DS90CF383B
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SNLS178E –JULY 2004–REVISED APRIL 2013
+3.3V Programmable LVDS Transmitter 24-Bit Flat Panel Display (FPD) Link-65 MHz
Check for Samples: DS90CF383B
1FEATURES DESCRIPTION
The DS90CF383B transmitter converts 28 bits of
23• No Special Start-up Sequence Required CMOS/TTL data into four LVDS (Low Voltage
Between Clock/Data and /PD Pins. Input Signal Differential Signaling) data streams. A phase-locked
(Clock and Data) Can be Applied Either Before transmit clock is transmitted in parallel with the data
or After the Device is Powered. streams over a fifth LVDS link. Every cycle of the
• Support Spread Spectrum Clocking Up to transmit clock 28 bits of input data are sampled and
100KHz Frequency Modulation & Deviations of transmitted. At a transmit clock frequency of 65 MHz,
24 bits of RGB data and 3 bits of LCD timing and
±2.5% Center Spread or −5% Down Spread. control data (FPLINE, FPFRAME, DRDY) are
• "Input Clock Detection" Feature Will Pull All transmitted at a rate of 455 Mbps per LVDS data
LVDS Pairs to Logic Low when Input Clock is channel. Using a 65 MHz clock, the data throughput
Missing and When /PD Pin is Logic High. is 227 Mbytes/sec. The DS90CF383B is fixed as a
• 18 to 68 MHz Shift Clock Support Falling edge strobe transmitter and will interoperate
with a Falling edge strobe Receiver (DS90CF386)
• Best–in–Class Set & Hold Times on TxINPUTs without any translation logic.
• Tx Power Consumption < 130 mW (typ)
@65MHz Grayscale This chipset is an ideal means to solve EMI and
cable size problems associated with wide, high speed
• 40% Less Power Dissipation Than BiCMOS TTL interfaces.
Alternatives
• Tx Power-down Mode < 60μW (typ)
• Supports VGA, SVGA, XGA and Dual Pixel
SXGA.
• Narrow Cus Reduces Cable Size and Cost
• Up to 1.8 Gbps Throughput
• Up to 227 Megabytes/sec Bandwidth
• 345 mV (typ) Swing LVDS Devices for Low EMI
• PLL Requires No External Components
• Compatible with TIA/EIA-644 LVDS Standard
• Low Profile 56-Lead TSSOP Package
• Improved Replacement for:
– SN75LVDS83, DS90CF383A
1Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
2TRI-STATE is a registered trademark of Texas Instruments.
3All other trademarks are the property of their respective owners.
PRODUCTION DATA information is current as of publication date. Copyright © 2004–2013, Texas Instruments Incorporated
Products conform to specifications per the terms of the Texas
Instruments standard warranty. Production processing does not
necessarily include testing of all parameters.
DS90CF383B
SNLS178E –JULY 2004–REVISED APRIL 2013
www.ti.com
Block Diagram
DS90CF383B
See Package Number DGG0056A
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
Absolute Maximum Ratings (1)(2)(1)
Value Unit
Supply Voltage (VCC)−0.3V to +4 V
CMOS/TTL Input Voltage −0.3V to (VCC + 0.3) V
LVDS Driver Output Voltage −0.3V to (VCC + 0.3) V
LVDS Output Short Circuit
Duration Continuous
Junction Temperature +150 °C
Storage Temperature −65°C to +150 °C
Lead Temperature
(Soldering, 4 sec) +260 °C
Maximum Package Power Dissipation Capacity @ 25°C DGG0056A (TSSOP) Package:
DS90CF383B 1.63 W
Package Derating: 12.5 mW/°C above
DS90CF383B +25°C
ESD Rating (HBM, 1.5 kΩ, 100 pF) 7 kV
ESD Rating (EIAJ, 0Ω, 200 pF) 500 V
(1) If Military/Aerospace specified devices are required, please contact the TI Sales Office/ Distributors for availability and specifications.
(2) “Absolute Maximum Ratings” are those values beyond which the safety of the device cannot be verified. They are not meant to imply
that the device should be operated at these limits. The “Electrical Characteristics” specify conditions for device operation.
Recommended Operating Conditions Min Nom Max Units
Supply Voltage (VCC) 3.0 3.3 3.6 V
Operating Free Air Temperature (TA)−10 +25 +70 °C
Supply Noise Voltage (VCC) 200 mVPP
TxCLKIN frequency 18 68 MHz
Electrical Characteristics(1)
Over recommended operating supply and temperature ranges unless otherwise specified.
(1) Current into device pins is defined as positive. Current out of device pins is defined as negative. Voltages are referenced to ground
unless otherwise specified (except VOD and ΔVOD).
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Electrical Characteristics(1) (continued)
Over recommended operating supply and temperature ranges unless otherwise specified.
Symbol Parameter Conditions Min Typ(2) Max Units
CMOS/TTL DC SPECIFICATIONS
VIH High Level Input Voltage 2.0 VCC V
VIL Low Level Input Voltage GND 0.8 V
VCL Input Clamp Voltage ICL =−18 mA −0.79 −1.5 V
IIN Input Current V IN = 0.4V, 2.5V or VCC +1.8 +10 μA
VIN = GND −10 0 μA
LVDS DC SPECIFICATIONS
VOD Differential Output Voltage RL= 100Ω250 345 450 mV
ΔVOD Change in VOD between complimentary 35 mV
output states
VOS Offset Voltage (3) 1.13 1.25 1.38 V
ΔVOS Change in VOS between complimentary 35 mV
output states
IOS Output Short Circuit Current VOUT = 0V, RL= 100Ω −3.5 −5 mA
IOZ Output TRI-STATE®Current Power Down = 0V, ±1 ±10 μA
VOUT = 0V or V CC
TRANSMITTER SUPPLY CURRENT
ICCTW Transmitter Supply Current RL= 100Ω, f = 25 MHz 31 45 mA
Worst Case CL= 5 pF, f = 40 MHz 37 50 mA
Worst Case Pattern f = 65 MHz 48 60 mA
(Figure 1 Figure 4 )" Typ
" values are given for V CC
= 3.6V and TA= +25°C, "
Max " values are given for
VCC = 3.6V and TA=
−10°C
ICCTG Transmitter Supply Current RL= 100Ω, f = 25 MHz 29 40 mA
16 Grayscale CL= 5 pF, f = 40 MHz 33 45 mA
16 Grayscale Pattern f = 65 MHz 39 50 mA
(Figure 2 Figure 4 )" Typ
" values are given for V CC
= 3.6V and TA= +25°C, "
Max " values are given for
VCC = 3.6V and TA=
−10°C
ICCTZ Transmitter Supply Current Power Down = Low 17 150 μA
Power Down Driver Outputs in TRI-STATE®under
Power Down Mode
(2) Typical values are given for VCC = 3.3V and T A= +25°C unless specified otherwise.
(3) VOS previously referred as VCM.
Recommended Transmitter Input Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
TCIT TxCLK IN Transition Time (Figure 5 )5 ns
TCIP TxCLK IN Period (Figure 6 )14.7 T 50 ns
TCIH TxCLK IN High Time (Figure 6 )0.35T 0.5T 0.65T ns
TCIL TxCLK IN Low Time (Figure 6)0.35T 0.5T 0.65T ns
TXIT TxIN, and Power Down pin Transition Time 1.5 6 ns
TXPD Minimum pulse width for Power Down pin signal 1 us
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Transmitter Switching Characteristics
Over recommended operating supply and temperature ranges unless otherwise specified
Symbol Parameter Min Typ Max Units
LLHT LVDS Low-to-High Transition Time (Figure 4 )0.75 1.4 ns
LHLT LVDS High-to-Low Transition Time (Figure 4 )0.75 1.4 ns
TPPos0 Transmitter Output Pulse Position for Bit 0 (Figure 11 )(1) f = 65 −0.20 0 +0.20 ns
MHz
TPPos1 Transmitter Output Pulse Position for Bit 1 2.00 2.20 2.40 ns
TPPos2 Transmitter Output Pulse Position for Bit 2 4.20 4.40 4.60 ns
TPPos3 Transmitter Output Pulse Position for Bit 3 6.39 6.59 6.79 ns
TPPos4 Transmitter Output Pulse Position for Bit 4 8.59 8.79 8.99 ns
TPPos5 Transmitter Output Pulse Position for Bit 5 10.70 10.99 11.19 ns
TPPos6 Transmitter Output Pulse Position for Bit 6 12.99 13.19 13.39 ns
TPPos0 Transmitter Output Pulse Position for Bit 0 (Figure 11 )(1) f = 40 −0.25 0 +0.25 ns
MHz
TPPos1 Transmitter Output Pulse Position for Bit 1 3.32 3.57 3.82 ns
TPPos2 Transmitter Output Pulse Position for Bit 2 6.89 7.14 7.39 ns
TPPos3 Transmitter Output Pulse Position for Bit 3 10.46 10.71 10.96 ns
TPPos4 Transmitter Output Pulse Position for Bit 4 14.04 14.29 14.54 ns
TPPos5 Transmitter Output Pulse Position for Bit 5 17.61 17.86 18.11 ns
TPPos6 Transmitter Output Pulse Position for Bit 6 21.18 21.43 21.68 ns
TPPos0 Transmitter Output Pulse Position for Bit 0 (Figure 11 )(1) f = 25 −0.45 0 +0.45 ns
MHz
TPPos1 Transmitter Output Pulse Position for Bit 1 5.26 5.71 6.16 ns
TPPos2 Transmitter Output Pulse Position for Bit 2 10.98 11.43 11.88 ns
TPPos3 Transmitter Output Pulse Position for Bit 3 16.69 17.14 17.59 ns
TPPos4 Transmitter Output Pulse Position for Bit 4 22.41 22.86 23.31 ns
TPPos5 Transmitter Output Pulse Position for Bit 5 28.12 28.57 29.02 ns
TPPos6 Transmitter Output Pulse Position for Bit 6 33.84 34.29 34.74 ns
TSTC TxIN Setup to TxCLK IN (Figure 6 )2.5 ns
THTC TxIN Hold to TxCLK IN (Figure 6 )0.5 ns
TCCD TxCLK IN to TxCLK OUT Delay (Figure 7 )50% duty cycle input clock is 3.011 6.062 ns
assumed, TA=−10°C, and 65MHz for " Min ", TA= 70°C, and 25MHz for
" Max ", VCC = 3.6V
SSCG Spread Spectrum Clock support; Modulation frequency with a linear f = 25 100KHz ±
profile (2) MHz 2.5%/−5%
f = 40 100KHz ±
MHz 2.5%/−5%
f = 65 100KHz ±
MHz 2.5%/−5%
TPLLS Transmitter Phase Lock Loop Set (Figure 8 )10 ms
TPDD Transmitter Power Down Delay (Figure 10 )100 ns
(1) The Minimum and Maximum Limits are based on statistical analysis of the device performance over process, voltage, and temperature
ranges. This parameter is functionality tested only on Automatic Test Equipment (ATE).
(2) Care must be taken to ensure TSTC and THTC are met so input data are sampling correctly. This SSCG parameter only shows the
performance of tracking Spread Spectrum Clock applied to TxCLK IN pin, and reflects the result on TxCLKOUT+ and TxCLK−pins.
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SNLS178E –JULY 2004–REVISED APRIL 2013
AC Timing Diagrams
Figure 1. “Worst Case” Test Pattern
The worst case test pattern produces a maximum toggling of digital circuits, LVDS I/O and CMOS/TTL I/O.
The 16 grayscale test pattern tests device power consumption for a “typical” LCD display pattern. The test pattern
approximates signal switching needed to produce groups of 16 vertical stripes across the display.
Figure 1 and Figure 2 show a falling edge data strobe (TxCLK IN/RxCLK OUT).
Recommended pin to signal mapping. Customer may choose to define differently.
Figure 2. “16 Grayscale” Test Pattern
Figure 3. DS90CF383B (Transmitter) LVDS Output Load
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SNLS178E –JULY 2004–REVISED APRIL 2013
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Figure 4. DS90CF383B (Transmitter) LVDS Transition Times
Figure 5. DS90CF383B (Transmitter) Input Clock Transition Time
Figure 6. DS90CF383B (Transmitter) Setup/Hold and High/Low Times (Falling Edge Strobe)
Figure 7. DS90CF383B (Transmitter) Clock In to Clock Out Delay (Falling Edge Strobe)
Figure 8. DS90CF383B (Transmitter) Phase Lock Loop Set Time
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SNLS178E –JULY 2004–REVISED APRIL 2013
Figure 9. 28 Parallel TTL Data Inputs Mapped to LVDS Outputs
Figure 10. Transmitter Power Down Delay
Figure 11. Transmitter LVDS Output Pulse Position Measurement
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DS90CF383B
SNLS178E –JULY 2004–REVISED APRIL 2013
www.ti.com
DS90CF383B PIN DESCRIPTIONS — FPD LINK TRANSMITTER
Pin Name I/O No. Description
TxIN I 28 TTL level input. This includes: 8 Red, 8 Green, 8 Blue, and 4 control lines—FPLINE, FPFRAME and
DRDY (also referred to as HSYNC, VSYNC, Data Enable).
TxOUT+ O 4 Positive LVDS differential data output.
TxOUT−O 4 Negative LVDS differential data output.
FPSHIFT IN I 1 TTL Ievel clock input. The falling edge acts as data strobe. Pin name TxCLK IN.
TxCLK OUT+ O 1 Positive LVDS differential clock output.
TxCLK OUT−O 1 Negative LVDS differential clock output.
PWR DOWN I 1 TTL level input. Assertion (low input) TRI-STATES the outputs, ensuring low current at power down.
See Applications Information.
VCC I 4 Power supply pins for TTL inputs.
GND I 5 Ground pins for TTL inputs.
PLL VCC I 1 Power supply pin for PLL.
PLL GND I 2 Ground pins for PLL.
LVDS VCC I 1 Power supply pin for LVDS outputs.
LVDS GND I 3 Ground pins for LVDS outputs.
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SNLS178E –JULY 2004–REVISED APRIL 2013
APPLICATIONS INFORMATION
The DS90CF383B are backward compatible with the DS90C383/DS90CF383, DS90C383A/DS90CF383A and
are a pin-for-pin replacement.
This device may also be used as a replacement for the DS90CF583 (5V, 65MHz) and DS90CF581 (5V, 40MHz)
FPD-Link Transmitters with certain considerations/modifications:
1. Change 5V power supply to 3.3V. Provide this supply to the VCC, LVDS VCC and PLL VCC of the transmitter.
TRANSMITTER INPUT PINS
The DS90CF383B transmitter input and control inputs accept 3.3V LVTTL/LVCMOS levels. They are not 5V
tolerant.
TRANSMITTER CLOCK CLOCK/DATA SEQUENCING
The DS90CF383B does not require any special requirement for sequencing of the input clock/data and PD
(PowerDown) signal. The DS90CF383B offers a more robust input sequencing feature where the input clock/data
can be inserted after the release of the PD signal. In the case where the clock/data is stopped and reapplied,
such as changing video mode within Graphics Controller, it is not necessary to cycle the PD signal. However,
there are in certain cases where the PD may need to be asserted during these mode changes. In cases where
the source (Graphics Source) may be supplying an unstable clock or spurious noisy clock output to the LVDS
transmitter, the LVDS Transmitter may attempt to lock onto this unstable clock signal but is unable to do so due
the instability or quality of the clock source. The PD signal in these cases should then be asserted once a stable
clock is applied to the LVDS transmitter. Asserting the PWR DOWN pin will effectively place the device in reset
and disable the PLL, enabling the LVDS Transmitter into a power saving standby mode. However, it is still
generally a good practice to assert the PWR DOWN pin or reset the LVDS transmitter whenever the clock/data is
stopped and reapplied but it is not mandatory for the DS90CF383B.
SPREAD SPECTRUM CLOCK SUPPORT
The DS90CF383B can support Spread Spectrum Clocking signal type inputs. The DS90CF383B outputs will
accurately track Spread Spectrum Clock/Data inputs with modulation frequencies of up to 100KHz (max.)with
either center spread of ±2.5% or down spread -5% deviations.
POWER SOURCES SEQUENCE
In typical applications, it is recommended to have VCC, LVDS VCC and PLL VCC from the same power source with
three separate de-coupling bypass capacitor groups. There is no requirement on which VCC entering the device
first.
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SNLS178E –JULY 2004–REVISED APRIL 2013
REVISION HISTORY
Changes from Revision D (April 2013) to Revision E Page
• Changed layout of National Data Sheet to TI format .......................................................................................................... 10
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PACKAGE OPTION ADDENDUM
www.ti.com 17-Apr-2013
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead/Ball Finish MSL Peak Temp
(3)
Op Temp (°C) Top-Side Markings
(4)
Samples
DS90CF383BMTX/NOPB ACTIVE TSSOP DGG 56 1000 Green (RoHS
& no Sb/Br) CU SN Level-2-260C-1 YEAR -10 to 70 DS90CF383BMT
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) Eco Plan - The planned eco-friendly classification: Pb-Free (RoHS), Pb-Free (RoHS Exempt), or Green (RoHS & no Sb/Br) - please check http://www.ti.com/productcontent for the latest availability
information and additional product content details.
TBD: The Pb-Free/Green conversion plan has not been defined.
Pb-Free (RoHS): TI's terms "Lead-Free" or "Pb-Free" mean semiconductor products that are compatible with the current RoHS requirements for all 6 substances, including the requirement that
lead not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, TI Pb-Free products are suitable for use in specified lead-free processes.
Pb-Free (RoHS Exempt): This component has a RoHS exemption for either 1) lead-based flip-chip solder bumps used between the die and package, or 2) lead-based die adhesive used between
the die and leadframe. The component is otherwise considered Pb-Free (RoHS compatible) as defined above.
Green (RoHS & no Sb/Br): TI defines "Green" to mean Pb-Free (RoHS compatible), and free of Bromine (Br) and Antimony (Sb) based flame retardants (Br or Sb do not exceed 0.1% by weight
in homogeneous material)
(3) MSL, Peak Temp. -- The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) Multiple Top-Side Markings will be inside parentheses. Only one Top-Side Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a
continuation of the previous line and the two combined represent the entire Top-Side Marking for that device.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
DS90CF383BMTX/NOPB TSSOP DGG 56 1000 330.0 24.4 8.6 14.5 1.8 12.0 24.0 Q1
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2013
Pack Materials-Page 1
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
DS90CF383BMTX/NOPB TSSOP DGG 56 1000 367.0 367.0 45.0
PACKAGE MATERIALS INFORMATION
www.ti.com 24-Apr-2013
Pack Materials-Page 2
www.ti.com
PACKAGE OUTLINE
C
TYP
8.3
7.9
1.2 MAX
54X 0.5
56X 0.27
0.17
2X
13.5
(0.15) TYP
0 - 8
0.15
0.05
0.25
GAGE PLANE
0.75
0.50
A
NOTE 3
14.1
13.9
B6.2
6.0
4222167/A 07/2015
TSSOP - 1.2 mm max heightDGG0056A
SMALL OUTLINE PACKAGE
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4. Reference JEDEC registration MO-153.
156
0.08 C A B
29
28
PIN 1 ID
AREA
SEATING PLANE
0.1 C
SEE DETAIL A
DETAIL A
TYPICAL
SCALE 1.200
www.ti.com
EXAMPLE BOARD LAYOUT
(7.5)
0.05 MAX
ALL AROUND
0.05 MIN
ALL AROUND
56X (1.5)
56X (0.3)
54X (0.5)
(R )
TYP
0.05
4222167/A 07/2015
TSSOP - 1.2 mm max heightDGG0056A
SMALL OUTLINE PACKAGE
SYMM
SYMM
LAND PATTERN EXAMPLE
SCALE:6X
1
28 29
56
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
SOLDER MASK DETAILS
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
www.ti.com
EXAMPLE STENCIL DESIGN
(7.5)
54X (0.5)
56X (0.3)
56X (1.5)
(R ) TYP0.05
4222167/A 07/2015
TSSOP - 1.2 mm max heightDGG0056A
SMALL OUTLINE PACKAGE
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SYMM
SYMM
1
28 29
56
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:6X
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