SOES019A - OCTOBER 1995 - REVISED JULY 1996 D D D D D D P PACKAGE (TOP VIEW) ac or dc Signal Coupling Wide Bandwidth . . . > 200 kHz High Transfer-Gain Stability . . . 0.05%/C 3500 V Peak Isolation UL Approval Pending Applications - Power-Supply Feedback - Medical-Sensor Isolation - Opto Direct-Access Arrangement (DAA) - Isolated Process-Control Transducers LEDK LEDA PDK1 PDA1 1 8 2 7 3 6 4 5 NC NC PDK2 PDA2 NC - No internal connection description The TIL300 precision linear optocoupler consists of an infrared LED irradiating an isolated feedback photodiode and an output photodiode in a bifurcated arrangement. The feedback photodiode captures a percentage of the flux of the LED and generates a control signal that can be used to regulate the LED drive current. This technique is used to compensate for the nonlinear time and temperature characteristics of the LED. The output-side photodiode produces an output signal that is linearly proportional to the servo-optical flux emitted from the LED. A typical application circuit (shown in Figure 1) uses an operational amplifier as the input to drive the LED. The feedback photodiode sources current through R1, which is connected to the inverting input of the input operational amplifier. The photocurrent IP1 assumes a magnitude that satisfies the relationship IP1 = VI/R1. The magnitude of the current is directly proportional to the LED current through the feedback transfer gain K1(VI/R1 = K1 x IF). The operational amplifier supplies LED current to produce sufficient photocurrent to keep the node voltage Vb equal to node voltage Va. TIL300 1 1VCC+ Va Vb + VI - P R3 + _ 2 IF K1 1VCC+ 1VCC- 3 6 4 5 2VCC+ 2VCC+ - R1 P K2 IP2 IP1 + R2 VO = K3(R2 / R1) VI 2VCC- NOTES: A. K1 is servo current gain, the ratio of the feedback photodiode current (IP1) to the input LED current (IF), i.e. K1 = IP1/IF. B. K2 is forward gain, the ratio of the output photodiode current (IP2) to the input LED current (IF), i.e. K2 = IP2/IF. C. K3 is transfer gain, the ratio of the forward gain to the servo gain, i.e. K3 = K2/K1. Figure 1. Typical Application Circuit Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet. Copyright 1996, Texas Instruments Incorporated !" ! # $ !! %&" ! ' ! & ! ' " * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * 1 SOES019A - OCTOBER 1995 - REVISED JULY 1996 Terminal Functions TERMINAL NAME NO. I/O DESCRIPTION LEDK 1 LED cathode LEDA 2 LED anode PDK1 3 Photodiode 1 cathode PDA1 4 Photodiode 1 anode PDA2 5 Photodiode 2 anode PDK2 6 Photodiode 2 cathode NC 7 No internal connection NC 8 No internal connection absolute maximum ratings over operating free-air temperature range (unless otherwise noted) Emitter Continuous total power dissipation (see Note 1) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 160 mW Input LED forward current, IF . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 60 mA Surge current with pulse width < 10 s . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 250 mA Reverse voltage, VR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5 V Reverse current, IR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 10 A Detector Continuous power dissipation (see Note 2) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 mW Reverse voltage, VR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 50 V Coupler Continuous total power dissipation (see Note 3) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 210 mW Storage temperature, Tstg . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55C to 150C Operating temperature, TA . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55C to 100C Input-to-output voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3535 Vpeak Lead temperature 1,6 mm (1/16 inch) from case for 10 seconds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 260C Stresses beyond those listed under "absolute maximum ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "recommended operating conditions" is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability. NOTES: 1. Derate linearly from 25C at a rate of 2.66 mW/C. 2. Derate linearly from 25C at a rate of 0.66 mW/C. 3. Derate linearly from 25C at a rate of 3.33 mW/C. 2 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * SOES019A - OCTOBER 1995 - REVISED JULY 1996 electrical characteristics at TA = 25C Emitter PARAMETER VF CONDITIONS Forward voltage MIN IF = 10 mA Temperature coefficient of VF IR tr Reverse current tf Cj Fall time TYP MAX 1.25 1.50 -2.2 VR = 5 V IF = 10 mA, Rise time IF = 2 mA IF = 2 mA Junction capacitance f = 1 MHz V mV/C 10 IF = 10 mA, VF = 0, UNIT A 1 s 1 s 15 pF Detector PARAMETER IDK CONDITIONS Dark current VR = 15 V, IF = 10 mA Open circuit voltage IOS Cj Short circuit current limit TYP IF = 0 IF = 10 mA VF = 0, Junction capacitance MIN MAX 25 f = 1 MHz UNIT nA 0.5 V 80 A 12 pF Coupler MIN TYP MAX 0.3% 0.7% 1.5% Servo current gain IF = 1 mA IF = 10 mA 0.5% 1.25% 2% 0.3% 0.7% 1.5% Forward current gain IF = 1 mA IF = 10 mA 0.5% 1.25% 2% IF = 1 mA IF = 10 mA 0.75 1 1.25 TIL300 0.75 1 1.25 0.9 1 1.10 TIL300A IF = 1 mA IF = 10 mA 1 1.10 PARAMETER K1 K2 CONDITIONS Detector bias voltage = -15 V K3 Transfer gain 0.9 K1/K2 Gain temperature coefficient K3 UNIT -0.5 IF = 10 mA 0.005 IF = 1 to 10 mA IF = 1 to 10 mA, IF = 10 mA, IF(MODULATION) = 2 mA K3# Transfer gain linearity BW Bandwidth tr Rise time IF = 10 mA, IF(MODULATION) = 2 mA tf Fall time Viso Peak Isolation voltage %/C 0.25% 0.5% TA = 0 to 75C RL = 1 k, 200 kHz RL = 1 k, 1.75 s IF = 10 mA, IF(MODULATION) = 2 mA RL = 1 k, 1.75 s IIO = 10 A, time = 1 minute f = 60 Hz 3535 V This symbol is not currently listed within EIA or JEDEC standards for semiconductor symbology. Servo current gain (K1) is the ratio of the feedback photodiode current (IP1) to the input LED current (IF) current (IF), i.e. K1 = IP1/IF. Forward gain (K2 is the ratio of the output photodiode current (IP2) to the input LED current (IF), i.e. K2 = IP2/IF. Transfer gain (K3) is the ratio of the forward gain to the servo gain, i.e. K3 = K2/K1. # Transfer gain linearity (K3) is the percent deviation of the transfer gain K3 as a function of LED input current (IF) or the package temperature. * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * 3 SOES019A - OCTOBER 1995 - REVISED JULY 1996 MECHANICAL DATA P (R-PDIP-T8) PLASTIC DUAL-IN-LINE PACKAGE 0.400 (10,60) 0.355 (9,02) 8 5 0.260 (6,60) 0.240 (6,10) 1 4 0.070 (1,78) MAX 0.310 (7,87) 0.290 (7,37) 0.020 (0,51) MIN 0.200 (5,08) MAX Seating Plane 0.125 (3,18) MIN 0.100 (2,54) 0.021 (0,53) 0.015 (0,38) 0- 15 0.010 (0,25) M 0.010 (0,25) NOM 4040082 / B 03/95 NOTES: A. All linear dimensions are in inches (millimeters). B. This drawing is subject to change without notice. C. Falls within JEDEC MS-001 4 * POST OFFICE BOX 655303 DALLAS, TEXAS 75265 POST OFFICE BOX 1443 HOUSTON, TEXAS 77251-1443 * PACKAGE OPTION ADDENDUM www.ti.com 2-Mar-2009 PACKAGING INFORMATION Orderable Device Status (1) Package Type Package Drawing Pins Package Eco Plan (2) Qty Lead/Ball Finish MSL Peak Temp (3) TIL300 OBSOLETE PDIP N 8 TBD Call TI Call TI TIL300A OBSOLETE PDIP N 8 TBD Call TI Call TI TIL300ADCS OBSOLETE OPTO DCS 8 TBD Call TI Call TI TIL300DCS OBSOLETE OPTO DCS 8 TBD Call TI Call TI (1) The marketing status values are defined as follows: ACTIVE: Product device recommended for new designs. LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect. NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design. PREVIEW: Device has been announced but is not in production. Samples may or may not be available. OBSOLETE: TI has discontinued the production of the device. (2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability information and additional product content details. TBD: The Pb-Free/Green conversion plan has not been defined. Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes. Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above. Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material) (3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature. Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the accuracy of such information. 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