BAS86 Schottky barrier single diode 25 July 2012 Product data sheet 1. Product profile 1.1 General description Planar Schottky barrier diode with an integrated guard ring for stress protection, encapsulated in a small hermetically sealed SOD80C glass Surface-Mounted Device (SMD) package with tin-plated metal discs at each end. It is suitable for "automatic placement" and as such it can withstand immersion soldering. 1.2 Features and benefits * Low forward voltage * High breakdown voltage * Guard ring protected * Hermetically sealed glass SMD package. 1.3 Applications * Ultra high-speed switching * Voltage clamping * Protection circuits * Blocking diodes 1.4 Quick reference data Table 1. Quick reference data Symbol Parameter IF(AV) average forward current VR reverse voltage VF forward voltage [1] Conditions [1] IF = 100 mA; Tamb = 25 C Min Typ Max Unit - - 200 mA - - 50 V - - 900 mV Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. Scan or click this QR code to view the latest information for this product BAS86 NXP Semiconductors Schottky barrier single diode 2. Pinning information Table 2. Pinning information Pin Symbol Description 1 K cathode[1] 2 A anode [1] Simplified outline k Graphic symbol K a A aaa-003679 LLDS; MiniMelf (SOD80C) The marking band indicates the cathode. 3. Ordering information Table 3. Ordering information Type number Package BAS86 Name Description Version LLDS; MiniMelf hermetically sealed glass surface-mounted package; 2 connectors SOD80C 4. Marking Table 4. Marking codes Type number Marking code BAS86 marking band 5. Limiting values Table 5. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter VR Min Max Unit reverse voltage - 50 V IF forward current - 200 mA IF(AV) average forward current - 200 mA IFRM repetitive peak forward current tp 1 s; 0.5 - 500 mA IFSM non-repetitive peak forward current tp = 10 ms; Tj(init) = 25 C - 5 A Tj junction temperature - 125 C Tamb ambient temperature -65 125 C Tstg storage temperature -65 150 C [1] BAS86 Product data sheet Conditions [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. All information provided in this document is subject to legal disclaimers. 25 July 2012 (c) NXP B.V. 2012. All rights reserved 2/9 BAS86 NXP Semiconductors Schottky barrier single diode 6. Thermal characteristics Table 6. Thermal characteristics Symbol Parameter Conditions Rth(j-a) thermal resistance from junction to ambient in free air [1] [1] Min Typ Max Unit - - 320 K/W Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint. 7. Characteristics Table 7. Characteristics Symbol Parameter Conditions Min Typ Max Unit VF forward voltage IF = 0.1 mA; Tamb = 25 C - - 300 mV IF = 1 mA; Tamb = 25 C - - 380 mV IF = 10 mA; Tamb = 25 C - - 450 mV IF = 30 mA; Tamb = 25 C - - 600 mV IF = 100 mA; Tamb = 25 C - - 900 mV VR = 40 V; Tamb = 25 C; pulsed; - - 5 A IR reverse current tp 300 s; 0.02 Cd diode capacitance f = 1 MHz; Tamb = 25 C; VR = 1 V - - 8 pF trr reverse recovery time IF = 10 mA; IR = 10 mA; RL = 100 ; - - 4 ns IR(meas) = 1 mA; Tamb = 25 C BAS86 Product data sheet All information provided in this document is subject to legal disclaimers. 25 July 2012 (c) NXP B.V. 2012. All rights reserved 3/9 BAS86 NXP Semiconductors Schottky barrier single diode mld357 103 IF (mA) (1) (2) (3) mgc686 105 IR (nA) 104 (1) 102 (2) 103 102 10 (1) 1 10 (2) (3) (3) 1 10- 1 0 0.4 0.8 VF (V) 10- 1 1.2 10 20 30 40 VR (V) 50 (1) Tamb = 85 C (1) Tamb = 125 C (2) Tamb = 25 C (2) Tamb = 85 C (3) Tamb = -40 C (3) Tamb = 25 C Fig. 1. 0 Forward current as a function of forward voltage; typical values Fig. 2. mgc687 12 Reverse current as a function of reverse voltage; typical values mra540 250 IF(AV) (mA) Cd (pF) 200 8 150 100 4 50 0 0 10 20 30 40 VR (V) 0 50 50 100 Tamb (C) 150 FR4 PCB, standard footprint Tamb = 25 C; f = 1 MHz Fig. 3. 0 Diode capacitance as a function of reverse voltage; typical values Fig. 4. Average forward current as a function of ambient temperature; derating curve 8. Test information BAS86 Product data sheet All information provided in this document is subject to legal disclaimers. 25 July 2012 (c) NXP B.V. 2012. All rights reserved 4/9 BAS86 NXP Semiconductors Schottky barrier single diode tr D.U.T. RS = 50 IF tp t 10 % + IF SAMPLING OSCILLOSCOPE trr t Ri = 50 V = VR + IF x RS VR mga881 (1) 90 % input signal output signal (1) IR = 1 mA Fig. 5. Reverse recovery time test circuit and waveforms 9. Package outline 0.3 0.3 3.7 3.3 1.60 1.45 Dimensions in mm Fig. 6. 06-03-16 LLDS; MiniMelf (SOD80C) 10. Soldering 4.55 4.30 2.30 solder lands solder paste 2.25 1.70 1.60 solder resist occupied area Dimensions in mm 0.90 (2x) Fig. 7. sod080c Reflow soldering footprint for SOD80C (LLDS; MiniMelf) BAS86 Product data sheet All information provided in this document is subject to legal disclaimers. 25 July 2012 (c) NXP B.V. 2012. All rights reserved 5/9 BAS86 NXP Semiconductors Schottky barrier single diode 6.30 4.90 2.70 1.90 solder lands solder resist occupied area 2.90 1.70 tracks Dimensions in mm sod080c Fig. 8. Wave soldering footprint for SOD80C (LLDS; MiniMelf) 11. Revision history Table 8. Revision history Data sheet ID Release date Data sheet status Change notice Supersedes BAS86 v.5 20120725 Product data sheet - BAS86 v.4 Modifications: * BAS86 v.4 20100908 Product data sheet - BAS86 v.3 BAS86 v.3 20000525 Product specification - BAS86 v.2 BAS86 v.2 19961001 Product specification - BAS86 v.1 BAS86 v.1 19960320 Product specification - - BAS86 Product data sheet Editorial update All information provided in this document is subject to legal disclaimers. 25 July 2012 (c) NXP B.V. 2012. All rights reserved 6/9 BAS86 NXP Semiconductors Schottky barrier single diode In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 12. Legal information 12.1 Data sheet status Notwithstanding any damages that customer might incur for any reason whatsoever, NXP Semiconductors' aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors. Document status [1][2] Product status [3] Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Definition Right to make changes -- NXP Semiconductors reserves the right to make changes to information published in this document, including without limitation specifications and product descriptions, at any time and without notice. This document supersedes and replaces all information supplied prior to the publication hereof. Please consult the most recently issued document before initiating or completing a design. The term 'short data sheet' is explained in section "Definitions". The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. [2] [3] 12.2 Definitions Preview -- The document is a preview version only. The document is still subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Draft -- The document is a draft version only. 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BAS86 Product data sheet Suitability for use -- NXP Semiconductors products are not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Quick reference data -- The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Applications -- Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products, and NXP Semiconductors accepts no liability for any assistance with applications or customer product design. It is customer's sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer's applications and products planned, as well as for the planned application and use of customer's third party customer(s). Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products. NXP Semiconductors does not accept any liability related to any default, damage, costs or problem which is based on any weakness or default in the customer's applications or products, or the application or use by customer's third party customer(s). Customer is responsible for doing all necessary testing for the customer's applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer's third party customer(s). NXP does not accept any liability in this respect. Limiting values -- Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale -- NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer's general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. No offer to sell or license -- Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the All information provided in this document is subject to legal disclaimers. 25 July 2012 (c) NXP B.V. 2012. All rights reserved 7/9 BAS86 NXP Semiconductors Schottky barrier single diode grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Export control -- This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. Non-automotive qualified products -- Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified, the product is not suitable for automotive use. It is neither qualified nor tested in accordance with automotive testing or application requirements. NXP Semiconductors accepts no liability for inclusion and/or use of nonautomotive qualified products in automotive equipment or applications. In the event that customer uses the product for design-in and use in automotive applications to automotive specifications and standards, customer (a) shall use the product without NXP Semiconductors' warranty of the product for such automotive applications, use and specifications, and (b) whenever customer uses the product for automotive applications beyond NXP Semiconductors' specifications such use shall be solely at customer's own risk, and (c) customer fully indemnifies NXP Semiconductors for any liability, damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors' standard warranty and NXP Semiconductors' product specifications. Translations -- A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. 12.4 Trademarks Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV, FabKey, GreenChip, HiPerSmart, HITAG, IC-bus logo, ICODE, I-CODE, ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse, QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET, TrenchMOS, TriMedia and UCODE -- are trademarks of NXP B.V. HD Radio and HD Radio logo -- are trademarks of iBiquity Digital Corporation. BAS86 Product data sheet All information provided in this document is subject to legal disclaimers. 25 July 2012 (c) NXP B.V. 2012. All rights reserved 8/9 BAS86 NXP Semiconductors Schottky barrier single diode 13. Contents 1 1.1 1.2 1.3 1.4 Product profile ....................................................... 1 General description .............................................. 1 Features and benefits ...........................................1 Applications .......................................................... 1 Quick reference data ............................................ 1 2 Pinning information ............................................... 2 3 Ordering information ............................................. 2 4 Marking ................................................................... 2 5 Limiting values .......................................................2 6 Thermal characteristics .........................................3 7 Characteristics ....................................................... 3 8 Test information ..................................................... 4 9 Package outline ..................................................... 5 10 Soldering ................................................................ 5 11 Revision history ..................................................... 6 12 12.1 12.2 12.3 12.4 Legal information ...................................................7 Data sheet status ................................................. 7 Definitions .............................................................7 Disclaimers ...........................................................7 Trademarks .......................................................... 8 (c) NXP B.V. 2012. All rights reserved For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: salesaddresses@nxp.com Date of release: 25 July 2012 BAS86 Product data sheet All information provided in this document is subject to legal disclaimers. 25 July 2012 (c) NXP B.V. 2012. All rights reserved 9/9