DS14C88
www.ti.com
SNLS080C –MAY 1998–REVISED APRIL 2013
DS14C88 Quad CMOS Line Driver
Check for Samples: DS14C88
1FEATURES DESCRIPTION
The DS14C88, pin-for-pin compatible to the
2• Meets EIA-232D and CCITT V.28 Standards DS1488/MC1488, is a quad line drivers designed to
• LOW Power Consumption interface data terminal equipment (DTE) with data
• Wide Power Supply Range: ±5V to ±12V circuit-terminating equipment (DCE). This device
translates standard TTL/CMOS logic levels to levels
• Available in SOIC Package conforming to EIA-232-D and CCITT V.28 standards.
The device is fabricated in low threshold CMOS metal
gate technology. The device provides very low power
consumption compared to its bipolar equivalents: 500
μA (DS14C88) versus 25 mA (DS1488).
The DS14C88 simplifies designs by eliminating the
need for external slew rate control capacitors. Slew
rate control in accordance with EIA-232D is provided
on-chip, eliminating the output capacitors.
Connection Diagram
Figure 1. SOIC or PDIP Package- Top View
See Package Number NFF0014A or D0014A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2All trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 1998–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DS14C88
SNLS080C –MAY 1998–REVISED APRIL 2013
www.ti.com
Absolute Maximum Ratings(1)(2)(3)(4)
Supply Voltage
V+Pin +13V
V−Pin −13V
Driver Input Voltage (V+) +0.3V to GND −0.3V
Driver Output Voltage |(V+)−VO|≤30V
|(V−)−VO|≤30V
Continuous Power Dissipation @+25°C(5)
NFF0014A Package 1513 mW
D0014A Package 1063 mW
Junction Temperature +150°C
Lead Temperature (Soldering 4 seconds) +260°C
Storage Temperature Range −65°C to +150°C
(1) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be Ensured. They are not meant to imply
that the devices should be operated at these limits. The tables of “Electrical Characteristics” specify conditions for device operation.
(2) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(3) This Product does not meet 2000V ESD rating.
(4) ESD Rating (HBM, 1.5 kΩ, 100 pF) ≥1.0 kV.
(5) Derate NFF0014A Package 12.1 mW/°C, and D0014A Package 8.5 mW/°C above +25°C.
Recommended Operating Conditions Min Max Units
V+Supply (GND = 0V) +4.5 +12.6 V
V−Supply (GND = 0V) −4.5 −12.6 V
Operating Free Air Temp. (TA)
DS14C88 0 +75 °C
Electrical Characteristics
Over Recommended Operating Conditions, unless otherwise specified
Parameter Test Conditions Min Typ Max Units
IIL Maximum Low Input Current VIN = GND +10 μA
IIH Maximum High Input Current VIN = V+−10 μA
VIL Low Level Input Voltage V+≥+7V, V−≤ −7V GND 0.8 V
V+< +7V, V−>−7V GND 0.6 V
VIH High Level Input Voltage 2.0 V+V
VOL Low Level Output Level VIN = VIH V+= 4.5V, V−=−4.5V −4.0 −3.0 V
RL= 3 kΩor 7 kΩV+= 9V, V−= 9V −8.0 −6.5 V
V+= 12V, V−=−12V −10.5 −9.0 V
VOH High Level Output Level VIN = VIL V+= 4.5V, V−=−4.5V 3.0 4.0 V
RL= 3 kΩor 7 kΩV+= 9V, V−=−9V 6.5 8.0 V
V+= 12V, V−=−12V 9.0 10.5 V
IOS+ High Level Output Short Circuit VIN = 0.8V, VO= GND V+= +12V, V−=−12V −45 mA
Current(1)
IOS−Low Level Output Short Circuit VIN = 2.0V, VO= GND +45 mA
Current(1)
ROUT Output Resistance V+= V−= GND = 0V 300 Ω
−2V ≤VO≤+2V(2) (Figure 2 )
(1) IOS+ and IOS−values are for one output at a time. If more than one output is shorted simultaneously, the device dissipation may be
exceeded.
(2) Power supply (V+, V−) and GND pins are connected to ground for the Output Resistance Test (RO).
2Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS14C88
DS14C88
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SNLS080C –MAY 1998–REVISED APRIL 2013
Electrical Characteristics (continued)
Over Recommended Operating Conditions, unless otherwise specified
Parameter Test Conditions Min Typ Max Units
ICC+ Positive Supply Current VIN = VILmax V+= 4.5V, V−=−4.5V 10 μA
RL= OPEN V+= 9V, V−=−9V 30 μA
V+= 12V, V−=−12V 60 μA
VIN = VIHmin V+= 4.5V, V−=−4.5V 50 μA
RL= OPEN V+= 9V, V−=−9V 300 μA
V+= 12V, V−=−12V 500 μA
ICC- Negative Supply Current VIN = VILmax V+= 4.5V, V−=−4.5V −10 μA
RL= OPEN V+= 9V, V−=−9V −10 μA
V+= 12V, V−=−12V −10 μA
VIN = VIHmin V+= 4.5V, V−=−4.5V −30 μA
RL= OPEN V+= 9V, V−=−9V −30 μA
V+= 12V, V−=−12V −60 μA
Switching Characteristics(1)(2)
Over Recommended Operating Conditions, unless otheriwse specified (Figure 3,Figure 4)
Parameter Test Conditions Min Typ Max Units
tPLH Propagation Delay Low to High V+= +4.5V, V−=−4.5V 1.5 6.0 μs
V+= +9.0V, V−=−9.0V 1.2 5.0 μs
V+= +12V, V−=−12V 1.2 4.0 μs
tPHL Propagation Delay High to Low V+= +4.5V, V−=−4.5V 1.5 6.0 μs
V+= +9.0V, V−=−9.0V 1.35 5.0 μs
V+= +12V, V−=−12V 1.3 4.0 μs
trRise Time(3) 0.2 1.0 μs
tfFall Time(3) 0.2 1.0 μs
tsk Typical Propagation Delay Skew V+= +4.5V, V−=−4.5V 250 ns
V+= +9.0V, V−=−9.0V 200 ns
V+= +12V, V−=−12V 150 ns
SROutput Slew Rate(3) RL= 3 kΩto 7 kΩ30 V/μs
CL= 15 pF to 2500 pF
(1) AC input test waveforms for test purposes: tr= tf≤20 ns, VIH = 2V, VIL = 0.8V (0.6V at V+= 4.5V, V−=−4.5V)
(2) Input rise and rall times must not exceed 5 μs.
(3) The output slew rate, rise time, and fall time are measured from the +3.0V to the −3.0V level on the output waveform.
Copyright © 1998–2013, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: DS14C88
DS14C88
SNLS080C –MAY 1998–REVISED APRIL 2013
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Parameter Measure Information
Figure 2. Output Resistance Test Circuit (Power-Off)
Figure 3. Driver Load Circuit(4)
Figure 4. Driver Switching Waveform
(4) CLinclude jig and probe capacitances.
TYPICAL APPLICATION INFORMATION
Figure 5. EIA-232D Data Transmission
4Submit Documentation Feedback Copyright © 1998–2013, Texas Instruments Incorporated
Product Folder Links: DS14C88
DS14C88
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SNLS080C –MAY 1998–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision B (April 2013) to Revision C Page
• Changed layout of National Data Sheet to TI format ............................................................................................................ 4
Copyright © 1998–2013, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: DS14C88
PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
DS14C88M NRND SOIC D 14 55 TBD Call TI Call TI 0 to 70 DS14C88M
DS14C88M/NOPB ACTIVE SOIC D 14 55 Green (RoHS
& no Sb/Br) CU SN Level-1-260C-UNLIM 0 to 70 DS14C88M
DS14C88MX NRND SOIC D 14 2500 TBD Call TI Call TI 0 to 70 DS14C88M
DS14C88MX/NOPB ACTIVE SOIC D 14 2500 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-260C-UNLIM 0 to 70 DS14C88M
DS14C88N NRND PDIP NFF 14 25 TBD Call TI Call TI 0 to 70 DS14C88N
DS14C88N/NOPB ACTIVE PDIP NFF 14 25 Green (RoHS
& no Sb/Br) SN | CU SN Level-1-NA-UNLIM 0 to 70 DS14C88N
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
PACKAGE OPTION ADDENDUM
www.ti.com 1-Nov-2013
Addendum-Page 2
(6) Lead/Ball Finish - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead/Ball Finish values may wrap to two lines if the finish
value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS14C88MX SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
DS14C88MX/NOPB SOIC D 14 2500 330.0 16.4 6.5 9.35 2.3 8.0 16.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS14C88MX SOIC D 14 2500 367.0 367.0 35.0
DS14C88MX/NOPB SOIC D 14 2500 367.0 367.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2013
Pack Materials-Page 2
MECHANICAL DATA
N0014A
www.ti.com
N14A (Rev G)
NFF0014A
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