Datasheet Audio 1-Chip SOC BM94803AEKU General Description Package BM94803AEKU is 1-Chip SOC for multimedia audio systems, which supports the USB memory, SD memory card, and CD. This IC has a built-in ARM946ES processor, SDRAM, and various peripherals. It is designated to download programs from external Serial Flash ROM and execute system control, file system management, Audio CODEC, and a wide range of media control. BM94803AEKU supports USB High-Speed and has built-in DSD Native reproduction function. Key Features HTQFP128UA 16.00mm 16.00mm 1.20mm 0.4 mm pitch (With Thermal PAD) Application Component Stereo Application Block DSDBCKO,DSDLO,DSDRO Audio SoC HCI controller (UART) USB Memory PC / iPod USB Host /Device controller SD Memory SDIO Host controller Amp with DAC BT stack A2DP SBC Decoder DSD Output I/F Audio Decoder I2S Output I/F CD Driver MIC /TUNER /AUX ADC Serial Flash ROM CD Servo DSP Shock Proof I2S Input I/F x2 Quad SPI I/F D-class Amp PWM Amp DSP & PWM Processor SEL SEL USB-DAC Audio Class CD pickup Audio DAC DSD input SEL BT HCI module D-class Amp File System FAT12/16/32 CD-ROM Decoder & File System ISO9660 MP3/WMA /AAC /WAV /FLAC/ALAC /DSD LRCK,BCK,SDATA Audio Encoder MP3/WAV MIXER This IC includes the following blocks: Processor ARM946ES Microprocessor Core Memory SDRAM Initial Program ROM Program SRAM Data SRAM SDRAM Controller System Multilayer AHB Interrupt Controller DMA Controller Serial, Media I/F GPIO Pin Controller USB2.0 Dual Role(Host/Device) Controller SD I/F Quad SPI I/F SPI I/F (Master/Slave) I2C I/F (Master/Slave) UART I/F I2S Input I/F I2S Output I/F CD Servo Controllers CD-ROM Decoder General Purpose A/D Converter Timer Timer Watchdog Timer Real Time Clock Other Clock Generator Reset Generator PLL Decode Path Encode Path Through Path Control Path System Controller KEY Control Display Control Peripheral Control 3.3V / 1.5V ADC GPIO Serial I/F SPI/I2C/UART 16.9344MHz / 32.768KHz KEY /Remote Control LCD Controller Peripheral modules Figure 1. Application Block Lineup Type BM94803AEKU Package HTQFP128UA Orderable Type Tray BM94803AEKU-Z Product structure : Silicon monolithic integrated circuit This product has no designed protection against radioactive rays www.rohm.com TSZ02201-0V2V0E600440-1-2 (c) 2016 ROHM Co., Ltd. All rights reserved. 1/24 25.Jan.2017 Rev.002 TSZ2211114001 BM94803AEKU Feature BM94801KUT BM94803AEKU TQFP128UM HTQFP128UA ARM946ES 96MHz 108MHz ICache/Dcache 4kB/4kB 4kB/4kB Package Processor Memory System Peripheral I/F SDRAM 16Mbit 16Mbit Initial Program ROM 2kByte 2kByte Program SRAM 64kByte 64kByte Data SRAM 64kByte 64kByte Multilayer AHB support support Interrupt Controller support support DMA Controller 2ch 1ch GPIO support support Pin Controller support support USB2.0 Controller HS 1port HS 1port SD I/F 1ch 1ch Quad SPI I/F 1ch 1ch SPI I/F (Master) 1ch 1ch SPI I/F (Slave) 1ch 1ch I2C I/F (Master/Slave) 2ch 2ch UART I/F 2ch 2ch 2ch 2series 2ch 2series I2S:stereo + mono I2S:stereo I2S Input I/F I2S Output I/F 192kHz/24bit 192kHz/24bit DSD : 5.6448MHz CD Servo Controllers support support CD-ROM Decoder support support RemoteControll support support 1.5V x 8ch 3.3V x 8ch General purpose A/D Converter Timer Entertainment Accelerator Clock Timer 5ch 5ch Watchdog Timer 1ch 1ch Real Time Clock 1ch 1ch DSP - - PWM out - - FLAC/ALAC - - Clock Generator support support Reset Generator support support Note: specification in the Datasheet is correct for the specifications of BM94801KUT. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 2/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Feature - continued ARM946ES Microprocessor Core 32Bit RISC Processor Operating Frequency: 108MHz 8kByte Cache Data Cache 4kByte Instruction Cache 4kByte SDRAM 16Mbit SDRAM with built-in MSM56V16160N from LAPIS Semiconductor 2Bank x 524,288-word x 16Bit Initial Program ROM ITCM ROM Size: 2kByte (512Word x 32Bit) boot program No-wait access REMAP Remapping can be implemented by writing to internal registers. SHADOW SRAM RAM Size: 512Byte (128-Word x 32-Bit) No-wait access Program SRAM ITCM RAM Size: 64kByte (16,384-Word x 32-Bit) No-wait access Data SRAM DTCM RAM Size: 64kByte (16,384-Word x 32-Bit) No-wait access SDRAM Controller Supports SDRAM Supports 11Bit row address, 8-bit column address, and 1-bit bank address to SDRAM AMBA 32Bit Data Bus Arbitrates ARM and DMA access with an arbiter Interrupt Controller 23 IRQ Interrupt Lines 1 FIQ Interrupt Line Allows programmable setting of interrupt priority levels Allows setting of 16 vector addresses DMA Controller Supports 1 Channel Channel FIFO Depth Up to 16 Bytes Allows programmable setting of transfer data width in the range of 1Byte to 4Bytes Allows programmable setting of channel priority levels Maximum Block Length Up to 4,095 Words Includes 12 handshake interfaces available for assignment to channels with software Supports multiblock transfers Connects the master board to system bus GPIO GPIO0(32 pins), GPIO1(32 pins), GPIO2(13pins) 4 of 17 pins assigned GPIO2 are not available because of analog pin. (See P9 Pin Description) Supports a maximum of 77 I/O pins (including 13 GPIO pins for exclusive use) Supports the interrupt function Supports external level-sensitive interrupt www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 3/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Feature - continued Pin Controller Controls connection settings between pins and blocks USB2.0 Dual Role (Host/Device) controller USB 2.0 conformance Bit rate: High-Speed (480Mbps)/Full-Speed (12Mbps) Configurable for up to five transmit endpoint FIFOs and four receive endpoint FIFOs (including endpoint 0) Each endpoint FIFO supports bulk transfer, interrupt transfer, and isochronous transfer. 4096-Byte RAM for Endpoint FIFO SD I/F Supports SDHC, and SD cards Provide access to SD card in SD Bus mode Allows control from the AMBA-AHB Bus Includes 512 Byte data transmit/receive FIFOs Quad SPI I/F Supports quad serial flash ROM Supports serial flash ROM address up to 24 bits Allows the setting of control registers from the AMBA-AHB bus Allows direct access from the memory map of the AMBA-AHB bus to serial flash ROM Includes 32 byte transmit/receive FIFOs SSI Master FIFO Depth Up to 16 Words and FIFO Data Width Up to 16Bits Selectable Data Size from 4 Bits to 16 Bits Serial protocol supports SPI from Motorola Includes DMA handshake interface SSI Slave FIFO Depth Up to 16 Words and FIFO Data Width Up to 16 Bits Selectable Data Size from 4 Bits to 16 Bits Serial protocol supports SPI from Motorola Includes DMA handshake interface I2C I/F (Master/Slave) 2 Ch I2C Serial Interface Supports two speed modes Standard mode (100Kb/s) Fast mode (400Kb/s) Supports I2C Master and Slave operation Allows 7 and 10 bit address generation Has built-in 32 stage transmit and receive FIFOs Includes DMA handshake interface UART I/F IS16550-Based Allows various baud rate settings with software (up to 6Mbps) No Support for IrDA FIFO Depth Up to 32 Words and FIFO Data Width Up to 8 Bits Incorporates a function to invert output Includes DMA handshake interface www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 4/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Feature - continued I2S Input I/F Two Lines of 2-Ch Digital Audio Input I2S, EIAJ format 16-Bit Data Selectable Bit Clock from 32fs, 48fs, and 64fs Selectable Input Sample Rate from 32kHz, 44.1kHz, and 48kHz One Line of Internal Input from the CD Servo Controller Maximum Input Rate Up to 4x Supports detection of CD-DA link Supports detection of CD-ROM sync Supports CD-ROM data descrambling Acquires Sub-Q data Acquires CD-Text data Built-in DMA 2ch Supports I2S Input at CD Play I2S Output I/F 2-Ch Digital Audio Output x 1 ( 2ch from Decoder) I2S, EIAJ format Selectable PCM Output Sample Rate from 32k, 44.1k, 48k, 88.2k, 96k,176.4k,192kHz Selectable PCM Data Width from 16 and 24 bits 64 fs PCM Bit Clock Supports pitch control (x0.5 - x2.0, 25step) Selectable DSD Output Sample Rate from DSD 2.8224MHz, 5.6448MHz CD servo controller Supports rotation speed of CD up to 4x Built-in Preservo-Amplifier with Power Save Mode, which supports Playback of CD-RW Allows independent offset adjustment of AC, BD, E, and F amplifiers Built-in Auto-Tracking and Focus Adjustment Function Built-in PLL and CLV with a Wide Lock Range Built-in Asymmetry Correction Function CD-ROM Decoder Supports Mode1, Mode2 form1, Mode2 form2 Supports ECC, EDC Built-in DMA General Purpose A/D Converter 10-Bit SAR ADC, 8 Ch ADC Analog Input Voltage range: VDD_ADC x10% to VDD_ADC x 90% Maximum A/D Conversion frequency Ch=88.2ksps Timer Supports five independent programmable timer functions Each timer supports time width up to 32 bits Each timer supports independent interrupt signal Watchdog Timer Composed of a counter having a set cycle to monitor the occurrence of timeout event Counter Width Up to 32 Bits The counter counts down from the set value and sets timeout occurrence when it reaches zero Realtime clock 32 Bit Programmable Timer Supports interrupt signals External 32.768 kHz Crystal Oscillator www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 5/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Feature - continued Remote Controller Receiver (RCR) Converts infrared remote control signal to code Compatible with the signal format of the Association for Electric Home Appliances Supports Sony format Enables to setup permissible value of input signal cycle to adjust the Duty deviation of input signal Clock Generator Supplies clocks to individual internal blocks Allows on/off control of clocks to individual blocks Generates master audio clocks At the normal operation, supports three modes (High-Speed mode, Middle Speed mode, Low-Speed mode) Supports Standby Mode Reset Generator Generates a pulse to be supplied to individual blocks PLL Generates 216MHz / 240MHz clock used to generate system clocks Generates 135.4752 MHz and 147.456 MHz clocks used to generate audio clocks Power Supply Voltage I/O Power Supply Voltage : 3.3V(3.0V to 3.6V) Analog Power Supply Voltage: 3.3V(3.0V to 3.6V) (Used for SDRAM, CD servo, USB, and ADC) Digital Core Power Supply Voltage : 1.5V(1.45V to 1.65V) (Used for Digital Core) www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 6/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU GPIO1_9 GPIO1_8 GPIO1_7 DVDD_LV FL_DAT0 FL_CLK FL_DAT3 FL_CS FL_DAT1 FL_DAT2 DVSS DATAO1 LRCKO BCKO DATAO0 DVSS DVDD_HV DVDD_HV MCLKO SDA0 SCL0 DSDBCKO DSDRO DSDLO DVSS JTAG_TRST JTAG_TDI JTAG_TMS JTAG_TCK JTAG_TDO 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81 80 79 78 77 76 75 74 73 72 71 70 69 68 67 66 65 CLK88 DVDD_HV 96 Pin Assignment 119 42 VSS_ADC RCR 120 41 ADIN7 UART1_RXD 121 40 ADIN6 UART1_TXD 122 39 ADIN5 DVSS 123 38 ADIN4 XIN_32K 124 37 ADIN3 XOUT_32K 125 36 ADIN2 TMODE 126 35 ADIN1 XIN_PLL 127 34 ADIN0 XOUT_PLL 128 33 VDD_ADC 32 ANA_MONI0 SDA1 GPIO0_22 43 31 118 GPIO0_21 ANA_MONI1 SCL1 30 44 GPIO0_20 117 29 RFI UART1_CTS GPIO0_19 45 28 116 SSDO EQO UART1_RTS 27 46 SSCLK 115 26 AD_MONI0 DATAI1 SSDI AD_MONI1 47 25 48 114 SSCS 113 BCKI1 24 LRCKI1 MSDO AVDD 23 49 MSCLK 112 22 AC DATAI0 MSDI 50 21 111 MSCS BD BCKI0 20 51 DVSS 110 19 VBIAS LRCKI0 DVSS 52 18 109 DVDD_LV AVSS GPIO1_18 17 53 DVDD_HV 108 16 E GPIO1_17 DVSS 54 15 107 GPIO0_10 F GPIO1_16 14 55 GPIO0_9 106 13 PD GPIO1_15 GPIO0_8 56 12 105 DVSS LD GPIO1_14 11 57 DVDD_HV 104 10 ASY UART0_CTS SD_DAT2 58 9 103 SD_DAT3 PCO UART0_RTS 8 59 SD_CMD 102 7 FCO UART0_TXD SD_CLK 60 6 101 SD_DAT0 FDOUT UART0_RXD 5 61 SD_DAT1 100 4 TDOUT REXTI SD_CON 62 3 99 DVDD_HV SDOUT DVSS 2 CLVOUT 63 1 64 98 SD_WP 97 USB_DP RESETX USB_DM Figure 2. Pin Assignment www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 7/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Pin Description No 1 2 3 4 5 6 7 8 9 10 11 12 13 Block RESET SD POWER SD SD SD SD SD SD SD POWER POWER GPIO Pin Name RESETX SD_WP DVDD_HV SD_CON SD_DAT1 SD_DAT0 SD_CLK SD_CMD SD_DAT3 SD_DAT2 DVDD_HV DVSS GPIO0_8 14 GPIO 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 GPIO0[8] I/O I I/O I/O I/O I/O I/O I/O I/O I/O I/O GPIO0_9 GPIO0[9] I/O GPIO POWER POWER POWER POWER POWER MSIO MSIO MSIO MSIO SSIO SSIO SSIO SSIO GPIO GPIO GPIO0_10 DVSS DVDD_HV DVDD_LV DVSS DVSS MSCS MSDI MSCLK MSDO SSCS SSDI SSCLK SSDO GPIO0_19 GPIO0_20 GPIO0[10] GPIO0[11] GPIO0[12] GPIO0[13] GPIO0[14] GPIO0[15] GPIO0[16] GPIO0[17] GPIO0[18] GPIO0[19] GPIO0[20] I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O 31 GPIO GPIO0_21 GPIO0[21] I/O 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 GPIO POWER ADC ADC ADC ADC ADC ADC ADC ADC POWER CDDSP CDDSP CDDSP CDDSP CDDSP CDDSP POWER CDDSP CDDSP CDDSP POWER CDDSP CDDSP CDDSP CDDSP GPIO0_22 VDD_ADC ADIN0 ADIN1 ADIN2 ADIN3 ADIN4 ADIN5 ADIN6 ADIN7 VSS_ADC ANA_MONI0 ANA_MONI1 RFI EQO AD_MONI0 AD_MONI1 AVDD AC BD VBIAS AVSS E F PD LD GPIO0[22] I/O I I I I I I I I I/O I/O I O I/O I/O I I O I I I O www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 GPIO GPIO0[0] GPIO0[1] GPIO0[2] GPIO0[3] GPIO0[4] GPIO0[5] GPIO0[6] GPIO0[7] GPIO2[0] GPIO2[1] GPIO2[2] GPIO2[3] GPIO2[4] GPIO2[5] GPIO2[6] GPIO2[7] GPIO2[8] GPIO2[9] GPIO2[10] GPIO2[11] 8/24 Function H: Release RESET, L: RESET SD Card I/F WP Detect 3.3V Power Supply SD Card I/F Connection Detect SD Card I/F Data I/O (1) SD Card I/F Data I/O (0) SD Card I/F Clock Output SD Card I/F Command Output SD Card I/F Data I/O (3) SD Card I/F Data I/O (2) 3.3V Power Supply GND GPIO for exclusive use GPIO pin. When CD is used, this pin is TRAY OPEN/CLOSE detect pin of CD mechanical tray. GPIO for exclusive use GND 3.3V Power Supply 1.5V Power Supply GND GND SIO Master Chip Select Output SIO Master Data Input SIO Master Clock Output SIO Master Data Output SIO Slave Chip Select Input SIO Slave Data Input SIO Slave Clock Input SIO Slave Data Output GPIO for exclusive use GPIO for exclusive use GPIO pin. When CD is used, this pin is INNER_SW detect pin. GPIO for exclusive use 3.3V ADC Power Supply AD input CH0 or GPIO AD input CH1 or GPIO AD input CH2 or GPIO AD input CH3 or GPIO AD input CH4 or GPIO AD input CH5 or GPIO AD input CH6 or GPIO AD input CH7 or GPIO ADC GND Input & Analog Monitor Output or GPIO Input & Analog Monitor Output or GPIO RF Output Capacitance Coupling Re-Input Output RF Equalizer Input & Monitor Signal Output or GPIO Input & Monitor Signal Output or GPIO 3.3V CD RF Power Supply A + C Voltage Input B + D Voltage Input VBIAS Output CD RF GND E Voltage Input F Voltage Input APC Photo Detector Input APC Laser Drive Output TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Pin Description - continued No 58 59 60 Block CDDSP CDDSP CDDSP Pin Name ASY PCO FCO GPIO I/O I O O 61 CDDSP FDOUT GPIO2[12] I/O 62 CDDSP TDOUT GPIO2[13] I/O 63 CDDSP SDOUT GPIO2[14] I/O 64 CDDSP CLVOUT GPIO2[15] I/O 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 CDDSP JTAG JTAG JTAG JTAG JTAG POWER DSD/GPIO DSD/GPIO DSD/GPIO I2C I2C I2S OUT POWER POWER POWER I2S OUT I2S OUT I2S OUT I2S OUT POWER FLASH FLASH FLASH FLASH FLASH FLASH POWER GPIO GPIO GPIO POWER USB USB POWER CLK88 JTAG_TDO JTAG_TCK JTAG_TMS JTAG_TDI JTAG_TRST DVSS DSDLO DSDRO DSDBCKO SCL0 SDA0 MCLKO DVDD_HV DVDD_HV DVSS DATAO0 BCKO LRCKO DATAO1 DVSS FL_DAT2 FL_DAT1 FL_CS FL_DAT3 FL_CLK FL_DAT0 DVDD_LV GPIO1_7 GPIO1_8 GPIO1_9 DVDD_HV USB_DM USB_DP DVSS GPIO2[16] I/O O I I I I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O - 100 USB REXTI www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 GPIO0[23] GPIO0[24] GPIO0[25] GPIO0[26] GPIO0[27] GPIO0[28] GPIO0[29] GPIO0[30] GPIO0[31] GPIO1[0] GPIO1[1] GPIO1[2] GPIO1[3] GPIO1[4] GPIO1[5] GPIO1[6] GPIO1[7] GPIO1[8] GPIO1[9] I 9/24 Function Asymmetric Correction PLL PCO Output PLL FCO-DAC Output Focus Drive Output Use this pin as analog pin. Tracking Drive Output Use this pin as analog pin. Sled Drive Output Use this pin as analog pin. CLV Drive Output Use this pin as analog pin. Clock Output for Driver IC or GPIO JTAG TDO JTAG TCK JTAG TMS JTAG TDI JTAG TRST GND DSD Lch Data Output or GPIO DSD Rch Data Output or GPIO DSD Bit Clock Output or GPIO I2C Clock I/O (0), Open drain output pin I2C Data I/O (0), Open drain output pin Digital Audio Master Clock Output 3.3V Power Supply 3.3V Power Supply GND Digital Audio Data Output (0) Digital Audio Bit Clock Output Digital Audio Channel Clock Output Digital Audio Data Output (1) GND Serial Flash ROM IF Data I/O (2) Serial Flash ROM I/F Data I/O (1) Serial Flash ROM I/F Command Output Serial Flash ROM I/F Data I/O (3) Serial Flash ROM I/F Clock Output Serial Flash ROM I/F Data I/O (0) 1.5V Power Supply GPIO for exclusive use GPIO for exclusive use GPIO for exclusive use 3.3V Power Supply USB DUSB D+ GND USB Reference Voltage Output. Connect a pull down resistance to DVSS pin. The pull down resistance must be 12.3 k1%. About on PCB, do not wire as long as possible and not wire side by side long distance with noise line, especially note the next pin UART0_RXD(pin101). TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Pin Description - continued No 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 118 119 120 121 122 123 124 125 126 127 128 Block UART UART UART UART GPIO GPIO GPIO GPIO GPIO I2S IN I2S IN I2S IN I2S IN I2S IN I2S IN UART UART I2C I2C RCR UART UART POWER CLOCK CLOCK TEST CLOCK CLOCK Pin Name UART0_RXD UART0_TXD UART0_RTS UART0_CTS GPIO1_14 GPIO1_15 GPIO1_16 GPIO1_17 GPIO1_18 LRCKI0 BCKI0 DATAI0 LRCKI1 BCKI1 DATAI1 UART1_RTS UART1_CTS SCL1 SDA1 RCR UART1_RXD UART1_TXD DVSS XIN_32K XOUT_32K TMODE XIN_PLL XOUT_PLL www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 GPIO GPIO1[10] GPIO1[11] GPIO1[12] GPIO1[13] GPIO1[14] GPIO1[15] GPIO1[16] GPIO1[17] GPIO1[18] GPIO1[19] GPIO1[20] GPIO1[21] GPIO1[22] GPIO1[23] GPIO1[24] GPIO1[25] GPIO1[26] GPIO1[27] GPIO1[28] GPIO1[29] GPIO1[30] GPIO1[31] I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I/O I O I I O Function UART0 Receive Data UART0 Transmit Data UART0 Transfer Request UART0 Clear Request GPIO for exclusive use GPIO for exclusive use GPIO for exclusive use GPIO for exclusive use GPIO for exclusive use Digital Audio Channel Clock Input (0) Digital Audio Bit Clock Input (0) Digital Audio Data Input (0) Digital Audio Channel Clock Input (1) Digital Audio Bit Clock Input (1) Digital Audio Data Input (1) UART1 Transfer Request UART1 Clear Request I2C Clock I/O (1), Open drain output pin I2C Data I/O (1), Open drain output pin Remote Controller Signal Input UART1 Receive Data UART1 Transmit Data GND X'tal(32.768KHz) connection input pin. X'tal(32.768KHz) connection output pin. Test Mode pin: This pin is connected to GND. X'tal(16.9344MHz) Connection Input X'tal(16.9344MHz) Connection Output 10/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Application Circuit Diagram Serial Flash ROM VDDH SIO0 GND SCLK SIO2 SIO3 SIO1 VCC CS# ICE(ARM debugger) for software debug VDDH 0.1 VDDH Audio Amp I2C I/F 76 75 74 SCL0 DSDBCKO 65 77 SDA0 66 78 MCLKO 67 79 DVDD_HV CLK88 80 DVDD_HV JTAG_TDO 81 68 82 DVSS 83 BCKO 84 LRCKO 10k DATAO0 85 86 DVSS DATAO1 FL_DAT2 88 FL_DAT1 87 91 FL_DAT0 89 92 DVDD_LV 90 93 GPIO1_7 FL_CS 94 GPIO1_8 FL_CLK 95 GPIO1_9 FL_DAT3 96 DVDD_HV 0.1 10k JTAG_TCK [USB] 10k (*) 0.1 10k 10k (*) 69 0.1 0.1 5V 10k DSD Audio I/F 70 VDDL JTAG_TMS VDDH Digital Audio I/F 71 About REXT (pin100) on PCB, do not wire as long as possible and not wire side by side long distance with noise line, especially note the next terminal UART0_RXD (pin101). VBUS 1 *. The Pull-up resistor of the I2C bus is affected by a condition of Slave IC or PCB. Please adjust the value of resistor as needed. 33 DSD DAC JTAG_TDI 22 JTAG_TRST 22 72 22 DVSS 22 DSDLO 22 DSDRO 73 22 Device DM 2 97 USB_DM CLVOUT 64 DP 3 98 USB_DP SDOUT 63 99 DVSS TDOUT 62 100 REXTI FDOUT 61 GND 4 12.3k TX 101 UART0_RXD FCO 60 [Device] RX 102 UART0_TXD PCO 59 UART I/F RTS 103 UART0_RTS ASY 58 CTS 104 UART0_CTS LD 57 105 GPIO1_14 PD 56 LRCLK F 55 107 GPIO1_16 E 54 108 GPIO1_17 AVSS 53 109 GPIO1_18 VBIAS 52 BCLK CD Block Reference BD 51 110 LRCKI0 Digital Audio output 106 GPIO1_15 AC 50 111 BCKI0 AVDD 49 112 DATAI0 DATA 113 LRCKI1 AD_MONI1 48 114 BCKI1 AD_MONI0 47 EQO 46 115 DATAI1 10k (*) I2C I/F 10k (*) Remote Control Receiver Module 116 UART1_RTS RFI 45 117 UART1_CTS ANA_MONI1 44 118 SCL1 ANA_MONI0 43 119 SDA1 VSS_ADC 42 120 RCR ADIN7 41 121 UART1_RXD ADIN6 40 122 UART1_TXD ADIN5 39 123 DVSS ADIN4 38 VDDH 10p 4.7M ADIN3 37 125 XOUT_32K ADIN2 36 126 TMODE 0 ADIN1 35 10p 127 XIN_PLL 680 1.2K 2.2K 6.8K ADIN0 34 GPIO0_21 VDD_ADC 33 32 GPIO0_22 31 30 GPIO0_20 29 GPIO0_19 28 SSDO 27 SSCLK 26 SSDI 25 SSCS 24 MSDO 23 MSCLK 22 MSDI 21 MSCS 20 DVSS 19 DVSS 18 DVDD_LV 10 SD_DAT2 DAT2 17 DVDD_HV 9 DAT3 16 DVSS SD_DAT3 8 15 GPIO0_10 SD_CMD 7 CLK CDM 14 GPIO0_9 SD_CLK 6 DAT0 13 GPIO0_8 SD_DAT0 5 DAT1 12 DVSS SD_DAT1 4 11 DVDD_HV DVDD_HV SD_CON 3 H L RESETX 270 SD_WP 128 XOUT_PLL Connect VDDH 1M 2 16.9344MHz 1 10p 2.7k 0.1 32.768kHz 0.1 10p 124 XIN_32K 0.1 X'tal using for matching with ROHM's evaluation board - 32.768kHz NIHON DEMPA KOGYO CO., LTD. Parts NameNX3215SA - 16.9344MHz NIHON DEMPA KOGYO CO., LTD. Parts NameNX3225GA VDDH Write protect * Design route of X'tal, IC and capacitor to be the shortest because the characteristic of X'tal oscillation is sensitive for routing of PCB pattern. 0.1 0.1 0.1 [SD Card] [Device0] SlaveSPI VDDH [Device1] MasterSPI VDDH VDDL Figure 3. Application Circuit Diagram www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 11/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Absolute Maximum Ratings (Ta=25C) Parameter Input Voltage (Analog, I/O) Input Voltage (Core) Input Voltage Storage Temperature Range Operating Temperature Range Maximum Junction Temperature Symbol Rating Unit VDDHMAX -0.3 to +4.5 V VDDLMAX VIN -0.3 to +2.1 -0.3 to VDDH+0.3 V V TSTG -55 to +125 C TOPR -40 to +85 C Tjmax +125 C Remarks DVDD_HV, VDD_ADC, AVDD DVDD_LV Caution: Operating the IC over the absolute maximum ratings may damage the IC. The damage can either be a short circuit between pins or an open circuit between pins and the internal circuitry. Therefore, it is important to consider circuit protection measures, such as adding a fuse, in case the IC is operated over the absolute maximum ratings. Recommended Operating Conditions (Ta=25C) Parameter Input Voltage (Analog, I/O) Input Voltage (Core) Symbol Rating Unit VDDH 3.0 to 3.6 V VDDL 1.45 to 1.65 V Remarks DVDD_HV, VDD_ADC, AVDD DVDD_LV Thermal Resistance (Note 1) Parameter Symbol Thermal Resistance (Typ) 1s (Note 3) 2s2p (Note 4) Unit HTQFP128UA Junction to Ambient Junction to Top Characterization Parameter (Note 2) JA 54.9 27.6 C/W JT 10 9 C/W (Note 1) Based on JESD51-2A(Still-Air) (Note 2) The thermal characterization parameter to report the difference between junction temperature and the temperature at the top center of the outside surface of the component package. (Note 3) Using a PCB board based on JESD51-3. (Note 4) Using a PCB board based on JESD51-5, 7. Layer Number of Measurement Board Single Material Board Size FR-4 114.3mm x 76.2mm x 1.57mmt Top Copper Pattern Thickness Footprints and Traces Layer Number of Measurement Board 4 Layers 70m Board Size FR-4 114.3mm x 76.2mm x 1.6mmt Top Copper Pattern Footprints and Traces Thermal Via (Note 5) Material 2 Internal Layers Pitch 1.20mm Diameter 0.30mm Bottom Thickness Copper Pattern Thickness Copper Pattern Thickness 70m 74.2mm (Square) 35m 74.2mm (Square) 70m (Note 5) This thermal via connects with the copper pattern of all layers. Caution: As reference information of thermal design, thermal resistance of 1s and 2s2p are described. If the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. Increase the board size and copper area to prevent exceeding the maximum junction temperature rating. This IC is recommended more than 2s PCB. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 12/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Electrical Characteristics (Unless otherwise noted, Ta=25C, DVDD_HV = VDD_ADC = AVDD = 3.0V, DVDD_LV = 1.5V, DVSS=VSS_ADC=AVSS =0V, XIN_PLL= 16.9344MHz, XIN_32K =32.768kHz, REXTI pin externally fitted resistance = 12.3 k1%) Rating Conditions Parameter Symbol Unit Suitable Pin MIN TYP MAX Operating Current IDDHS1 115 180 mA Using USB High-Speed Consumption (VDDH) Operating Current IDD2 150 210 mA Consumption (VDDL) In a standby mode Consumption current ISTBH 1.1 mA At standby mode (VDDH) In a standby mode Consumption current ISTBL 50 A At standby mode (VDDL) (Note 1) H input current IIH 1.0 A (Note 1) L input current IIL -1.0 A (Note 1) Input "H" Voltage VIH VDDH*0.7 VDDH V (Note 1) Input "L" Voltage VIL DVSS VDDH*0.3 V (Note 2) Output "H" Voltage 1 VOH1 VDDH-0.4 VDDH V IOH=-1.6mA, (Note 2) Output "L" Voltage 1 VOL1 0 0.4 V IOL=1.6mA. (Note 3) Output "H" Voltage 2 VOH2 VDDH-0.4 VDDH V IOH=-3.6mA, (Note 3) (Note 4) Output "L" Voltage 2 VOL2 0 0.4 V IOL=3.6mA, (Note 5) Output "H" Voltage 3 VOH3 VDDH-1.0 VDDH V IOH=-0.6mA, (Note 5) Output "L" Voltage 3 VOL3 0 1.0 V IOL=0.6mA, (Note 7) Idle Pull-Up Resistance RPU_ID 0.9 1.575 k (Note 7) RX Pull-Up Resistance RPU_RX 1.425 3.09 k (Note 6) Pull-Down Resistance RPD 14.25 24.8 k (Note 6) HS High Voltage VHSOH 360 440 mV HS RX Differential Input (Note 6) VHSSQ 100 mV Sensitivity HS RX Differential Input (Note 6) VHSCM -50 600 mV Range HS Disconnect Judgment (Note 6) VHSDSC 525 625 mV Voltage Measured at 45 Output Chirp J Voltage VCHIRPJ 700 1100 mV (Note 6) Termination (Note 6) Chirp K Voltage VCHIRPK -900 -500 mV (Note 6) FS High Output Impedance ZFDRH 45 (Note 6) FS Low Output Impedance ZFDRL 45 Measured when pin is pulled FS High Voltage VFOH 2.8 3.6 V down to VSS using 15 k resistor (Note 6) FS Low Voltage FS RX Differential Input Sensitivity FS RX Differential Input Range H input voltage L input voltage A/D Conversion Frequency Analog Input Voltage Range Differential Non-Linearity Integral Non-Linearity Measured when pin is pulled up to DVDD_HV using 1.5 k (Note 6) resistor VFOL 0 - 0.3 V VFLSNS - - 200 mV (Note 6) VFLCM 0.8 - 2.5 V (Note 6) VIHUSB VILUSB 2 DVSS - VDDH 0.8 V V (Note 6) FADCONV VAIN DNL INL 0.1*VDDH - - 705.6 0.9*VDDH 5 5 kHz V LSB LSB (Note 6) FADCONV16.9344MHz/24 (Note 1) Input pin 1,2,4-10,13-15,21-32,34-41,43-44,47-48,65,67-70,72-77,81-84,86-91,93-95,101-122 pin (Note 2) Output pin1 13-15,29-32,34-41,43,44,47,48,61-66,77,81-84,93-95,101-117,120-122 pin (Note 3) Output pin2 2,4-10,21-28,72-74,86-91 pin (Note 4) Output pin3 75,76,118,119 pin (Note 5) Output pin4 125,128 pin (Note 6) USB pin 97,98 pin (Note 7) USB pin 98 pin www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 13/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Electrical Characteristics - continued (Unless otherwise noted, Ta=25C, DVDD_HV = VDD_ADC = AVDD = 3.0V, DVDD_LV = 1.55V, DVSS= VSS_ADC= AVSS= 0V, XIN_PLL= 16.9344MHz, XIN_32K =32.768kHz, RL=10k, VBIAS=Reference) Rating Conditions Parameter Symbol Unit Suitable Pin MIN TYP MAX Maximum Oscillation fVCOH 4.6 6.5 MHz GPIO1_7,1/4 of VCO Output Frequency Minimum Oscillation fVCOL 1.1 1.7 MHz GPIO1_7,1/4 of VCO Output Frequency Offset Voltage VFCOF -50 +50 mV FCO Maximum Output VFCH 0.2 0.5 V FCO Voltage Minimum Output VFCL -0.5 -0.2 V FCO Voltage Output "L" Voltage VPCH -1.0 -0.6 V PCO Output "H" Voltage VPCL 0.6 1.0 V PCO < EFM Comparator > Threshold Voltage VEFM -200 200 mV RFI,ANA_MONI0,GPIO1_8 Offset Voltage VADOF -140 +140 mV ANA_MONI0,ANA_MONI1 Maximum Conversion VADH 1.0 1.2 1.4 V ANA_MONI0,ANA_MONI1 Voltage Minimum Conversion VADL -1.4 -1.2 -1.0 V ANA_MONI0,ANA_MONI1 Voltage Offset Voltage VDAOF -80 +80 mV FDOUT,TDOUT,SDOUT,CLVOUT Maximum Output VDAH 0.8 1.2 V FDOUT,TDOUT,SDOUT,CLVOUT Voltage Minimum Output VDAL -1.2 -0.8 V FDOUT,TDOUT,SDOUT,CLVOUT Voltage Maximum Output IBO 1.5 mA VBIAS, BIAS Fluctuation: 200mV or less Current Offset Voltage VRFOF 0 mV AC,BD,EQO Maximum Output VRFH 1.0 1.2 V AC,BD,EQO Voltage Minimum Output VRFL -1.3 -1.1 V AC,BD,EQO Voltage Offset Voltage VFEOF 0 mV AC,BD,ANA_MONI0,ANA_MONI1 Maximum Output VFEH 1.0 1.4 V AC,BD,ANA_MONI0,ANA_MONI1 Voltage Minimum Output VFEL -1.4 -1.0 V AC,BD,ANA_MONI0,ANA_MONI1 Voltage Offset Voltage VTEOF 70 mV E,F,ANA_MONI0,ANA_MONI1 Maximum Output VTEH 1.0 1.4 V E,F,ANA_MONI0,ANA_MONI1 Voltage Minimum Output VTEL -1.4 -1.0 V E,F,ANA_MONI0,ANA_MONI1 Voltage Offset Voltage VASYOF 0 mV ASY=VBIAS,RFI,ANA_MONI0 Maximum Output VASYH 1.1 1.4 V ASY,RFI,ANA_MONI0 Voltage Minimum Output VASYL -1.4 -1.1 V ASY,RFI,ANA_MONI0 Voltage PD="H", Output Voltage 1 VAPC1 2.4 2.8 V LD,ANA_MONI0 PD="L", Output Voltage 2 VAPC2 0.1 0.5 V LD,ANA_MONI0 Maximum Reference VAPCH 220 mV PD,LD,ANA_MONI0 Voltage Minimum Reference VAPCL 145 mV PD,LD,ANA_MONI0 www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 14/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Application Information Power on/ Reset Timing/ Power off Release the Reset Signal by L input with over 100s after clock input from I/O pins of 16.9344MHz becomes stable. (See Figure 4) Waiting for Oscillation Stabilization DVDD_HV VDD_ADC AVDD DVDD_LV XIN_PLL RESETX tRSTX tVDDon XIN_32K Figure 4. Power on/ Reset Timing DVDD_HV VDD_ADC AVDD DVDD_LV XIN_PLL tVDDoff Figure 5. Power off Parameter Time lag of Power Supply at Starting Reset L Interval Time lag of Power Supply at Shutting down. MIN Rating TYP MAX tVDDon 0 - - ms tRSTX 100 - - s tVDDoff 0 - - ms Symbol Unit Remarks Note) There is a risk that the electric current flows in case the order of power supply starting and shutting down is other than the above order. Oscillation Stable Time Suggested value for XIN_PLL(16.9344MHz) oscillation stable time is 4ms. Suggested value for XIN_32K(32.768kHz) oscillation stable time is 500ms. The above-mentioned oscillation stable time cannot be guaranteed since the oscillation stable time depends on crystal oscillator, external constant, or board layout. Check the oscillation stable time of your own system. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 15/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU I/O Equivalence Circuits No. Name 1 RESETX I/O I Power DVDD_HV 34 35 36 37 38 39 40 41 43 44 47 48 61 62 63 64 ADIN0 ADIN1 ADIN2 ADIN3 ADIN4 ADIN5 ADIN6 ADIN7 ANA_MONI0 ANA_MONI1 AD_MONI0 AD_MONI1 FDOUT TDOUT SDOUT CLVOUT 45 RFI I I I I I I I I O O O O O O O O VDD_ADC AVDD I AVDD 46 EQO O AVDD 50 AC 51 BD I I AVDD 54 E 55 F I I AVDD Internal Circuits No. 2 4 5 6 7 8 9 10 13 14 15 21 22 23 24 25 26 27 28 29 30 31 32 65 72 73 74 77 81 82 83 84 93 94 95 101 102 103 104 105 106 107 108 109 110 111 112 113 114 115 116 117 120 121 122 Name SD_WP SD_CON SD_DAT1 SD_DAT0 SD_CLK SD_CMD SD_DAT3 SD_DAT2 GPIO0_8 GPIO0_9 GPIO0_10 MSCS MSDI MSCLK MSDO SSCS SSDI SSCLK SSDO GPIO0_19 GPIO0_20 GPIO0_21 GPIO0_22 CLK88 DSDLO DSDRO DSDBCKO MCLKO DATAO0 BCKO LRCKO DATAO1 GPIO1_7 GPIO1_8 GPIO1_9 UART0_RXD UART0_TXD UART0_RTS UART0_CTS GPIO1_14 GPIO1_15 GPIO1_16 GPIO1_17 GPIO1_18 LRCKI0 BCKI0 DATAI0 LRCKI1 BCKI1 DATAI1 UART1_RTS UART1_CTS RCR UART1_RXD UART1_TXD I/O Power I DVDD_HV I I/O I/O O O I/O I/O I/O I/O I/O O I O O I I I O I/O I/O I/O I/O O I/O I/O I/O O O O O O I/O I/O I/O I O O I I/O I/O I/O I/O I/O I I I I I I I/O I/O I I O Internal Circuits Figure 6. I/O equivalence circuits 1 www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 16/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU I/O Equivalence Circuits - continued No. Name 56 PD 57 LD I/O I O Power AVDD Internal Circuits PD LD 58 ASY I AVDD 52 VBIAS No. 75 76 118 119 Name SCL0 SDA0 SCL1 SDA1 I/O Power I/O I/O DVDD_HV I/O I/O 86 87 88 89 90 91 FL_DAT2 FL_DAT1 FL_CS FL_DAT3 FL_CLK FL_DAT0 I/O DVDD_HV I/O O I/O O I/O 97 USB_DM 98 USB_DP I/O I/O DVDD_HV Internal Circuits O USB_DM AVDD USB_DP 59 PCO 60 FCO O O 100 REXTI I AVDD DVDD_HV PCO 124 XIN_32K 125 XOUT_32K I O DVDD_HV FCO 66 JTAG_TDO XIN_32K XOUT_32K O DVDD_HV 127 XIN_PLL 128 XOUT_PLL I O DVDD_HV XIN_PLL 67 68 69 70 126 JTAG_TCK JTAG_TMS JTAG_TDI JTAG_TRST TMODE I I I I I XOUT_PLL DVDD_HV Figure 7. I/O equivalence circuits 2 www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 17/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Operational Notes1 1. About Compatibility in USB Memory Device and SD Memory Card According to the file structure and communication speed of USB memory, SD memory card, this LSI might not play back correctly. 2. About Compatibility in Bluetooth device According to the type of Bluetooth device, , this LSI might not play back correctly. 3. About 2X Speed Recording Recording to a memory with slow access speed may require data connection operation. 2X speed recording to all the memories cannot be guaranteed. 4. Power OFF or Memory Disconnection Under Memory Writing The sudden power off or memory disconnection during recording or file write operation to a memory may break the data in a memory. 5. Browsing Operation With a memory with slow access speed, browsing operation during music playing may generate skipping. 6. CD-ROM Playing CD-ROM playing operation is premised on data being inputted so that an internal data buffer may not become empty. When an input does not meet the deadline and internal data buffers become empty, skipping occurs. 7. Playing Time of MP3 File The playing time when MP3 file playing may shift when fast forward playing, rewind playing, and VBR playing. 8. Write-In Operation Exceeding Memory Size Writing to a file when memory size is exceeded is not supported. 9. Write-In Operation of the File Size Exceeding FAT Specification Writing to a file when file size is exceeded is not supported. 10. About I2C Format I/F Although this LSI has adopted the I2C format, the level shifter circuit is not built in. For this reason, level shifter is needed for connection with the device besides the range of operating power supply voltage of this LSI. 11. CD Media Playing According to the condition of CD media, flawed, dirty, curved, eccentric and etc., this LSI might not play back normally. 12. Application Block Diagram Each software function of Audio Encoder, Audio Decoder, BT stack A2DP, SBC Decoder and File System(FTA12/16/32, ISO9660) described in Figure 1. Application Block are realized by downloading applicable program from external Serial Flash ROM. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 18/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Operational Notes2 1. Reverse Connection of Power Supply Connecting the power supply in reverse polarity can damage the IC. Take precautions against reverse polarity when connecting the power supply, such as mounting an external diode between the power supply and the IC's power supply pins. 2. Power Supply Lines Design the PCB layout pattern to provide low impedance supply lines. Separate the ground and supply lines of the digital and analog blocks to prevent noise in the ground and supply lines of the digital block from affecting the analog block. Furthermore, connect a capacitor to ground at all power supply pins. Consider the effect of temperature and aging on the capacitance value when using electrolytic capacitors. 3. Ground Voltage Ensure that no pins are at a voltage below that of the ground pin at any time, even during transient condition. 4. Ground Wiring Pattern When using both small-signal and large-current ground traces, the two ground traces should be routed separately but connected to a single ground at the reference point of the application board to avoid fluctuations in the small-signal ground caused by large currents. Also ensure that the ground traces of external components do not cause variations on the ground voltage. The ground lines must be as short and thick as possible to reduce line impedance. 5. Thermal Consideration Should by any chance the maximum junction temperature rating be exceeded the rise in temperature of the chip may result in deterioration of the properties of the chip. In case of exceeding this absolute maximum rating, increase the board size and copper area to prevent exceeding the maximum junction temperature rating. 6. Recommended Operating Conditions These conditions represent a range within which the expected characteristics of the IC can be approximately obtained. The electrical characteristics are guaranteed under the conditions of each parameter. 7. Inrush Current When power is first supplied to the IC, it is possible that the internal logic may be unstable and inrush current may flow instantaneously due to the internal powering sequence and delays, especially if the IC has more than one power supply. Therefore, give special consideration to power coupling capacitance, power wiring, width of ground wiring, and routing of connections. 8. Operation Under Strong Electromagnetic Field Operating the IC in the presence of a strong electromagnetic field may cause the IC to malfunction. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 19/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Operational Notes2 - continued 9. Testing on Application Boards When testing the IC on an application board, connecting a capacitor directly to a low-impedance output pin may subject the IC to stress. Always discharge capacitors completely after each process or step. The IC's power supply should always be turned off completely before connecting or removing it from the test setup during the inspection process. To prevent damage from static discharge, ground the IC during assembly and use similar precautions during transport and storage. 10. Inter-pin Short and Mounting Errors Ensure that the direction and position are correct when mounting the IC on the PCB. Incorrect mounting may result in damaging the IC. Avoid nearby pins being shorted to each other especially to ground, power supply and output pin. Inter-pin shorts could be due to many reasons such as metal particles, water droplets (in very humid environment) and unintentional solder bridge deposited in between pins during assembly to name a few. 11. Unused Input Pins Input pins of an IC are often connected to the gate of a MOS transistor. The gate has extremely high impedance and extremely low capacitance. If left unconnected, the electric field from the outside can easily charge it. The small charge acquired in this way is enough to produce a significant effect on the conduction through the transistor and cause unexpected operation of the IC. So unless otherwise specified, unused input pins should be connected to the power supply or ground line. 12. Regarding the Input Pin of the IC In the construction of this IC, P-N junctions are inevitably formed creating parasitic diodes or transistors. The operation of these parasitic elements can result in mutual interference among circuits, operational faults, or physical damage. Therefore, conditions which cause these parasitic elements to operate, such as applying a voltage to an input pin lower than the ground voltage should be avoided. Furthermore, do not apply a voltage to the input pins when no power supply voltage is applied to the IC. Even if the power supply voltage is applied, make sure that the input pins have voltages within the values specified in the electrical characteristics of this IC. 13. Ceramic Capacitor When using a ceramic capacitor, determine the dielectric constant considering the change of capacitance with temperature and the decrease in nominal capacitance due to DC bias and others. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 20/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Ordering Information B M 9 4 8 Part Number www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 0 3 A E K U - Z Package HTQFP128UA,supply with tray 21/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Marking Diagram HTQFP128UA (TOP VIEW) Part Number Marking 94803A LOT Number 1PIN MARK www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 22/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Physical Dimension, Tape and Reel Information Package Name www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 HTQFP128UA 23/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 BM94803AEKU Revision History Date Revision Changes 30.Aug.2016 001 25.Jan.2017 002 New Release P10: Modified Block name of 118/119pin to I2C. P11: Modified pin name of Serial Flash ROM from SCLK to SIO3. P14: Modified pin name FLAG1 to GPIO1_7, FLAG2 to GPIO1_8, VC to VBIAS, and removed ASY_TEST, APCREF in Electrical Characteristics. P18: Added Note about Application Block diagram. www.rohm.com (c) 2016 ROHM Co., Ltd. All rights reserved. TSZ2211115001 24/24 TSZ02201-0V2V0E600440-1-2 25.Jan.2017 Rev.002 Notice Precaution on using ROHM Products 1. Our Products are designed and manufactured for application in ordinary electronic equipments (such as AV equipment, OA equipment, telecommunication equipment, home electronic appliances, amusement equipment, etc.). If you (Note 1) intend to use our Products in devices requiring extremely high reliability (such as medical equipment , transport equipment, traffic equipment, aircraft/spacecraft, nuclear power controllers, fuel controllers, car equipment including car accessories, safety devices, etc.) and whose malfunction or failure may cause loss of human life, bodily injury or serious damage to property ("Specific Applications"), please consult with the ROHM sales representative in advance. Unless otherwise agreed in writing by ROHM in advance, ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of any ROHM's Products for Specific Applications. (Note1) Medical Equipment Classification of the Specific Applications JAPAN USA EU CHINA CLASS CLASSb CLASS CLASS CLASS CLASS 2. ROHM designs and manufactures its Products subject to strict quality control system. However, semiconductor products can fail or malfunction at a certain rate. Please be sure to implement, at your own responsibilities, adequate safety measures including but not limited to fail-safe design against the physical injury, damage to any property, which a failure or malfunction of our Products may cause. The following are examples of safety measures: [a] Installation of protection circuits or other protective devices to improve system safety [b] Installation of redundant circuits to reduce the impact of single or multiple circuit failure 3. Our Products are designed and manufactured for use under standard conditions and not under any special or extraordinary environments or conditions, as exemplified below. Accordingly, ROHM shall not be in any way responsible or liable for any damages, expenses or losses arising from the use of any ROHM's Products under any special or extraordinary environments or conditions. If you intend to use our Products under any special or extraordinary environments or conditions (as exemplified below), your independent verification and confirmation of product performance, reliability, etc, prior to use, must be necessary: [a] Use of our Products in any types of liquid, including water, oils, chemicals, and organic solvents [b] Use of our Products outdoors or in places where the Products are exposed to direct sunlight or dust [c] Use of our Products in places where the Products are exposed to sea wind or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [d] Use of our Products in places where the Products are exposed to static electricity or electromagnetic waves [e] Use of our Products in proximity to heat-producing components, plastic cords, or other flammable items [f] Sealing or coating our Products with resin or other coating materials [g] Use of our Products without cleaning residue of flux (even if you use no-clean type fluxes, cleaning residue of flux is recommended); or Washing our Products by using water or water-soluble cleaning agents for cleaning residue after soldering [h] Use of the Products in places subject to dew condensation 4. The Products are not subject to radiation-proof design. 5. Please verify and confirm characteristics of the final or mounted products in using the Products. 6. In particular, if a transient load (a large amount of load applied in a short period of time, such as pulse. is applied, confirmation of performance characteristics after on-board mounting is strongly recommended. Avoid applying power exceeding normal rated power; exceeding the power rating under steady-state loading condition may negatively affect product performance and reliability. 7. De-rate Power Dissipation depending on ambient temperature. When used in sealed area, confirm that it is the use in the range that does not exceed the maximum junction temperature. 8. Confirm that operation temperature is within the specified range described in the product specification. 9. ROHM shall not be in any way responsible or liable for failure induced under deviant condition from what is defined in this document. Precaution for Mounting / Circuit board design 1. When a highly active halogenous (chlorine, bromine, etc.) flux is used, the residue of flux may negatively affect product performance and reliability. 2. In principle, the reflow soldering method must be used on a surface-mount products, the flow soldering method must be used on a through hole mount products. If the flow soldering method is preferred on a surface-mount products, please consult with the ROHM representative in advance. For details, please refer to ROHM Mounting specification Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Precautions Regarding Application Examples and External Circuits 1. If change is made to the constant of an external circuit, please allow a sufficient margin considering variations of the characteristics of the Products and external components, including transient characteristics, as well as static characteristics. 2. You agree that application notes, reference designs, and associated data and information contained in this document are presented only as guidance for Products use. Therefore, in case you use such information, you are solely responsible for it and you must exercise your own independent verification and judgment in the use of such information contained in this document. ROHM shall not be in any way responsible or liable for any damages, expenses or losses incurred by you or third parties arising from the use of such information. Precaution for Electrostatic This Product is electrostatic sensitive product, which may be damaged due to electrostatic discharge. Please take proper caution in your manufacturing process and storage so that voltage exceeding the Products maximum rating will not be applied to Products. Please take special care under dry condition (e.g. Grounding of human body / equipment / solder iron, isolation from charged objects, setting of Ionizer, friction prevention and temperature / humidity control). Precaution for Storage / Transportation 1. Product performance and soldered connections may deteriorate if the Products are stored in the places where: [a] the Products are exposed to sea winds or corrosive gases, including Cl2, H2S, NH3, SO2, and NO2 [b] the temperature or humidity exceeds those recommended by ROHM [c] the Products are exposed to direct sunshine or condensation [d] the Products are exposed to high Electrostatic 2. Even under ROHM recommended storage condition, solderability of products out of recommended storage time period may be degraded. It is strongly recommended to confirm solderability before using Products of which storage time is exceeding the recommended storage time period. 3. Store / transport cartons in the correct direction, which is indicated on a carton with a symbol. Otherwise bent leads may occur due to excessive stress applied when dropping of a carton. 4. Use Products within the specified time after opening a humidity barrier bag. Baking is required before using Products of which storage time is exceeding the recommended storage time period. Precaution for Product Label A two-dimensional barcode printed on ROHM Products label is for ROHM's internal use only. Precaution for Disposition When disposing Products please dispose them properly using an authorized industry waste company. Precaution for Foreign Exchange and Foreign Trade act Since concerned goods might be fallen under listed items of export control prescribed by Foreign exchange and Foreign trade act, please consult with ROHM in case of export. Precaution Regarding Intellectual Property Rights 1. All information and data including but not limited to application example contained in this document is for reference only. ROHM does not warrant that foregoing information or data will not infringe any intellectual property rights or any other rights of any third party regarding such information or data. 2. ROHM shall not have any obligations where the claims, actions or demands arising from the combination of the Products with other articles such as components, circuits, systems or external equipment (including software). 3. No license, expressly or implied, is granted hereby under any intellectual property rights or other rights of ROHM or any third parties with respect to the Products or the information contained in this document. Provided, however, that ROHM will not assert its intellectual property rights or other rights against you or your customers to the extent necessary to manufacture or sell products containing the Products, subject to the terms and conditions herein. Other Precaution 1. This document may not be reprinted or reproduced, in whole or in part, without prior written consent of ROHM. 2. The Products may not be disassembled, converted, modified, reproduced or otherwise changed without prior written consent of ROHM. 3. In no event shall you use in any way whatsoever the Products and the related technical information contained in the Products or this document for any military purposes, including but not limited to, the development of mass-destruction weapons. 4. The proper names of companies or products described in this document are trademarks or registered trademarks of ROHM, its affiliated companies or third parties. Notice-PGA-E (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.003 Datasheet General Precaution 1. Before you use our Pro ducts, you are requested to care fully read this document and fully understand its contents. ROHM shall n ot be in an y way responsible or liabl e for fa ilure, malfunction or acci dent arising from the use of a ny ROHM's Products against warning, caution or note contained in this document. 2. All information contained in this docume nt is current as of the issuing date and subj ect to change without any prior notice. Before purchasing or using ROHM's Products, please confirm the la test information with a ROHM sale s representative. 3. The information contained in this doc ument is provi ded on an "as is" basis and ROHM does not warrant that all information contained in this document is accurate an d/or error-free. ROHM shall not be in an y way responsible or liable for an y damages, expenses or losses incurred b y you or third parties resulting from inaccur acy or errors of or concerning such information. Notice - WE (c) 2015 ROHM Co., Ltd. All rights reserved. Rev.001 Datasheet bm94803aeku - Web Page Buy Distribution Inventory Part Number Package Unit Quantity Minimum Package Quantity Packing Type Constitution Materials List RoHS bm94803aeku HTQFP128UA 900 900 Tray inquiry Yes