Notice for TAIYO YUDEN products Please read this notice before using the TAIYO YUDEN products. REMINDERS Product information in this catalog is as of October 2011. All of the contents specified herein are subject to change without notice due to technical improvements, etc. Therefore, please check for the latest information carefully before practical application or usage of the Products. Please note that Taiyo Yuden Co., Ltd. shall not be responsible for any defects in products or equipment incorporating such products, which are caused under the conditions other than those specified in this catalog or individual specification. Please contact Taiyo Yuden Co., Ltd. for further details of product specifications as the individual specification is available. Please conduct validation and verification of products in actual condition of mounting and operating environment before commercial shipment of the equipment. All electronic components or functional modules listed in this catalog are developed, designed and intended for use in general electronics equipment.(for AV, office automation, household, office supply, information service, telecommunications, (such as mobile phone or PC) etc.). Before incorporating the components or devices into any equipment in the field such as transportation,( automotive control, train control, ship control), transportation signal, disaster prevention, medical, public information network (telephone exchange, base station) etc. which may have direct influence to harm or injure a human body, please contact Taiyo Yuden Co., Ltd. for more detail in advance. Do not incorporate the products into any equipment in fields such as aerospace, aviation, nuclear control, submarine system, military, etc. where higher safety and reliability are especially required. In addition, even electronic components or functional modules that are used for the general electronic equipment, if the equipment or the electric circuit require high safety or reliability function or performances, a sufficient reliability evaluation check for safety shall be performed before commercial shipment and moreover, due consideration to install a protective circuit is strongly recommended at customer's design stage. The contents of this catalog are applicable to the products which are purchased from our sales offices or distributors (so called"TAIYO YUDEN' s official sales channel"). It is only applicable to the products purchased from any of TAIYO YUDEN's official sales channel. Please note that Taiyo Yuden Co., Ltd. shall have no responsibility for any controversies or disputes that may occur in connection with a third party's intellectual property rights and other related rights arising from your usage of products in this catalog. Taiyo Yuden Co., Ltd. grants no license for such rights. Caution for export Certain items in this catalog may require specific procedures for export according to"Foreign Exchange and Foreign Trade Control Law"of Japan,"U.S. Export Administration Regulations", and other applicable regulations. Should you have any question or inquiry on this matter, please contact our sales staff. 12 notice_e-01 SUPER LOW DISTORTION MULTILAYER CERAMIC CAPACITORSCFCAPTM REFLOW FEATURES APPLICATIONS Newly developed dielectric material and the use of nickel for internal electrodes provide superior temperature characteristics with high capacitance, small case size and low cost. Signal line for AV products Analog signal coupling applications PLL circuit of mobile phones Low distortion and low shock noise make these capacitors appropriate for use in analog or digital mobile devices. Good temperature characteristics for time constant circuits, oscillation circuits and filters Superior heat-resistance, high breakdown voltage, and mechanical strength make these capacitors appropriate for replacing film capacitors. PART NUMBER T M K 3 Rated voltageVDC U 50 G 35 T 25 E 16 L 10 M J 6.3 End termination K Plated Series name Multilayer ceramic capacitor 1 6 S Type 105 107 212 316 D 1 0 Dimension inch LxWmm 0402 1.0x0.5 0603 1.6x0.8 0805 2.0x1.25 1206 3.2x1.6 Series symbol SD Standard Nominal capacitanceF example 223 0.022 104 0.1 Dimension tolerance Standard 4 Capacitance tolerance K 10% Blank space K L T Thickness mm P 0.3 V 0.5 A 0.8 D 0.85 F 1.15 G 1.25 L 1.6 Special code Standard Internal code Standard Blank space Packaging 178mm Taping 4mm pitch 107, 212, 316 Type 178mm Taping 2mm pitch 105 Type T F STANDARD EXTERNAL DIMENSIONS/STANDARD QUANTITY Dimension [mm] Type L W MK105 0402 inch 1.00.05 0.50.05 MK107 0603 inch 1.60.10 0.80.10 MK212 0805 inch 2.00.10 1.250.10 MK316 1206 inch 3.20.15 1.60.15 T 0.30.03 0.50.05 Standard quantity [pcs] Paper tape Embossed tape e P V 0.250.10 0.80.10 A 0.350.25 4000 0.850.10 1.250.10 1.150.10 1.60.20 D G F L 0.50.25 4000 0.5 0.35/0.25 3000 3000 2000 10000 AVAILABLE CAPACITANCE RANGE Cap [pF] 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 10000 12000 15000 18000 22000 27000 33000 39000 47000 56000 68000 82000 100000 Type VDC [3-digit] 391 471 561 681 821 102 122 152 182 222 272 332 392 472 562 682 822 103 123 153 183 223 273 333 393 473 563 683 823 104 50V 25V 105 SD 16V 107 SD 10V 6.3V 50V 25V 212 SD 16V 10V 50V 35V 316 SD 16V 10V 35V 25V V V V V V V V V V V V P P V V V A A A A A A A A A D D D D D D A A A A A A A A D D G G G D F F D G G G Letters in the table indicate thickness. F F F L L This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 22 12 mlcc05_e-01 REPRESENTATIVE PART NUMBERS 105TYPE 0.5mm thickness V Rated voltage Part number 1 50V Part number 2 25V 16V 10V Capacitance pF Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave Standard type 390 470 560 680 820 1000 1200 1500 1800 2200 2700 3300 3900 4700 10 10 10 10 10 10 10 10 10 10 10 10 10 10 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 0.50.05 R R R R R R R R R R R R R R Temp. char. Capacitance pF Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave Standard type 1500 2700 10 10 0.1 0.1 0.30.03 0.30.03 R R HALT % Rated voltage 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% Internal code P/N 1 Note HALT % Rated voltage 200% 200% Internal code P/N 1 Note HALT % Rated voltage 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% Internal code P/N 1 Note HALT % Rated voltage 200% 200% 200% 200% 200% 200% Internal code P/N 1 Note HALT % Rated voltage 200% 200% 200% 200% 200% 200% 200% 200% 200% 200% Internal code P/N 1 Note 0.3mm thickness P Rated voltage Part number 1 10V 6.3V LMK105 SD152KP JMK105 SD272KP Part number 2 CAPACITORS UMK105 SD391KV UMK105 SD471KV UMK105 SD561KV TMK105 SD681KV TMK105 SD821KV TMK105 SD102KV TMK105 SD122KV EMK105 SD152KV EMK105 SD182KV EMK105 SD222KV EMK105 SD272KV LMK105 SD332KV LMK105 SD392KV LMK105 SD472KV Temp. char. NoteCapacitance tolerance J (5%) is also available. Please contact Taiyo Yuden sales channels. 107TYPE Rated voltage Part number 1 50V Part number 2 UMK107 SD102KA UMK107 SD122KA UMK107 SD152KA UMK107 SD182KA UMK107 SD222KA UMK107 SD272KA UMK107 SD332KA TMK107 SD392KA TMK107 SD472KA EMK107 SD562KA EMK107 SD682KA EMK107 SD822KA EMK107 SD103KA LMK107 SD123KA LMK107 SD153KA LMK107 SD183KA LMK107 SD223KA 25V 16V 10V Temp. char. Capacitance pF Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave Standard type 1000 1200 1500 1800 2200 2700 3300 3900 4700 5600 6800 8200 10000 12000 15000 18000 22000 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 10 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.80.1 0.80.1 0.80.1 0.80.1 0.80.1 0.80.1 0.80.1 0.80.1 0.80.1 0.80.1 0.80.1 0.80.1 0.80.1 0.80.1 0.80.1 0.80.1 0.80.1 R R R R R R R R R R R R R R R R R NoteCapacitance tolerance J (5%) is also available. Please contact Taiyo Yuden sales channels. 212TYPE 1.25mm thickness G Rated voltage 35V 10V Part number 1 Part number 2 GMK212 SD183KG GMK212 SD223KG GMK212 SD273KG LMK212 SD683KG LMK212 SD823KG LMK212 SD104KG Temp. char. Capacitance pF Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave Standard type 18000 22000 27000 68000 82000 100000 10 10 10 10 10 10 0.1 0.1 0.1 0.1 0.1 0.1 1.250.1 1.250.1 1.250.1 1.250.1 1.250.1 1.250.1 R R R R R R Temp. char. Capacitance pF Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave Standard type 3900 4700 5600 6800 8200 10000 12000 15000 33000 47000 10 10 10 10 10 10 10 10 10 10 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.1 0.850.1 0.850.1 0.850.1 0.850.1 0.850.1 0.850.1 0.850.1 0.850.1 0.850.1 0.850.1 R R R R R R R R R R 0.85mm thickness D Rated voltage 50V 35V 16V 10V Part number 1 UMK212 SD392KD UMK212 SD472KD UMK212 SD562KD UMK212 SD682KD UMK212 SD822KD UMK212 SD103KD GMK212 SD123KD GMK212 SD153KD EMK212 SD333KD LMK212 SD473KD Part number 2 NoteCapacitance tolerance J (5%) is also available. Please contact Taiyo Yuden sales channels. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc05_e-01 12 23 REPRESENTATIVE PART NUMBERS 316TYPE 1.6mm thickness L Rated voltage Part number 1 25V TMK316 SD823KL TMK316 SD104KL Part number 2 Temp. char. Capacitance pF Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave Standard type 82000 100000 10 10 0.1 0.1 1.60.2 1.60.2 R R Temp. char. Capacitance pF Capacitance tolerance tan % Thickness mm Soldering R:Reflow W:Wave Standard type 33000 39000 47000 56000 68000 10 10 10 10 10 0.1 0.1 0.1 0.1 0.1 1.150.1 1.150.1 1.150.1 1.150.1 1.150.1 R R R R R HALT % Rated voltage 200% 200% Internal code P/N 1 Note HALT % Rated voltage 200% 200% 200% 200% 200% Internal code P/N 1 Note 1.15mm thickness F Rated voltage 35V 25V Part number 1 Part number 2 GMK316 SD333KF GMK316 SD393KF TMK316 SD473KF TMK316 SD563KF TMK316 SD683KF NoteCapacitance tolerance J (5%) is also available. Please contact Taiyo Yuden sales channels. ELECTRICAL CHARACTERISTICS Capacitance-temperature characteristics 20 15 SD : Standard Type 10 5 0 -5 -10 -15 -20 -60 -40 -20 0 20 40 60 80 100 120 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. 24 12 mlcc05_e-01 CAPACITORS This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc05_e-01 12 25 PACKAGING Minimum Quantity Taped package Thickness Type MK042 MK063 2K096 WK105 MK105 VK105 MK107 WK107 2K110 MK212 WK212 4K212 2K212 MK316 MK325 MK432 mm code 0.2 0.3 0.3 0.45 0.3 0.2 0.3 0.5 0.5 0.45 0.5 0.8 0.5 0.6 0.8 0.45 0.85 1.25 0.85 0.85 0.85 1.15 1.25 1.6 0.85 1.15 1.9 2.0max 2.5 2.5 C,D P,T P K P C P V, W W K V A V B A K D G D D D F G L D F N Y M M Standard quantity [pcs] Embossed tape -- 40000 15000 Representative taping dimensions Paper Tape8mm wide Pressed carrier tape2mm pitch 0.1/-0 Paper tape 10000 20000 15000 -- T1 10000 4000 -- 4000 Unitmm 4000 -- -- 3000 4000 -- Type No bottom tape for pressed carrier tape Insertion Pitch MK063 2K096 WK105 MK105 *1C 0.65 1.15 MK105 *1P 1 * Thickness, C0.2mmP0.3mm Tape Thickness T1 0.45max. 0.42max. 0.4max. 0.45max. 0.3max. 0.42max. 2.00.05 Punched carrier tape2mm pitch 0.1/-0 -- 3000 2000 -- -- 500T, 1000P 500 Unitmm Type Taping material Chip Cavity 0.37 0.67 0.65 1.02 2K096 MK105 VK105 Chip Cavity A B 0.72 1.02 0.65 Insertion Pitch F Tape Thickness T 0.6max. 52.00.05 1.15 0.8max. Paper tape Punched carrier tape4mm pitch 0.1/-0 Unitmm Embossed tape Type MK107 WK107 2K110 MK212 WK212 4K212 2K212 MK316 Chip Cavity A B Insertion Pitch F Tape Thickness T 1.0 1.8 1.1max. 1.15 1.55 1.0max. 1.65 2.4 2.0 3.6 4.00.1 1.1max. Chip filled NoteTaping size might be different depending on the size of the product. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_pack-P1 12 mlcc_pack_e-01 PACKAGING Embossed tape4mm wide Trailer and Leader 0.80.04 4.00.05 1.80.02 0.90.05 100mm or more Trailer 160mm min. Leader 400mm min. 1.00.02 2.00.04 Unitmm Type MK042 Chip Cavity A B 0.23 0.43 Insertion Pitch F 1.00.02 Tape Thickness K T 0.5max. 0.25max. Reel size t E C Embossed tape8mm wide 0.1/-0 A B D R W Unitmm A 1782.0 B 50min. C 13.00.2 D 21.00.8 E 2.00.5 R 1.0 4mm wide tape 8mm wide tape 12mm wide tape t 1.5max. 2.5max. 2.5max. W 51.0 101.5 141.5 Unitmm Type WK107 MK212 MK316 MK325 Chip Cavity A B 1.0 1.8 1.65 2.4 2.0 3.6 2.8 3.6 Insertion Pitch F 4.00.1 Tape Thickness K T 1.3max 0.250.1 3.4max. 0.6max. Embossed tape12mm wide Top Tape Strength 0.1/-0 The top tape requires a peel-off force of 0.1 to 0.7N in the direction of the arrow as illustrated below. 2.00.1 F Type MK432 Chip Cavity A B 3.7 4.9 Unitmm Insertion Pitch F 8.00.1 Tape Thickness K T 4.0max. 0.6max. Bulk Cassette The exchange of individual specification is necessary. Please contact Taiyo Yuden sales channels. 120.1 360/-0.2 1100.7 8.80.1 2.00/-0.1 1.50.1/-0 6.80.1 12.00.1 0/-0.2 0.2/-0 1.00/-0.1 Unitmm This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_pack_e-01 12 mlcc_pack-P2 RELIABILITY DATA Multilayer Ceramic Capacitors and Medium-High Voltage Multilayer Ceramic Capacitors are noted separately. Super Low Distortion Multilayer Ceramic CapacitorsCFCAP 1. Operating Temperature Range Specified Value 55 to 125 2. Storage Temperature Range Specified Value 55 to 125 3. Rated Voltage Specified Value 6.3VDC, 10VDC, 16VDC, 25VDC, 35VDC, 50VDC Between terminals 4. Dielectric Withstanding Voltage Specified Value Test Methods and Remarks Applied voltage: Rated voltagex3 Duration: 1 to 5 sec. Charge/discharge current: 50mA max. Insulation Resistance Specified Value Test Methods and Remarks Applied voltage: Rated voltage Duration: 605 sec. Charge/discharge current: 50mA max. 6CapacitanceTolerance Specified Value Test Methods and Remarks Measuring frequency1Hz10% Measuring voltage10.2Vrms Bias application: None Dissipation Factor Specified Value Test Methods and Remarks Measuring frequency1Hz10% Measuring voltage10.2Vrms Bias application: None No breakdown or damage 10000 M or 500MF, whichever is smaller 10 0.1%max 8Bending Strength Appearance: No abnormality Capacitance change: 5% Specified Value Test Methods and Remarks Warp: 1mm Speed: 0.5mm/second Duration:10 seconds Test board: glass epoxy resin substrate Thickness: 1.6mm Capacitance measurement shall be conducted with the board bent. 9Adhesive Force of Terminal Electrodes Specified Value Test Methods and Remarks Applied force: 5N Duration: 30 5 seconds 10Solderability Specified Value Test Methods and Remarks Eutectic solder Lead-free solder Solder type H60A or H63A Sn3.0Ag0.5Cu R-230 Terminal electrodes shall be no exfoliation or a sign of exfoliation. At least 95% of terminal electrode is covered by new solder. Solder temperature 2305 2453 Duration 41 sec. 11Resistance to Soldering Heat Specified Value Appearance: No abnormality Capacitance change: 2.5% max. Dissipation factor : Initial value Insulation resistance: Initial value Withstanding voltagebetween terminals : No abnormality Test Methods and Remarks Solder temp.: 270 5 Duration: 3 0.5 sec. Preheating conditions80 to 100, 2 to 5 min. or 5 to 10 min. 150 to 200, 2 to 5 min. or 5 to 10 min. Measurement shall be conducted : 242hrs under the standard condition Note1 This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc05_reli-R1 12 mlcc05_reli_e-01 RELIABILITY DATA 12Temperature Cycle Thermal Shock Specified Value Appearance: No abnormality Capacitance change: 2.5% max Dissipation factor : Initial value Insulation resistance: Initial value Withstanding voltagebetween terminals : No abnormality Test Methods and Remarks 0 Conditions for 1 cycle Step 1: Minimum operating temperature 3 303 min. Step 2: Normal temperature 2 to 3 min. 0 Step 3: Maximum operating temperature 3 303 min. Step 4: Normal temperature 2 to 3 min. Number of cycles: 5 times Measurement shall be conducted : 242hrs under the standard condition Note1 13HumiditySteady state Specified Value Appearance: No abnormality Capacitance change: 5% max Dissipation factor : 0.5% max Insulation resistance 50MF or 1000M, whichever is smaller Test Methods and Remarks Temperature:402 Humidity:90 to 95% RH 24 Duration:500 0 hrs Measurement shall be conducted : 24 2hrs under the standard condition Note1 14Humidity Loading Specified Value Appearance: No abnormality Capacitance change: 7.5% max Dissipation factor : 0.5% max Insulation resistance: 25MF or 500M, whichever is smaller Test Methods and Remarks According to JIS C 5102 clause 9.9. Temperature:402 Humidity:90 to 95% RH 24 Duration:500 0 hrs Applied voltage: Rated voltage Charge/discharge current:50mA max Measurement shall be conducted : 24 2hrs under the standard condition Note1 15High Temperature Loading Specified Value Appearance: No abnormality Capacitance change: 3% max Dissipation factor : 0.35% max Insulation resistance: 50MF or 1000M, whichever is smaller Test Methods and Remarks According to JIS C 5102 clause 9.10. Temperature:1253 48 Duration:1000 0 hrs Applied voltage: Rated voltage x 2 Charge/discharge current:50mA max Measurement shall be conducted : 24 2hrs under the standard condition Note1 Note1 Standard condition: Temperature: 5 to 35, Relative humidity: 45 to 85 % RH, Air pressure: 86 to 106kPa When there are questions concerning measurement results, in order to provide correlation data, the test shall be conducted under the following condition. Temperature: 202, Relative humidity: 60 to 70 % RH, Air pressure: 86 to 106kPa Unless otherwise specified, all the tests are conducted under the "standard condition". This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc05_reli_e-01 12 mlcc05_reli-R2 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors 1. Circuit Design Verification of operating environment, electrical rating and performance 1. A malfunction of equipment in fields such as medical, aerospace, nuclear control, etc. may cause serious harm to human life or have severe social ramifications. Therefore, any capacitors to be used in such equipment may require higher safety and reliability, and shall be clearly differentiated from them used in general purpose applications. Operating VoltageVerification of Rated voltage Precautions 1. The operating voltage for capacitors must always be their rated voltage or less. If an AC voltage is loaded on a DC voltage, the sum of the two peak voltages shall be the rated voltage or less. For a circuit where an AC or a pulse voltage may be used, the sum of their peak voltages shall also be the rated voltage or less. 2. Even if an applied voltage is the rated voltage or less reliability of capacitors may be deteriorated in case that either a high frequency AC voltage or a pulse voltage having rapid rise time is used in a circuit. 2. PCB Design Pattern configurationsDesign of Land-patterns 1. When capacitors are mounted on PCBs, the amount of solder usedsize of filletcan directly affect the capacitor performance. Therefore, the following items must be carefully considered in the design of land patterns: 1 Excessive solder applied can cause mechanical stresses which lead to chip breaking or cracking. Therefore, please consider appropriate land-patterns for proper amount of solder. Precautions 2 When more than one component are jointly soldered onto the same land, each component's soldering point shall be separated by solder-resist. Pattern configurations Capacitor layout on PCBs After capacitors are mounted on boards, they can be subjected to mechanical stresses in subsequent manufacturing processesPCB cutting, board inspection, mounting of additional parts, assembly into the chassis, wave soldering of the boards, etc. . For this reason, land pattern configurations and positions of capacitors shall be carefully considered to minimize stresses. Pattern configurationsDesign of Land-patterns The following diagrams and tables show some examples of recommended land patterns to prevent excessive solder amounts. 1 Recommended land dimensions for typical chip capacitors Multilayer Ceramic Capacitors : Recommended land dimensionsunit: mm Wave-soldering Land patterns for PCBs Type Size L W A B C Land 107 212 316 325 1.6 2.0 3.2 3.2 0.8 51.25 1.6 2.5 0.8 to 1.0 1.0 to 1.4 1.8 to 2.5 1.8 to 2.5 0.5 to 0.8 0.8 to 1.5 0.8 to 1.7 0.8 to 1.7 0.6 to 0.8 0.9 to 1.2 1.2 to 1.6 1.8 to 2.5 Chip capacitor C B Reflow-soldering Type Size L W A B C 042 063 105 107 0.4 0.6 1.0 1.6 0.2 0.3 0.5 0.8 0.15 to 0.25 0.20 to 0.30 0.45 to 0.55 0.8 to 1.0 0.15 to 0.20 0.20 to 0.30 0.40 to 0.50 0.6 to 0.8 0.15 to 0.30 0.25 to 0.40 0.45 to 0.55 0.6 to 0.8 212 2.0 51.25 0.8 to 1.2 0.8 to 1.2 0.9 to 1.6 316 3.2 1.6 1.8 to 2.5 1.0 to 1.5 1.2 to 2.0 325 3.2 2.5 1.8 to 2.5 1.0 to 1.5 1.8 to 3.2 432 4.5 3.2 2.5 to 3.5 1.5 to 1.8 2.3 to 3.5 Chip capacitor W L LWDC: Recommended land dimensions for reflow-solderingunit: mm Type Technical considerations 105 0.52 1.0 0.18 to 0.22 0.2 to 0.25 0.9 to 1.1 L W A B C 107 50.8 1.6 0.25 to 0.3 0.3 to 0.4 1.5 to 1.7 LWDC 212 1.25 2.0 0.5 to 0.7 0.4 to 0.5 1.9 to 2.1 W L Array type: Recommended land dimensions for reflow-solderingunit: mm Type Size a b c d L W B A NoteRecommended land size might be different according to the allowance of the size of the product. Size Solder-resist 2 circuits 0962 circuits 1102 circuits 2122 circuits 212 4 circuits 0.9 1.37 2.0 2.0 0.6 1.0 1.25 1.25 0.25 to 0.35 0.35 to 0.45 0.5 to 0.6 0.5 to 0.6 0.15 to 0.25 0.55 to 0.65 0.5 to 0.6 0.5 to 0.6 0.15 to 0.25 0.3 to 0.4 0.5 to 0.6 0.2 to 0.3 0.45 0.64 1.0 0.5 4 circuits Chip capacitor c c a b a Land d a b a d 2 Examples of good and bad solder application Items Not recommended Recommended Mixed mounting of SMD and leaded components Component placement close to the chassis Hand-soldering of leaded components near mounted components Horizontal component placement To next page This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_prec-P1 12 mlcc_prec_e-01 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors 2. PCB Design Pattern configurations Capacitor layout on PCBs 1-1. The following is examples of good and bad capacitor layouts ; capacitors shall be located to minimize any possible mechanical stresses from board warp or deflection. Items Not recommended Recommended Deflection of board Technical considerations 1-2. The amount of mechanical stresses given will vary depending on capacitor layout. Please refer to diagram below. 1-3. When PCB is split, the amount of mechanical stress on the capacitors can vary according to the method used. The following methods are listed in order from least stressful to most stressful: push-back, slit, V-grooving, and perforation. Thus, please consider the PCB, split methods as well as chip location. 3. Mounting Adjustment of mounting machine 1. When capacitors are mounted on PCB, excessive impact load shall not be imposed on them. 2.Maintenance and inspection of mounting machines shall be conducted periodically. Precautions Selection of Adhesives 1. When chips are attached on PCBs with adhesives prior to soldering, it may cause capacitor characteristics degradation unless the following factors are appropriately checked : size of land patterns, type of adhesive, amount applied, hardening temperature and hardening period. Therefore, please contact us for further information. Adjustment of mounting machine 1. When the bottom dead center of a pick-up nozzle is too low, excessive force is imposed on capacitors and causes damages. To avoid this, the following points shall be considerable. 1The bottom dead center of the pick-up nozzle shall be adjusted to the surface level of PCB without the board deflection. 2The pressure of nozzle shall be adjusted between 1 and 3 N static loads. 3To reduce the amount of deflection of the board caused by impact of the pick-up nozzle, supporting pins or back-up pins shall be used on the other side of the PCB. The following diagrams show some typical examples of good and bad pick-up nozzle placement: Items Not recommended Recommended Single-sided mounting Double-sided mounting Technical considerations 2. As the alignment pin is worn out, adjustment of the nozzle height can cause chipping or cracking of capacitors because of mechanical impact on the capacitors. To avoid this, the monitoring of the width between the alignment pins in the stopped position, maintenance, check and replacement of the pin shall be conducted periodically. Selection of Adhesives Some adhesives may cause IR deterioration. The different shrinkage percentage of between the adhesive and the capacitors may result in stresses on the capacitors and lead to cracking. Moreover, too little or too much adhesive applied to the board may adversely affect components. Therefore, the following precautions shall be noted in the application of adhesives. 1 Required adhesive characteristics a. The adhesive shall be strong enough to hold parts on the board during the mounting & solder process. b. The adhesive shall have sufficient strength at high temperatures. c. The adhesive shall have good coating and thickness consistency. d. The adhesive shall be used during its prescribed shelf life. e. The adhesive shall harden rapidly. f . The adhesive shall have corrosion resistance. g. The adhesive shall have excellent insulation characteristics. h. The adhesive shall have no emission of toxic gasses and no effect on the human body. 2 The recommended amount of adhesives is as follows; Recommended condition Figure 212/316 case sizes as examples a 0.3mm min b 100 to 120 m c Adhesives shall not contact land This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_prec_e-01 12 mlcc_prec-P2 PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors 4. Soldering Selection of Flux Since flux may have a significant effect on the performance of capacitors, it is necessary to verify the following conditions prior to use; 1 Flux used shall be less than or equal to 0.1 wt%in CI equivalentof halogenated content. Flux having a strong acidity content shall not be applied. 2 When shall capacitors are soldered on boards, the amount of flux applied shall be controlled at the optimum level. 3 When water-soluble flux is used, special care shall be taken to properly clean the boards. Precautions Soldering Temperature, time, amount of solder, etc. shall be set in accordance with their recommended conditions. Sn-Zn solder paste can adversely affect MLCC reliability. Please contact us prior to usage of Sn-Zn solder. Selection of Flux 1-1. When too much halogenated substanceChlorine, Chlorine, etc. content is used to activate fl flux, ux, or highly acidic fl flux ux is used, it may lead to corrosion of terminal electrodes or degradation of insulation resistance on the surfaces of the capacitors. 1-2. Flux is used to increase solderability in wave soldering. However if too much flux is applied, a large amount of flux gas may be emitted and may adversely affect the solderability. To minimize the amount of flux applied, it is recommended to use a flux-bubbling system. 1-3. Since the residue of water-soluble flux is easily dissolved in moisture in the air, the residues on the surfaces of capacitors in high humidity conditions may cause a degradation of insulation resistance and reliability of the capacitors. Therefore, the cleaning methods and the capability of the machines used shall also be considered carefully when water-soluble flux is used. Peak260 260Max. Max. Peak 230 Within10sec. 10sec. Within Within 10 sec. Preheating 200 60sec. 200 200 Min. 60sec. Min. Slow Slow cooling Slowcooling cooling 300 100 100 100 Peak 260 Max. Withinabove 10sec. Heating Preheating 150 230 200 60sec. Min. 40sec. Max. 0 Slow cooling 300 100 Peak 260 Max. 230250 Within 10sec. Heating above Heating above Within 3sec. Preheating Heating above Preheating 150 150 Preheating 230 230 Preheating 150 120sec. Min. 230 60sec. Min. Min. 60sec. 40sec. Max. Max. 40sec. 200 60sec. Min. 200 00 40sec. Max. Slow 0 0 Slow cooling cooling Caution 300 The300 ideal condition is to have solder massfilletcontrolled to 1/2 to 1/3 of the thickness of a capacitor. 300 100 excessive dwell times 100 230250 230250 Because can adversely affect solderability, soldering duration230250 shall be kept as Within 3sec. Within 3sec. close to recommended timesHeating as possible. Preheating Preheating Within 3sec. above Preheating Preheating 150 120sec. Min. 120sec. Min. 230 120sec. Min. 200 200 60sec. Min. 200 40sec. Max. Wave soldering 0 0 Slow cooling cooling Slow Slow cooling Recommended condition for Pb-free soldering Recommended conditions for eutectic soldering 200 00 Preheating 120sec. Min. 300 100 200 Slow cooling 300 300 100 200 200 0 230250 Within 3sec. Peak260 260Max. Max. Peak Within10sec. 10sec. Within 120sec. Min. Min. 120sec. Slow Slow cooling Preheating cooling Preheating 150 150 120sec. Min. Hand200 soldering 00 120sec. Min. 0 300 100 200 0 Slow Preheating cooling 150 Peak 260 Max. Within 10sec. 120sec. Min. Slow 100 300 230280 Within 3 sec. The soldering iron shall not directly touch capacitors. 0 Preheating 60sec. Min. 0 400 60sec. Min. T Slow cooling 200 400 400 400 100 300 300 300 0 200 200 200 400 100 100 100 300 00 200 100 0 400 Peak 350 Max. Within 3sec. 300 0 Recommended condition for Pb-free soldering 200 400 400 Slow cooling 400 Peak 350 350Max. Max. Peak 230280Within Within 3sec. 3sec. 100 Within 3 sec. 300 300 300 Preheating T T 60sec. Min. 0 Slow cooling cooling Slow 0 200 200 200 200 200 Slow cooling cooling Slow Preheating Preheating Slow cooling 400 400 150 Min.350 Max. 150 Min. Peak 230280 100 100 100 100 Within 3sec. 100 Within 3 sec. 300 Preheating 300 Preheating Preheating T 60sec. Min. 60sec. Min. 60sec. Min. Min. 60sec. 60sec. Min. 00 00 0 Slow cooling T 200 200 Slow cooling 316type or less Preheating T150 Caution 150 Min. Use100 a 50W soldering iron with a maximum tip diameter of100 1.0 mm. Slow Recommended conditions for eutectic soldering Preheating cooling 400 400 150 100 230280 230280 Within 33 sec. sec. Within 300 300 T PC board Peak 260 Max. Within 10sec. Caution Preheating cooling 300 400 as for reflow soldering Wave soldering must not be applied to capacitors designated 150 only. 100 100 Peak 260 Max. Within 10sec. Capacitor Solder Temperature Temperature Temperature Temperature Temperature 300 100 100 Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Technical considerations 300 100 0 Preheating Peak 280 280Max. Max. Peak 150 Peak Min. 350 Max. Within 3sec. 3sec. Within Within 3sec. T Min. 60sec. T T Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature Temperature 300 300 300 200 Slow Recommended condition for Pb-free cooling soldering Slow cooling cooling Slow Slow cooling Preheating Preheating Preheating 150 Min. 150 Min. Peak 280 Max. 150 Min. Within 3sec. 60sec. Min. Min. 60sec. 60sec. Min. T Slow cooling T 325type or morePreheating T130 150 Min. 60sec. Min. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_prec-P3 12 mlcc_prec_e-01 300 T 200 400 100 Temperature Recommended conditions for eutectic soldering Temperature Reflow soldering Temperature Soldering * Ceramic chip capacitors are susceptible to thermal shock when exposed to rapid or concentrated heating or rapid cooling. as to prevent malfunction of the components due to excessive thermal shock. * Therefore, the soldering must be conducted with great care so300 Peak 260 * Preheating : Capacitors shall be preheated sufficiently, and the temperature difference between theMax. capacitors and solder shall be within 100 to 130. * Cooling : The temperature difference between the capacitors and cleaning process shall Within not be10sec. greater than 100. 300 60sec. M 0 200 T 100 0 60sec. PRECAUTIONS Precautions on the use of Multilayer Ceramic Capacitors 5. Cleaning Precautions Technical considerations Cleaning conditions 1. When PCBs are cleaned after capacitors mounting, please select the appropriate cleaning solution in accordance with the intended use of the cleaning.e.g. to remove soldering flux or other materials from the production process. 2. Cleaning condition shall be determined after it is verified by using actual cleaning machine that the cleaning process does not affect capacitor's characteristics. 1. The use of inappropriate cleaning solutions can cause foreign substances such as flux residue to adhere to capacitors or deteriorate their outer coating, resulting in a degradation of the capacitor's electrical propertiesespecially insulation resistance . 2. Inappropriate cleaning conditionsinsufficient or excessive cleaningmay adversely affect the performance of the capacitors. In the case of ultrasonic cleaning, too much power output can cause excessive vibration of PCBs which may lead to the cracking of capacitors or the soldered portion, or decrease the terminal electrodes' strength. Therefore, the following conditions shall be carefully checked; Ultrasonic output : 20 W/ or less Ultrasonic frequency : 40 kHz or less Ultrasonic washing period : 5 min. or less 6. Resin coating and mold 1. With some type of resins, decomposition gas or chemical reaction vapor may remain inside the resin during the hardening period or while left under normal storage conditions resulting in the deterioration of the capacitor's performance. 2. When a resin's hardening temperature is higher than capacitor's operating temperature, the stresses generated by the excessive heat may lead to damage or Precautions destruction of capacitors. The use of such resins, molding materials etc. is not recommended. 7. Handling Splitting of PCB 1. When PCBs are split after components mounting, care shall be taken so as not to give any stresses of deflection or twisting to the board. 2. Board separation shall not be done manually, but by using the appropriate devices. Precautions Mechanical considerations Be careful not to subject capacitors to excessive mechanical shocks. 1 If ceramic capacitors are dropped onto a floor or a hard surface, they shall not be used. 2 Please be careful that the mounted components do not come in contact with or bump against other boards or components. 8. Storage conditions Storage 1. To maintain the solderability of terminal electrodes and to keep packaging materials in good condition, care must be taken to control temperature and humidity in the storage area. Humidity should especially be kept as low as possible. Recommended conditions Ambient temperature : Below 30 Humidity : Below 70% RH Precautions The ambient temperature must be kept below 40. Even under ideal storage conditions, solderability of capacitor is deteriorated as time passes, so capacitors shall be used within 6 months from the time of delivery. Ceramic chip capacitors shall be kept where no chlorine or sulfur exists in the air. 2. The capacitance values of high dielectric constant capacitors will gradually decrease with the passage of time, o care shall be taken to design circuits . Even if capacitance value decreases as time passes, it will get back to the initial value by a heat treatment at 150 for 1hour. Technical If capacitors are stored in a high temperature and humidity environment, it might rapidly cause poor solderability due to terminal oxidation and quality loss of taping/ consider- packaging materials. For this reason, capacitors shall be used within 6 months from the time of delivery. If exceeding the above period, please check solderability beations fore using the capacitors. RCR-2335B Safety Application Guide for fixed ceramic capacitors for use in electronic equipment is published by JEITA. Please check the guide regarding precautions for deflection test, soldering by spot heat, and so on. This catalog contains the typical specification only due to the limitation of space. When you consider the purchase of our products, please check our specification. For details of each product (characteristics graph, reliability information, precautions for use, and so on), see our Web site (http://www.ty-top.com/) or CD catalogs. mlcc_prec_e-01 12 mlcc_prec-P4