Semiconductor Components Industries, LLC, 2000
March, 2000 – Rev. 3 1Publication Order Number:
MC14555B/D
MC14555B, MC14556B
Dual Binary to 1-of-4
Decoder/Demultiplexer
The MC14555B and MC14556B are constructed with
complementary MOS (CMOS) enhancement mode devices. Each
Decoder/Demultiplexer has two select inputs (A and B), an active low
Enable input (E), and four mutually exclusive outputs (Q0, Q1, Q2,
Q3). The MC14555B has the selected output go to the “high” state,
and the MC14556B has the selected output go to the “low” state.
Expanded decoding such as binary–to–hexadecimal (1–of–16), etc.,
can be achieved by using other MC14555B or MC14556B devices.
Applications include code conversion, address decoding, memory
selection control, and demultiplexing (using the Enable input as a data
input) in digital data transmission systems.
Diode Protection on All Inputs
Active High or Active Low Outputs
Expandable
Supply Voltage Range = 3.0 Vdc to 18 Vdc
All Outputs Buffered
Capable of Driving Two Low–Power TTL Loads or One Low–Power
Schottky TTL Load Over the Rated Temperature Range
MAXIMUM RATINGS (Voltages Referenced to VSS) (Note 2.)
Symbol Parameter Value Unit
VDD DC Supply Voltage Range 0.5 to +18.0 V
Vin, Vout Input or Output V oltage Range
(DC or Transient) 0.5 to VDD + 0.5 V
Iin, Iout Input or Output Current
(DC or Transient) per Pin ±10 mA
PDPower Dissipation,
per Package (Note 3.) 500 mW
TAAmbient Temperature Range 55 to +125 °C
Tstg Storage Temperature Range 65 to +150 °C
TLLead Temperature
(8–Second Soldering) 260 °C
2. Maximum Ratings are those values beyond which damage to the device
may occur.
3. Temperature Derating:
Plastic “P and D/DW” Packages: – 7.0 mW/
_
C From 65
_
C To 125
_
C
This device contains protection circuitry to guard against damage due to high
static voltages or electric fields. However, precautions must be taken to avoid
applications of any voltage higher than maximum rated voltages to this
high–impedance circuit. For proper operation, Vin and Vout should be constrained
to the range VSS
v
(Vin or Vout)
v
VDD.
Unused inputs must always be tied to an appropriate logic voltage level (e.g.,
either VSS or VDD). Unused outputs must be left open.
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X = Specific Device Code
A = Assembly Location
WL or L = W afer Lot
YY or Y = Year
WW or W = Work Week
Device Package Shipping
ORDERING INFORMATION
MC14555BCP PDIP–16 2000/Box
MC14555BD SOIC–16 48/Rail
MC14555BDR2 SOIC–16 2500/Tape & Reel
1. For ordering information on the EIAJ version of
the SOIC packages, please contact your local
ON Semiconductor representative.
MARKING
DIAGRAMS
1
16
PDIP–16
P SUFFIX
CASE 648
MC1455XBCP
AWLYYWW
SOIC–16
D SUFFIX
CASE 751B 1
16
1455XB
AWLYWW
SOEIAJ–16
F SUFFIX
CASE 966
1
16
MC1455XB
AWLYWW
MC14555BFEL SOEIAJ–16 See Note 1.
MC14555BF SOEIAJ–16 See Note 1.
MC14556BCP PDIP–16 2000/Box
MC14556BD SOIC–16 48/Rail
MC14556BDR2 SOIC–16 2500/Tape & Reel
MC14556BFEL SOEIAJ–16 See Note 1.
MC14556BF SOEIAJ–16 See Note 1.
MC14555B, MC14556B
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2
PIN ASSIGNMENTS
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
Q0B
BB
AB
EB
VDD
Q3B
Q2B
Q1B
Q0A
BA
AA
EA
VSS
Q3A
Q2A
Q1A
13
14
15
16
9
10
11
125
4
3
2
1
8
7
6
Q0B
BB
AB
EB
VDD
Q3B
Q2B
Q1B
Q0A
BA
AA
EA
VSS
Q3A
Q2A
Q1A
MC14555B MC14556B
TRUTH TABLE
Inputs Outputs
Enable Select MC14555B MC14556B
EB A Q3 Q2 Q1 Q0 Q3Q2Q1Q0
0 0 0 00011110
0 0 1 00101101
0 1 0 01001011
0 1 1 10000111
1 X X 00001111
X = Don’t Care
BLOCK DIAGRAM
24
MC14555B MC14556B
3
1
14
13
15
5
6
7
12
11
10
9
24
3
1
14
13
15
5
6
7
12
11
10
9
VDD = PIN 16
VSS = PIN 8
A
B
E
Q0
Q1
Q2
Q3
A
B
E
Q0
Q1
Q2
Q3
A
B
E
Q0
Q1
Q2
Q3
A
B
E
Q0
Q1
Q2
Q3
MC14555B, MC14556B
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3
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ELECTRICAL CHARACTERISTICS (Voltages Referenced to VSS)
V
DD
– 55
_
C 25
_
C 125
_
C
Characteristic Symbol
VDD
Vdc Min Max Min Typ (4.) Max Min Max Unit
Output Voltage “0” Level
Vin = VDD or 0 VOL 5.0
10
15
0.05
0.05
0.05
0
0
0
0.05
0.05
0.05
0.05
0.05
0.05
Vdc
“1” Level
Vin = 0 or VDD VOH 5.0
10
15
4.95
9.95
14.95
4.95
9.95
14.95
5.0
10
15
4.95
9.95
14.95
Vdc
Input Voltage “0” Level
(VO = 4.5 or 0.5 Vdc)
(VO = 9.0 or 1.0 Vdc)
(VO = 13.5 or 1.5 Vdc)
VIL 5.0
10
15
1.5
3.0
4.0
2.25
4.50
6.75
1.5
3.0
4.0
1.5
3.0
4.0
Vdc
“1” Level
(VO = 0.5 or 4.5 Vdc)
(VO = 1.0 or 9.0 Vdc)
(VO = 1.5 or 13.5 Vdc)
VIH 5.0
10
15
3.5
7.0
11
3.5
7.0
11
2.75
5.50
8.25
3.5
7.0
11
Vdc
Output Drive Current
(VOH = 2.5 Vdc) Source
(VOH = 4.6 Vdc)
(VOH = 9.5 Vdc)
(VOH = 13.5 Vdc)
IOH 5.0
5.0
10
15
– 3.0
– 0.64
– 1.6
– 4.2
– 2.4
– 0.51
– 1.3
– 3.4
– 4.2
– 0.88
– 2.25
– 8.8
– 1.7
– 0.36
– 0.9
– 2.4
mAdc
(VOL = 0.4 Vdc) Sink
(VOL = 0.5 Vdc)
(VOL = 1.5 Vdc)
IOL 5.0
10
15
0.64
1.6
4.2
0.51
1.3
3.4
0.88
2.25
8.8
0.36
0.9
2.4
mAdc
Input Current Iin 15 ±0.1 ±0.00001 ±0.1 ±1.0 µAdc
Input Capacitance
(Vin = 0) Cin 5.0 7.5 pF
Quiescent Current
(Per Package) IDD 5.0
10
15
5.0
10
20
0.005
0.010
0.015
5.0
10
20
150
300
600
µAdc
Total Supply Current (5.) (6.)
(Dynamic plus Quiescent,
Per Package)
(CL = 50 pF on all outputs, all
buffers switching)
IT5.0
10
15
IT = (0.85 µA/kHz) f + IDD
IT = (1.70 µA/kHz) f + IDD
IT = (2.60 µA/kHz) f + IDD
µAdc
4. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
5. The formulas given are for the typical characteristics only at 25
_
C.
6. To calculate total supply current at loads other than 50 pF:
IT(CL) = IT(50 pF) + (CL – 50) Vfk
where: IT is in µA (per package), CL in pF, V = (VDD – VSS) in volts, f in kHz is input frequency, and k = 0.002.
MC14555B, MC14556B
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4
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
ÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎÎ
SWITCHING CHARACTERISTICS (7.) (CL = 50 pF, TA = 25
_
C)
Characteristic Symbol VDD Min Typ (8.) Max Unit
Output Rise and Fall T ime
tTLH, tTHL = (1.5 ns/pF) CL + 25 ns
tTLH, tTHL = (0.75 ns/pF) CL + 12.5 ns
tTLH, tTHL = (0.55 ns/pF) CL + 9.5 ns
tTLH,
tTHL 5.0
10
15
100
50
40
200
100
80
ns
Propagation Delay Time — A, B to Output
tPLH, tPHL = (1.7 ns/pF) CL + 135 ns
tPLH, tPHL = (0.66 ns/pF) CL + 62 ns
tPLH, tPHL = (0.5 ns/pF) CL + 45 ns
tPLH,
tPHL 5.0
10
15
220
95
70
440
190
140
ns
Propagation Delay Time — E to Output
tPLH, tPHL = (1.7 ns/pF) CL + 115 ns
tPLH, tPHL = (0.66 ns/pF) CL + 52 ns
tPLH, tPHL = (0.5 ns/pF) CL + 40 ns
tPLH,
tPHL 5.0
10
15
200
85
65
400
170
130
ns
7. The formulas given are for the typical characteristics only at 25
_
C.
8. Data labelled “Typ” is not to be used for design purposes but is intended as an indication of the IC’s potential performance.
Figure 1. Dynamic Power Dissipation Signal Waveforms Figure 2. Dynamic Signal Waveforms
All 8 outputs connect to respective CL loads.
f in respect to a system clock.
INPUT E LOW
20 ns 20 ns
90%
50%
10%
2f
1
VDD
VSS
VDD
VSS
VOH
VOL
A INPUTS
(50% DUTY CYCLE)
B INPUTS
(50% DUTY CYCLE)
OUTPUT Q1
20 ns 20 ns
VDD
VSS
VOH
VOL
VOH
VOL
90%
50%
10%
90%
50%
10%
90%
50%
10%
tPLH
tTLH
tPHL
tPHL
tTHL
tPLH
tTLH tTHL
INPUT A HIGH, INPUT E LOW
INPUT B
OUTPUT Q3
MC14556B
OUTPUT Q3
MC14555B
LOGIC DIAGRAM
(1/2 of Dual)
*Eliminated for MC14555B
*
*
*
*
Q0
Q1
Q2
Q3
E
B
A
MC14555B, MC14556B
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5
PACKAGE DIMENSIONS
PDIP–16
P SUFFIX
PLASTIC DIP PACKAGE
CASE 648–08
ISSUE R NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION L TO CENTER OF LEADS WHEN
FORMED PARALLEL.
4. DIMENSION B DOES NOT INCLUDE MOLD FLASH.
5. ROUNDED CORNERS OPTIONAL.
–A–
B
FC
S
HGD
J
L
M
16 PL
SEATING
18
916
K
PLANE
–T–
M
A
M
0.25 (0.010) T
DIM MIN MAX MIN MAX
MILLIMETERSINCHES
A0.740 0.770 18.80 19.55
B0.250 0.270 6.35 6.85
C0.145 0.175 3.69 4.44
D0.015 0.021 0.39 0.53
F0.040 0.70 1.02 1.77
G0.100 BSC 2.54 BSC
H0.050 BSC 1.27 BSC
J0.008 0.015 0.21 0.38
K0.110 0.130 2.80 3.30
L0.295 0.305 7.50 7.74
M0 10 0 10
S0.020 0.040 0.51 1.01
____
MC14555B, MC14556B
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6
PACKAGE DIMENSIONS
SOIC–16
D SUFFIX
PLASTIC SOIC PACKAGE
CASE 751B–05
ISSUE J
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS A AND B DO NOT INCLUDE
MOLD PROTRUSION.
4. MAXIMUM MOLD PROTRUSION 0.15 (0.006)
PER SIDE.
5. DIMENSION D DOES NOT INCLUDE DAMBAR
PROTRUSION. ALLOWABLE DAMBAR
PROTRUSION SHALL BE 0.127 (0.005) TOTAL
IN EXCESS OF THE D DIMENSION AT
MAXIMUM MATERIAL CONDITION.
18
16 9
SEATING
PLANE
F
J
M
RX 45
_
G
8 PLP
–B–
–A–
M
0.25 (0.010) B S
–T–
D
K
C
16 PL
S
B
M
0.25 (0.010) A S
T
DIM MIN MAX MIN MAX
INCHESMILLIMETERS
A9.80 10.00 0.386 0.393
B3.80 4.00 0.150 0.157
C1.35 1.75 0.054 0.068
D0.35 0.49 0.014 0.019
F0.40 1.25 0.016 0.049
G1.27 BSC 0.050 BSC
J0.19 0.25 0.008 0.009
K0.10 0.25 0.004 0.009
M0 7 0 7
P5.80 6.20 0.229 0.244
R0.25 0.50 0.010 0.019
____
MC14555B, MC14556B
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7
PACKAGE DIMENSIONS
HE
A1
DIM MIN MAX MIN MAX
INCHES
––– 2.05 ––– 0.081
MILLIMETERS
0.05 0.20 0.002 0.008
0.35 0.50 0.014 0.020
0.18 0.27 0.007 0.011
9.90 10.50 0.390 0.413
5.10 5.45 0.201 0.215
1.27 BSC 0.050 BSC
7.40 8.20 0.291 0.323
0.50 0.85 0.020 0.033
1.10 1.50 0.043 0.059
0
0.70 0.90 0.028 0.035
––– 0.78 ––– 0.031
A1
HE
Q1
LE
_
10
_
0
_
10
_
LEQ1
_
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: MILLIMETER.
3. DIMENSIONS D AND E DO NOT INCLUDE
MOLD FLASH OR PROTRUSIONS AND ARE
MEASURED AT THE PARTING LINE. MOLD FLASH
OR PROTRUSIONS SHALL NOT EXCEED 0.15
(0.006) PER SIDE.
4. TERMINAL NUMBERS ARE SHOWN FOR
REFERENCE ONLY.
5. THE LEAD WIDTH DIMENSION (b) DOES NOT
INCLUDE DAMBAR PROTRUSION. ALLOWABLE
DAMBAR PROTRUSION SHALL BE 0.08 (0.003)
TOTAL IN EXCESS OF THE LEAD WIDTH
DIMENSION A T MAXIMUM MATERIAL CONDITION.
DAMBAR CANNOT BE LOCATED ON THE LOWER
RADIUS OR THE FOOT. MINIMUM SPACE
BETWEEN PROTRUSIONS AND ADJACENT LEAD
TO BE 0.46 ( 0.018).
M
L
DETAIL P
VIEW P
c
A
b
e
M
0.13 (0.005) 0.10 (0.004)
1
16 9
8
D
Z
E
A
b
c
D
E
e
L
M
Z
SOEIAJ–16
F SUFFIX
PLASTIC EIAJ SOIC PACKAGE
CASE 966–01
ISSUE O
MC14555B, MC14556B
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8
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without further notice to any products herein. SCILLC makes no warranty , representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “T ypicals” must be
validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others.
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attorney fees arising out of, directly or indirectly , any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim
alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Af firmative Action Employer.
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Sales Representative.
MC14555B/D
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