SP2526A Dual Channel USB Power Distribution Switch November 2011 Rev. 2.1.0 GENERAL DESCRIPTION APPLICATIONS The SP2526A device is a dual +3.0V to +5.5V USB Supervisory Power Control Switch ideal for self-powered and bus-powered Universal Serial Bus (USB) applications. Self Powered USB 2.0 and 3.0 Hubs Each switch has low on-resistance (110m typical) and can supply 500mA minimum. The fault currents are limited to 1.0A typical and the flag output pin for each switch is available to indicate fault conditions to the USB controller. The thermal shutdown feature will prevent damage to the device when subjected to excessive current loads. The undervoltage lockout feature will ensure that the device will remain off unless there is a valid input voltage present. Generic Power Switching The SP2526A is offered in a RoHS compliant "green"/halogen free 8-pin NSOIC package. USB Compliant VBUS Power Distribution Audio-Video Equipments FEATURES +3.0V to +5.5V Input Voltage Range Two Independent Power Switches Two Error Flag Outputs, Open Drain 2.6V Undervoltage Lockout 1.25A Short Circuit Current Limit 150m Maximum On-Resistance 110A On-State Supply Current 1A Shutdown Current Output can be Forced Higher than Input (Off-State) Thermal Shutdown 1ms Soft Start Power Up, Fast Turn Off Active-high Version: SP2526A-1 Active-low Version: SP2526A-2 RoHS Compliant, Green/Halogen Free 8-Pin NSOIC Package TYPICAL APPLICATION DIAGRAM Fig. 1: SP2526A Application Diagram - Two Port Self Powered Hub Exar Corporation 48720 Kato Road, Fremont CA 94538, USA www.exar.com Tel. +1 510 668-7000 - Fax. +1 510 668-7001 SP2526A Dual Channel USB Power Distribution Switch ABSOLUTE MAXIMUM RATINGS OPERATING RATINGS These are stress ratings only and functional operation of the device at these ratings or any other above those indicated in the operation sections of the specifications below is not implied. Exposure to absolute maximum rating conditions for extended periods of time may affect reliability. Ambient Temperature Range ..................... -40C to 85C Supply Voltage VIN ................................................. 7.0V Fault Flag Voltage VFLG............................................ 7.0V Fault Flag Current IFLG ........................................... 50mA Enable Input VEN ......................................... -0.3V to 15V Storage Temperature .............................. -65C to 150C Soldering Temperature (10sec) ............................. 260C Maximum Junction Temperature ............................ 125C Power Dissipation (NSOIC-8) ......................................... (derate 6.14mW/C above 70C)...................... 500mW ELECTRICAL SPECIFICATIONS Specifications with standard type are for an Operating Ambient Temperature of TA = 25C only; limits applying over the full Operating Junction Temperature range are denoted by a "*". Minimum and Maximum limits are guaranteed through test, design, or statistical correlation. Typical values represent the most likely parametric norm at TA = 25C, and are provided for reference purposes only. Unless otherwise indicated, VIN = 5.0V, TA= 25C. Parameter Min. Supply Current Enable Input Voltage 0.8 Typ. 0.75 5.0 110 160 1.7 2.0 Enable Input Current Enable Input Capacitance Max. 2.4 0.01 1 0.01 1 1 Output MOSFET Resistance 110 Output turn-on delay Units A V A Conditions VEN = Logic "0" OUT =open VEN = Logic "1" OUT =open VEN = Logic "0" VEN = Logic "1" VEN = Logic "0" VEN = Logic "1" pF 150 m s RL=10, each output 1000 4000 s RL=10, each output Output turn-off delay 0.8 20 s RL=10, each output Output turn-off fall time 0.7 20 s RL=10, each output 10 A 100 Output turn-on rise time Output Leakage Current Current limit threshold Over temperature shutdown threshold Error Flag Output Resistance Error Flag Current UVLO threshold (c) 2011 Exar Corporation 0.6 1.0 1.25 135 A C Temperature TJ raising Temperature TJ decreasing 125 10 25 15 40 0.01 1 2.6 A V 2.4 2/9 VIN=5V, IL=10mA VIN=3.3V, IL=10mA VFLAG=5V VIN increasing VIN decreasing Rev. 2.1.0 SP2526A Dual Channel USB Power Distribution Switch BLOCK DIAGRAM Fig. 2: SP2526A Block Diagram PIN ASSIGNMENT Fig. 3: SP2526A Pin Assignment (c) 2011 Exar Corporation 3/9 Rev. 2.1.0 SP2526A Dual Channel USB Power Distribution Switch PIN DESCRIPTION Name Pin Number Description ENA 1 Enable Input for channel A. Active High for SP2526A-1 and Active Low for SP2526A-2 FLGA 2 An active-low and open-drained fault flag output for channel A. It can indicate current limit ENA is active. In normal mode operation (ENA and/or ENB is active), it also can indicate thermal shutdown or under voltage FLGB 3 An active-low and open-drained fault flag output for channel B. It can indicate current limit ENA is active. In normal mode operation (ENA and/or ENB is active), it also can indicate thermal shutdown or under voltage ENB 1 Enable Input for channel B. Active High for SP2526A-1 and Active Low for SP2526A-2 OUTB 5 Output for Channel B. This is the output pin of the MOSFET source of channel B, typically connected to the switched side of the load GND 6 Ground IN 7 Power Supply Input 8 Output for Channel A. This is the output pin of the MOSFET source of channel A, typically connected to the switched side of the load OUTA ORDERING INFORMATION Part Number Temperature Range SP2526A-1EN-L -40CTA+85C SP2526A-1EN-L/TR -40CTA+85C SP2526A-2EN-L -40CTA+85C SP2526A-2EN-L/TR -40CTA+85C Marking Sipex 2526A-1E YYWWL Sipex 2526A-2E YYWWL Package NSOIC8 NSOIC8 Packing Quantity Note 1 Note 2 Bulk Enable Active high Bulk Enable Active Low RoHS Compliant 2.5K/Tape & Reel Halogen Free RoHS Compliant 2.5K/Tape & Reel Halogen Free "YY" = Year - "WW" = Work Week - "X" = Lot Number (c) 2011 Exar Corporation 4/9 Rev. 2.1.0 SP2526A Dual Channel USB Power Distribution Switch TYPICAL PERFORMANCE CHARACTERISTICS All data taken at VIN = 5.0V, TA = 25C, unless otherwise specified - Schematic and BOM from Application Information section of this datasheet. Fig. 4: Output On-Resistance vs Supply Voltage Fig. 5: Output On-Resistance vs Temperature Fig. 6: UVLO Threshold vs Temperature Fig. 7: On-state Supply Current vs Supply Voltage Fig. 8: On-state Supply Current vs Temperature Fig. 9: Off-state Supply Current vs Temperature (c) 2011 Exar Corporation 5/9 Rev. 2.1.0 SP2526A Dual Channel USB Power Distribution Switch Fig. 11: Control Threshold vs Supply Voltage Fig. 10: Off-state Supply Current vs Supply Voltage Fig. 12: Turn-on/Turn-off Characteristics (c) 2011 Exar Corporation 6/9 Rev. 2.1.0 SP2526A Dual Channel USB Power Distribution Switch may cause ringing on the input (from supply lead inductance) which can damage internal control circuitry. APPLICATION INFORMATION ERROR FLAG An open-drained output of an N-channel MOSFET, the FLG output is pulled low to signal the following fault conditions: input undervoltage, output current limit, and thermal shutdown. TRANSIENT REQUIREMENTS USB supports dynamic attachment (hot plugin) of peripherals. A current surge is caused by the input capacitance of a downstream device. Ferrite beads are recommended in series with all power and ground connector pins. Ferrite beads reduce EMI and limit the inrush current during hotattachment by filtering high-frequency signals. CURRENT LIMIT The current limit threshold is preset internally. It protects the output MOSFET switches from damage resulting from undesirable short circuit conditions or excess inrush current, which is often encountered during hot plug-in. The low limit of the current limit threshold of the SP2526A allows a minimum current of 0.6A through the MOSFET switches. A current limit condition will signal the Error Flag. SHORT CIRCUIT TRANSIENT Bulk capacitance provides the short-term transient current needed during a hotattachment event. A 33F/16V tantalum or a 100F/10V electrolytic capacitor mounted close to the downstream connector at each port should provide sufficient transient drop protection. THERMAL SHUTDOWN When the chip temperature exceeds 135C for any reason other than overcurrent fault of either one of the two MOSFETs, the thermal shutdown function turns off both MOSFET switches and signals the error flag. A hysteresis of 10C prevents the MOSFETs from turning back on until the chip temperature drops below 125C. However, if thermal shutdown is triggered by chip temperature rise resulting from overcurrent fault condition of either one of the MOSFET switches, the thermal shutdown function will only turn off the switch that is in overcurrent condition and the other switch can still remain its normal operation. In other words, the thermal shutdown function of the two switches is independent of each other in the case of overcurrent fault. PRINTED CIRCUIT LAYOUT The Power circuitry of USB printed circuit boards requires a customized layout to maximize thermal dissipation and to minimize voltage drop and EMI. TEST CIRCUIT SUPPLY FILTERING A 0.1F to 1F bypass capacitor from IN to GND, located near the device, is strongly recommended to control supply transients. Without a bypass capacitor, an output short (c) 2011 Exar Corporation 7/9 Rev. 2.1.0 SP2526A Dual Channel USB Power Distribution Switch PACKAGE SPECIFICATION 8-PIN NSOIC (c) 2011 Exar Corporation 8/9 Rev. 2.1.0 SP2526A Dual Channel USB Power Distribution Switch REVISION HISTORY Revision Date 2.0.0 11/19/2010 Reformat of datasheet Description 2.1.1 11/04/2011 Updated package specification FOR FURTHER ASSISTANCE Email: customersupport@exar.com Exar Technical Documentation: http://www.exar.com/TechDoc/default.aspx? EXAR CORPORATION HEADQUARTERS AND SALES OFFICES 48720 Kato Road Fremont, CA 94538 - USA Tel.: +1 (510) 668-7000 Fax: +1 (510) 668-7030 www.exar.com NOTICE EXAR Corporation reserves the right to make changes to the products contained in this publication in order to improve design, performance or reliability. EXAR Corporation assumes no responsibility for the use of any circuits described herein, conveys no license under any patent or other right, and makes no representation that the circuits are free of patent infringement. Charts and schedules contained here in are only for illustration purposes and may vary depending upon a user's specific application. While the information in this publication has been carefully checked; no responsibility, however, is assumed for inaccuracies. EXAR Corporation does not recommend the use of any of its products in life support applications where the failure malfunction of the product can reasonably be expected to cause failure of the life support system or to significantly affect safety or effectiveness. Products are not authorized for use in such applications unless EXAR Corporation receives, writing, assurances to its satisfaction that: (a) the risk of injury or damage has been minimized; (b) the user assumes such risks; (c) potential liability of EXAR Corporation is adequately protected under the circumstances. or its in all Reproduction, in part or whole, without the prior written consent of EXAR Corporation is prohibited. (c) 2011 Exar Corporation 9/9 Rev. 2.1.0