MUR8100E, MUR880E MUR8100E is a Preferred Device SWITCHMODEt Power Rectifiers Ultrafast "E'' Series with High Reverse Energy Capability The MUR8100 and MUR880E diodes are designed for use in switching power supplies, inverters and as free wheeling diodes. Features * 20 mJ Avalanche Energy Guaranteed * Excellent Protection Against Voltage Transients in Switching * * * * * * * * * Inductive Load Circuits Ultrafast 75 Nanosecond Recovery Time 175C Operating Junction Temperature Popular TO-220 Package Epoxy Meets UL 94 V-0 @ 0.125 in. Low Forward Voltage Low Leakage Current High Temperature Glass Passivated Junction Reverse Voltage to 1000 V Pb-Free Packages are Available* http://onsemi.com ULTRAFAST RECTIFIERS 8.0 A, 800 V - 1000 V 1 4 3 4 TO-220AC CASE 221B 1 3 Mechanical Characteristics: MARKING DIAGRAM * Case: Epoxy, Molded * Weight: 1.9 Grams (Approximately) * Finish: All External Surfaces Corrosion Resistant and Terminal * Leads are Readily Solderable Lead Temperature for Soldering Purposes: 260C Max. for 10 Seconds AY WWG U8xxxE KA A Y WW G U8xxxE KA = = = = = Assembly Location Year Work Week Pb-Free Package Device Code xxx = 100 or 80 = Diode Polarity ORDERING INFORMATION Device Package Shipping MUR8100E TO-220 50 Units / Rail TO-220 (Pb-Free) 50 Units / Rail TO-220 50 Units / Rail TO-220 (Pb-Free) 50 Units / Rail MUR8100EG MUR880E MUR880EG *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. (c) Semiconductor Components Industries, LLC, 2008 June, 2008 - Rev. 4 1 Preferred devices are recommended choices for future use and best overall value. Publication Order Number: MUR8100E/D MUR8100E, MUR880E MAXIMUM RATINGS Rating Symbol Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage MUR880E MUR8100E Average Rectified Forward Current (Rated VR, TC = 150C) Total Device VRRM VRWM VR Value Unit V 800 1000 IF(AV) 8.0 A Peak Repetitive Forward Current (Rated VR, Square Wave, 20 kHz, TC = 150C) IFM 16 A Non-Repetitive Peak Surge Current (Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz) IFSM 100 A TJ, Tstg -65 to +175 C Operating Junction and Storage Temperature Range Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. THERMAL CHARACTERISTICS Characteristic Maximum Thermal Resistance, Junction-to-Case Symbol Value Unit RqJC 2.0 C/W Symbol Value Unit ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (Note 1) (iF = 8.0 A, TC = 150C) (iF = 8.0 A, TC = 25C) vF Maximum Instantaneous Reverse Current (Note 1) (Rated DC Voltage, TC = 100C) (Rated DC Voltage, TC = 25C) iR Maximum Reverse Recovery Time (IF = 1.0 A, di/dt = 50 A/ms) (IF = 0.5 A, iR = 1.0 A, IREC = 0.25 A) trr Controlled Avalanche Energy (See Test Circuit in Figure 6) WAVAL 1. Pulse Test: Pulse Width = 300 ms, Duty Cycle 2.0%. http://onsemi.com 2 1.5 1.8 500 25 100 75 20 V mA ns mJ MUR8100E, MUR880E 100 10,000 70 IR, REVERSE CURRENT ( mA) 1000 50 30 10 100 175C 150C 10 100C 1.0 0.1 TJ = 25C 0.01 TJ = 175C 7.0 0 100C 5.0 200 400 25C 600 800 1000 VR, REVERSE VOLTAGE (VOLTS) Figure 2. Typical Reverse Current* 3.0 2.0 IF(AV) , AVERAGE FORWARD CURRENT (AMPS) iF, INSTANTANEOUS FORWARD CURRENT (AMPS) 20 1.0 0.7 0.5 0.3 0.2 0.1 0.6 0.8 1.0 1.2 1.4 1.6 dc 6.0 SQUARE WAVE 5.0 4.0 3.0 2.0 1.0 0 160 150 170 Figure 1. Typical Forward Voltage Figure 3. Current Derating, Case 8.0 7.0 dc 6.0 SQUARE WAVE 4.0 3.0 dc 2.0 SQUARE WAVE 0 20 7.0 vF, INSTANTANEOUS VOLTAGE (VOLTS) RqJA = 16C/W RqJA = 60C/W (No Heat Sink) 0 8.0 TC, CASE TEMPERATURE (C) 9.0 1.0 RATED VR APPLIED 9.0 140 10 5.0 10 1.8 PF(AV) , AVERAGE POWER DISSIPATION (WATTS) 0.4 I F(AV) , AVERAGE FORWARD CURRENT (AMPS) * The curves shown are typical for the highest voltage device in the voltage * grouping. Typical reverse current for lower voltage selections can be * estimated from these same curves if VR is sufficiently below rated VR. 40 60 80 100 120 140 160 180 200 180 14 TJ = 175C 12 SQUARE WAVE 10 dc 8.0 6.0 4.0 2.0 0 0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 TA, AMBIENT TEMPERATURE (C) IF(AV), AVERAGE FORWARD CURRENT (AMPS) Figure 4. Current Derating, Ambient Figure 5. Power Dissipation http://onsemi.com 3 9.0 10 MUR8100E, MUR880E +VDD IL 40 mH COIL BVDUT VD ID MERCURY SWITCH ID IL DUT S1 VDD t0 Figure 6. Test Circuit BV 2 DUT W [ 1 LI LPK AVAL 2 V BV DUT DD t2 t Figure 7. Current-Voltage Waveforms The unclamped inductive switching circuit shown in Figure 6 was used to demonstrate the controlled avalanche capability of the new "E'' series Ultrafast rectifiers. A mercury switch was used instead of an electronic switch to simulate a noisy environment when the switch was being opened. When S1 is closed at t0 the current in the inductor IL ramps up linearly; and energy is stored in the coil. At t1 the switch is opened and the voltage across the diode under test begins to rise rapidly, due to di/dt effects, when this induced voltage reaches the breakdown voltage of the diode, it is clamped at BVDUT and the diode begins to conduct the full load current which now starts to decay linearly through the diode, and goes to zero at t2. By solving the loop equation at the point in time when S1 is opened; and calculating the energy that is transferred to the diode it can be shown that the total energy transferred is equal to the energy stored in the inductor plus a finite amount of energy from the VDD power supply while the diode is in EQUATION (1): t1 breakdown (from t1 to t2) minus any losses due to finite component resistances. Assuming the component resistive elements are small Equation (1) approximates the total energy transferred to the diode. It can be seen from this equation that if the VDD voltage is low compared to the breakdown voltage of the device, the amount of energy contributed by the supply during breakdown is small and the total energy can be assumed to be nearly equal to the energy stored in the coil during the time when S1 was closed, Equation (2). The oscilloscope picture in Figure 8, shows the MUR8100E in this test circuit conducting a peak current of one ampere at a breakdown voltage of 1300 V, and using Equation (2) the energy absorbed by the MUR8100E is approximately 20 mjoules. Although it is not recommended to design for this condition, the new "E'' series provides added protection against those unforeseen transient viruses that can produce unexplained random failures in unfriendly environments. 500V 50mV CH1 CH2 A 20ms 953 V VERT CHANNEL 2: IL 0.5 AMPS/DIV. CHANNEL 1: VDUT 500 VOLTS/DIV. EQUATION (2): 2 W [ 1 LI LPK AVAL 2 TIME BASE: 20 ms/DIV. 1 CH1 ACQUISITIONS SAVEREF SOURCE CH2 217:33 HRS STACK REF REF Figure 8. Current-Voltage Waveforms http://onsemi.com 4 1.0 0.7 0.5 D = 0.5 0.3 0.2 0.1 0.1 0.07 0.05 P(pk) 0.05 0.01 t1 0.03 0.02 0.01 0.01 t2 DUTY CYCLE, D = t1/t2 SINGLE PULSE 0.02 0.05 0.1 0.2 0.5 1.0 2.0 5.0 10 20 Figure 9. Thermal Response 1000 TJ = 25C 300 100 30 10 1.0 10 VR, REVERSE VOLTAGE (VOLTS) Figure 10. Typical Capacitance http://onsemi.com 5 ZqJC(t) = r(t) RqJC RqJC = 1.5C/W MAX D CURVES APPLY FOR POWER PULSE TRAIN SHOWN READ TIME AT t1 TJ(pk) - TC = P(pk) ZqJC(t) 50 t, TIME (ms) C, CAPACITANCE (pF) r(t), TRANSIENT THERMAL RESISTANCE (NORMALIZED) MUR8100E, MUR880E 100 100 200 500 1000 MUR8100E, MUR880E PACKAGE DIMENSIONS TO-220 TWO-LEAD CASE 221B-04 ISSUE E C B Q F T S DIM A B C D F G H J K L Q R S T U 4 A 1 3 U H K L D G NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. R J INCHES MIN MAX 0.595 0.620 0.380 0.405 0.160 0.190 0.025 0.035 0.142 0.161 0.190 0.210 0.110 0.130 0.014 0.025 0.500 0.562 0.045 0.060 0.100 0.120 0.080 0.110 0.045 0.055 0.235 0.255 0.000 0.050 MILLIMETERS MIN MAX 15.11 15.75 9.65 10.29 4.06 4.82 0.64 0.89 3.61 4.09 4.83 5.33 2.79 3.30 0.36 0.64 12.70 14.27 1.14 1.52 2.54 3.04 2.04 2.79 1.14 1.39 5.97 6.48 0.000 1.27 SWITCHMODE is a trademark of Semiconductor Components Industries, LLC. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 http://onsemi.com 6 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative MUR8100E/D