74ACT08SCX - NATIONAL SEMICONDUCTOR

January, 2015 − Rev. 9 1Publication Order Number:

MC74AC05/D

MC74AC05, MC74ACT05

Hex Inverter with

Open-Drain Outputs

High−Performance Silicon−Gate CMOS

The MC74AC/ACT05 is identical in pinout to the LS05. The device

inputs are compatible with standard CMOS outputs; with pullup

resistors, they are compatible with TTL outputs.

Features

•Outputs Source/Sink 24 mA

•′ACT05 Has TTL Compatible Inputs

•These are Pb−Free Devices

GND

Figure 1. Pinout: 14-Lead Packages

1314 12 11 10 9 8

2134567

VCC A6Y6A5Y5A4Y4

A1Y1A2Y2A3Y3

Top View

Figure 2. Logic Diagram

2, 4, 6, 8, 10, 12

1, 3, 5, 9, 11, 13

PIN 14 = VCC

PIN 7 = GND

* DENOTES OPEN‐DRAIN OUTPUTS

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See detailed ordering and shipping information in the packag

dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

FUNCTION TABLE

Input A

Output Y

NOTE: Z = High Impedance

MARKING

DIAGRAMS

xxx = AC or ACT

A = Assembly Location

WL or L = Wafer Lot

Y = Year

WW or W = Work Week

G or G= Pb−Free Package

TSSOP−14

DT SUFFIX

CASE 948G

xxx

ALYWG

SOIC−14

D SUFFIX

CASE 751A

xxx05G

AWLYWW

(Note: Microdot may be in either location)

MC74AC05, MC74ACT05

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MAXIMUM RATINGS

Symbol Parameter Value Unit

VCC DC Supply Voltage *0.5 to )7.0 V

VIDC Input Voltage *0.5 v VI v VCC )0.5 V

VODC Output Voltage (Note 1) *0.5 v VO v VCC )0.5 V

IIK DC Input Diode Current $20 mA

IOK DC Output Diode Current $50 mA

IODC Output Sink/Source Current $50 mA

ICC DC Supply Current per Output Pin $50 mA

IGND DC Ground Current per Output Pin $50 mA

TSTG Storage Temperature Range *65 to )150 °C

TLLead temperature, 1 mm from Case for 10 Seconds 260 °C

TJJunction temperature under Bias )150 °C

qJA Ther mal Resistance (Note 2) SOIC

TSSOP 125

170 °C/W

PDPower Dissipation in Still Air at 85°C SOIC

TSSOP 125

170 mW

MSL Moisture Sensitivity Level 1

FRFlammability Rating Oxygen Index: 30% − 35% UL 94 V−0 @ 0.125 in

VESD ESD Withstand Voltage Human Body Model (Note 3)

Machine Model (Note 4)

Charged Device Model (Note 5)

> 2000

> 200

> 1000

ILatch−Up Latch−Up Performance Above VCC and Below GND at 85°C (Note 6) $100 mA

Stresses exceeding those listed in the Maximum Ratings table may damage the device. If any of these limits are exceeded, device functionality

should not be assumed, damage may occur and reliability may be af fected.

1. IO absolute maximum rating must be observed.

2. The package thermal impedance is calculated in accordance with JESD51−7.

3. Tested to EIA/JESD22−A114−A.

4. Tested to EIA/JESD22−A115−A.

5. Tested to JESD22−C101−A.

6. Tested to EIA/JESD78.

RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Typ Min Unit

VCC Supply Voltage ′AC 2.0 5.0 6.0 V

′ACT 4.5 5.0 5.5

VREG DC Regulated Power Voltage (Ref. to GND) 0 − VCC V

tr, tfInput Rise and Fall Time (Note 1)

′AC Devices except Schmitt Inputs

VCC @ 3.0 V − 150 −

VCC @ 4.5 V − 40 − ns/V

VCC @ 5.5 V − 25 −

tr, tfInput Rise and Fall Time (Note 2)

′ACT Devices except Schmitt Inputs VCC @ 4.5 V − 10 − ns/V

VCC @ 5.5 V − 8.0 −

TJJunction Temperature (PDIP) − − 140 °C

TAOperating Ambient Temperature Range −40 25 85 °C

IOH Output Current − HIGH − − −24 mA

IOL Output Current − LOW − − 24 mA

Functional operation above the stresses listed in the Recommended Operating Ranges is not implied. Extended exposure to stresses beyond

the Recommended Operating Ranges limits may affect device reliability.

1. Vin from 30% to 70% VCC; see individual Data Sheets for devices that differ from the typical input rise and fall times.

2. Vin from 0.8 V to 2.0 V; see individual Data Sheets for devices that differ from the typical input rise and fall times.

MC74AC05, MC74ACT05

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DC CHARACTERISTICS

Symbol Parameter VCC

(V)

74AC 74AC

Unit Conditions

TA = +25°C TA = −40°C to +85°C

Typ Guaranteed Limits

VIH Minimum High Level Input Voltage 3.0 1.5 2.1 2.1 VOUT = 0.1 V

4.5 2.25 3.15 3.15 V or VCC − 0.1 V

5.5 2.75 3.85 3.85

VIL Maximum Low Level Input Voltage 3.0 1.5 0.9 0.9 VOUT = 0.1 V

4.5 2.25 1.35 1.35 V or VCC − 0.1 V

5.5 2.75 1.65 1.65

VOL Maximum Low Level Output Voltage 3.0 0.002 0.1 0.1 IOUT = 50 mA

4.5 0.001 0.1 0.1 V

5.5 0.001 0.1 0.1

*VIN = VIL or VIH

3.0 − 0.36 0.44 12 mA

4.5 − 0.36 0.44 IOL 24 mA

5.5 − 0.36 0.44 24 mA

IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mAVI = VCC, GND

IOLD †Minimum Dynamic

Output Current 5.5 − − 75 mA VOLD = 1.65 V Max

IOHD 5.5 − − −75 mA VOHD = 3.85 V Min

ICC Maximum Quiescent Supply Current 5.5 − 4.0 40 mAVIN = VCC or GND

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

*All outputs loaded; thresholds on input associated with output under test.

†Maximum test duration 2.0 ms, one output loaded at a time.

NOTE: IIN and ICC @ 3.0 V are guaranteed to be less than or equal to the respective limit @ 5.5 V.

AC CHARACTERISTICS

Symbol Parameter VCC*

(V)

74AC 74AC

Unit

TA = +25°C CL = 50 pF TA = −40°C to + 85°C CL = 50 pF

Min Typ Max Min Max

tPZL Propagation Delay Output Enable 3.3 1.5 − 8.0 1.0 9.0 ns

5.0 1.5 − 6.0 1.0 6.5

tPLZ Propagation Delay Output Enable 3.3 1.5 − 8.0 1.0 9.0 ns

5.0 1.5 − 6.0 1.0 6.5

*Voltage Range 3.3 V is 3.3 V ±0.3 V.

Voltage Range 5.0 V is 5.0 V ±0.5 V.

MC74AC05, MC74ACT05

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DC CHARACTERISTICS

Symbol Parameter VCC

(V)

74ACT 74ACT

Unit Conditions

TA = +25°C TA = −40°C to +85°C

Typ Guaranteed Limits

VIH Minimum High Level Input Voltage 4.5

5.5 1.5

1.5 2.0

2.0 2.0

2.0 VVOUT = 0.1 V

or VCC − 0.1 V

VIL Maximum Low Level Input Voltage 4.5

5.5 1.5

1.5 0.8

0.8 0.8

0.8 VVOUT = 0.1 V

or VCC − 0.1 V

VOL Maximum Low Level Output Voltage 4.5

5.5 0.001

0.001 0.1

0.1 0.1

0.1 VIOUT = 50 mA

4.5

5.5 −

−0.36

0.36 0.44

0.44 0.44 *VIN = VIL or VIH

IOH 24 mA

IIN Maximum Input Leakage Current 5.5 − ±0.1 ±1.0 mAVI = VCC, GND

DICCT Additional Max. ICC/Input 5.5 0.6 − 1.5 mA VI = VCC − 2.1 V

IOLD

IOHD

†Minimum Dynamic Output Current

5.5

5.5 −

−−

−75

−75 mA

mA VOLD = 1.65 V Max

VOHD = 3.85 V Min

ICC Maximum Quiescent Supply Current 5.5 − 4.0 40 mAVIN = VCC or GND

Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product

performance may not be indicated by the Electrical Characteristics if operated under different conditions.

*All outputs loaded; thresholds on input associated with output under test.

†Maximum test duration 2.0 ms, one output loaded at a time.

AC CHARACTERISTICS

Symbol Parameter VCC*

(V)

74ACT 74ACT

Unit

TA = +25°C CL = 50 pF TA = −40°C to +85°C CL = 50 pF

Min Typ Max Min Max

tPZL Propagation Delay Output Enable 5.0 1.5 − 8.0 1.0 8.5 ns

tPLZ Propagation Delay Output Enable 5.0 1.5 − 8.5 1.0 9.0 ns

*Voltage Range 5.0 V is 5.0 V ±0.5 V.

CAPACITANCE

Symbol Parameter Value Typ Unit Test Conditions

CIN Input Capacitance 4.5 pF VCC = 5.0 V

CPD Power Dissipation Capacitance 30 pF VCC = 5.0 V

ORDERING INFORMATION

Device Package Shipping†

MC74AC05DG SOIC−14

(Pb−Free) 55 Units / Rail

MC74AC05DR2G SOIC−14

(Pb−Free) 2500 / Tape & Reel

MC74ACT05DG SOIC−14

(Pb−Free) 55 Units / Rail

MC74ACT05DR2G SOIC−14

(Pb−Free) 2500 / Tape & Reel

MC74ACT05DTR2G TSSOP−14

(Pb−Free) 2500 / Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MC74AC05, MC74ACT05

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PACKAGE DIMENSIONS

SOIC−14 NB

CASE 751A−03

ISSUE K

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ASME Y14.5M, 1994.

2. CONTROLLING DIMENSION: MILLIMETERS.

3. DIMENSION b DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE PROTRUSION

SHALL BE 0.13 TOTAL IN EXCESS OF AT

MAXIMUM MATERIAL CONDITION.

4. DIMENSIONS D AND E DO NOT INCLUDE

MOLD PROTRUSIONS.

5. MAXIMUM MOLD PROTRUSION 0.15 PER

SIDE.

14 8

0.25 B M

X 45

SEATING

PLANE

0.25 B S

13X

DET AIL A

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

D8.55 8.75 0.337 0.344

E3.80 4.00 0.150 0.157

A1.35 1.75 0.054 0.068

b0.35 0.49 0.014 0.019

L0.40 1.25 0.016 0.049

e1.27 BSC 0.050 BSC

A3 0.19 0.25 0.008 0.010

A1 0.10 0.25 0.004 0.010

M0 7 0 7

H5.80 6.20 0.228 0.244

h0.25 0.50 0.010 0.019

__ __

6.50

14X

0.58

14X

1.18

1.27

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MC74AC05, MC74ACT05

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PACKAGE DIMENSIONS

TSSOP−14

CASE 948G

ISSUE B

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A4.90 5.10 0.193 0.200

B4.30 4.50 0.169 0.177

C−−− 1.20 −−− 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.50 0.60 0.020 0.024

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI

Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE INTERLEAD

FLASH OR PROTRUSION. INTERLEAD FLASH

OR PROTRUSION SHALL NOT EXCEED 0.25

(0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE DAMBAR

PROTRUSION. ALLOWABLE DAMBAR

PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN

EXCESS OF THE K DIMENSION AT MAXIMUM

MATERIAL CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE DETERMINED

AT DATUM PLANE −W−.

____

U0.15 (0.006) T

2X L/2

0.10 (0.004) V S

L−U−

SEATING

PLANE

0.10 (0.004)

−T−

ÇÇÇ

SECTION N−N

DETAIL E

JJ1

ÉÉÉ

DETAIL E

−W−

0.25 (0.010)

PIN 1

IDENT.

U0.15 (0.006) T

−V−

14X REFK

7.06

14X

0.36 14X

1.26

0.65

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MC74AC05, MC74ACT05

www.onsemi.com

UBLICATION ORDERING INFORMATION

N. American Technical Support: 800−282−9855 Toll Free

USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MC74AC05/D

LITERATURE FULFILLMENT:

Literature Distribution Center for ON Semiconductor

P.O. Box 5163, Denver, Colorado 80217 USA

Phone: 303−675−2175 or 800−344−3860 Toll Free USA/Canada

Fax: 303−675−2176 or 800−344−3867 Toll Free USA/Canada

Email: orderlit@onsemi.com

ON Semiconductor Website: www.onsemi.com

Order Literature: http://www.onsemi.com/orderlit

For additional information, please contact your loc

Sales Representative

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