MC78L00A Series, NCV78L00A
www.onsemi.com
15
PACKAGE DIMENSIONS
SOT−89, 3 LEAD
CASE 528AG
ISSUE O
MOUNTING FOOTPRINT*
RECOMMENDED
C0.10
T OP VIEW
SIDE VIEW
BOTTOM VIEW
C
H
1
DIM MIN MAX
MILLIMETERS
A1.40 1.60
b1 0.46 0.55
b0.38 0.47
c0.40 0.44
D4.40 4.60
D2 1.60 1.90
E2.40 2.60
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. LEAD THICKNESS INCLUDES LEAD FINISH.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
5. DIMENSIONS L, L2, D2, AND H ARE MEASURED
AT DATUM PLANE C.
6. CENTER LEAD CONTOUR MAY VARY WITHIN THE
REGION DEFINED BY DIMENSION E.
7. DIMENSION D2 IS DEFINED AT ITS WIDEST POINT.
e
L0.89 1.20
H4.05 4.25
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
D
E
Ac
23
bb1 L2
D2
L
0.58
DIMENSIONS: MILLIMETERS
1
2X 1.50
0.86
1.57
4.45
2X 0.50
2.00
123
A
B
e e
1.50 BSC
PACKAGE
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