MC74LCX08 Low-Voltage CMOS Quad 2-Input AND Gate With 5 V-Tolerant Inputs The MC74LCX08 is a high performance, quad 2-input AND gate operating from a 2.3 to 3.6 V supply. High impedance TTL compatible inputs significantly reduce current loading to input drivers while TTL compatible outputs offer improved switching noise performance. A VI specification of 5.5 V allows MC74LCX08 inputs to be safely driven from 5.0 V devices. Current drive capability is 24 mA at the outputs. 14 SOIC-14 D SUFFIX CASE 751A 1 Designed for 2.3 V to 3.6 V VCC Operation 5.0 V Tolerant Inputs - Interface Capability With 5.0 V TTL Logic LCX08G AWLYWW 1 LVTTL Compatible 14 LVCMOS Compatible 14 24 mA Balanced Output Sink and Source Capability Near Zero Static Supply Current (10 mA) Substantially Reduces System Power Requirements Latchup Performance Exceeds 500 mA * * ESD Performance: * MARKING DIAGRAMS 14 Features * * * * * * http://onsemi.com Human Body Model >2000 V Machine Model >200 V These Devices are Pb-Free, Halogen Free/BFR Free and are RoHS Compliant 1 TSSOP-14 DT SUFFIX CASE 948G 1 LCX 08 ALYWG G A = Assembly Location L, WL = Wafer Lot Y = Year W, WW = Work Week G or G = Pb-Free Package (Note: Microdot may be in either location) ORDERING INFORMATION See detailed ordering and shipping information in the package dimensions section on page 4 of this data sheet. (c) Semiconductor Components Industries, LLC, 2012 July, 2012 - Rev. 8 1 Publication Order Number: MC74LCX08/D MC74LCX08 VCC A2 14 13 B2 O2 12 A3 11 10 B3 9 A0 O3 B0 8 A1 B1 A2 B2 1 2 3 4 5 6 7 A3 A0 B0 O0 A1 B1 O1 GND B3 1 3 2 4 6 5 13 11 12 10 8 9 Figure 1. Pinout: 14-Lead (Top View) O0 O1 O2 O3 Figure 2. Logic Diagram PIN NAMES TRUTH TABLE Pins Function An, Bn Data Inputs On Outputs Inputs Outputs An Bn On L L L L H L H L L H H H H = High Voltage Level L = Low Voltage Level For ICC reasons, DO NOT FLOAT Inputs MAXIMUM RATINGS Symbol Parameter VCC DC Supply Voltage VI DC Input Voltage VO DC Output Voltage IIK Value Condition Unit -0.5 to +7.0 V -0.5 VI +7.0 V -0.5 VO VCC + 0.5 Output in HIGH or LOW State (Note 1) V DC Input Diode Current -50 VI < GND mA IOK DC Output Diode Current -50 VO < GND mA +50 VO > VCC mA IO DC Output Source/Sink Current 50 mA ICC DC Supply Current Per Supply Pin 100 mA IGND DC Ground Current Per Ground Pin 100 mA TSTG Storage Temperature Range -65 to +150 C MSL Moisture Sensitivity Level 1 Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal operating conditions) and are not valid simultaneously. If these limits are exceeded, device functional operation is not implied, damage may occur and reliability may be affected. 1. IO absolute maximum rating must be observed. http://onsemi.com 2 MC74LCX08 RECOMMENDED OPERATING CONDITIONS Symbol Parameter Min Type Max Unit 2.0 1.5 2.5, 3.3 2.5, 3.3 3.6 3.6 V 0 5.5 V 0 VCC V VCC = 3.0 V - 3.6 V VCC = 2.7 V - 3.0 V VCC = 2.3 V - 2.7 V -24 -12 -8 mA VCC = 3.0 V - 3.6 V VCC = 2.7 V - 3.0 V VCC = 2.3 V - 2.7 V +24 +12 +8 mA -40 +85 C 0 10 ns/V VCC Supply Voltage Operating Data Retention Only VI Input Voltage VO Output Voltage (HIGH or LOW State) (3-State) IOH HIGH Level Output Current IOL LOW Level Output Current TA Operating Free-Air Temperature Dt/DV Input Transition Rise or Fall Rate, VIN from 0.8 V to 2.0 V, VCC = 3.0 V DC ELECTRICAL CHARACTERISTICS TA = -40C to +85C Symbol VIH VIL VOH VOL Characteristic HIGH Level Input Voltage (Note 2) LOW Level Input Voltage (Note 2) HIGH Level Output Voltage LOW Level Output Voltage Condition Min 2.3 V VCC 2.7 V 1.7 2.7 V VCC 3.6 V 2.0 Max V 2.3 V VCC 2.7 V 0.7 2.7 V VCC 3.6 V 0.8 2.3 V VCC 3.6 V; IOH = -100 mA VCC - 0.2 VCC = 2.3 V; IOH = -8 mA 1.8 VCC = 2.7 V; IOH = -12 mA 2.2 VCC = 3.0 V; IOH = -18 mA 2.4 VCC = 3.0 V; IOH = -24 mA 2.2 Unit V V 2.3 V VCC 3.6 V; IOL = 100 mA 0.2 VCC = 2.3 V; IOL = 8 mA 0.6 VCC = 2.7 V; IOL = 12 mA 0.4 VCC = 3.0 V; IOL = 16 mA 0.4 VCC = 3.0 V; IOL = 24 mA 0.55 V IOFF Power Off Leakage Current VCC = 0, VIN = 3.6 V or VOUT = 3.6 V 10 mA IIN Input Leakage Current VCC = 0 to 3.6 V, VIN = 3.6 V or GND 5 mA ICC Quiescent Supply Current VCC = 3.6 V, VIN = 3.6 V or VOUT = 3.6 V 10 mA DICC Increase in ICC per Input 2.3 VCC 3.6 V; VIH = VCC - 0.6 V 500 mA 2. These values of VI are used to test DC electrical characteristics only. http://onsemi.com 3 MC74LCX08 AC CHARACTERISTICS tR = tF = 2.5 ns; RL = 500 W Limits TA = -40C to +85C Symbol VCC = 3.3 V 0.3 V VCC = 2.7 V VCC = 2.5 V 0.2 V CL = 50 pF CL = 50 pF CL = 30 pF Parameter Waveform Min Max Min Max Min Max Unit tPLH Propagation Delay Time 1 1.5 5.5 1.5 6.2 1.5 6.6 ns tPHL Input to Output 1.5 5.5 1.5 6.2 1.5 6.6 tOSHL Output-to-Output Skew 1.0 tOSLH (Note 3) 1.0 ns 3. Skew is defined as the absolute value of the difference between the actual propagation delay for any two separate outputs of the same device. The specification applies to any outputs switching in the same direction, either HIGH-to-LOW (tOSHL) or LOW-to-HIGH (tOSLH); parameter guaranteed by design. DYNAMIC SWITCHING CHARACTERISTICS TA = +25C Symbol VOLP VOLV Characteristic Condition Min Typ Max Unit Dynamic LOW Peak Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V 0.8 V (Note 4) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V 0.6 V Dynamic LOW Valley Voltage VCC = 3.3 V, CL = 50 pF, VIH = 3.3 V, VIL = 0 V -0.8 V (Note 4) VCC = 2.5 V, CL = 30 pF, VIH = 2.5 V, VIL = 0 V -0.6 V 4. Number of outputs defined as "n". Measured with "n-1" outputs switching from HIGH-to-LOW or LOW-to-HIGH. The remaining output is measured in the LOW state. CAPACITIVE CHARACTERISTICS Symbol Condition Typical Unit CIN Input Capacitance Parameter VCC = 3.3 V, VI = 0 V or VCC 7 pF COUT Output Capacitance VCC = 3.3 V, VI = 0 V or VCC 8 pF CPD Power Dissipation Capacitance 10 MHz, VCC = 3.3 V, VI = 0 V or VCC 25 pF ORDERING INFORMATION Package Shipping MC74LCX08DG SOIC-14 (Pb-Free) 55 Units / Rail MC74LCX08DR2G SOIC-14 (Pb-Free) 2500 Tape & Reel MC74LCX08DTG TSSOP-14 (Pb-Free) 96 Units / Rail MC74LCX08DTR2G TSSOP-14 (Pb-Free) 2500 Tape & Reel Device For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. http://onsemi.com 4 MC74LCX08 Vcc Vmi An, Bn Vmi 0V tPHL tPLH Vmo On VOH Vmo VOL WAVEFORM 1 - PROPAGATION DELAYS tR = tF = 2.5 ns, 10% to 90%; f = 1 MHz; tW = 500 ns Vcc Symbol 3.3 V + 0.3 V 2.7 V 2.5 V + 0.2 V Vmi 1.5 V 1.5 V Vcc/2 Vmo 1.5 V 1.5 V Vcc/2 Figure 3. AC Waveforms VCC PULSE GENERATOR DUT RT CL = CL = RL = RT = CL RL 50 pF at VCC = 3.3 + 0.3 V or equivalent (includes jig and probe capacitance) 30 pF at VCC = 2.5 + 0.2 V or equivalent (includes jig and probe capacitance) R1 = 500 W or equivalent ZOUT of pulse generator (typically 50 W) Figure 4. Test Circuit http://onsemi.com 5 MC74LCX08 PACKAGE DIMENSIONS SOIC-14 CASE 751A-03 ISSUE J NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSIONS A AND B DO NOT INCLUDE MOLD PROTRUSION. 4. MAXIMUM MOLD PROTRUSION 0.15 (0.006) PER SIDE. 5. DIMENSION D DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.127 (0.005) TOTAL IN EXCESS OF THE D DIMENSION AT MAXIMUM MATERIAL CONDITION. -A- 14 8 -B- P 7 PL 0.25 (0.010) M 7 1 G -T- 0.25 (0.010) M T B S A DIM A B C D F G J K M P R J M K D 14 PL F R X 45 _ C SEATING PLANE B M S SOLDERING FOOTPRINT* 7X 7.04 14X 1.52 1 14X 0.58 1.27 PITCH DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 6 MILLIMETERS MIN MAX 8.55 8.75 3.80 4.00 1.35 1.75 0.35 0.49 0.40 1.25 1.27 BSC 0.19 0.25 0.10 0.25 0_ 7_ 5.80 6.20 0.25 0.50 INCHES MIN MAX 0.337 0.344 0.150 0.157 0.054 0.068 0.014 0.019 0.016 0.049 0.050 BSC 0.008 0.009 0.004 0.009 0_ 7_ 0.228 0.244 0.010 0.019 MC74LCX08 PACKAGE DIMENSIONS TSSOP-14 CASE 948G-01 ISSUE B 14X K REF 0.10 (0.004) 0.15 (0.006) T U M T U V S S N 2X 14 L/2 0.25 (0.010) 8 M B -U- L PIN 1 IDENT. N F 7 1 0.15 (0.006) T U NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: MILLIMETER. 3. DIMENSION A DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS. MOLD FLASH OR GATE BURRS SHALL NOT EXCEED 0.15 (0.006) PER SIDE. 4. DIMENSION B DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSION. INTERLEAD FLASH OR PROTRUSION SHALL NOT EXCEED 0.25 (0.010) PER SIDE. 5. DIMENSION K DOES NOT INCLUDE DAMBAR PROTRUSION. ALLOWABLE DAMBAR PROTRUSION SHALL BE 0.08 (0.003) TOTAL IN EXCESS OF THE K DIMENSION AT MAXIMUM MATERIAL CONDITION. 6. TERMINAL NUMBERS ARE SHOWN FOR REFERENCE ONLY. 7. DIMENSION A AND B ARE TO BE DETERMINED AT DATUM PLANE -W-. S S DETAIL E K A -V- EEE CCC CCC EEE K1 J J1 DIM A B C D F G H J J1 K K1 L M SECTION N-N -W- C 0.10 (0.004) -T- SEATING PLANE D H G DETAIL E SOLDERING FOOTPRINT* 7.06 1 0.65 PITCH 14X 0.36 14X 1.26 DIMENSIONS: MILLIMETERS *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. http://onsemi.com 7 MILLIMETERS INCHES MIN MAX MIN MAX 4.90 5.10 0.193 0.200 4.30 4.50 0.169 0.177 --- 1.20 --- 0.047 0.05 0.15 0.002 0.006 0.50 0.75 0.020 0.030 0.65 BSC 0.026 BSC 0.50 0.60 0.020 0.024 0.09 0.20 0.004 0.008 0.09 0.16 0.004 0.006 0.19 0.30 0.007 0.012 0.19 0.25 0.007 0.010 6.40 BSC 0.252 BSC 0_ 8_ 0_ 8_ MC74LCX08 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. 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