1CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
Copyright © 2004, Texas Instruments Incorporated
Data sheet acquired from Harris Semiconductor
SCHS046I
CD4049UB, CD4050B
CMOS Hex Buffer/Converters
The CD4049UB and CD4050B devices are inverting and
non-inver ting hex buffers, respectively, and feature logic-
level conversion using only one supply voltage (VCC). The
input-signal high level (VIH) can exceed the VCC supply
voltage when these devices are used for logic-level
conversions. These devices are intended for use as CMOS
to DTL/TTL conver ters and can dr ive directly two DTL/TTL
loads. (VCC = 5V, VOL ≤ 0.4V, and IOL ≥ 3.3mA.)
The CD4049UB and CD4050B are designated as
replacements for CD4009UB and CD4010B, respectively.
Because the CD4049UB and CD4050B require only one
power supply, they are preferred over the CD4009UB and
CD4010B and should be used in place of the CD4009UB
and CD4010B in all inverter, current driver, or logic-level
conversion applications. In these applications the
CD4049UB and CD4050B are pin compatible with the
CD4009UB and CD4010B respectively, and can be
substituted for these devices in existing as well as in new
designs. Terminal No. 16 is not connected internally on the
CD4049UB or CD4050B, therefore, connection to this
terminal is of no consequence to circuit operation. For
applications not requiring high sink-current or voltage
conversion, the CD4069UB Hex Inverter is recommended.
Features
• CD4049UB Inverting
• CD4050B Non-Inverting
• High Sink Current for Driving 2 TTL Loads
• High-To-Low Level Logic Conversion
• 100% Tested for Quiescent Current at 20V
• Maximum Input Current of 1µA at 18V Ov er Full Pac kage
Temperature Range; 100nA at 18V and 25oC
• 5V, 10V and 15V Parametric Ratings
Applications
• CMOS to DTL/TTL Hex Converter
• CMOS Current “Sink” or “Source” Driver
• CMOS High-To-Low Logic Level Converter
Pinouts
Ordering Information
PART NUMBER TEMP.
RANGE (oC) PACKAGE
CD4049UBF3A -55 to 125 16 Ld CERDIP
CD4050BF3A -55 to 125 16 Ld CERDIP
CD4049UBD -55 to 125 16 Ld SOIC
CD4049UBDR -55 to 125 16 Ld SOIC
CD4049UBDT -55 to 125 16 Ld SOIC
CD4049UBDW -55 to 125 16 Ld SOIC
CD4049UBDWR -55 to 125 16 Ld SOIC
CD4049UBE -55 to 125 16 Ld PDIP
CD4049UBNSR -55 to 125 16 Ld SOP
CD4049UBPW -55 to 125 16 Ld TSSOP
CD4049UBPWR -55 to 125 16 Ld TSSOP
CD4050BD -55 to 125 16 Ld SOIC
CD4050BDR -55 to 125 16 Ld SOIC
CD4050UBDT -55 to 125 16 Ld SOIC
CD4050BDW -55 to 125 16 Ld SOIC
CD4050BDWR -55 to 125 16 Ld SOIC
CD4050BE -55 to 125 16 Ld PDIP
CD4050NSR -55 to 125 16 Ld SOP
CD4050BPW -55 to 125 16 Ld TSSOP
CD4050BPWR -55 to 125 16 Ld TSSOP
NOTE: When ordering, use the entire part number. The suffix R denotes tape
and reel. The suffix T denotes a small-quantity reel of 250.
CD4049UB (PDIP, CERDIP, SOIC, SOP, TSSOP)
TOP VIEW CD4050B (PDIP, CERDIP, SOIC, SOP)
TOP VIEW
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
VCC
G = A
A
H = B
B
I = C
VSS
C
NC
F
NC
K = E
E
J = D
D
L = F
14
15
16
9
13
12
11
10
1
2
3
4
5
7
6
8
VCC
G = A
A
H = B
B
I = C
VSS
C
NC
F
NC
K = E
E
J = D
D
L = F
August 1998 - Revised May 2004
[
/Title
(
CD40
4
9UB,
C
D405
0
B)
/
Sub-
j
ect
(
CMO
S
Hex
B
uffer/
C
on-
v
erters)
/
Autho
r
()
/
Key-
w
ords
(
Harris
S
emi-
c
on-
d
uctor,
C
D400
0
,
m
etal
g
ate,
C
MOS
2
Functional Block Diagrams
CD4049UB CD4050B
32
AG =
A
54
BH =
B
76
CI =
C
910
DJ =
D
11 12
EK =
E
14 15
FL =
F
1
8
VCC
VSS
NC = 13
NC = 16
32
A G = A
54
B H = B
76
C I = C
910
D J = D
11 12
E K = E
14 15
F L = F
1
8
VCC
VSS
NC = 13
NC = 16
Schematic Diagrams
FIGURE 1A. SCHEMATIC DIAGRAM OF CD4049UB, 1 OF 6
IDENTICAL UNITS FIGURE 1B. SCHEMATIC DIAGRAM OF CD4050B, 1 OF 6
IDENTICAL UNITS
VCC
OUT
VSS
P
N
R
IN
P
N
R
IN
VCC
OUT
VSS
P
N
CD4049UB, CD4050B
3
Absolute Maximum Ratings Thermal Information
Supply Voltage (V+ to V-). . . . . . . . . . . . . . . . . . . . . . . -0.5V to 20V
DC Input Current, Any One Input. . . . . . . . . . . . . . . . . . . . . . ±10mA
Operating Conditions
Temperature Range. . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC
Package Thermal Impedance, θJA (see Note1):
E (PDIP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 67oC/W
D (SOIC) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 73oC/W
DW (SOIC) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . 57oC/W
NS (SOP) Package . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 64oC/W
PW (TSSOP) Package. . . . . . . . . . . . . . . . . . . . . . . . . . 108oC/W
Maximum Junction Temperature (Plastic Package). . . . . . . . .150oC
Maximum Storage Temperature Range. . . . . . . . . . . 65oC to 150oC
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . .265oC
SOIC - Lead Tips Only
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTE:
1. The package thermal impedance is calculated in accordance with JESD 51-7.
DC Electrical Specifications
PARAMETER
TEST CONDITIONS
LIMITS AT INDICATED TEMPERATURE (oC)
UNITS-55 -40 85 125
25
VO
(V) VIN
(V) VCC (V) MIN TYP MAX
Quiescent Device Current
IDD (Max) - 0,5 5 1 1 30 30 - 0.02 1 µA
- 0,10 10 2 2 60 60 - 0.02 2 µA
- 0,15 15 4 4 120 120 - 0.02 4 µA
- 0,20 20 20 20 600 600 - 0.04 20 µA
Output Low (Sink) Current
IOL (Min) 0.4 0,5 4.5 3.3 3.1 2.1 1.8 2.6 5.2 - mA
0.4 0,5 5 4 3.8 2.9 2.4 3.2 6.4 - mA
0.5 0,10 10 10 9.6 6.6 5.6 8 16 - mA
1.5 0,15 15 26 25 20 18 24 48 - mA
Output High (Source) Current
IOH (Min) 4.6 0,5 5 -0.81 -0.73 -0.58 -0.48 -0.65 -1.2 - mA
2.5 0,5 5 -2.6 -2.4 -1.9 -1.55 -2.1 -3.9 - mA
9.5 0,10 10 -2.0 -1.8 -1.35 -1.18 -1.65 -3.0 - mA
13.5 0,15 15 -5.2 -4.8 -3.5 -3.1 -4.3 -8.0 - mA
Out Voltage Low Level
VOL (Max) - 0,5 5 0.05 0.05 0.05 0.05 - 0 0.05 V
- 0,10 10 0.05 0.05 0.05 0.05 - 0 0.05 V
- 0,15 15 0.05 0.05 0.05 0.05 - 0 0.05 V
Output Voltage High Level
VOH (Min) - 0,5 5 4.95 4.95 4.95 4.95 4.95 5 - V
- 0,10 10 9.95 9.95 9.95 9.95 9.95 10 - V
- 0,15 15 14.95 14.95 14.95 14.95 14.95 15 - V
Input Low Voltage, VIL (Max)
CD4049UB 4.5 - 5 1 1 1 1 - - 1 V
9 - 102222- -2 V
13.5 - 15 2.5 2.5 2.5 2.5 - - 2.5 V
Input Low Voltage, VIL (Max)
CD4050B 0.5 - 5 1.5 1.5 1.5 1.5 - - 1.5 V
1 - 103333- -3 V
1.5 - 15 4 4 4 4 - - 4 V
CD4049UB, CD4050B
4
Input High Voltage, VIH Min
CD4049UB 0.5 - 5 44444- - V
1 - 1088888- - V
1.5 - 15 12.5 12.5 12.5 12.5 12.5 - - V
Input High Voltage, VIH Min
CD4050B 4.5 - 5 3.5 3.5 3.5 3.5 3.5 - - V
9 - 1077777- - V
13.5 - 15 11 11 11 11 11 - - V
Input Current, IIN Max - 0,18 18 ±0.1 ±0.1 ±1±1-±10-5 ±0.1 µA
DC Electrical Specifications (Continued)
PARAMETER
TEST CONDITIONS
LIMITS AT INDICATED TEMPERATURE (oC)
UNITS-55 -40 85 125
25
VO
(V) VIN
(V) VCC (V) MIN TYP MAX
AC Electrical Specifications TA = 25oC, Input tr, tf = 20ns, CL = 50pF, RL = 200kΩ
PARAMETER
TEST CONDITIONS LIMITS (ALL PACKAGES)
UNITSVIN VCC TYP MAX
Propagation Delay Time
Low to High, tPLH
CD4049UB
5 5 60 120 ns
10 10 32 65 ns
10 5 45 90 ns
15 15 25 50 ns
15 5 45 90 ns
Propagation Delay Time
Low to High, tPLH
CD4050B
5 5 70 140 ns
10 10 40 80 ns
10 5 45 90 ns
15 15 30 60 ns
15 5 40 80 ns
Propagation Delay Time
High to Low, tPHL
CD4049UB
5 5 32 65 ns
10 10 20 40 ns
10 5 15 30 ns
15 15 15 30 ns
15 5 10 20 ns
Propagation Delay Time
High to Low, tPHL
CD4050B
5 5 55 110 ns
10 10 22 55 ns
10 5 50 100 ns
15 15 15 30 ns
15 5 50 100 ns
Transition Time, Low to High, tTLH 5 5 80 160 ns
10 10 40 80 ns
15 15 30 60 ns
Transition Time, High to Low, tTHL 5 5 30 60 ns
10 10 20 40 ns
15 15 15 30 ns
CD4049UB, CD4050B
5
Input Capacitance, CIN
CD4049UB - - 15 22.5 pF
Input Capacitance, CIN
CD4050B - - 5 7.5 pF
AC Electrical Specifications TA = 25oC, Input tr, tf = 20ns, CL = 50pF, RL = 200kΩ (Continued)
PARAMETER
TEST CONDITIONS LIMITS (ALL PACKAGES)
UNITSVIN VCC TYP MAX
Typical Performance Curves
FIGURE 2. MINIMUM AND MAXIMUM VOLTAGE TRANSFER
CHARACTERISTICS FOR CD4049UB FIGURE 3. MINIMUM AND MAXIMUM VOLTAGE TRANSFER
CHARACTERISTICS FOR CD4050B
FIGURE 4. TYPICAL OUTPUT LOW (SINK) CURRENT
CHARACTERISTICS FIGURE 5. MINIMUM OUTPUT LOW (SINK) CURRENT DRAIN
CHARACTERISTICS
5
4
3
2
1
01234
VI, INPUT VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
TA = 25oC
SUPPLY VOLTAGE (VCC) = 5V
MAXIMUMMINIMUM
5
4
3
2
1
01234
VI, INPUT VOLTAGE (V)
VO, OUTPUT VOLTAGE (V)
TA = 25oC
SUPPLY VOLTAGE (VCC) = 5V
MAXIMUMMINIMUM
50
40
30
20
10
01234
VDS, DRAIN TO SOURCE VOLTAGE (V)
IOL, OUTPUT LOW (SINK) CURRENT (mA)
TA = 25oC
GATE TO SOURCE VOLTAGE (VGS) = 5V
10V
15V
60
70
5678
50
40
30
20
10
01234
VDS, DRAIN TO SOURCE VOLTAGE (V)
IOL, OUTPUT LOW (SINK) CURRENT (mA)
TA = 25oC
GATE TO SOURCE VOLTAGE (VGS) = 5V
10V15V
60
70
5678
CD4049UB, CD4050B
6
FIGURE 6. TYPICAL OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS FIGURE 7. MINIMUM OUTPUT HIGH (SOURCE) CURRENT
CHARACTERISTICS
FIGURE 8. TYPICAL VOLTAGE TRANSFER CHARACTERISTICS
AS A FUNCTION OF TEMPERATURE FOR CD4049UB FIGURE 9. TYPICAL VOLTAGE TRANSFER CHARACTERISTICS
AS A FUNCTION OF TEMPERATURE FOR CD4050B
FIGURE 10. TYPICAL POWER DISSIPATION vs FREQUENCY
CHARACTERISTICS FIGURE 11. TYPICAL POWER DISSIPATION vs INPUT RISE
AND FALL TIMES PER INVERTER FOR CD4049UB
Typical Performance Curves (Continued)
-5
-10
-15
-20
-25
-30
-35
OUTPUT HIGH (SOURCE)
CURRENT CHARACTERISTICS
-15V
-10V
GATE TO SOURCE VOLTAGE
VGS = -5V
TA = 25oC
-8 -7 -6 -5 -4 -3 -2 -1 0
VDS, DRAIN TO SOURCE VOLTAGE (V)
-5
-10
-15
-20
-25
-30
-35
OUTPUT HIGH (SOURCE)
CURRENT CHARACTERISTICS
-15V
-10V
GATE TO SOURCE VOLTAGE
VGS = -5V
TA = 25oC
-8 -7 -6 -5 -4 -3 -2 -1 0
VDS, DRAIN TO SOURCE VOLTAGE (V)
10
6
5
4
3
2
1
VO, OUTPUT VOLTAGE (V)
-55oC
125oC
SUPPLY VOLTAGE
VCC = 10V
TA = -55oC
876543210 VI, INPUT VOLTAGE (V)
910
9
8
7
0
125oC
VCC = 5V
10
6
5
4
3
2
1
VO, OUTPUT VOLTAGE (V)
-55oC
125oC
SUPPLY VOLTAGE
VCC = 10V
TA = -55oC
876543210 VI, INPUT VOLTAGE (V)
910
9
8
7
0
125oC
VCC = 5V
105
104
103
102
10
10 102103104105
TA = 25oC
SUPPLY VOLTAGE VCC = 15V
10V
10V
5V
LOAD CAPACITANCE
CL = 50pF
(11pF FIXTURE + 39pF EXT)
(11pF FIXTURE + 4pF EXT)
CL = 15pF
POWER DISSIPATION PER INVERTER (µW)
f, INPUT FREQUENCY (kHz)
105
104
103
102
10
10 102103104105
TA = 25oC
POWER DISSIPATION PER INVERTER (µW)
tr, tf, INPUT RISE AND FALL TIME (ns)
SUPPLY VOLTAGE VCC = 5V FREQUENCY (f) = 10kHz
15V; 1MHz
15V; 100kHz
10V; 100kHz
15V; 10kHz
10V; 10kHz
15V; 1kHz
106107108
CD4049UB, CD4050B
7
FIGURE 12. TYPICAL POWER DISSIPATION vs INPUT RISE
AND FALL TIMES PER INVERTER FOR CD4050B
Typical Performance Curves (Continued)
106
104
103
102
110 102103104105
TA = 25oC
POWER DISSIPATION PER INVERTER (µW)
tr, tf, INPUT RISE AND FALL TIME (ns)
SUPPLY VOLTAGE VCC = 5V FREQUENCY (f) = 10kHz
106107108
10
105
15V; 1MHz
15V; 100kHz
10V; 100kHz
15V; 10kHz
10V; 10kHz
15V; 1kHz
Test Circuits
FIGURE 13. QUIESCENT DEVICE CURRENT TEST CIRCUIT NOTE: Test any one input with other inputs at VCC or VSS.
FIGURE 14. INPUT VOLTAGE TEST CIRCUIT
NOTE: Measure inputs sequentially, to both VCC and VSS connect
all unused inputs to either VCC or VSS.
FIGURE 15. INPUT CURRENT TEST CIRCUIT
In Terminal - 3, 5, 7, 9, 11, or 14
Out Terminal - 2, 4, 6, 10, 12 or 15
VCC Terminal - 1
VSS Terminal - 8
FIGURE 16. LOGIC LEVEL CONVERSION APPLICATION
IDD
VCC
INPUTS
VSS
VCC
VSS
VCC
OUTPUTSINPUTS
VIH
VIL
VSS
DVM
+
-
VCC
OUTPUTSINPUTS
VCC
VSS
VSS
I
VCC = 5V
OUTPUT
INPUTS
10V = VIH
0 = VIL VSS
TO DTL/TTL
CMOS 10V LEVEL TO DTL/TTL 5V LEVEL
COS/MOS
IN
0 = VOL
5V = VOH
CD4049
CD4049UB, CD4050B
8
FIGURE 17. DYNAMIC POWER DISSIPATION TEST CIRCUITS
Test Circuits (Continued)
I
VDD
500µF
0.1µF
CL
10kHz,
100kHz, 1MHz
1
2
3
4
5
6
7
8
CD4049UB
16
15
14
13
12
11
10
9
CL INCLUDES FIXTURE CAPACITANCE
CD4049UB, CD4050B
9
CD4049UB, CD4050B
PACKAGING INFORMATION
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
CD4049UBD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDT ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDTE4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDTG4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDWE4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDWR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBE ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD4049UBEE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD4049UBF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
CD4049UBF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
CD4049UBF3AS2283 OBSOLETE CDIP J 16 TBD Call TI Call TI
CD4049UBF3AS2534 OBSOLETE CDIP J 16 TBD Call TI Call TI
CD4049UBM OBSOLETE SOIC D 16 TBD Call TI Call TI
CD4049UBM96 OBSOLETE SOIC D 16 TBD Call TI Call TI
CD4049UBNSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBNSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBPW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 1
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
CD4049UBPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BD ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDE4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDG4 ACTIVE SOIC D 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDR ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDRE4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDT ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDTE4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDTG4 ACTIVE SOIC D 16 250 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDW ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDWE4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDWG4 ACTIVE SOIC DW 16 40 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDWR ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BE ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD4050BEE4 ACTIVE PDIP N 16 25 Pb-Free
(RoHS) CU NIPDAU N / A for Pkg Type
CD4050BF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
CD4050BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
CD4050BF3AS2283 OBSOLETE CDIP J 16 TBD Call TI Call TI
CD4050BF3AS2534 OBSOLETE CDIP J 16 TBD Call TI Call TI
CD4050BM OBSOLETE SOIC D 16 TBD Call TI Call TI
CD4050BNSR ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 2
Orderable Device Status (1) Package
Type Package
Drawing Pins Package
Qty Eco Plan (2) Lead/Ball Finish MSL Peak Temp (3)
CD4050BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BPW ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS &
no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
JM38510/05553BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/05554BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in
a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check
http://www.ti.com/productcontent for the latest availability information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements
for all 6 substances, including the requirement that lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered
at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and
package, or 2) lead-based die adhesive used between the die and leadframe. The component is otherwise considered Pb-Free (RoHS
compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame
retardants (Br or Sb do not exceed 0.1% by weight in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder
temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is
provided. TI bases its knowledge and belief on information provided by third parties, and makes no representation or warranty as to the
accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take
reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on
incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited
information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI
to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 15-Oct-2009
Addendum-Page 3
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0 (mm) B0 (mm) K0 (mm) P1
(mm) W
(mm) Pin1
Quadrant
CD4049UBDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4049UBDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
CD4049UBNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4049UBPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
CD4050BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4050BDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
CD4050BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4050BPWR TSSOP PW 16 2000 330.0 12.4 7.0 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4049UBDR SOIC D 16 2500 333.2 345.9 28.6
CD4049UBDWR SOIC DW 16 2000 346.0 346.0 33.0
CD4049UBNSR SO NS 16 2000 346.0 346.0 33.0
CD4049UBPWR TSSOP PW 16 2000 346.0 346.0 29.0
CD4050BDR SOIC D 16 2500 333.2 345.9 28.6
CD4050BDWR SOIC DW 16 2000 346.0 346.0 33.0
CD4050BNSR SO NS 16 2000 346.0 346.0 33.0
CD4050BPWR TSSOP PW 16 2000 346.0 346.0 29.0
PACKAGE MATERIALS INFORMATION
www.ti.com 19-Mar-2008
Pack Materials-Page 2
MECHANICAL DATA
MTSS001C – JANUARY 1995 – REVISED FEBRUARY 1999
POST OFFICE BOX 655303 • DALLAS, TEXAS 75265
PW (R-PDSO-G**) PLASTIC SMALL-OUTLINE PACKAGE
14 PINS SHOWN
0,65 M
0,10
0,10
0,25
0,50
0,75
0,15 NOM
Gage Plane
28
9,80
9,60
24
7,90
7,70
2016
6,60
6,40
4040064/F 01/97
0,30
6,60
6,20
80,19
4,30
4,50
7
0,15
14
A
1
1,20 MAX
14
5,10
4,90
8
3,10
2,90
A MAX
A MIN
DIM PINS **
0,05
4,90
5,10
Seating Plane
0°–8°
NOTES: A. All linear dimensions are in millimeters.
B. This drawing is subject to change without notice.
C. Body dimensions do not include mold flash or protrusion not to exceed 0,15.
D. Falls within JEDEC MO-153
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
CD4049UBD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDTE4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDTG4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDWE4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDWR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
CD4049UBEE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
CD4049UBF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 2
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
CD4049UBF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
CD4049UBF3AS2283 OBSOLETE CDIP J 16 TBD Call TI Call TI
CD4049UBF3AS2534 OBSOLETE CDIP J 16 TBD Call TI Call TI
CD4049UBM OBSOLETE SOIC D 16 TBD Call TI Call TI
CD4049UBM96 OBSOLETE SOIC D 16 TBD Call TI Call TI
CD4049UBNSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBNSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBNSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBPW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBPWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4049UBPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BD ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDE4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDG4 ACTIVE SOIC D 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDR ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDRE4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDRG4 ACTIVE SOIC D 16 2500 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 3
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
CD4050BDT ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDTE4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDTG4 ACTIVE SOIC D 16 250 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDW ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDWE4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDWG4 ACTIVE SOIC DW 16 40 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDWR ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDWRE4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BDWRG4 ACTIVE SOIC DW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BE ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
CD4050BEE4 ACTIVE PDIP N 16 25 Pb-Free (RoHS) CU NIPDAU N / A for Pkg Type
CD4050BF ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
CD4050BF3A ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
CD4050BF3AS2283 OBSOLETE CDIP J 16 TBD Call TI Call TI
CD4050BF3AS2534 OBSOLETE CDIP J 16 TBD Call TI Call TI
CD4050BM OBSOLETE SOIC D 16 TBD Call TI Call TI
CD4050BNSR ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BNSRE4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BNSRG4 ACTIVE SO NS 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BPW ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BPWE4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 4
Orderable Device Status (1) Package Type Package
Drawing Pins Package Qty Eco Plan (2) Lead/
Ball Finish MSL Peak Temp (3) Samples
(Requires Login)
CD4050BPWG4 ACTIVE TSSOP PW 16 90 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BPWR ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BPWRE4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
CD4050BPWRG4 ACTIVE TSSOP PW 16 2000 Green (RoHS
& no Sb/Br) CU NIPDAU Level-1-260C-UNLIM
JM38510/05553BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
JM38510/05554BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
M38510/05553BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
M38510/05554BEA ACTIVE CDIP J 16 1 TBD A42 N / A for Pkg Type
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
PACKAGE OPTION ADDENDUM
www.ti.com 25-Jan-2012
Addendum-Page 5
OTHER QUALIFIED VERSIONS OF CD4049UB, CD4049UB-MIL, CD4050B, CD4050B-MIL :
•Catalog: CD4049UB, CD4050B
•Military: CD4049UB-MIL, CD4050B-MIL
NOTE: Qualified Version Definitions:
•Catalog - TI's standard catalog product
•Military - QML certified for Military and Defense Applications
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
CD4049UBDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4049UBDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
CD4049UBNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4049UBPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
CD4050BDR SOIC D 16 2500 330.0 16.4 6.5 10.3 2.1 8.0 16.0 Q1
CD4050BDWR SOIC DW 16 2000 330.0 16.4 10.75 10.7 2.7 12.0 16.0 Q1
CD4050BNSR SO NS 16 2000 330.0 16.4 8.2 10.5 2.5 12.0 16.0 Q1
CD4050BPWR TSSOP PW 16 2000 330.0 12.4 6.9 5.6 1.6 8.0 12.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
CD4049UBDR SOIC D 16 2500 333.2 345.9 28.6
CD4049UBDWR SOIC DW 16 2000 367.0 367.0 38.0
CD4049UBNSR SO NS 16 2000 367.0 367.0 38.0
CD4049UBPWR TSSOP PW 16 2000 367.0 367.0 35.0
CD4050BDR SOIC D 16 2500 333.2 345.9 28.6
CD4050BDWR SOIC DW 16 2000 367.0 367.0 38.0
CD4050BNSR SO NS 16 2000 367.0 367.0 38.0
CD4050BPWR TSSOP PW 16 2000 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 14-Jul-2012
Pack Materials-Page 2
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