NPN EPITAXIAL PLANAR SILICON TRANSISTORS MPSA 42
MPSA 43
TO-92
CBE
Hi
g
h Volta
g
e Transistors.
ABSOLUTE MAXIMUM RATINGS(Ta=25deg C unless otherwise specified)
DESCRIPTION SYMBOL MPSA42 MPSA43 UNIT
Collector -Emitter Voltage VCEO 300 200 V
Collector -Base Voltage VCBO 300 200 V
Emitter -Base Voltage VEBO V
Collector Current Continuous IC mA
Power Dissipation @ Ta=25 degC PD mW
Derate above 25 deg C mW./deg C
Power Dissipation @ Tc=25 degC PD W
Derate above 25 deg C mW./deg C
Operating And Storage Junction Tj, Tstg deg C
Temperature Range
THERMAL RESISTANCE
Junction to Case Rth(j-c) deg C/W
Junction to Ambient Rth(j-a) deg C/W
ELECTRICAL CHARACTERISTICS (Ta=25 deg C Unless Otherwise Specified)
DESCRIPTION SYMBOL TEST CONDITION MPSA42 MPSA43 UNIT
Collector -Emitter Voltage VCEO IC=1mA,IB=0 >300 >200 V
Collector -Base Voltage VCBO IC=100uA.IE=0 >300 >200 V
Emitter-Base Voltage VEBO IE=100uA, IC=0 >6.0 >6.0 V
Collector-Cut off Current ICBO VCB=200V, IE=0 <100 - nA
VCB=160V, IE=0 - <100 nA
Emitter-Cut off Current IEBO VEB=6V, IC=0 <100 - nA
VEB=4V, IC=0 - <100 nA
DC Current Gain hFE* IC=1mA,VCE=10V >25 >25
IC=10mA,VCE=10V >40 >40
IC=30mA,VCE=10V >40 >40
Collector Emitter Saturation Voltage VCE(Sat)* IC=20mA,IB=2mA <0.5 <0.4 V
Base Emitter Saturation Voltage VBE(Sat) * IC=20mA,IB=2mA <0.9 <0.9 V
DYNAMIC CHARACTERISTICS .
Current Gain-Bandwidth Product ft IC=10mA, VCE=20V >50 >50 MHz
f=100MHz
Collector Base Capacitance Ccb VCB=20V, IE=0 <3.0 <4,0 pF
f=1MHz
*Pulse Test: Pulse Width=300us, Duty Cycle=2%
6
500
625
5
200
1.5
12
-55 to +150
83.3
E
B
C
Transys
Electronics
LI
M
ITE
D
TO-92 Transistors on Tape and Ammo Pack
TO-92 Plastic Package
TO-92 Bulk
TO-92 T&A
1K/polybag
2K/ammo box
200 gm/1K pcs
645 gm/2K pcs
3" x 7.5" x 7.5"
12.5" x 8" x 1.8"
5.0K
2.0K
17" x 15" x 13.5"
17" x 15" x 13.5"
80.0K
32.0K
23 kgs
12.5 kgs
PACKAGE
Net Weight/Qty
Details
STANDARD PACK INNER CARTON BOX
Qty
OUTER CARTON BOX
Qty Gr WtSize Size
P
ac
ki
ng
D
eta
il
CUMULATIVE PITCH
ERROR 1.0 mm/20
PITCH
TO BE MEASURED AT
BOTTOM O F CLINCH
AT TO P OF BO DY
t1 0.3 - 0.6
BODY WIDTH
BODY HEIGHT
BODY THICKNESS
PITCH OF COMPONENT
FEED HOLE PITCH
FEED HOLE CENTRE TO
COMPONENT CENTRE
DISTANCE BETWEEN OUTER
LEADS
CO M PONENT ALIGN MENT
TAPE WIDTH
HOLD-DOWN TAPE WIDTH
HOLE POSITION
HOLD-DOWN TAPE POSITION
LEAD WIRE CLINCH HEIGHT
COMPONENT HEIGHT
LENGTH OF SNIPPED LEADS
FEED HOLE DIAMETER
TOTAL TAPE THICKNESS
LEAD - TO - LEAD DISTANCEF1,
CLINCH HEIGHT
PULL - OUT FORCE
ITE M
A1
A
T
P
Po
P2
F
h
W
Wo
W1
W2
Ho
H1
L
Do
t
F2
H2
(P)
SYMBOL
SPECIFICATION
4.0
4.8
3.9
6N
MIN.
12.7
12.7
6.35
5.08
0
18
6
9
0.5
16
4
2.54
NOM.
4.8
5.2
4.2
1
23.25
11.0
1.2
3
MAX.
±1
±0.3
±0.4
+0.6
-0.2
±0.5
±0.2
+0.7
-0.5
±0.2
±0.5
±0.2
+0.4
-0.1
TOL . REMARKS
NOTES
1. MAXIMUM ALIGNMENT DEVIATION BETWEEN LEADS NOT TO BE GREATER THAN 0.2 mm.
2. MAXIMUM NON-CUMULATIVE VARIATION BETWEEN TAPE FEED HOLES SHALL NOT EXCEED 1 mm IN 20
PIT CH ES .
3. HOLDDOW N TAPE NOT TO EXCEED BEYOND THE EDGE(S) OF CARRIER TAPE AND THERE SHALL BE NO
EXPOSURE OF ADHESIVE.
4. NO MORE THAN 3 CONSECUTIVE MISSING COMPONENTS ARE PERMITTED.
5. A TAPE TRAILER, HAVING AT LEAST THREE FEED HOLES ARE REQUIRED AFTER THE LAST COMPONENT.
6. SPLICES SHALL NOT INTERFERE W ITH THE SPROCKET FEED HOLES.
All dimensions in mm unless specified otherwise
Ammo Pack
S
t
y
le
Adhesive Ta
p
e on To
p
Side
FLAT SIDE
MECHANICAL DATA
T
t1
tF1 F2
F
P2
Po
Do
(p)
W2
Wo W1
W
H1
A
A1
P
H0
L
Flat Side of Transistor and
Adhesive Tape Visible
2000 pcs./Am mo Pack
LABEL
Carrier
Strip
8.2"
13"
FEED
1.77"
hh
B
3 2 1
AK
E
DAA
SEC AA
G
D
FF
H
C
3 2 1
321
All diminsions in mm.
DIM MIN. MAX.
A 4.32 5.33
B 4.45 5.20
C 3.18 4.19
D 0.41 0.55
E 0.35 0.50
F5 DEG
G 1.14 1.40
H 1.14 1.53
K 12.70 —
PIN CONFIGURATION
1. COLLECTOR
2. BASE
3. EMITTER
