T4-LDS-0232-1, Rev. 1 (111957) ©2011 Microsemi Corporation Page 1 of 6
1N5221BUR-1 thru 1N5281BUR-1
Available on
commercial
versions
METALLURGICALL Y BONDED GLASS
SURFACE MOUNT 500 mW Z ENERS
reference to
MIL-PRF-19500
available
The 1N5221BUR-1 thru 1N5281BUR-1 ser ies of 0.5 wat t Zener voltage regulators provides a
surfac e mount equivalent to t he popu l ar JEDEC registered 1 N5221 to 1N5281 series for 2.4 t o
200 volts i n a met al lur gically bonded c onfigu r ation. Th ey are availabl e wit h standard 5% or
10% toler ances as w el l as tig hter t ol er anc es identified by dif ferent suffix let ters on the part
number. Mic r osemi als o off er s n umerous other Zener prod uc ts to meet high er and lower
power applications.
DO-213AA Package
Also available in:
DO-35 (DO-204AH)
(axial-leaded)
1N5221B-1 thru 1N5281B-1
Important: For the latest information, vi sit our website http://www.microsemi.com.
• Sur face mount equiv alent of JEDEC registered 1N5221 thru 1N5281 series.
• Voltage tolerances of 10%, 5%, 2%, and 1% available.
• Hermetical ly sealed surface mount pack age.
• I nter nal meta llurgi cal bond.
• Up-screening in reference to MIL-PRF-19500 is available. (See part nomenclature for all available
options.)
• RoHS compliant versions available (commercial grade only).
• Regulates voltage over a broad operating current and temperature range.
• Extensive selection from 2.4 to 200 V.
• Non-sensitive to ESD (MIL-STD-750 method 1020).
• Minimal capacitance (see Figure 3).
• Inherently radiation hard per Microsemi “MicroNote 050”.
MSC – Lawrence
6 Lake Street,
Lawrence, MA 01841
Tel: 1-800-446-1158 or
(978) 620-2600
Fax: (978) 689-0803
MSC – Ireland
Gort Road Business Park,
Ennis, Co. Clare, Ireland
Tel: + 353 (0) 65 6840044
Fax: +353 (0) 65 6822298
Website:
www.microsemi.com
Parameters/Test Conditions
Junction and Storage Temperature
Thermal Resistance Junction-to-Ambient (1)
Thermal Resistance Junction-to-End Cap
Steady-State Power Dissipation (2)
Solder Temperature @ 10 s
Notes: 1. When mounted on FR4 PC board (1 oz Cu) with recommended footprint (see last page).
2. At end cap temperature TEC < 125 oC or ambient temperature TA < 50 ºC when moun ted on FR4 PC
board as described for thermal resistance above (see Fi g ure 2 for derating).