GBPC12, 15, 25 and 35 Vishay Semiconductors formerly General Semiconductor Glass Passivated Single-Phase Bridge Rectifier GBPC GBPC-W 1.135 (28.8) 1.115 (28.3) 1.135 (28.8) Hole for #10 Screw 0.220 (5.59) DIA. 0.200 (5.08) 1.115 (28.3) 0.732 (18.6) 0.692 (17.6) 1.135 (28.8) 0.24 (6.0) 0.18 (4.6) 0.732 (18.6) 0.692 (17.6) 1.115 (28.3) 0.24 (6.0) 0.18 (4.6) 0.470 (11.9) 0.430 (10.9) Reverse Voltage 50 and 1000V Forward Current 12 to 35A Hole for #10 Screw 0.220 (5.59) DIA. 0.200 (5.08) 0.672 (17.1) 0.632 (16.1) AC 1.135 (28.8) 1.115 (28.3) 0.672 (17.1) 0.632 (16.1) 0.50 (12.7) 0.44 (11.7) 0.582 (14.8) 0.542 (13.8) 0.732 (18.6) 0.692 (17.6) 0.094 (2.4) DIA. 0.042 (1.07) 0.038 (0.97) DIA. 0.034 (0.86) 1.25 (31.8) MIN. 0.25 (6.35) 0.030 (0.76) 0.840 (21.3) 0.740 (18.8) 0.310 (7.62) 0.310 (7.62) 0.290 (7.36) 0.290 (7.36) Dimensions in inches and (millimeters) Mechanical Data Features Case: Molded plastic with heatsink integrally mounted in the bridge encapsulation * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 * This series is UL listed under the Recognized Component Index, file number E54214 * Integrally molded heatsink provides very low thermal resistance for maximum heat dissipation * Universal 3-way terminals; snap-on, wire wrap-around, or P.C.B. mounting * High forward surge current capability * Glass passivated chip junctions * Typical IR less than 0.3A * High temperature soldering guaranteed: 260C/10 seconds at 5lbs. (2.3kg) tension Terminals: Either plated 0.25" (6.35mm) Faston lugs or plated copper leads 0.040" (1.02mm) diameter. Suffix letter "W" added to indicate wire leads (e.g. GBPC12005W) Mounting Position: See NOTE 2 Polarity: Polarity symbols molded on body Mounting Torque: 20 in. - lb. max. Weight: 0.53 ounce, 15 grams Packaging codes/options: 1/100 EA. per Bulk Box Document Number 88612 13-Feb-02 www.vishay.com 1 GBPC12, 15, 25 and 35 Vishay Semiconductors formerly General Semiconductor Maximum Ratings and Thermal Characteristics (T A = 25C unless otherwise noted) GBPC12, 15, 25, 35 Symbols 005 01 02 04 06 08 10 Units Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 800 1000 V Maximum RMS voltage VRMS 35 70 140 280 420 560 700 V VDC 50 100 200 400 600 800 1000 V Maximum DC blocking voltage Maximum average forward rectified output current GBPC12 GBPC15 GBPC25 GBPC35 (See Fig.1) Peak forward surge current single sine-wave superimposed on rated load (JEDEC Method) GBPC12 GBPC15 GBPC25 GBPC35 Rating (non-repetitive, for t greater than 1ms and less than 8.3ms) for fusing GBPC12 GBPC15 GBPC25 GBPC35 RMS isolation voltage from case to leads Typical thermal resistance per leg (1) GBPC12-25 GBPC35 Operating junction storage temperature range Electrical Characteristics 12 15 25 35 IF(AV) A 200 300 300 400 IFSM A It 160 375 375 660 A2 sec VISO 2500 V RJC 1.9 1.4 C/W TJ, TSTG -55 to +150 C 2 Ratings at 25C ambient temperature unless otherwise specified. GBPC12, 15, 25, 35 Symbols Maximum instantaneous forward voltage drop per leg at GBPC12 GBPC15 GBPC25 GBPC35 IF=6.0A IF=7.5A IF=12.5A IF=17.5A 005 01 02 04 06 08 10 Units VF 1.1 V Maximum reverse DC current at rated TA=25C DC blocking voltage per leg TA=125C IR 5.0 500 A Typical junction capacitance per leg at 4V, 1MHZ CJ 300 pF Notes: (1) Thermal resistance from junction to case per leg (2) Bolt down on heatsink with silicone thermal compound between bridge and mounting surface for maximum heat transfer with #10 screw www.vishay.com 2 Document Number 88612 13-Feb-02 GBPC12, 15, 25 and 35 Vishay Semiconductors formerly General Semiconductor Ratings and Characteristic Curves (TA = 25C unless otherwise noted) Fig. 1 -- Maximum Output Rectified Current Fig. 2 -- Maximum Output Rectified Current 40 Bridges Mounted on 9.5 x 3.5 x 4.6" (22.9 x 8.9 x 11.7cm) AL. Finned Plate 35 30 Average Forward Current (A) Average Forward Current (A) 40 5 x 6 x 4.9" AL, Finned Plate 25 20 5 x 4 x 3" AL. Finned Plate 15 6 x 2.2 x 2.2" AL. Finned Plate 10 5 0 60 HZ Resistive or Inductive Load 0 25 50 75 100 125 150 175 30 GBPC25 20 GBPC15 RthS-A = 1.0C/W 15 10 GBPC12 5 RthS-A = 1.0C/W 0 Case Temperature (C) 20 30 40 50 500 80 70 Capacitive Load 60 50 TJ = TJ max. 40 Resistive or Inductive Load 30 20 10 0 10 20 30 Average Output Current (A) Document Number 88612 13-Feb-02 60 70 80 90 100 Fig. 4 -- Maximum Non-Repetitive Peak Forward Surge Current Per Leg Peak Forward Surge Current (A) Average Power Dissipation of Bridge (W) 10 Ambient Temperature (C) Fig. 3 -- Maximum Power Dissipation 0 60 HZ Resistive or Inductive Load 25 RthS-A = 0.5C/W 0 200 GBPC35 35 RthS-A = 0.5C/W 40 TJ = TJ max. 0.5 Single Sine-Wave (JEDEC Method) GBPC35 GBPC15 GBPC25 100 GBPC12 1.0 Cycle 1 10 100 Number of Cycles at 60 HZ www.vishay.com 3 GBPC12, 15, 25 and 35 Vishay Semiconductors formerly General Semiconductor Ratings and Characteristic Curves (TA = 25C unless otherwise noted) Fig. 5 -- Typical Instantaneous Forward Characteristics Per Leg Fig. 6 -- Typical Reverse Leakage Characteristics Per Leg Instantaneous Reverse Leakage Current (A) Instantaneous Forward Current (A) 100 10 TJ = 25C Pulse Width = 300s 1% Duty Cycle 1 0.1 0.01 0.4 TJ = 150C 10 1 0.8 1 1.2 1.4 1.6 20 40 60 80 Fig. 7 -- Typical Junction Capacitance Per Leg Fig. 8 -- Typical Transient Thermal Impedance Per Leg 100 10 100 Transient Thermal Impedance (CW) 1,000 Reverse Voltage (V) www.vishay.com 4 0 Percent of Rated Peak Reverse Voltage (V) 100 1 TJ = 25C Instantaneous Forward Voltage (V) TJ = 25C f = 1.0MHZ Vsig = 50MVp-p 50 50 - 400V 600 - 1000V 0.1 0.01 0.6 600 Junction Capacitance (pF) TJ = 125C 100 TJ = 25C f = 1.0MHZ Vsig = 50MVp-p 100 10 1 0.01 0.1 1 10 100 t, Heating Time, sec. Document Number 88612 13-Feb-02