MC74LCX08MELG - ON Semiconductor - searchdatasheet.com

July, 2012 − Rev. 8

Publication Order Number:

MC74LCX08/D

MC74LCX08

Low-Voltage CMOS Quad

2-Input AND Gate

With 5 V−Tolerant Inputs

The MC74LCX08 is a high performance, quad 2−input AND gate

operating from a 2.3 to 3.6 V supply. High impedance TTL compatible

inputs significantly reduce current loading to input drivers while TTL

compatible outputs offer improved switching noise performance. A VI

specification of 5.5 V allows MC74LCX08 inputs to be safely driven

from 5.0 V devices.

Current drive capability is 24 mA at the outputs.

Features

•Designed for 2.3 V to 3.6 V VCC Operation

•5.0 V Tolerant Inputs − Interface Capability With 5.0 V TTL Logic

•LVTTL Compatible

•LVCMOS Compatible

•24 mA Balanced Output Sink and Source Capability

•Near Zero Static Supply Current (10 mA) Substantially Reduces

System Power Requirements

•Latchup Performance Exceeds 500 mA

•ESD Performance: Human Body Model >2000 V

Machine Model >200 V

•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS

Compliant

MARKING

DIAGRAMS

A = Assembly Location

L, WL = Wafer Lot

Y = Year

W, WW = Work Week

G or G=Pb−Free Package

(Note: Microdot may be in either location)

TSSOP−14

DT SUFFIX

CASE 948G

SOIC−14

D SUFFIX

CASE 751A

LCX08G

AWLYWW

See detailed ordering and shipping information in the package

dimensions section on page 4 of this data sheet.

ORDERING INFORMATION

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LCX

ALYWG

MC74LCX08

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Figure 1. Pinout: 14−Lead (Top View)

1314 12 11 10 9 8

21 34567

VCC A2 B2 O2 A3 B3 O3

A0 B0 O0 A1 B1 O1 GND

3O0

Figure 2. Logic Diagram

6O1

11 O2

8O3

PIN NAMES

Pins Function

An, Bn Data Inputs

On Outputs

TRUTH TABLE

Inputs Outputs

An Bn On

L L L

L H L

H L L

H H H

H = High Voltage Level

L = Low Voltage Level

For ICC reasons, DO NOT FLOAT Inputs

MAXIMUM RATINGS

Symbol Parameter Value Condition Unit

VCC DC Supply Voltage −0.5 to +7.0 V

VIDC Input Voltage −0.5 ≤ VI ≤ +7.0 V

VODC Output Voltage −0.5 ≤ VO ≤ VCC + 0.5 Output in HIGH or LOW State (Note 1) V

IIK DC Input Diode Current −50 VI < GND mA

IOK DC Output Diode Current −50 VO < GND mA

+50 VO > VCC mA

IODC Output Source/Sink Current ±50 mA

ICC DC Supply Current Per Supply Pin ±100 mA

IGND DC Ground Current Per Ground Pin ±100 mA

TSTG Storage Temperature Range −65 to +150 °C

MSL Moisture Sensitivity Level 1

Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit

values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied,

damage may occur and reliability may be affected.

1. IO absolute maximum rating must be observed.

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RECOMMENDED OPERATING CONDITIONS

Symbol Parameter Min Type Max Unit

VCC Supply Voltage Operating

Data Retention Only

2.0

1.5

2.5, 3.3

3.6

VIInput Voltage 0 5.5 V

VOOutput Voltage (HIGH or LOW State)

(3−State)

0 VCC V

IOH HIGH Level Output Current VCC = 3.0 V − 3.6 V

VCC = 2.7 V − 3.0 V

VCC = 2.3 V − 2.7 V

−24

−12

−8

IOL LOW Level Output Current VCC = 3.0 V − 3.6 V

VCC = 2.7 V − 3.0 V

VCC = 2.3 V − 2.7 V

+24

+12

TAOperating Free−Air Temperature −40 +85 °C

Dt/DVInput Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V 0 10 ns/V

DC ELECTRICAL CHARACTERISTICS

TA = −40°C to +85°C

Symbol Characteristic Condition Min Max Unit

VIH HIGH Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 1.7 V

2.7 V ≤ VCC ≤ 3.6 V 2.0

VIL LOW Level Input Voltage (Note 2) 2.3 V ≤ VCC ≤ 2.7 V 0.7 V

2.7 V ≤ VCC ≤ 3.6 V 0.8

VOH HIGH Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOH = −100 mAVCC −0.2 V

VCC = 2.3 V; IOH = −8 mA 1.8

VCC = 2.7 V; IOH = −12 mA 2.2

VCC = 3.0 V; IOH = −18 mA 2.4

VCC = 3.0 V; IOH = −24 mA 2.2

VOL LOW Level Output Voltage 2.3 V ≤ VCC ≤ 3.6 V; IOL = 100 mA0.2 V

VCC = 2.3 V; IOL = 8 mA 0.6

VCC = 2.7 V; IOL = 12 mA 0.4

VCC = 3.0 V; IOL = 16 mA 0.4

VCC = 3.0 V; IOL = 24 mA 0.55

IOFF Power Off Leakage Current VCC = 0, VIN = 3.6 V or VOUT = 3.6 V 10 mA

IIN Input Leakage Current VCC = 0 to 3.6 V, VIN = 3.6 V or GND ±5mA

ICC Quiescent Supply Current VCC = 3.6 V, VIN = 3.6 V or VOUT = 3.6 V 10 mA

DICC Increase in ICC per Input 2.3 ≤ VCC ≤ 3.6 V; VIH = VCC − 0.6 V 500 mA

2. These values of VI are used to test DC electrical characteristics only.

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AC CHARACTERISTICS tR = tF = 2.5 ns; RL = 500 W

Limits

TA = −40°C to +85°C

VCC = 3.3 V ± 0.3 V VCC = 2.7 V VCC = 2.5 V ± 0.2 V

CL = 50 pF CL = 50 pF CL = 30 pF

Symbol Parameter Waveform Min Max Min Max Min Max Unit

tPLH Propagation Delay Time 1 1.5 5.5 1.5 6.2 1.5 6.6 ns

tPHL Input to Output 1.5 5.5 1.5 6.2 1.5 6.6

tOSHL Output−to−Output Skew 1.0 ns

tOSLH (Note 3) 1.0

3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device.

The specification applies to any outputs switching in the same direction, either HIGH−to−LOW (tOSHL) or LOW−to−HIGH (tOSLH); parameter

guaranteed by design.

DYNAMIC SWITCHING CHARACTERISTICS

TA = +25°C

Symbol Characteristic Condition Min Typ Max Unit

VOLP Dynamic LOW Peak Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V

(Note 4) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.6 V

VOLV Dynamic LOW Valley Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V −0.8 V

(Note 4) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V −0.6 V

4. Number of outputs defined as “n”. Measured with “n−1” outputs switching from HIGH−to−LOW or LOW−to−HIGH. The remaining output is

measured in the LOW state.

CAPACITIVE CHARACTERISTICS

Symbol Parameter Condition Typical Unit

CIN Input Capacitance VCC = 3.3 V, VI = 0 V or VCC 7 pF

COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF

CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF

ORDERING INFORMATION

Device Package Shipping†

MC74LCX08DG SOIC−14

(Pb−Free)

55 Units / Rail

MC74LCX08DR2G SOIC−14

(Pb−Free)

2500 Tape & Reel

MC74LCX08DTG TSSOP−14

(Pb−Free)

96 Units / Rail

MC74LCX08DTR2G TSSOP−14

(Pb−Free)

2500 Tape & Reel

†For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging

Specifications Brochure, BRD8011/D.

MC74LCX08

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WAVEFORM 1 − PROPAGATION DELAYS

tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns

Vcc

0 V

VOH

VOL

An, Bn

tPLH

tPHL

Vmi

Vmo

Vmi

Vmo

Vcc

Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V

Vmi 1.5 V 1.5 V Vcc/2

Vmo 1.5 V 1.5 V Vcc/2

Figure 3. AC Waveforms

PULSE

GENERATOR

DUT

VCC

CL= 50 pF at VCC = 3.3 + 0.3 V or equivalent (includes jig and probe capacitance)

CL= 30 pF at VCC = 2.5 + 0.2 V or equivalent (includes jig and probe capacitance)

RL= R1 = 500 W or equivalent

RT= ZOUT of pulse generator (typically 50 W)

Figure 4. Test Circuit

MC74LCX08

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PACKAGE DIMENSIONS

SOIC−14

CASE 751A−03

ISSUE J

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSIONS A AND B DO NOT INCLUDE

MOLD PROTRUSION.

4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)

PER SIDE.

5. DIMENSION D DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.127

(0.005) TOTAL IN EXCESS OF THE D

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

−A−

−B−

P7 PL

14 8

0.25 (0.010) B M

0.25 (0.010) A S

−T−

RX 45

SEATING

PLANE D14 PL K

_DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A8.55 8.75 0.337 0.344

B3.80 4.00 0.150 0.157

C1.35 1.75 0.054 0.068

D0.35 0.49 0.014 0.019

F0.40 1.25 0.016 0.049

G1.27 BSC 0.050 BSC

J0.19 0.25 0.008 0.009

K0.10 0.25 0.004 0.009

M0 7 0 7

P5.80 6.20 0.228 0.244

R0.25 0.50 0.010 0.019

__ __

7.04

14X

0.58

14X

1.52

1.27

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MC74LCX08

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PACKAGE DIMENSIONS

TSSOP−14

CASE 948G−01

ISSUE B

DIM MIN MAX MIN MAX

INCHESMILLIMETERS

A4.90 5.10 0.193 0.200

B4.30 4.50 0.169 0.177

C−−− 1.20 −−− 0.047

D0.05 0.15 0.002 0.006

F0.50 0.75 0.020 0.030

G0.65 BSC 0.026 BSC

H0.50 0.60 0.020 0.024

J0.09 0.20 0.004 0.008

J1 0.09 0.16 0.004 0.006

K0.19 0.30 0.007 0.012

K1 0.19 0.25 0.007 0.010

L6.40 BSC 0.252 BSC

M0 8 0 8

NOTES:

1. DIMENSIONING AND TOLERANCING PER

ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: MILLIMETER.

3. DIMENSION A DOES NOT INCLUDE MOLD

FLASH, PROTRUSIONS OR GATE BURRS.

MOLD FLASH OR GATE BURRS SHALL NOT

EXCEED 0.15 (0.006) PER SIDE.

4. DIMENSION B DOES NOT INCLUDE

INTERLEAD FLASH OR PROTRUSION.

INTERLEAD FLASH OR PROTRUSION SHALL

NOT EXCEED 0.25 (0.010) PER SIDE.

5. DIMENSION K DOES NOT INCLUDE

DAMBAR PROTRUSION. ALLOWABLE

DAMBAR PROTRUSION SHALL BE 0.08

(0.003) TOTAL IN EXCESS OF THE K

DIMENSION AT MAXIMUM MATERIAL

CONDITION.

6. TERMINAL NUMBERS ARE SHOWN FOR

REFERENCE ONLY.

7. DIMENSION A AND B ARE TO BE

DETERMINED AT DATUM PLANE −W−.

____

U0.15 (0.006) T

2X L/2

0.10 (0.004) V S

L−U−

SEATING

PLANE

0.10 (0.004)

−T−

ÇÇÇ

SECTION N−N

DETAIL E

JJ1

ÉÉÉ

DETAIL E

−W−

0.25 (0.010)

PIN 1

IDENT.

U0.15 (0.006) T

−V−

14X REFK

7.06

14X

0.36 14X

1.26

0.65

DIMENSIONS: MILLIMETERS

PITCH

SOLDERING FOOTPRINT*

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

MC74LCX08

http://onsemi.com

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limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications

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MC74LCX08/D

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