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BAS86

Schottky barrier single diode

25 July 2012 Product data sheet

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1. Product profile

1.1 General description

Planar Schottky barrier diode with an integrated guard ring for stress protection,

encapsulated in a small hermetically sealed SOD80C glass Surface-Mounted Device

(SMD) package with tin-plated metal discs at each end. It is suitable for “automatic

placement” and as such it can withstand immersion soldering.

1.2 Features and benefits

•Low forward voltage

•High breakdown voltage

•Guard ring protected

•Hermetically sealed glass SMD package.

1.3 Applications

•Ultra high-speed switching

•Voltage clamping

•Protection circuits

•Blocking diodes

1.4 Quick reference data

Table 1. Quick reference data

Symbol Parameter Conditions Min Typ Max Unit

IF(AV) average forward

current

[1] - - 200 mA

VRreverse voltage - - 50 V

VFforward voltage IF = 100 mA; Tamb = 25 °C - - 900 mV

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

NXP Semiconductors BAS86

Schottky barrier single diode

Product data sheet 25 July 2012 2 / 9

2. Pinning information

Table 2. Pinning information

Pin Symbol Description Simplified outline Graphic symbol

1 K cathode[1]

2 A anode

k a

LLDS; MiniMelf (SOD80C)

aaa-003679

K A

[1] The marking band indicates the cathode.

3. Ordering information

Table 3. Ordering information

PackageType number

Name Description Version

BAS86 LLDS;

MiniMelf

hermetically sealed glass surface-mounted package; 2

connectors

SOD80C

4. Marking

Table 4. Marking codes

Type number Marking code

BAS86 marking band

5. Limiting values

Table 5. Limiting values

In accordance with the Absolute Maximum Rating System (IEC 60134).

Symbol Parameter Conditions Min Max Unit

VRreverse voltage - 50 V

IFforward current - 200 mA

IF(AV) average forward current [1] - 200 mA

IFRM repetitive peak forward current tp ≤ 1 s; δ ≤ 0.5 - 500 mA

IFSM non-repetitive peak forward

current

tp = 10 ms; Tj(init) = 25 °C - 5 A

Tjjunction temperature - 125 °C

Tamb ambient temperature -65 125 °C

Tstg storage temperature -65 150 °C

[1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard

footprint.

NXP Semiconductors BAS86

Schottky barrier single diode

Product data sheet 25 July 2012 3 / 9

6. Thermal characteristics

Table 6. Thermal characteristics

Symbol Parameter Conditions Min Typ Max Unit

Rth(j-a) thermal resistance

from junction to

ambient

in free air [1] - - 320 K/W

[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.

7. Characteristics

Table 7. Characteristics

Symbol Parameter Conditions Min Typ Max Unit

IF = 0.1 mA; Tamb = 25 °C - - 300 mV

IF = 1 mA; Tamb = 25 °C - - 380 mV

IF = 10 mA; Tamb = 25 °C - - 450 mV

IF = 30 mA; Tamb = 25 °C - - 600 mV

VFforward voltage

IF = 100 mA; Tamb = 25 °C - - 900 mV

IRreverse current VR = 40 V; Tamb = 25 °C; pulsed;

tp ≤ 300 µs; δ ≤ 0.02

- - 5 µA

Cddiode capacitance f = 1 MHz; Tamb = 25 °C; VR = 1 V - - 8 pF

trr reverse recovery time IF = 10 mA; IR = 10 mA; RL = 100 Ω;

IR(meas) = 1 mA; Tamb = 25 °C

- - 4 ns

NXP Semiconductors BAS86

Schottky barrier single diode

Product data sheet 25 July 2012 4 / 9

1.20.80.40 VF(V)

(mA)

103

102

10- 1

mld357

(1) (2) (3)

(1) Tamb = 125 °C

(2) Tamb = 85 °C

(3) Tamb = 25 °C

Fig. 1. Forward current as a function of forward

voltage; typical values

mgc686

105

104

(nA)

103

102

10- 1

500 10 20 30 40

VR(V)

(1)

(2)

(3)

(1) Tamb = 85 °C

(2) Tamb = 25 °C

(3) Tamb = −40 °C

Fig. 2. Reverse current as a function of reverse

voltage; typical values

mgc687

0 50

(pF)

10 20 30 40

VR(V)

Tamb = 25 °C; f = 1 MHz

Fig. 3. Diode capacitance as a function of reverse

voltage; typical values

100

150

200

250

0 50 100 150

IF(AV)

(mA)

Tamb (°C)

mra540

FR4 PCB, standard footprint

Fig. 4. Average forward current as a function of

ambient temperature; derating curve

8. Test information

NXP Semiconductors BAS86

Schottky barrier single diode

Product data sheet 25 July 2012 5 / 9

trr

(1)

+ IF

output signal

trtp

10 %

90 %

input signal

V = VR+ IF× RS

RS= 50 ΩIF

D.U.T.

Ri= 50 Ω

SAMPLING

OSCILLOSCOPE

mga881

(1) IR = 1 mA

Fig. 5. Reverse recovery time test circuit and waveforms

9. Package outline

06-03-16Dimensions in mm

1.60

1.45

0.3

3.7

3.3

0.3

Fig. 6. LLDS; MiniMelf (SOD80C)

10. Soldering

sod080c

2.30

4.30

4.55

1.601.702.25

0.90

(2x)

solder lands

solder resist

occupied area

solder paste

Dimensions in mm

Fig. 7. Reflow soldering footprint for SOD80C (LLDS; MiniMelf)

NXP Semiconductors BAS86

Schottky barrier single diode

Product data sheet 25 July 2012 6 / 9

sod080c

2.70

4.90

6.30

1.702.90

1.90

solder lands

tracks

solder resist

occupied area

Dimensions in mm

Fig. 8. Wave soldering footprint for SOD80C (LLDS; MiniMelf)

11. Revision history

Table 8. Revision history

Data sheet ID Release date Data sheet status Change notice Supersedes

BAS86 v.5 20120725 Product data sheet - BAS86 v.4

Modifications: •Editorial update

BAS86 v.4 20100908 Product data sheet - BAS86 v.3

BAS86 v.3 20000525 Product specification - BAS86 v.2

BAS86 v.2 19961001 Product specification - BAS86 v.1

BAS86 v.1 19960320 Product specification - -

NXP Semiconductors BAS86

Schottky barrier single diode

Product data sheet 25 July 2012 7 / 9

12. Legal information

12.1 Data sheet status

Document

status [1][2]

Product

status [3]

Definition

Objective

[short] data

sheet

Development This document contains data from

the objective specification for product

development.

Preliminary

[short] data

sheet

Qualification This document contains data from the

preliminary specification.

Product

[short] data

sheet

Production This document contains the product

specification.

[1] Please consult the most recently issued document before initiating or

completing a design.

[2] The term 'short data sheet' is explained in section "Definitions".

[3] The product status of device(s) described in this document may have

changed since this document was published and may differ in case of

multiple devices. The latest product status information is available on

the Internet at URL http://www.nxp.com.

12.2 Definitions

Preview — The document is a preview version only. The document is still

subject to formal approval, which may result in modifications or additions.

NXP Semiconductors does not give any representations or warranties as to

the accuracy or completeness of information included herein and shall have

no liability for the consequences of use of such information.

Draft — The document is a draft version only. The content is still under

internal review and subject to formal approval, which may result in

modifications or additions. NXP Semiconductors does not give any

representations or warranties as to the accuracy or completeness of

information included herein and shall have no liability for the consequences

of use of such information.

Short data sheet — A short data sheet is an extract from a full data sheet

with the same product type number(s) and title. A short data sheet is

intended for quick reference only and should not be relied upon to contain

detailed and full information. For detailed and full information see the

relevant full data sheet, which is available on request via the local NXP

Semiconductors sales office. In case of any inconsistency or conflict with the

short data sheet, the full data sheet shall prevail.

Product specification — The information and data provided in a Product

data sheet shall define the specification of the product as agreed between

NXP Semiconductors and its customer, unless NXP Semiconductors and

customer have explicitly agreed otherwise in writing. In no event however,

shall an agreement be valid in which the NXP Semiconductors product

is deemed to offer functions and qualities beyond those described in the

Product data sheet.

12.3 Disclaimers

Limited warranty and liability — Information in this document is believed

to be accurate and reliable. However, NXP Semiconductors does not give

any representations or warranties, expressed or implied, as to the accuracy

or completeness of such information and shall have no liability for the

consequences of use of such information. NXP Semiconductors takes no

responsibility for the content in this document if provided by an information

source outside of NXP Semiconductors.

In no event shall NXP Semiconductors be liable for any indirect, incidental,

punitive, special or consequential damages (including - without limitation -

lost profits, lost savings, business interruption, costs related to the removal

or replacement of any products or rework charges) whether or not such

damages are based on tort (including negligence), warranty, breach of

contract or any other legal theory.

Notwithstanding any damages that customer might incur for any reason

whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards

customer for the products described herein shall be limited in accordance

with the Terms and conditions of commercial sale of NXP Semiconductors.

Right to make changes — NXP Semiconductors reserves the right to

make changes to information published in this document, including without

limitation specifications and product descriptions, at any time and without

notice. This document supersedes and replaces all information supplied prior

to the publication hereof.

Suitability for use — NXP Semiconductors products are not designed,

authorized or warranted to be suitable for use in life support, life-critical or

safety-critical systems or equipment, nor in applications where failure or

malfunction of an NXP Semiconductors product can reasonably be expected

to result in personal injury, death or severe property or environmental

damage. NXP Semiconductors and its suppliers accept no liability for

inclusion and/or use of NXP Semiconductors products in such equipment or

applications and therefore such inclusion and/or use is at the customer’s own

risk.

Quick reference data — The Quick reference data is an extract of the

product data given in the Limiting values and Characteristics sections of this

document, and as such is not complete, exhaustive or legally binding.

Applications — Applications that are described herein for any of these

products are for illustrative purposes only. NXP Semiconductors makes no

representation or warranty that such applications will be suitable for the

specified use without further testing or modification.

Customers are responsible for the design and operation of their

applications and products using NXP Semiconductors products, and NXP

Semiconductors accepts no liability for any assistance with applications or

customer product design. It is customer’s sole responsibility to determine

whether the NXP Semiconductors product is suitable and fit for the

customer’s applications and products planned, as well as for the planned

application and use of customer’s third party customer(s). Customers should

provide appropriate design and operating safeguards to minimize the risks

associated with their applications and products.

NXP Semiconductors does not accept any liability related to any default,

damage, costs or problem which is based on any weakness or default

in the customer’s applications or products, or the application or use by

customer’s third party customer(s). Customer is responsible for doing all

necessary testing for the customer’s applications and products using NXP

Semiconductors products in order to avoid a default of the applications

and the products or of the application or use by customer’s third party

customer(s). NXP does not accept any liability in this respect.

Limiting values — Stress above one or more limiting values (as defined in

the Absolute Maximum Ratings System of IEC 60134) will cause permanent

damage to the device. Limiting values are stress ratings only and (proper)

operation of the device at these or any other conditions above those

given in the Recommended operating conditions section (if present) or the

Characteristics sections of this document is not warranted. Constant or

repeated exposure to limiting values will permanently and irreversibly affect

the quality and reliability of the device.

Terms and conditions of commercial sale — NXP Semiconductors

products are sold subject to the general terms and conditions of commercial

sale, as published at http://www.nxp.com/profile/terms, unless otherwise

agreed in a valid written individual agreement. In case an individual

agreement is concluded only the terms and conditions of the respective

agreement shall apply. NXP Semiconductors hereby expressly objects to

applying the customer’s general terms and conditions with regard to the

purchase of NXP Semiconductors products by customer.

No offer to sell or license — Nothing in this document may be interpreted

or construed as an offer to sell products that is open for acceptance or the

NXP Semiconductors BAS86

Schottky barrier single diode

Product data sheet 25 July 2012 8 / 9

grant, conveyance or implication of any license under any copyrights, patents

or other industrial or intellectual property rights.

Export control — This document as well as the item(s) described herein

may be subject to export control regulations. Export might require a prior

authorization from competent authorities.

Non-automotive qualified products — Unless this data sheet expressly

states that this specific NXP Semiconductors product is automotive qualified,

the product is not suitable for automotive use. It is neither qualified nor

tested in accordance with automotive testing or application requirements.

NXP Semiconductors accepts no liability for inclusion and/or use of non-

automotive qualified products in automotive equipment or applications.

In the event that customer uses the product for design-in and use in

automotive applications to automotive specifications and standards,

customer (a) shall use the product without NXP Semiconductors’ warranty

of the product for such automotive applications, use and specifications, and

(b) whenever customer uses the product for automotive applications beyond

NXP Semiconductors’ specifications such use shall be solely at customer’s

own risk, and (c) customer fully indemnifies NXP Semiconductors for any

liability, damages or failed product claims resulting from customer design and

use of the product for automotive applications beyond NXP Semiconductors’

standard warranty and NXP Semiconductors’ product specifications.

Translations — A non-English (translated) version of a document is for

reference only. The English version shall prevail in case of any discrepancy

between the translated and English versions.

12.4 Trademarks

Notice: All referenced brands, product names, service names and

trademarks are the property of their respective owners.

Adelante, Bitport, Bitsound, CoolFlux, CoReUse, DESFire, EZ-HV,

FabKey, GreenChip, HiPerSmart, HITAG, I²C-bus logo, ICODE, I-CODE,

ITEC, Labelution, MIFARE, MIFARE Plus, MIFARE Ultralight, MoReUse,

QLPAK, Silicon Tuner, SiliconMAX, SmartXA, STARplug, TOPFET,

TrenchMOS, TriMedia and UCODE — are trademarks of NXP B.V.

HD Radio and HD Radio logo — are trademarks of iBiquity Digital

Corporation.

NXP Semiconductors BAS86

Schottky barrier single diode

Product data sheet 25 July 2012 9 / 9

13. Contents

1 Product profile ....................................................... 1

1.1 General description .............................................. 1

1.2 Features and benefits ...........................................1

1.3 Applications .......................................................... 1

1.4 Quick reference data ............................................ 1

2 Pinning information ............................................... 2

3 Ordering information ............................................. 2

4 Marking ................................................................... 2

5 Limiting values .......................................................2

6 Thermal characteristics .........................................3

7 Characteristics .......................................................3

8 Test information ..................................................... 4

9 Package outline ..................................................... 5

10 Soldering ................................................................ 5

11 Revision history .....................................................6

12 Legal information ...................................................7

12.1 Data sheet status ................................................. 7

12.2 Definitions .............................................................7

12.3 Disclaimers ...........................................................7

12.4 Trademarks .......................................................... 8

For more information, please visit: http://www.nxp.com

For sales office addresses, please send an email to: salesaddresses@nxp.com

Date of release: 25 July 2012