
K3
Transfer gain
TIL300A
IF = 1 mA 0.9 1 1.10
TIL300A IF = 10 mA 0.9 1 1.10
Gain temperature coefficient
K1/K2
IF = 10 mA
0.5
Gain temperature coefficient K3 IF = 10 mA ±0.005 %/°C
K3#
Transfer gain linearity
IF = 1 to 10 mA ±0.25%
K3
#
Transfer gain linearity IF = 1 to 10 mA, TA = 0 to 75°C±0.5%
BW Bandwidth IF = 10 mA,
IF(MODULATION) = ±2 mA RL = 1 k,200 kHz
trRise time IF = 10 mA,
IF(MODULATION) = ±2 mA RL = 1 k,1.75 µs
tfFall time IF = 10 mA,
IF(MODULATION) = ±2 mA RL = 1 k,1.75 µs
VisoPeak Isolation voltage IIO = 10 µA,
time = 1 minute f = 60 Hz 3535 V
This symbol is not currently listed within EIA or JEDEC standards for semiconductor symbology.
Servo current gain (K1) is the ratio of the feedback photodiode current (IP1) to the input LED current (IF) current (IF), i.e. K1 = IP1/IF.
§Forward gain (K2 is the ratio of the output photodiode current (IP2) to the input LED current (IF), i.e. K2 = IP2/IF.
Transfer gain (K3) is the ratio of the forward gain to the servo gain, i.e. K3 = K2/K1.
#Transfer gain linearity (∆K3) is the percent deviation of the transfer gain K3 as a function of LED input current (IF) or the package temperature.
 
  
SOES019A − OC TOBER 1995 − REVISED JULY 1996
4POST OFFICE BOX 655303 DALLAS, TEXAS 75265
POST OFFICE BOX 1443 HOUSTON, TEXAS 77251−1443
MECHANICAL DATA
P (R-PDIP-T8) PLASTIC DUAL-IN-LINE PACKAGE
4040082/B 03/95
0.310 (7,87)
0.290 (7,37)
0.010 (0,25) NOM
0.400 (10,60)
0.355 (9,02)
58
41
0.020 (0,51) MIN
0.070 (1,78) MAX
0.240 (6,10)
0.260 (6,60)
0.200 (5,08) MAX
0.125 (3,18) MIN
0.015 (0,38)
0.021 (0,53)
Seating Plane
M
0.010 (0,25)
0.100 (2,54) 0°ā15°
NOTES: A. All linear dimensions are in inches (millimeters).
B. This drawing is subject to change without notice.
C. Falls within JEDEC MS-001
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
TIL300 OBSOLETE PDIP N 8 TBD Call TI Call TI
TIL300A OBSOLETE PDIP N 8 TBD Call TI Call TI
TIL300ADCS OBSOLETE OPTO DCS 8 TBD Call TI Call TI
TIL300DCS OBSOLETE OPTO DCS 8 TBD Call TI Call TI
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 2-Mar-2009
Addendum-Page 1
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