5 Energy Way, P.O. Box 1019, West Warwick, RI 02893 USA Tel. 800-424-9850/401-823-5200 • Fax 401-823-8723 • Email info@advintcorp.com • Internet http://www.advintcorp.com
To order: Add 3M to end of part #
To order: Add RTV to end of part #
Note: RTV not available with HCS or HCIS Insulators
Low Insertion Force
Peel-A-Way®PGA Sockets
Features:
•Disposable carriers peel away after
soldering.
•Peel-A-Way®tabs and full grid wafer
supplied on all Peel-A-Way®PGA sockets.
•Maximum air flow under PGA for greater
cooling.
•Better flux rinse and cleaning.
•Allows inspection of solder joints on both
sides of PCB.
•Lowest profile with use of type -210
terminal.
•Peel-A-Way®disposable socket terminal
carrier available in any configuration shown
or custom designed to meet your
specifications.
Terminals and Contacts:
Terminal: Brass - Copper Alloy (C36000)
ASTM-B-16
Contact: Beryllium Copper (C17200)
ASTM-B-194
Solder Preform:
63% Tin, 37% Lead
Plating:
Terminal: Gold over Nickel or
Tin-Lead over Nickel
Contact: Gold over Nickel or
Tin-Lead over Nickel
Gold per MIL-G-45204
Tin-Lead per MIL-P-81728
Nickel per QQ-N-290
Body Material:
KS/KIS - Polyimide Film
-269˚C to 400˚C (-452˚F to 752˚F)
Peel-A-Way®Low Insertion Force PGA Sockets
How To Order
KS - 2.5 oz.(70.85 g) avg. insertion force
KIS - 1 oz.(28.34 g) avg. insertion force
to PCB.
for inspection and cleaning.
Sealant Options
Peel-A-Way®covered by patent rights issued and/or pending.
How To Use:
1. Place socket in PCB.
2. Send PCB and socket through soldering operation.
3. Peel away polyimide film carrier.
inch/(mm)Products shown covered by patents issued and/or pending. Specifications subject to change without notice. Page 34