© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/18
Thyristors
Surface Mount – 50 - 100V > MCR69-2, MCR69-3
• Glass-Passivated Junctions for Greater Parameter Stability
and Reliability
• Center-Gate Geometry for Uniform Current Spreading
Enabling High Discharge Current
• Small Rugged, Thermowatt Package Constructed for Low
Thermal Resistance and Maximum Power Dissipation
and Durability
• High Capacitor Discharge Current, 750 Amps
• Pb−Free Packages are Available
Features
Designed for overvoltage protection in crowbar circuits.
Description
MCR69-2, MCR69-3
Functional Diagram
Pb
Additional Information
Samples
Resources
Datasheet
Pin Out
CASE 221A
STYLE 3
123
4
MCR69x
AKA
AYWW
Pin Assignment
1 Cathode
2 Anode
3 Gate
4 Anode
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/18
Thyristors
Surface Mount – 50 - 100V > MCR69-2, MCR69-3
Rating Part Number Symbol Value Unit
Peak Repetitive Off-State Voltage (Note 1)
(TJ = -40 to +125°C, Gate Open)
MCR169-2 VDRM,
VRRM
50
V
MCR69-3 100
Peak Discharge Current (Note 2) ITM 750 A
On-State RMS Current (180° Conduction Angles; TC = 85°C) IT (RMS) 25 A
Average On-State Current (180° Conduction Angles; TC = 80°C) IT(AV) 16 A
Peak Non-Repetitive Surge Current (1/2 Cycle, Sine Wave, 60 Hz, TJ = 125°C) ITSM 300 A
Circuit Fusing Considerations (t = 8.3 ms) I2t 375 A2sec
Forward Peak Gate Current (Pulse Width ≤ 1.0 µs, TC = 85°C) IGM 2.0 A
Forward Average Gate Power (t = 8.3 ms, TC = 80°C) PGM 20 W
Operating Junction Temperature Range TJ-40 to +125 °C
Storage Temperature Range Tstg -40 to +150 °C
Mounting Torque – 8.0 in. lb.
Maximum Ratings (TJ = 25°C unless otherwise noted)
Maximum ratings are those values beyond which device damage can occur. Maximum ratings applied to the device are individual stress limit values (not normal
operating conditions) and are not valid simultaneously. If these limitsare exceeded, device functional operation is not implied, damage may occur and reliability
may be affected.
1. VDRM and VRRM for all types can be applied on a continuous basis. Ratings apply for zero or negative gate voltage; however, positive gate voltage shall
not be applied concurrent with negative potential on the anode. Blocking voltages shall not be tested with a constant current source such that the voltage
ratings of the devices are exceeded.
2. Ratings apply for tw = 1 ms. See Figure 1 for ITM capability for various duration of an exponentially decaying current waveform, tw is defined as 5 time
constants of an exponentially decaying current pulse.
3. Test Conditions: IG = 150 mA, VD = Rated VDRM, ITM = Rated Value, TJ = 125°C.
Thermal Characteristics
Characterstic Symbol Value Unit
Thermal Resistance, Junction-to-Case RΘJC 1.5 °C/W
Thermal Resistance, Junction-to-Ambient RΘJA 60
Maximum Lead Temperature for Soldering Purposes, 1/8” from
case for 10 seconds TL260 °C
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/18
Thyristors
Surface Mount – 50 - 100V > MCR69-2, MCR69-3
Electrical Characteristics - OFF (TJ = 25°C unless otherwise noted)
Electrical Characteristics - ON
Characteristic Symbol Min Typ Max Unit
Peak Repetitive Blocking Current
(VAK = VDRM = VRRM; Gate Open)
TJ = 25°C IDRM
IRRM
- - 10 µA
TJ = 125°C - - 2.0 mA
Dynamic Characteristics
Characteristic Symbol Min Typ Max Unit
Critical Rate−of−Rise of Off-State Voltage
(VD = Rated VDRM, Exponential Waveform, Gate Open, TJ = 125°C) dv/dt 10 – − V/µs
Critical Rate of Rise of On−State Current
IG = 150 mA , TJ = 125°C di/dt – – 100 A/µs
Characteristic Symbol Min Typ Max Unit
Peak Forward On−State Voltage
(Note 4) (ITM = 50 A)
VTM
− – 1.8
V
(ITM = 750 A, tw = 1 ms)
(Note 5) − 6.0 −
Gate Trigger Current (Continuous dc) (VD = 12 V, RL = 100 Ω) IGT 2.0 7. 0 30 mA
Gate Trigger Voltage (Continuous dc) (VD = 12 Vdc, RL = 100 Ω) VGT 0.5 0.65 1.0 V
Gate Non-Trigger Voltage (Continuous dc) (VD = 12 Vdc, RL = 100 Ω, TJ -125ºC) VGD 0.2 0.40 – V
Holding Current (VD = 12 Vdc, Initiating Current = 200 mA, Gate Open) IH3.0 15 50 mA
Latch Current (VD = 12 VDC, IG = 150 mA) IL– – 60 mA
Gate Controlled Turn-On Time (Note 6) (VD = Rated VDRM, IG = 150 mA)
(ITM = 50 A Peak) tgt –1.0 – µs
4. Pulse duration ≤ 300 µs, duty cycle ≤ 2%.
5. Ratings apply for tw = 1 ms. See Figure 1 for ITM capability for various durations of an exponentially decaying current waveform.
tw is defined as 5 time constants of an exponentially decaying current pulse.
6. The gate controlled turn-on time in a crowbar circuit will be influenced by the circuit inductance.
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/18
Thyristors
Surface Mount – 50 - 100V > MCR69-2, MCR69-3
Voltage Current Characteristic of SCR
Symbol Parameter
VDRM Peak Repetitive Forward Off State Voltage
IDRM Peak Forward Blocking Current
VRRM Peak Repetitive Reverse Off State Voltage
IRRM Peak Reverse Blocking Current
VTM Maximum On State Voltage
IHHolding Current
I
I
I
Figure 1. Typical RMS Current Derating Figure 2. Peak Capacitor Discharge Current Derating
Figure 4. Maximum Power DissipationFigure 3. Current Derating
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/18
Thyristors
Surface Mount – 50 - 100V > MCR69-2, MCR69-3
Figure 7. Gate Trigger Voltage
Figure 5. Thermal Response
Figure 6.Gate Trigger Current
Figure 8. Holding Current
2 k 10 kk 3k 510
t, TIME (ms)
1 k030 50 010 020 030 05
0.2
20
1
0.7
0.5
0.
1
0.2
0.02
5233
.
05
.
010.
1
0.3
0.07
0.05
0.03
0.01
ZJC(t
)
= R JC • r(t
)
r(t), TRANSIENT THERMAL RESISTANCE(NORMALIZED
)
© 2018 Littelfuse, Inc.
Specifications are subject to change without notice.
Revised: 12/20/18
Thyristors
Surface Mount – 50 - 100V > MCR69-2, MCR69-3
Dimensions Part Marking System
Ordering Information
Device Package Shipping
MCR69-2 TO-220AB
500 / Box
MCR69-2G TO-220AB
(Lead-Free)
MCR69-3 TO-220AB
MCR69-3G TO-220AB
(Lead-Free)
CASE 221A
STYLE 3
123
4
MCR69x
A= Assembly Location
Y= Year
WW = Work Week
MCR69= Device Code
x= 2 or 3
AKA= Location Code
AKA
AYWW
A
K
L
V
G
D
N
Z
H
Q
FB
12 3
4
PLANE
SEATING
S
R
J
U
T
C
1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. DIMENSION Z DEFINES A ZONE WHERE ALL BODY AND LEAD IRREGULARITIES ARE
ALLOWED.
Dim
Inches Millimeters
Min Max Min Max
A 0.590 0.620 14.99 15.75
B 0.380 0.420 9.65 10.67
C 0.178 0.188 4.52 4.78
D 0.025 0.035 0.64 0.89
F 0.142 0.147 3.61 3.73
G 0.095 0.105 2.41 2.67
H0.110 0.130 2.79 3.30
J0.018 0.024 0.46 0.61
K 0.540 0.575 13.72 14.61
L 0.060 0.075 1.52 1.91
N 0.195 0.205 4.95 5.21
Q 0.105 0.115 2.67 2.92
R 0.085 0.095 2.16 2.41
S 0.045 0.060 1. 14 1.52
T 0.235 0.255 5.97 6.47
U 0.000 0.050 0.00 1.27
V 0.045 --- 1.15 ---
Z --- 0.080 --- 2.04
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test each product selected for their own applications. Littelfuse products are not designed for, and may not be used in, all applications.
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