Datashee
t
Product structure : Silicon monolithic integrated circuit This product has no designed protection against radioactive rays
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TSZ02201-0V2V0E600440-1-2
25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211114001
Audio 1-Chip SOC
BM94803AEKU
General Description
BM94803AEKU is 1-Chip SOC for multimedia audio
systems, which supports the USB memory, SD memory
card, and CD. This IC has a built-in ARM946ES
processor, SDRAM, and various peripherals. It is
designated to download programs from external Serial
Flash ROM and execute system control, file system
management, Audio CODEC, and a wide range of media
control.
BM94803AEKU supports USB High-Speed and has
built-in DSD Native reproduction function.
Key Features
This IC includes the following blocks:
Processor
ARM946ES Microprocessor Core
Memory
SDRAM
Initial Program ROM
Program SRAM
Data SRAM
SDRAM Controller
System
Multilayer AHB
Interrupt Controller
DMA Controller
Serial, Media I/F
GPIO
Pin Controller
USB2.0 Dual Role(Host/Device) Controller
SD I/F
Quad SPI I/F
SPI I/F (Master/Slave)
I2C I/F (Master/Slave)
UART I/F
I2S Input I/F
I2S Output I/F
CD Servo Controllers
CD-ROM Decoder
General Purpose A/D Converter
Timer
Timer
Watchdog Timer
Real Time Clock
Other
Clock Generator
Reset Generator
PLL
Package
Application
Component Stereo
Application Block
Figure 1. Application Block
Lineup
Type
Package
BM94803AEKU
HTQFP128UA
Tray
USB Memory
PC / iPod
USB Host
/Device
controller
SD
Memory
SDIO
Host
controller
CD
pickup CD Servo
DSP
MIC
/TUNER
/AUX
I2S
Input I/F
x2
File System
FAT12/16/32
Audio
Decoder
MP3/WMA
/AAC /WAV
/FLAC/ALAC
/DSD
CD-ROM
Decoder
&
File System
ISO9660
SEL
I2S
Output
I/F
DSP
&
PWM
Processor
PWM Amp
D-class
Amp
SEL
Audio
Encoder
MP3/WAV
LRCK,BCK,SDATA
MIXER
Decode Path
Encode Path
Through Path
USB-DAC
Audio Class
CD
Driver
Control Path
Quad SPI
I/F
Serial Flash
ROM
3.3V / 1.5V
16.9344MHz
/ 32.768KHz
KEY
Control
Display
Control
KEY
/Remote Control
LCD
Controller
Peripheral
Control
ADC GPIO Serial I/F
SPI/I2C/UART
System Controller
Peripheral
modules
DSD
Output
I/F
BT
HCI module
HCI
controller
(UART)
BT stack
A2DP
SBC
Decoder
Audio SoC
SEL
Audio
DAC
DSD input
Amp with DAC
D-class
Amp
DSDBCKO,DSDLO,DSDRO
Shock
Proof
ADC
HTQFP128UA
16.00mm 16.00mm 1.20mm
0.4 mm pitch (With Thermal PAD)
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BM94803AEKU
TSZ02201-0V2V0E600440-1-2
25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Feature
BM94801KUT
BM94803AEKU
Package
TQFP128UM
HTQFP128UA
Processor
ARM946ES
96MHz
108MHz
ICache/Dcache
4kB/4kB
4kB/4kB
Memory
SDRAM
16Mbit
16Mbit
Initial Program ROM
2kByte
2kByte
Program SRAM
64kByte
64kByte
Data SRAM
64kByte
64kByte
System
Multilayer AHB
support
support
Interrupt Controller
support
support
DMA Controller
2ch
1ch
Peripheral
I/F
GPIO
support
support
Pin Controller
support
support
USB2.0 Controller
HS 1port
HS 1port
SD I/F
1ch
1ch
Quad SPI I/F
1ch
1ch
SPI I/F (Master)
1ch
1ch
SPI I/F (Slave)
1ch
1ch
I2C I/F (Master/Slave)
2ch
2ch
UART I/F
2ch
2ch
I2S Input I/F
2ch 2series
2ch 2series
I2S Output I/F
I2S:stereo + mono
I2S:stereo
192kHz/24bit
192kHz/24bit
DSD : 5.6448MHz
CD Servo Controllers
support
support
CD-ROM Decoder
support
support
RemoteControll
support
support
General purpose
1.5V x 8ch
3.3V x 8ch
A/D Converter
Timer
Timer
5ch
5ch
Watchdog Timer
1ch
1ch
Real Time Clock
1ch
1ch
Entertainment
DSP
-
-
PWM out
-
-
Accelerator
FLAC/ALAC
-
-
Clock
Clock Generator
support
support
Reset Generator
support
support
Note: specification in the Datasheet is correct for the specifications of BM94801KUT.
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25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Feature continued
ARM946ES Microprocessor Core
32Bit RISC Processor
Operating Frequency: 108MHz
8kByte Cache
Data Cache 4kByte
Instruction Cache 4kByte
SDRAM
16Mbit
SDRAM with built-in MSM56V16160N from LAPIS Semiconductor
2Bank x 524,288-word x 16Bit
Initial Program ROM
ITCM ROM Size: 2kByte (512Word x 32Bit)
boot program
No-wait access
REMAP
Remapping can be implemented by writing to internal registers.
SHADOW SRAM
RAM Size: 512Byte (128-Word x 32-Bit)
No-wait access
Program SRAM
ITCM RAM Size: 64kByte (16,384-Word x 32-Bit)
No-wait access
Data SRAM
DTCM RAM Size: 64kByte (16,384-Word x 32-Bit)
No-wait access
SDRAM Controller
Supports SDRAM
Supports 11Bit row address, 8-bit column address, and 1-bit bank address to SDRAM
AMBA
32Bit Data Bus
Arbitrates ARM and DMA access with an arbiter
Interrupt Controller
23 IRQ Interrupt Lines
1 FIQ Interrupt Line
Allows programmable setting of interrupt priority levels
Allows setting of 16 vector addresses
DMA Controller
Supports 1 Channel
Channel FIFO Depth Up to 16 Bytes
Allows programmable setting of transfer data width in the range of 1Byte to 4Bytes
Allows programmable setting of channel priority levels
Maximum Block Length Up to 4,095 Words
Includes 12 handshake interfaces available for assignment to channels with software
Supports multiblock transfers
Connects the master board to system bus
GPIO
GPIO0(32 pins), GPIO1(32 pins), GPIO2(13pins)
4 of 17 pins assigned GPIO2 are not available because of analog pin. (See P9 Pin Description)
Supports a maximum of 77 I/O pins (including 13 GPIO pins for exclusive use)
Supports the interrupt function
Supports external level-sensitive interrupt
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TSZ02201-0V2V0E600440-1-2
25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Feature continued
Pin Controller
Controls connection settings between pins and blocks
USB2.0 Dual Role (Host/Device) controller
USB 2.0 conformance
Bit rate: High-Speed (480Mbps)/Full-Speed (12Mbps)
Configurable for up to five transmit endpoint FIFOs and four receive endpoint FIFOs (including endpoint 0)
Each endpoint FIFO supports bulk transfer, interrupt transfer, and isochronous transfer.
4096-Byte RAM for Endpoint FIFO
SD I/F
Supports SDHC, and SD cards
Provide access to SD card in SD Bus mode
Allows control from the AMBA-AHB Bus
Includes 512 Byte data transmit/receive FIFOs
Quad SPI I/F
Supports quad serial flash ROM
Supports serial flash ROM address up to 24 bits
Allows the setting of control registers from the AMBA-AHB bus
Allows direct access from the memory map of the AMBA-AHB bus to serial flash ROM
Includes 32 byte transmit/receive FIFOs
SSI Master
FIFO Depth Up to 16 Words and FIFO Data Width Up to 16Bits
Selectable Data Size from 4 Bits to 16 Bits
Serial protocol supports SPI from Motorola
Includes DMA handshake interface
SSI Slave
FIFO Depth Up to 16 Words and FIFO Data Width Up to 16 Bits
Selectable Data Size from 4 Bits to 16 Bits
Serial protocol supports SPI from Motorola
Includes DMA handshake interface
I2C I/F (Master/Slave)
2 Ch I2C Serial Interface
Supports two speed modes
Standard mode (100Kb/s)
Fast mode (400Kb/s)
Supports I2C Master and Slave operation
Allows 7 and 10 bit address generation
Has built-in 32 stage transmit and receive FIFOs
Includes DMA handshake interface
UART I/F
IS16550-Based
Allows various baud rate settings with software (up to 6Mbps)
No Support for IrDA
FIFO Depth Up to 32 Words and FIFO Data Width Up to 8 Bits
Incorporates a function to invert output
Includes DMA handshake interface
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25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Feature continued
I2S Input I/F
Two Lines of 2-Ch Digital Audio Input
I2S, EIAJ format
16-Bit Data
Selectable Bit Clock from 32fs, 48fs, and 64fs
Selectable Input Sample Rate from 32kHz, 44.1kHz, and 48kHz
One Line of Internal Input from the CD Servo Controller
Maximum Input Rate Up to 4x
Supports detection of CD-DA link
Supports detection of CD-ROM sync
Supports CD-ROM data descrambling
Acquires Sub-Q data
Acquires CD-Text data
Built-in DMA 2ch
Supports I2S Input at CD Play
I2S Output I/F
2-Ch Digital Audio Output x 1 ( 2ch from Decoder)
I2S, EIAJ format
Selectable PCM Output Sample Rate from 32k, 44.1k, 48k, 88.2k, 96k,176.4k,192kHz
Selectable PCM Data Width from 16 and 24 bits
64 fs PCM Bit Clock
Supports pitch control (x0.5 - x2.0, 25step)
Selectable DSD Output Sample Rate from DSD 2.8224MHz, 5.6448MHz
CD servo controller
Supports rotation speed of CD up to 4x
Built-in Preservo-Amplifier with Power Save Mode, which supports Playback of CD-RW
Allows independent offset adjustment of AC, BD, E, and F amplifiers
Built-in Auto-Tracking and Focus Adjustment Function
Built-in PLL and CLV with a Wide Lock Range
Built-in Asymmetry Correction Function
CD-ROM Decoder
Supports Mode1, Mode2 form1, Mode2 form2
Supports ECC, EDC
Built-in DMA
General Purpose A/D Converter
10-Bit SAR ADC, 8 Ch ADC
Analog Input Voltage range: VDD_ADC x10% to VDD_ADC x 90%
Maximum A/D Conversion frequency Ch=88.2ksps
Timer
Supports five independent programmable timer functions
Each timer supports time width up to 32 bits
Each timer supports independent interrupt signal
Watchdog Timer
Composed of a counter having a set cycle to monitor the occurrence of timeout event
Counter Width Up to 32 Bits
The counter counts down from the set value and sets timeout occurrence when it reaches zero
Realtime clock
32 Bit Programmable Timer
Supports interrupt signals
External 32.768 kHz Crystal Oscillator
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© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Feature continued
Remote Controller Receiver (RCR)
Converts infrared remote control signal to code
Compatible with the signal format of the Association for Electric Home Appliances
Supports Sony format
Enables to setup permissible value of input signal cycle to adjust the Duty deviation of input signal
Clock Generator
Supplies clocks to individual internal blocks
Allows on/off control of clocks to individual blocks
Generates master audio clocks
At the normal operation, supports three modes (High-Speed mode, Middle Speed mode, Low-Speed mode)
Supports Standby Mode
Reset Generator
Generates a pulse to be supplied to individual blocks
PLL
Generates 216MHz / 240MHz clock used to generate system clocks
Generates 135.4752 MHz and 147.456 MHz clocks used to generate audio clocks
Power Supply Voltage
I/O Power Supply Voltage : 3.3V(3.0V to 3.6V)
Analog Power Supply Voltage: 3.3V(3.0V to 3.6V)
(Used for SDRAM, CD servo, USB, and ADC)
Digital Core Power Supply Voltage : 1.5V(1.45V to 1.65V)
(Used for Digital Core)
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25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Pin Assignment
Figure 2. Pin Assignment
RESETX
SD_WP
DVDD_HV
SD_DAT0
SD_CLK
SD_CMD
SD_DAT3
DVDD_HV
GPIO0_9
GPIO0_10
DVDD_LV
DVSS
DVDD_HV
DVSS
DVSS
DVSS
GPIO1_8
DVDD_LV
FL_CS
DVSS
DATAO1
FL_DAT2
DVSS
DVDD_HV
DATAO0
FL_DAT1
FL_DAT3
FL_CLK
MCLKO
DVDD_HV
BCKO
FL_DAT0
XOUT_32K
LRCKI1
DATAI0
BCKI0
BCKI1
LRCKI0
DATAI1
XIN_32K
DVSS
UART1_RTS
XIN_PLL
RCR
TMODE
XOUT_PLL
LRCKO
ADIN0
ADIN2
ADIN3
ADIN4
ADIN5
ADIN6
ADIN7
AC
EQO
AD_MONI0
VBIAS
ADIN1
ANA_MONI1
BD
SD_DAT1
RFI
VDD_ADC
AVDD
SD_DAT2
GPIO0_8
UART1_TXD
AD_MONI1
GPIO1_9
DVDD_HV
GPIO1_7
UART1_CTS
SDA1
SCL1
SD_CON
UART1_RXD
ANA_MONI0
VSS_ADC
123
122
121
120
119
118
117
116
115
114
113
112
111
128
127
126
125
124
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
40
41
42
43
44
45
46
47
48
49
50
51
52
33
34
35
36
37
38
39
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
MSCS
MSDI
SSCS
SSDI
SSCLK
SSDO
GPIO0_20
GPIO0_21
MSDO
GPIO0_19
GPIO0_22
MSCLK
20
21
22
23
24
25
26
27
28
29
30
31
32
SCL0
DSDRO
JTAG_TDI
JTAG_TDO
CLK88
JTAG_TCK
JTAG_TMS
JTAG_TRST
DVSS
DSDLO
SDA0
DSDBCKO
77
76
75
74
73
72
71
70
69
68
67
66
AVSS
F
PD
LD
ASY
PCO
FCO
E
SDOUT
CLVOUT
TDOUT
FDOUT
59
60
61
62
63
64
53
54
55
56
57
58
GPIO1_15
GPIO1_14
UART0_CTS
GPIO1_18
REXTI
GPIO1_16
UART0_RTS
USB_DM
DVSS
USB_DP
UART0_TXD
104
103
102
101
100
99
110
109
108
107
106
105
65
98
97
GPIO1_17
UART0_RXD
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25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Pin Description
No
Block
Pin Name
GPIO
I/O
Function
1
RESET
RESETX
I
H: Release RESET, L: RESET
2
SD
SD_WP
GPIO0[0]
I/O
SD Card I/F WP Detect
3
POWER
DVDD_HV
-
3.3V Power Supply
4
SD
SD_CON
GPIO0[1]
I/O
SD Card I/F Connection Detect
5
SD
SD_DAT1
GPIO0[2]
I/O
SD Card I/F Data I/O (1)
6
SD
SD_DAT0
GPIO0[3]
I/O
SD Card I/F Data I/O (0)
7
SD
SD_CLK
GPIO0[4]
I/O
SD Card I/F Clock Output
8
SD
SD_CMD
GPIO0[5]
I/O
SD Card I/F Command Output
9
SD
SD_DAT3
GPIO0[6]
I/O
SD Card I/F Data I/O (3)
10
SD
SD_DAT2
GPIO0[7]
I/O
SD Card I/F Data I/O (2)
11
POWER
DVDD_HV
-
3.3V Power Supply
12
POWER
DVSS
-
GND
13
GPIO
GPIO0_8
GPIO0[8]
I/O
GPIO for exclusive use
14
GPIO
GPIO0_9
GPIO0[9]
I/O
GPIO pin. When CD is used, this pin is TRAY
OPEN/CLOSE detect pin of CD mechanical tray.
15
GPIO
GPIO0_10
GPIO0[10]
I/O
GPIO for exclusive use
16
POWER
DVSS
-
GND
17
POWER
DVDD_HV
-
3.3V Power Supply
18
POWER
DVDD_LV
-
1.5V Power Supply
19
POWER
DVSS
-
GND
20
POWER
DVSS
-
GND
21
MSIO
MSCS
GPIO0[11]
I/O
SIO Master Chip Select Output
22
MSIO
MSDI
GPIO0[12]
I/O
SIO Master Data Input
23
MSIO
MSCLK
GPIO0[13]
I/O
SIO Master Clock Output
24
MSIO
MSDO
GPIO0[14]
I/O
SIO Master Data Output
25
SSIO
SSCS
GPIO0[15]
I/O
SIO Slave Chip Select Input
26
SSIO
SSDI
GPIO0[16]
I/O
SIO Slave Data Input
27
SSIO
SSCLK
GPIO0[17]
I/O
SIO Slave Clock Input
28
SSIO
SSDO
GPIO0[18]
I/O
SIO Slave Data Output
29
GPIO
GPIO0_19
GPIO0[19]
I/O
GPIO for exclusive use
30
GPIO
GPIO0_20
GPIO0[20]
I/O
GPIO for exclusive use
31
GPIO
GPIO0_21
GPIO0[21]
I/O
GPIO pin. When CD is used, this pin is INNER_SW detect
pin.
32
GPIO
GPIO0_22
GPIO0[22]
I/O
GPIO for exclusive use
33
POWER
VDD_ADC
-
3.3V ADC Power Supply
34
ADC
ADIN0
GPIO2[0]
I
AD input CH0 or GPIO
35
ADC
ADIN1
GPIO2[1]
I
AD input CH1 or GPIO
36
ADC
ADIN2
GPIO2[2]
I
AD input CH2 or GPIO
37
ADC
ADIN3
GPIO2[3]
I
AD input CH3 or GPIO
38
ADC
ADIN4
GPIO2[4]
I
AD input CH4 or GPIO
39
ADC
ADIN5
GPIO2[5]
I
AD input CH5 or GPIO
40
ADC
ADIN6
GPIO2[6]
I
AD input CH6 or GPIO
41
ADC
ADIN7
GPIO2[7]
I
AD input CH7 or GPIO
42
POWER
VSS_ADC
-
ADC GND
43
CDDSP
ANA_MONI0
GPIO2[8]
I/O
Input & Analog Monitor Output or GPIO
44
CDDSP
ANA_MONI1
GPIO2[9]
I/O
Input & Analog Monitor Output or GPIO
45
CDDSP
RFI
I
RF Output Capacitance Coupling Re-Input
46
CDDSP
EQO
O
Output RF Equalizer
47
CDDSP
AD_MONI0
GPIO2[10]
I/O
Input & Monitor Signal Output or GPIO
48
CDDSP
AD_MONI1
GPIO2[11]
I/O
Input & Monitor Signal Output or GPIO
49
POWER
AVDD
-
3.3V CD RF Power Supply
50
CDDSP
AC
I
A + C Voltage Input
51
CDDSP
BD
I
B + D Voltage Input
52
CDDSP
VBIAS
O
VBIAS Output
53
POWER
AVSS
-
CD RF GND
54
CDDSP
E
I
E Voltage Input
55
CDDSP
F
I
F Voltage Input
56
CDDSP
PD
I
APC Photo Detector Input
57
CDDSP
LD
O
APC Laser Drive Output
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25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Pin Description continued
No
Block
Pin Name
GPIO
I/O
Function
58
CDDSP
ASY
I
Asymmetric Correction
59
CDDSP
PCO
O
PLL PCO Output
60
CDDSP
FCO
O
PLL FCO-DAC Output
61
CDDSP
FDOUT
GPIO2[12]
I/O
Focus Drive Output
Use this pin as analog pin.
62
CDDSP
TDOUT
GPIO2[13]
I/O
Tracking Drive Output
Use this pin as analog pin.
63
CDDSP
SDOUT
GPIO2[14]
I/O
Sled Drive Output
Use this pin as analog pin.
64
CDDSP
CLVOUT
GPIO2[15]
I/O
CLV Drive Output
Use this pin as analog pin.
65
CDDSP
CLK88
GPIO2[16]
I/O
Clock Output for Driver IC or GPIO
66
JTAG
JTAG_TDO
O
JTAG TDO
67
JTAG
JTAG_TCK
I
JTAG TCK
68
JTAG
JTAG_TMS
I
JTAG TMS
69
JTAG
JTAG_TDI
I
JTAG TDI
70
JTAG
JTAG_TRST
I/O
JTAG TRST
71
POWER
DVSS
-
GND
72
DSD/GPIO
DSDLO
GPIO0[23]
I/O
DSD Lch Data Output or GPIO
73
DSD/GPIO
DSDRO
GPIO0[24]
I/O
DSD Rch Data Output or GPIO
74
DSD/GPIO
DSDBCKO
GPIO0[25]
I/O
DSD Bit Clock Output or GPIO
75
I2C
SCL0
GPIO0[26]
I/O
I2C Clock I/O (0), Open drain output pin
76
I2C
SDA0
GPIO0[27]
I/O
I2C Data I/O (0), Open drain output pin
77
I2S OUT
MCLKO
GPIO0[28]
I/O
Digital Audio Master Clock Output
78
POWER
DVDD_HV
-
3.3V Power Supply
79
POWER
DVDD_HV
-
3.3V Power Supply
80
POWER
DVSS
-
GND
81
I2S OUT
DATAO0
GPIO0[29]
I/O
Digital Audio Data Output (0)
82
I2S OUT
BCKO
GPIO0[30]
I/O
Digital Audio Bit Clock Output
83
I2S OUT
LRCKO
GPIO0[31]
I/O
Digital Audio Channel Clock Output
84
I2S OUT
DATAO1
GPIO1[0]
I/O
Digital Audio Data Output (1)
85
POWER
DVSS
-
GND
86
FLASH
FL_DAT2
GPIO1[1]
I/O
Serial Flash ROM IF Data I/O (2)
87
FLASH
FL_DAT1
GPIO1[2]
I/O
Serial Flash ROM I/F Data I/O (1)
88
FLASH
FL_CS
GPIO1[3]
I/O
Serial Flash ROM I/F Command Output
89
FLASH
FL_DAT3
GPIO1[4]
I/O
Serial Flash ROM I/F Data I/O (3)
90
FLASH
FL_CLK
GPIO1[5]
I/O
Serial Flash ROM I/F Clock Output
91
FLASH
FL_DAT0
GPIO1[6]
I/O
Serial Flash ROM I/F Data I/O (0)
92
POWER
DVDD_LV
-
1.5V Power Supply
93
GPIO
GPIO1_7
GPIO1[7]
I/O
GPIO for exclusive use
94
GPIO
GPIO1_8
GPIO1[8]
I/O
GPIO for exclusive use
95
GPIO
GPIO1_9
GPIO1[9]
I/O
GPIO for exclusive use
96
POWER
DVDD_HV
-
3.3V Power Supply
97
USB
USB_DM
I/O
USB D-
98
USB
USB_DP
I/O
USB D+
99
POWER
DVSS
-
GND
100
USB
REXTI
I
USB Reference Voltage Output. Connect a pull down
resistance to DVSS pin. The pull down resistance must be
12.3 ±1%.
About on PCB, do not wire as long as possible and not wire
side by side long distance with noise line, especially note
the next pin UART0_RXD(pin101).
10/24
BM94803AEKU
TSZ02201-0V2V0E600440-1-2
25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Pin Description - continued
No
Block
Pin Name
GPIO
I/O
Function
101
UART
UART0_RXD
GPIO1[10]
I/O
UART0 Receive Data
102
UART
UART0_TXD
GPIO1[11]
I/O
UART0 Transmit Data
103
UART
UART0_RTS
GPIO1[12]
I/O
UART0 Transfer Request
104
UART
UART0_CTS
GPIO1[13]
I/O
UART0 Clear Request
105
GPIO
GPIO1_14
GPIO1[14]
I/O
GPIO for exclusive use
106
GPIO
GPIO1_15
GPIO1[15]
I/O
GPIO for exclusive use
107
GPIO
GPIO1_16
GPIO1[16]
I/O
GPIO for exclusive use
108
GPIO
GPIO1_17
GPIO1[17]
I/O
GPIO for exclusive use
109
GPIO
GPIO1_18
GPIO1[18]
I/O
GPIO for exclusive use
110
I2S IN
LRCKI0
GPIO1[19]
I/O
Digital Audio Channel Clock Input (0)
111
I2S IN
BCKI0
GPIO1[20]
I/O
Digital Audio Bit Clock Input (0)
112
I2S IN
DATAI0
GPIO1[21]
I/O
Digital Audio Data Input (0)
113
I2S IN
LRCKI1
GPIO1[22]
I/O
Digital Audio Channel Clock Input (1)
114
I2S IN
BCKI1
GPIO1[23]
I/O
Digital Audio Bit Clock Input (1)
115
I2S IN
DATAI1
GPIO1[24]
I/O
Digital Audio Data Input (1)
116
UART
UART1_RTS
GPIO1[25]
I/O
UART1 Transfer Request
117
UART
UART1_CTS
GPIO1[26]
I/O
UART1 Clear Request
118
I2C
SCL1
GPIO1[27]
I/O
I2C Clock I/O (1), Open drain output pin
119
I2C
SDA1
GPIO1[28]
I/O
I2C Data I/O (1), Open drain output pin
120
RCR
RCR
GPIO1[29]
I/O
Remote Controller Signal Input
121
UART
UART1_RXD
GPIO1[30]
I/O
UART1 Receive Data
122
UART
UART1_TXD
GPIO1[31]
I/O
UART1 Transmit Data
123
POWER
DVSS
-
GND
124
CLOCK
XIN_32K
I
X'tal(32.768KHz) connection input pin.
125
CLOCK
XOUT_32K
O
X'tal(32.768KHz) connection output pin.
126
TEST
TMODE
I
Test Mode pin: This pin is connected to GND.
127
CLOCK
XIN_PLL
I
X'tal(16.9344MHz) Connection Input
128
CLOCK
XOUT_PLL
O
X'tal(16.9344MHz) Connection Output
11/24
BM94803AEKU
TSZ02201-0V2V0E600440-1-2
25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Application Circuit Diagram
Figure 3. Application Circuit Diagram
Write protect
DAT1
DAT0
CLK
CDM
DAT3
DAT2
[SD Card]
0.1µ
Connect
Device
I2C
I/F
CD
Block
Reference
Audio
Amp
Digital
Audio I/F
SIO0
SCLK
SIO3
VCC
GND
SIO2
SIO1
CS#
Serial Flash ROM
0.1µ
22 22 22 22 22 22
VDDH
LRCLK
BCLK
DATA
Digital Audio
output
10p
0
1M
32.768kHz
16.9344MHz
0.1µ 0.1µ
[Device0]
SlaveSPI
0.1μ
0.1μ
680 1.2K 2.2K 6.8K
2.7k
0.1µ
270
10p
10p
10p
[Device]
UART I/F
CTS
RTS
RX
TX
Remote Control
Receiver Module
0.1µ VDDH
VDDH VDDH VDDL
VDDH
VDDH
VDDH
0.1µ
VDDL
[Device1]
MasterSPI
DSD
DAC
DSD
Audio I/F
VBUS 1
DM 2
DP 3
GND 4
5V
0.1µ
0.1µ
VDDH
[USB]
12.3k
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
31
32
40
41
42
43
44
45
46
47
48
49
50
51
52
33
34
35
36
37
38
39
59
60
61
62
63
64
53
54
55
56
57
58
96
95
94
93
92
91
90
89
88
87
86
85
84
83
82
81
80
79
78
77
76
75
74
73
72
71
70
69
68
67
66
65
123
122
121
120
119
118
117
116
115
114
113
112
111
128
127
126
125
124
104
103
102
101
100
99
110
109
108
107
106
105
98
97
GPIO0_21
GPIO0_22
RESETX
SD_WP
DVDD_HV
SD_DAT0
SD_CLK
SD_CMD
SD_DAT3
DVDD_HV
GPIO0_9
GPIO0_10
DVDD_LV
DVSS
DVDD_HV
DVSS
DVSS
DVSS
SD_DAT1
SD_DAT2
GPIO0_8
SD_CON
MSCS
MSDI
SSCS
SSDI
SSCLK
SSDO
GPIO0_20
MSDO
GPIO0_19
MSCLK
GPIO1_8
DVDD_LV
FL_CS
DVSS
DATAO1
FL_DAT2
DVSS
DVDD_HV
DATAO0
FL_DAT1
FL_DAT3
FL_CLK
MCLKO
DVDD_HV
BCKO
FL_DAT0
LRCKO
GPIO1_9
DVDD_HV
GPIO1_7
SCL0
DSDRO
JTAG_TDI
JTAG_TDO
CLK88
JTAG_TCK
JTAG_TMS
JTAG_TRST
DVSS
DSDLO
SDA0
DSDBCKO
ANA_MONI1
ADIN0
ADIN2
ADIN3
ADIN4
ADIN5
ADIN6
ADIN7
AC
EQO
AD_MONI0
VBIAS
ADIN1
BD
RFI
VDD_ADC
AVDD
AD_MONI1
ANA_MONI0
VSS_ADC
AVSS
F
PD
LD
ASY
PCO
FCO
E
SDOUT
CLVOUT
TDOUT
FDOUT
UART0_TXD
XOUT_32K
LRCKI1
DATAI0
BCKI0
BCKI1
LRCKI0
DATAI1
XIN_32K
DVSS
UART1_RTS
XIN_PLL
RCR
TMODE
XOUT_PLL
UART1_TXD
UART1_CTS
SDA1
SCL1
UART1_RXD
GPIO1_15
GPIO1_14
UART0_CTS
GPIO1_18
REXTI
GPIO1_16
UART0_RTS
USB_DM
DVSS
USB_DP
GPIO1_17
UART0_RXD
I2C
I/F
H
L
About REXT (pin100) on PCB, do not wire
as long as possible and not wire side by
side long distance with noise line, especially
note the next terminal UART0_RXD
(pin101).
VDDH
ICE(ARM debugger)
for software debug
10k
10k
10k
10k
33
4.7M
10k
(*)
10k
(*)
10k
(*)
10k
(*)
*. The Pull-up resistor of the I2C bus is affected by a condition of
Slave IC or PCB. Please adjust the value of resistor as needed.
* Design route of Xtal, IC and capacitor to be the shortest
because the characteristic of Xtal oscillation is sensitive for
routing of PCB pattern.
X’tal using for matching with ROHM’s evaluation board
- 32.768kHz
NIHON DEMPA KOGYO CO., LTD.
Parts NameNX3215SA
- 16.9344MHz
NIHON DEMPA KOGYO CO., LTD.
Parts NameNX3225GA
12/24
BM94803AEKU
TSZ02201-0V2V0E600440-1-2
25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Absolute Maximum Ratings (Ta=25°C)
Parameter
Symbol
Rating
Unit
Remarks
Input Voltage
(Analog, I/O)
VDDHMAX
-0.3 to +4.5
V
DVDD_HV, VDD_ADC,
AVDD
Input Voltage (Core)
VDDLMAX
-0.3 to +2.1
V
DVDD_LV
Input Voltage
VIN
-0.3 to VDDH+0.3
V
Storage Temperature
Range
TSTG
-55 to +125
°C
Operating Temperature
Range
TOPR
-40 to +85
°C
Maximum Junction
Temperature
Tjmax
+125
°C
Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit
between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over
the absolute maximum ratings.
Recommended Operating Conditions (Ta=25°C)
Parameter
Symbol
Rating
Unit
Remarks
Input Voltage
(Analog, I/O)
VDDH
3.0 to 3.6
V
DVDD_HV, VDD_ADC,
AVDD
Input Voltage (Core)
VDDL
1.45 to 1.65
V
DVDD_LV
Thermal Resistance (Note 1)
Parameter
Symbol
Thermal Resistance (Typ)
Unit
1s (Note 3)
2s2p (Note 4)
HTQFP128UA
Junction to Ambient
θJA
54.9
27.6
°C/W
Junction to Top Characterization Parameter(Note 2)
ΨJT
10
9
°C/W
(Note 1) Based on JESD51-2A(Still-Air)
(Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside
surface of the component package.
(Note 3) Using a PCB board based on JESD51-3.
(Note 4) Using a PCB board based on JESD51-5, 7.
Layer Number of
Measurement Board
Material
Board Size
Single
FR-4
114.3mm x 76.2mm x 1.57mmt
Top
Copper Pattern
Thickness
Footprints and Traces
70µm
Layer Number of
Measurement Board
Material
Board Size
Thermal Via (Note 5)
Pitch
Diameter
4 Layers
FR-4
114.3mm x 76.2mm x 1.6mmt
1.20mm
Φ0.30mm
Top
2 Internal Layers
Bottom
Copper Pattern
Thickness
Copper Pattern
Thickness
Copper Pattern
Thickness
Footprints and Traces
70µm
74.2mm (Square)
35µm
74.2mm (Square)
70µm
(Note 5) This thermal via connects with the copper pattern of all layers.
Caution: As reference information of thermal design, thermal resistance of 1s and 2s2p are described. If the maximum junction temperature rating be exceeded
the rise in temperature of the chip may result in deterioration of the properties of the chip. Increase the board size and copper area to prevent exceeding the
maximum junction temperature rating. This IC is recommended more than 2s PCB.
13/24
BM94803AEKU
TSZ02201-0V2V0E600440-1-2
25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Electrical Characteristics
(Unless otherwise noted, Ta=25°C, DVDD_HV = VDD_ADC = AVDD = 3.0V, DVDD_LV = 1.5V, DVSS=VSS_ADC=AVSS
=0V, XIN_PLL= 16.9344MHz, XIN_32K =32.768kHz, REXTI pin externally fitted resistance = 12.3 kΩ±1%)
Parameter
Symbol
Rating
Unit
Conditions
Suitable Pin
MIN
TYP
MAX
<Overall>
Operating Current
Consumption (VDDH)
IDDHS1
-
115
180
mA
Using USB High-Speed
Operating Current
Consumption (VDDL)
IDD2
-
150
210
mA
In a standby mode
Consumption current
(VDDH)
ISTBH
-
1.1
-
mA
At standby mode
In a standby mode
Consumption current
(VDDL)
ISTBL
-
50
-
μA
At standby mode
<Logic Interface>
H input current
IIH
-
-
1.0
μA
(Note 1)
L input current
IIL
-1.0
-
-
μA
(Note 1)
Input HVoltage
VIH
VDDH*0.7
-
VDDH
V
(Note 1)
Input LVoltage
VIL
DVSS
-
VDDH*0.3
V
(Note 1)
Output HVoltage 1
VOH1
VDDH-0.4
-
VDDH
V
IOH=-1.6mA, (Note 2)
Output LVoltage 1
VOL1
0
-
0.4
V
IOL=1.6mA. (Note 2)
Output HVoltage 2
VOH2
VDDH-0.4
-
VDDH
V
IOH=-3.6mA, (Note 3)
Output LVoltage 2
VOL2
0
-
0.4
V
IOL=3.6mA, (Note 3) (Note 4)
Output HVoltage 3
VOH3
VDDH-1.0
-
VDDH
V
IOH=-0.6mA, (Note 5)
Output LVoltage 3
VOL3
0
-
1.0
V
IOL=0.6mA, (Note 5)
<USB Interface>
Idle Pull-Up Resistance
RPU_ID
0.9
-
1.575
(Note 7)
RX Pull-Up Resistance
RPU_RX
1.425
-
3.09
(Note 7)
Pull-Down Resistance
RPD
14.25
-
24.8
(Note 6)
HS High Voltage
VHSOH
360
-
440
mV
(Note 6)
HS RX Differential Input
Sensitivity
VHSSQ
100
-
-
mV
(Note 6)
HS RX Differential Input
Range
VHSCM
-50
-
600
mV
(Note 6)
HS Disconnect Judgment
Voltage
VHSDSC
525
-
625
mV
(Note 6)
Chirp J Voltage
VCHIRPJ
700
-
1100
mV
Measured at 45Ω Output
Termination (Note 6)
Chirp K Voltage
VCHIRPK
-900
-
-500
mV
(Note 6)
FS High Output Impedance
ZFDRH
-
45
-
Ω
(Note 6)
FS Low Output Impedance
ZFDRL
-
45
-
Ω
(Note 6)
FS High Voltage
VFOH
2.8
-
3.6
V
Measured when pin is pulled
down to VSS using 15 resistor
(Note 6)
FS Low Voltage
VFOL
0
-
0.3
V
Measured when pin is pulled up
to DVDD_HV using 1.5
resistor (Note 6)
FS RX Differential Input
Sensitivity
VFLSNS
-
-
200
mV
(Note 6)
FS RX Differential Input
Range
VFLCM
0.8
-
2.5
V
(Note 6)
H input voltage
VIHUSB
2
-
VDDH
V
(Note 6)
L input voltage
VILUSB
DVSS
-
0.8
V
(Note 6)
<ADC>
A/D Conversion Frequency
FADCONV
-
-
705.6
kHz
FADCONV16.9344MHz/24
Analog Input Voltage Range
VAIN
0.1*VDDH
-
0.9*VDDH
V
Differential Non-Linearity
DNL
-
-
±5
LSB
Integral Non-Linearity
INL
-
-
±5
LSB
(Note 1) Input pin 1,2,4-10,13-15,21-32,34-41,43-44,47-48,65,67-70,72-77,81-84,86-91,93-95,101-122 pin
(Note 2) Output pin1 13-15,29-32,34-41,43,44,47,48,61-66,77,81-84,93-95,101-117,120-122 pin
(Note 3) Output pin2 2,4-10,21-28,72-74,86-91 pin
(Note 4) Output pin3 75,76,118,119 pin
(Note 5) Output pin4 125,128 pin
(Note 6) USB pin 97,98 pin
(Note 7) USB pin 98 pin
14/24
BM94803AEKU
TSZ02201-0V2V0E600440-1-2
25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Electrical Characteristics continued
(Unless otherwise noted, Ta=25°C, DVDD_HV = VDD_ADC = AVDD = 3.0V, DVDD_LV = 1.55V, DVSS= VSS_ADC= AVSS=
0V, XIN_PLL= 16.9344MHz, XIN_32K =32.768kHz, RL=10kΩ, VBIAS=Reference)
Parameter
Symbol
Rating
Unit
Conditions
Suitable Pin
MIN
TYP
MAX
<PLL (VCO) Block>
Maximum Oscillation
Frequency
fVCOH
4.6
6.5
-
MHz
GPIO1_7,1/4 of VCO Output
Minimum Oscillation
Frequency
fVCOL
-
1.1
1.7
MHz
GPIO1_7,1/4 of VCO Output
<FC DAC>
Offset Voltage
VFCOF
-50
-
+50
mV
FCO
Maximum Output
Voltage
VFCH
0.2
0.5
-
V
FCO
Minimum Output
Voltage
VFCL
-
-0.5
-0.2
V
FCO
<PCO.>
Output LVoltage
VPCH
-
-1.0
-0.6
V
PCO
Output HVoltage
VPCL
0.6
1.0
-
V
PCO
< EFM Comparator >
Threshold Voltage
VEFM
-200
-
200
mV
RFI,ANA_MONI0,GPIO1_8
<Servo ADC>
Offset Voltage
VADOF
-140
-
+140
mV
ANA_MONI0,ANA_MONI1
Maximum Conversion
Voltage
VADH
1.0
1.2
1.4
V
ANA_MONI0,ANA_MONI1
Minimum Conversion
Voltage
VADL
-1.4
-1.2
-1.0
V
ANA_MONI0,ANA_MONI1
<Servo DAC>
Offset Voltage
VDAOF
-80
-
+80
mV
FDOUT,TDOUT,SDOUT,CLVOUT
Maximum Output
Voltage
VDAH
0.8
1.2
-
V
FDOUT,TDOUT,SDOUT,CLVOUT
Minimum Output
Voltage
VDAL
-
-1.2
-0.8
V
FDOUT,TDOUT,SDOUT,CLVOUT
<Bias Amplifier>
Maximum Output
Current
IBO
-
±1.5
-
mA
VBIAS, BIAS Fluctuation: 200mV or less
<RF Amplifier>
Offset Voltage
VRFOF
-
0
-
mV
AC,BD,EQO
Maximum Output
Voltage
VRFH
1.0
1.2
-
V
AC,BD,EQO
Minimum Output
Voltage
VRFL
-
-1.3
-1.1
V
AC,BD,EQO
<FE Amplifier>
Offset Voltage
VFEOF
-
0
-
mV
AC,BD,ANA_MONI0,ANA_MONI1
Maximum Output
Voltage
VFEH
1.0
1.4
-
V
AC,BD,ANA_MONI0,ANA_MONI1
Minimum Output
Voltage
VFEL
-
-1.4
-1.0
V
AC,BD,ANA_MONI0,ANA_MONI1
<TE Amplifier>
Offset Voltage
VTEOF
-
70
-
mV
E,F,ANA_MONI0,ANA_MONI1
Maximum Output
Voltage
VTEH
1.0
1.4
-
V
E,F,ANA_MONI0,ANA_MONI1
Minimum Output
Voltage
VTEL
-
-1.4
-1.0
V
E,F,ANA_MONI0,ANA_MONI1
<Asymmetry Amplifier>
Offset Voltage
VASYOF
-
0
-
mV
ASY=VBIAS,RFI,ANA_MONI0
Maximum Output
Voltage
VASYH
1.1
1.4
-
V
ASY,RFI,ANA_MONI0
Minimum Output
Voltage
VASYL
-
-1.4
-1.1
V
ASY,RFI,ANA_MONI0
<APC Block>
Output Voltage 1
VAPC1
2.4
2.8
-
V
PD=”H”,
LD,ANA_MONI0
Output Voltage 2
VAPC2
-
0.1
0.5
V
PD=”L”,
LD,ANA_MONI0
Maximum Reference
Voltage
VAPCH
-
220
-
mV
PD,LD,ANA_MONI0
Minimum Reference
VAPCL
-
145
-
mV
PD,LD,ANA_MONI0
15/24
BM94803AEKU
TSZ02201-0V2V0E600440-1-2
25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Application Information
Power on/ Reset Timing/ Power off
Release the Reset Signal by L input with over 100μs after clock input from I/O pins of 16.9344MHz becomes stable.
(See Figure 4)
Figure 4. Power on/ Reset Timing
Figure 5. Power off
Parameter
Symbol
Rating
Unit
Remarks
MIN
TYP
MAX
Time lag of Power Supply
at Starting
tVDDon
0
-
-
ms
Reset L Interval
tRSTX
100
-
-
μs
Time lag of Power Supply
at Shutting down.
tVDDoff
0
-
-
ms
Note) There is a risk that the electric current flows in case the order of power supply starting and shutting down is other than the above order.
Oscillation Stable Time
Suggested value for XIN_PLL(16.9344MHz) oscillation stable time is 4ms.
Suggested value for XIN_32K(32.768kHz) oscillation stable time is 500ms.
The above-mentioned oscillation stable time cannot be guaranteed since the oscillation stable time depends on crystal
oscillator, external constant, or board layout. Check the oscillation stable time of your own system.
Waiting for Oscillation Stabilization
tRSTX
DVDD_HV
VDD_ADC
AVDD
RESETX
XIN_PLL
DVDD_LV
tVDDon
XIN_32K
DVDD_HV
VDD_ADC
AVDD
XIN_PLL
DVDD_LV
tVDDoff
16/24
BM94803AEKU
TSZ02201-0V2V0E600440-1-2
25.Jan.2017 Rev.002
© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
I/O Equivalence Circuits
Figure 6. I/O equivalence circuits 1
No. Name I/O Power Internal Circuits No. Name I/O Power Internal Circuits
1 RESETX I 2 SD_WP I DVDD_HV
DVDD_HV 4 SD_CON I
5 SD_DAT1 I/O
6 SD_DAT0 I/O
7 SD_CLK O
8 SD_CMD O
9 SD_DAT3 I/O
10 SD_DAT2 I/O
34 ADIN0 I 13 GPIO0_8 I/O
35 ADIN1 I VDD_ADC 14 GPIO0_9 I/O
36 ADIN2 I 15 GPIO0_10 I/O
37 ADIN3 I 21 MSCS O
38 ADIN4 I 22 MSDI I
39 ADIN5 I 23 MSCLK O
40 ADIN6 I 24 MSDO O
41 ADIN7 I 25 SSCS I
43 ANA_MONI0 O 26 SSDI I
44 ANA_MONI1 O AVDD 27 SSCLK I
47 AD_MONI0 O 28 SSDO O
48 AD_MONI1 O 29 GPIO0_19 I/O
61 FDOUT O 30 GPIO0_20 I/O
62 TDOUT O 31 GPIO0_21 I/O
63 SDOUT O 32 GPIO0_22 I/O
64 CLVOUT O 65 CLK88 O
72 DSDLO I/O
45 RFI I 73 DSDRO I/O
AVDD 74 DSDBCKO I/O
77 MCLKO O
81 DATAO0 O
82 BCKO O
83 LRCKO O
84 DATAO1 O
46 EQO O 93 GPIO1_7 I/O
AVDD 94 GPIO1_8 I/O
95 GPIO1_9 I/O
101 UART0_RXD I
102 UART0_TXD O
103 UART0_RTS O
104 UART0_CTS I
105 GPIO1_14 I/O
106 GPIO1_15 I/O
50 AC I107 GPIO1_16 I/O
51 BD I AVDD 108 GPIO1_17 I/O
109 GPIO1_18 I/O
110 LRCKI0 I
111 BCKI0 I
112 DATAI0 I
113 LRCKI1 I
54 E I 114 BCKI1 I
55 F I AVDD 115 DATAI1 I
116 UART1_RTS I/O
117 UART1_CTS I/O
120 RCR I
121 UART1_RXD I
122 UART1_TXD O
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www.rohm.com
TSZ2211115001
I/O Equivalence Circuits continued
Figure 7. I/O equivalence circuits 2
No. Name I/O Power Internal Circuits No. Name I/O Power Internal Circuits
56 PD I75 SCL0 I/O
57 LD O AVDD 76 SDA0 I/O DVDD_HV
118 SCL1 I/O
119 SDA1 I/O
86 FL_DAT2 I/O DVDD_HV
58 ASY I 87 FL_DAT1 I/O
AVDD 88 FL_CS O
89 FL_DAT3 I/O
90 FL_CLK O
91 FL_DAT0 I/O
97 USB_DM I/O
98 USB_DP I/O DVDD_HV
52 VBIAS O
AVDD
59 PCO O 100 REXTI I
60 FCO O AVDD DVDD_HV
124 XIN_32K I
125 XOUT_32K O DVDD_HV
66 JTAG_TDO O
DVDD_HV
127 XIN_PLL I
128 XOUT_PLL O DVDD_HV
67 JTAG_TCK I
68 JTAG_TMS I DVDD_HV
69 JTAG_TDI I
70 JTAG_TRST I
126 TMODE I
PCO
FCO
PD
LD
XIN_32K XOUT_32K
USB_DM
USB_DP
XIN_PLL XOUT_PLL
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TSZ2211115001
Operational Notes1
1. About Compatibility in USB Memory Device and SD Memory Card
According to the file structure and communication speed of USB memory, SD memory card, this LSI might not play
back correctly.
2. About Compatibility in Bluetooth device
According to the type of Bluetooth device, , this LSI might not play back correctly.
3. About 2X Speed Recording
Recording to a memory with slow access speed may require data connection operation.
2X speed recording to all the memories cannot be guaranteed.
4. Power OFF or Memory Disconnection Under Memory Writing
The sudden power off or memory disconnection during recording or file write operation to a memory may break the data
in a memory.
5. Browsing Operation
With a memory with slow access speed, browsing operation during music playing may generate skipping.
6. CD-ROM Playing
CD-ROM playing operation is premised on data being inputted so that an internal data buffer may not become empty.
When an input does not meet the deadline and internal data buffers become empty, skipping occurs.
7. Playing Time of MP3 File
The playing time when MP3 file playing may shift when fast forward playing, rewind playing, and VBR playing.
8. Write-In Operation Exceeding Memory Size
Writing to a file when memory size is exceeded is not supported.
9. Write-In Operation of the File Size Exceeding FAT Specification
Writing to a file when file size is exceeded is not supported.
10. About I2C Format I/F
Although this LSI has adopted the I2C format, the level shifter circuit is not built in.
For this reason, level shifter is needed for connection with the device besides the range of operating power supply
voltage of this LSI.
11. CD Media Playing
According to the condition of CD media, flawed, dirty, curved, eccentric and etc., this LSI might not play back normally.
12. Application Block Diagram
Each software function of Audio Encoder, Audio Decoder, BT stack A2DP, SBC Decoder and File System(FTA12/16/32,
ISO9660) described in Figure 1. Application Block are realized by downloading applicable program from external Serial
Flash ROM.
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www.rohm.com
TSZ2211115001
Operational Notes2
1. Reverse Connection of Power Supply
Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when
connecting the power supply, such as mounting an external diode between the power supply and the ICs power
supply pins.
2. Power Supply Lines
Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the
digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog
block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and
aging on the capacitance value when using electrolytic capacitors.
3. Ground Voltage
Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition.
4. Ground Wiring Pattern
When using both small-signal and large-current ground traces, the two ground traces should be routed separately but
connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal
ground caused by large currents. Also ensure that the ground traces of external components do not cause variations
on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance.
5. Thermal Consideration
Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may
result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the
board size and copper area to prevent exceeding the maximum junction temperature rating.
6. Recommended Operating Conditions
These conditions represent a range within which the expected characteristics of the IC can be approximately obtained.
The electrical characteristics are guaranteed under the conditions of each parameter.
7. Inrush Current
When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow
instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power
supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and
routing of connections.
8. Operation Under Strong Electromagnetic Field
Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction.
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TSZ2211115001
Operational Notes2 continued
9. Testing on Application Boards
When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may
subject the IC to stress. Always discharge capacitors completely after each process or step. The ICs power supply
should always be turned off completely before connecting or removing it from the test setup during the inspection
process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during
transport and storage.
10. Inter-pin Short and Mounting Errors
Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in
damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin.
Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and
unintentional solder bridge deposited in between pins during assembly to name a few.
11. Unused Input Pins
Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and
extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small
charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and
cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the
power supply or ground line.
12. Regarding the Input Pin of the IC
In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation
of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage.
Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin
lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power
supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have
voltages within the values specified in the electrical characteristics of this IC.
13. Ceramic Capacitor
When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with
temperature and the decrease in nominal capacitance due to DC bias and others.
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www.rohm.com
TSZ2211115001
Ordering Information
B
M
9
4
8
0
3
A
E
K
U
-
Z
Part Number
Package
HTQFP128UA,supply with tray
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TSZ2211115001
Marking Diagram
HTQFP128UA (TOP VIEW)
94803A
Part Number Marking
LOT Number
1PIN MARK
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TSZ2211115001
Physical Dimension, Tape and Reel Information
Package Name
HTQFP128UA
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© 2016 ROHM Co., Ltd. All rights reserved.
www.rohm.com
TSZ2211115001
Revision History
Date
Revision
Changes
30.Aug.2016
001
New Release
25.Jan.2017
002
P10: Modified Block name of 118/119pin to I2C.
P11: Modified pin name of Serial Flash ROM from SCLK to SIO3.
P14: Modified pin name FLAG1 to GPIO1_7, FLAG2 to GPIO1_8, VC to VBIAS, and
removed ASY_TEST, APCREF in Electrical Characteristics.
P18: Added Note about Application Block diagram.
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Notice
Precaution on using ROHM Products
1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment,
OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you
intend to use our Products in devices requiring extremely high reliability (such as medical equipment (Note 1), transport
equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car
accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or
serious damage to property (Specific Applications), please consult with the ROHM sales representative in advance.
Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any
damages, expenses or losses incurred by you or third parties arising from the use of any ROHMs Products for Specific
Applications.
(Note1) Medical Equipment Classification of the Specific Applications
JAPAN
USA
EU
CHINA
CLASS
CLASS
CLASSb
CLASS
CLASS
CLASS
2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor
products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate
safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which
a failure or malfunction of our Products may cause. The following are examples of safety measures:
[a] Installation of protection circuits or other protective devices to improve system safety
[b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure
3. Our Products are designed and manufactured for use under standard conditions and not under any special or
extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way
responsible or liable for any damages, expenses or losses arising from the use of any ROHM’s Products under any
special or extraordinary environments or conditions. If you intend to use our Products under any special or
extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of
product performance, reliability, etc, prior to use, must be necessary:
[a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents
[b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust
[c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2,
H2S, NH3, SO2, and NO2
[d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves
[e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items
[f] Sealing or coating our Products with resin or other coating materials
[g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of
flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning
residue after soldering
[h] Use of the Products in places subject to dew condensation
4. The Products are not subject to radiation-proof design.
5. Please verify and confirm characteristics of the final or mounted products in using the Products.
6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied,
confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power
exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect
product performance and reliability.
7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in
the range that does not exceed the maximum junction temperature.
8. Confirm that operation temperature is within the specified range described in the product specification.
9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in
this document.
Precaution for Mounting / Circuit board design
1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product
performance and reliability.
2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must
be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products,
please consult with the ROHM representative in advance.
For details, please refer to ROHM Mounting specification
Notice-PGA-E Rev.003
© 2015 ROHM Co., Ltd. All rights reserved.
Precautions Regarding Application Examples and External Circuits
1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the
characteristics of the Products and external components, including transient characteristics, as well as static
characteristics.
2. You agree that application notes, reference designs, and associated data and information contained in this document
are presented only as guidance for Products use. Therefore, in case you use such information, you are solely
responsible for it and you must exercise your own independent verification and judgment in the use of such information
contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses
incurred by you or third parties arising from the use of such information.
Precaution for Electrostatic
This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper
caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be
applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron,
isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control).
Precaution for Storage / Transportation
1. Product performance and soldered connections may deteriorate if the Products are stored in the places where:
[a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2
[b] the temperature or humidity exceeds those recommended by ROHM
[c] the Products are exposed to direct sunshine or condensation
[d] the Products are exposed to high Electrostatic
2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period
may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is
exceeding the recommended storage time period.
3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads
may occur due to excessive stress applied when dropping of a carton.
4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of
which storage time is exceeding the recommended storage time period.
Precaution for Product Label
A two-dimensional barcode printed on ROHM Products label is for ROHMs internal use only.
Precaution for Disposition
When disposing Products please dispose them properly using an authorized industry waste company.
Precaution for Foreign Exchange and Foreign Trade act
Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign
trade act, please consult with ROHM in case of export.
Precaution Regarding Intellectual Property Rights
1. All information and data including but not limited to application example contained in this document is for reference
only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any
other rights of any third party regarding such information or data.
2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the
Products with other articles such as components, circuits, systems or external equipment (including software).
3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any
third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM
will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to
manufacture or sell products containing the Products, subject to the terms and conditions herein.
Other Precaution
1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM.
2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written
consent of ROHM.
3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the
Products or this document for any military purposes, including but not limited to, the development of mass-destruction
weapons.
4. The proper names of companies or products described in this document are trademarks or registered trademarks of
ROHM, its affiliated companies or third parties.
DatasheetDatasheet
Notice – WE Rev.001
© 2015 ROHM Co., Ltd. All rights reserved.
General Precaution
1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents.
ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny
ROHM’s Products against warning, caution or note contained in this document.
2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior
notice. Before purchasing or using ROHM’s Products, please confirm the la test information with a ROHM sale s
representative.
3. The information contained in this doc ument is provi ded on an “as is” basis and ROHM does not warrant that all
information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or
liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or
concerning such information.
Datasheet
Part Number bm94803aeku
Package HTQFP128UA
Unit Quantity 900
Minimum Package Quantity 900
Packing Type Tray
Constitution Materials List inquiry
RoHS Yes
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