MBRS130LT3G - ON Semiconductor L.L.C.

 Semiconductor Components Industries, LLC, 2012

January, 2012 − Rev. 9

1Publication Order Number:

MBRS130LT3/D

MBRS130LT3G,

SBRS8130LT3G

Schottky Power Rectifier

Surface Mount Power Package

This device employs the Schottky Barrier principle in a large area

metal−to−silicon power diode. State−of−the−art geometry features

epitaxial construction with oxide passivation and metal overlay

contact. Ideally suited for low voltage, high frequency rectification,

or as free wheeling and polarity protection diodes, in surface mount

applications where compact size and weight are critical to the

system.

Features

Very Low Forward Voltage Drop (0.395 Volts Max @ 1.0 A, TJ = 25C)

Small Compact Surface Mountable Package with J−Bend Leads

Highly Stable Oxide Passivated Junction

Guard−Ring for Stress Protection

ESD Ratings:

Human Body Model = 3B (> 16000 V)

Machine Model = C (> 400 V)

AEC−Q101 Qualified and PPAP Capable

SBRS8 Prefix for Automotive and Other Applications Requiring

Unique Site and Control Change Requirements

All Packages are Pb−Free*

Mechanical Characteristics

Case: Epoxy, Molded

Weight: 100 mg (approximately)

Finish: All External Surfaces Corrosion Resistant and Terminal

Leads are Readily Solderable

Lead and Mounting Surface Temperature for Soldering Purposes:

260C Max. for 10 Seconds

Cathode Polarity Band

*For additional information on our Pb−Free strategy and soldering details, please

download the ON Semiconductor Soldering and Mounting Techniques

Reference Manual, SOLDERRM/D.

http://onsemi.com

SMB

CASE 403A

SCHOTTKY BARRIER

RECTIFIER

1.0 AMPERE

30 VOLTS

Device Package Shipping†

ORDERING INFORMATION

MBRS130LT3G SMB

(Pb−Free)

2,500 /

Tape & Reel

†For information on tape and reel specifications,

including part orientation and tape sizes, please

refer to our Tape and Reel Packaging Specifications

Brochure, BRD8011/D.

MARKING DIAGRAM

1BL3 = Specific Device Code

A = Assembly Location

Y = Year

WW = Work Week

G= Pb−Free Package

AYWW

1BL3G

(Note: Microdot may be in either location)

SBRS8130LT3G SMB

(Pb−Free)

2,500 /

Tape & Reel

MBRS130LT3G, SBRS8130LT3G

http://onsemi.com

MAXIMUM RATINGS

Rating Symbol Value Unit

Peak Repetitive Reverse Voltage

Working Peak Reverse Voltage

DC Blocking Voltage

VRRM

VRWM

30 V

Average Rectified Forward Current

TL = 120C

TL = 110C

IF(AV) 1.0

2.0

Non−Repetitive Peak Surge Current

(Surge Applied at Rated Load Conditions Halfwave, Single Phase, 60 Hz)

IFSM 40

Operating Junction Temperature TJ−65 to +125 C

Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the

Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect

device reliability.

THERMAL CHARACTERISTICS

Characteristic Symbol Value Unit

Thermal Resistance,

Junction−to−Lead

YJL 12

C/W

Thermal Resistance,

Junction−to−Ambient (TA = 25C, Min Pad, 1 oz copper)

Junction−to−Ambient (TA = 25C, 1” Pad, 1 oz copper)

RqJA 228.8

71.3

C/W

ELECTRICAL CHARACTERISTICS

Characteristic Symbol Value Unit

Maximum Instantaneous Forward Voltage (Note 1)

(iF = 1.0 A, TJ = 25C)

(iF = 2.0 A, TJ = 25C)

VF0.395

0.445

Maximum Instantaneous Reverse Current (Note 1)

(Rated dc Voltage, TJ = 25C)

(Rated dc Voltage, TJ = 100C)

IR1.0

1. Pulse Test: Pulse Width = 300 ms, Duty Cycle  2%.

, INSTANTANEOUS VOLTAGE (V)

Figure 1. Typical Forward Voltage Figure 2. Maximum Forward Voltage

0.1

0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

, INSTANTANEOUS FORWARD CURRENT

(A)

TJ = 100C

25C

0.1

0 0.1 0.2 0.3 0.4 0.5 0.6 0.7

, MAXIMUM INSTANTANEOUS FORWARD

CURRENT (A)

TJ = 100C

25C

, MAXIMUM INSTANTANEOUS VOLTAGE (V)

MBRS130LT3G, SBRS8130LT3G

http://onsemi.com

100

1.0

0.1

0.01

0.001

0 3 6 9 12 15 18 21 24 27 30

VR, REVERSE VOLTAGE (V)

IR, IREVERSE CURRENT (mA)

TJ = 100C

25C

0 3 6 9 12 15 18 21 24 27 30

VR, REVERSE VOLTAGE (V)

IR, IREVERSE CURRENT (mA)

TJ = 100C

25C

Figure 3. Typical Reverse Leakage Current Figure 4. Typical Maximum Reverse Leakage

Curent

100

1.0

0.1

0.01

0.001

0.2

0.4

0.6

0.8

1.2

1.4

1.6

1.8

100 105 110 115 120 125 130

TC, CASE TEMPERATURE (C)

Figure 5. Current Derating (Case)

IF(AV), AVERAGE FORWARD CURRENT (A)

SQUARE WAVE

0.1

0.2

0.3

0.4

0.5

0.6

0.7

0.8

0.9

0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6

IF(AV), AVERAGE FORWARD CURRENT (A)

Figure 6. Typical Power Dissipation

PF(AV), AVERAGE POWER DISSIPATION (W)

SQUARE

C, CAPACITANCE (pF)

400

350

300

250

200

150

100

0 4 8 12162024 2832

VR, REVERSE VOLTAGE (VOLTS)

Figure 7. Typical Capacitance

NOTE: TYPICAL CAPACITANCE

AT 0 V = 290 pF

MBRS130LT3G, SBRS8130LT3G

http://onsemi.com

Figure 8. Thermal Response, Min Pad

t, TIME (s)

1000

0.1

0.2

0.02

D = 0.5

0.05

0.01

SINGLE PULSE

100 1000100.10.0010.00010.000001

0.1

100

10.010.00001

EFFECTIVE TRANSIENT THERMAL RESISTANCE

Figure 9. Thermal Response, 1 Inch Pad

t, TIME (s)

0.1

0.2

0.02

D = 0.5

0.05

0.01

SINGLE PULSE

100 1000100.10.0010.00010.000001

0.1

100

10.010.00001

EFFECTIVE TRANSIENT THERMAL RESISTANCE

Figure 10. Thermal Resistance vs. Copper Area Figure 11. Power Dissipation vs. Copper Area

100

125

150

175

200

225

0 100 200 300 400 500 600 700

COPPER AREA (mm2)

qJA (C/W)

2.0 oz

1.0 oz

250

275

0.2

0.4

0.6

0.8

1.0

1.2

1.4

1.6

1.8

0 100 200 300 400 500 600 700

COPPER AREA (mm2)

POWER DISSIPATION (W)

2.0 oz

1.0 oz

2.0

Power based on TA = 25C

MBRS130LT3G, SBRS8130LT3G

http://onsemi.com

PACKAGE DIMENSIONS

SMB

CASE 403A−03

ISSUE H

NOTES:

1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982.

2. CONTROLLING DIMENSION: INCH.

3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P.

2.261

0.089

2.743

0.108

2.159

0.085 ǒmm

inchesǓ

SCALE 8:1

*For additional information on our Pb−Free strategy and soldering

details, please download the ON Semiconductor Soldering and

Mounting Techniques Reference Manual, SOLDERRM/D.

SOLDERING FOOTPRINT*

DIM

MIN NOM MAX MIN

MILLIMETERS

1.90 2.20 2.28 0.075

INCHES

A1 0.05 0.10 0.19 0.002

b1.96 2.03 2.20 0.077

c0.15 0.23 0.31 0.006

D3.30 3.56 3.95 0.130

E4.06 4.32 4.60 0.160

L0.76 1.02 1.60 0.030

0.087 0.090

0.004 0.007

0.080 0.087

0.009 0.012

0.140 0.156

0.170 0.181

0.040 0.063

NOM MAX

5.21 5.44 5.60 0.205 0.214 0.220

0.51 REF 0.020 REF

POLARITY INDICATOR

OPTIONAL AS NEEDED

ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice

to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability

arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.

“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All

operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights

nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications

intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should

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and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death

associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal

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PUBLICATION ORDERING INFORMATION

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USA/Canada

Europe, Middle East and Africa Technical Support:

Phone: 421 33 790 2910

Japan Customer Focus Center

Phone: 81−3−5817−1050

MBRS130LT3/D

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