BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 33 - 2
1 of 5
www.diodes.com
February 2018
© Diodes Incorporated
BZX84C2V4 - BZX84C51
350mW SURFACE MOUNT ZENER DIODE
Features
Planar Die Construction
350mW Power Dissipation
Zener Voltages from 2.4V - 51V
Ideally Suited for Automated Assembly Processes
Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2)
Halogen and Antimony Free. “Green” Device (Note 3)
Qualified to AEC-Q101 Standards for High Reliability
Mechanical Data
Case: SOT23
Case Material: Molded Plastic.
UL Flammability Classification Rating 94V-0
Moisture Sensitivity: Level 1 per J-STD-020
Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe
(Lead Free Plating). Solderable per MIL-STD-202, Method 208
Polarity: See Diagram
Weight: 0.008 grams (Approximate)
Ordering Information (Note 5)
Part Number
Compliance
Packaging
(Type Number)-7-F
Standard
3,000/Tape & Reel
(Type Number)Q-7-F
Automotive
3,000/Tape & Reel
(Type Number)-13-F
Standard
10,000/Tape & Reel
(Type Number)Q-13-F
Automotive
10,000/Tape & Reel
*For (Type Number), please see the Electrical Characteristics Table. Example: 6.2V Zener = BZX84C6V2-7-F.
Notes: 1. No purposely added lead. Fully EU Directive 2002/95/EC (RoHS), 2011/65/EU (RoHS 2) & 2015/863/EU (RoHS 3).compliant.
2. See https://www.diodes.com/quality/lead-free/ for more information about Diodes Incorporated’s definitions of Halogen- and Antimony-free, "Green" and
Lead-free.
3. Halogen- and Antimony-free "Green” products are defined as those which contain <900ppm bromine, <900ppm chlorine (<1500ppm total Br + Cl) and
<1000ppm antimony compounds.
4. BZX84C2V4-BZX84C39 products manufactured with Date Code OW (week 42, 2009) and newer are built with Green Molding Compound. BZX84C2V4-
BZX84C39 products manufactured prior to Date Code OW are built with Non-Green Molding Compound and may contain Halogens or Sb2O3 Fire
Retardants. BZX84C43-BZX84C51 products manufactured with Date Code V9 (week 33, 2008) and newer are built with Green Molding Compound.
BZX84C43-BZX84C51 products manufactured prior to Date Code V9 are built with Non-Green Molding Compound and may contain Halogens or Sb2O3
Fire Retardants.
5. For packaging details, go to our website at http://www.diodes.com/products/packages.html.
Marking Information
Date Code Key
Year
1998
…
2008
2009
2010
2011
2012
2013
2014
2015
2016
2017
2018
2019
2020
2021
2022
Code
J
…
V
W
X
Y
Z
A
B
C
D
E
F
G
H
I
J
Month
Jan
Feb
Mar
Apr
May
Jun
Jul
Aug
Sep
Oct
Nov
Dec
Code
1
2
3
4
5
6
7
8
9
O
N
D
Top View
Device Schematic
SOT23
xx = Product Type Marking Code
(See Electrical Characteristics Table)
YM = Date Code Marking for Shanghai
Assembly / Test site
Y = Year (ex: Z = 2012)
M = Month (ex: 9 = September)
xx = Product Type Marking Code
(See Electrical Characteristics Table)
= Date Code Marking for Chengdu
Assembly / Test site
= Year (ex: Z = 2012)
M = Month (ex: 9 = September)
Kxx
YM
Kxx
YM
YM
Y
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 33 - 2
2 of 5
www.diodes.com
February 2018
© Diodes Incorporated
BZX84C2V4 - BZX84C51
Maximum Ratings (@TA = +25°C, unless otherwise specified.)
Characteristic
Symbol
Value
Unit
Forward Voltage @ IF = 10mA
VF
0.9
V
Thermal Characteristics
Characteristic
Symbol
Value
Unit
Power Dissipation (Note 6)
PD
300
mW
Power Dissipation (Note 7)
PD
350
mW
Thermal Resistance, Junction to Ambient Air (Note 6)
RθJA
417
°C/W
Thermal Resistance, Junction to Ambient Air (Note 7)
RθJA
357
°C/W
Operating and Storage Temperature Range
TJ, TSTG
-65 to +150
°C
Electrical Characteristics (@TA = +25°C, unless otherwise specified.)
Type
Number
Marking
Code
Zener Voltage
Range
(Note 8)
Maximum Zener
Impedance
f = 1KHz
Maximum Reverse
Current
(Note 8)
Temperature
Coefficient
@ IZT mV/C
VZ @ IZT
IZT
ZZT @ IZT
ZZK @ IZK
IR
VR
Min
Max
Nom (V)
Min (V)
Max (V)
(mA)
()
()
(mA)
(µA)
(V)
BZX84C2V4
ZB
2.4
2.2
2.6
5.0
100
600
1.0
50
1.0
-3.5
0
BZX84C2V7
ZC
2.7
2.5
2.9
5.0
100
600
1.0
20
1.0
-3.5
0
BZX84C3V0
ZD
3.0
2.8
3.2
5.0
95
600
1.0
10
1.0
-3.5
0
BZX84C3V3
ZE
3.3
3.1
3.5
5.0
95
600
1.0
5.0
1.0
-3.5
0
BZX84C3V6
ZF
3.6
3.4
3.8
5.0
90
600
1.0
5.0
1.0
-3.5
0
BZX84C3V9
ZG
3.9
3.7
4.1
5.0
90
600
1.0
3.0
1.0
-3.5
0
BZX84C4V3
ZH
4.3
4.0
4.6
5.0
90
600
1.0
3.0
1.0
-3.5
0
BZX84C4V7
Z1
4.7
4.4
5.0
5.0
80
500
1.0
3.0
2.0
-3.5
0.2
BZX84C5V1
Z2
5.1
4.8
5.4
5.0
60
480
1.0
2.0
2.0
-2.7
1.2
BZX84C5V6
Z3
5.6
5.2
6.0
5.0
40
400
1.0
1.0
2.0
-2.0
2.5
BZX84C6V2
Z4
6.2
5.8
6.6
5.0
10
150
1.0
3.0
4.0
0.4
3.7
BZX84C6V8
Z5
6.8
6.4
7.2
5.0
15
80
1.0
2.0
4.0
1.2
4.5
BZX84C7V5
Z6
7.5
7.0
7.9
5.0
15
80
1.0
1.0
5.0
2.5
5.3
BZX84C8V2
Z7
8.2
7.7
8.7
5.0
15
80
1.0
0.7
5.0
3.2
6.2
BZX84C9V1
Z8
9.1
8.5
9.6
5.0
15
100
1.0
0.5
6.0
3.8
7.0
BZX84C10
Z9
10
9.4
10.6
5.0
20
150
1.0
0.2
7.0
4.5
8.0
BZX84C11
Y1
11
10.4
11.6
5.0
20
150
1.0
0.1
8.0
5.4
9.0
BZX84C12
Y2
12
11.4
12.7
5.0
25
150
1.0
0.1
8.0
6.0
10.0
BZX84C13
Y3
13
12.4
14.1
5.0
30
170
1.0
0.1
8.0
7.0
11.0
BZX84C15
Y4
15
13.8
15.6
5.0
30
200
1.0
0.1
10.5
9.2
13.0
BZX84C16
Y5
16
15.3
17.1
5.0
40
200
1.0
0.1
11.2
10.4
14.0
BZX84C18
Y6
18
16.8
19.1
5.0
45
225
1.0
0.1
12.6
12.4
16.0
BZX84C20
Y7
20
18.8
21.2
5.0
55
225
1.0
0.1
14.0
14.4
18.0
BZX84C22
Y8
22
20.8
23.3
5.0
55
250
1.0
0.1
15.4
16.4
-
BZX84C24
Y9
24
22.8
25.6
5.0
70
250
1.0
0.1
16.8
18.4
-
BZX84C27
YA
27
25.1
28.9
2.0
80
300
0.5
0.1
18.9
21.4
-
BZX84C30
YB
30
28.0
32.0
2.0
80
300
0.5
0.1
21.0
24.4
-
BZX84C33
YC
33
31.0
35.0
2.0
80
325
0.5
0.1
23.1
27.4
-
BZX84C36
YD
36
34.0
38.0
2.0
90
350
0.5
0.1
25.2
30.4
-
BZX84C39
YE
39
37.0
41.0
2.0
130
350
0.5
0.1
27.3
33.4
-
BZX84C43
YF
43
40.0
46.0
2.0
150
375
0.5
0.1
30.1
37.6
-
BZX84C47
YG
47
44.0
50.0
2.0
170
375
0.5
0.1
32.9
42.0
-
BZX84C51
YH
51
48.0
54.0
2.0
180
400
0.5
0.1
35.7
46.6
-
Notes: 6. Device mounted on FR-4 PC board with recommended pad layout, which can be found on our website at http://www.diodes.com.
7. Valid provided the terminals are kept at ambient temperature.
8. Short duration pulse test used to minimize self-heating effect.
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 33 - 2
3 of 5
www.diodes.com
February 2018
© Diodes Incorporated
BZX84C2V4 - BZX84C51
400
T , Ambient Temperature, (°C)
Fig. 1 Power Derating Curve
A
P , POWER DISSIPATION (mW)
D
200
100
300
0
500
0100 200
Note 6 Note 7
0
10
20
30
40
50
0 1 2 3 4 5 6 78 9 10
I , ZENER CURRENT (mA)
Z
V , ZENER VOLTAGE (V)
Fig. 2 Typical Zener Breakdown Characteristics
Z
0
10
20
30
0
I , ZENER CURRENT (mA)
Z
V , ZENER VOLTAGE (V)
Fig. 3 Typical Zener Breakdown Characteristics
Z
10 20 30 40
T = 25°C
j
Test current I
5mA Z
Test current I
2mA Z
C10
C12
C18
C22
C27
C33 C36
C39
C15
0
2
4
6
8
10
10
020 30 40 50 60 70
I , ZENER CURRENT (mA)
Z
V , ZENER VOLTAGE (V)
Fig. 4 Typical Zener Breakdown Characteristics
Z
T = 25°C
J
Test Current I
2mA Z
C43
C47
C51
C , TOTAL CAPACITANCE (pF)
T
10
100
1,000
10 100
1V , NOMINAL ZENER VOLTAGE (V)
Fig. 5 Typical Total Capacitance vs. Nominal Zener Voltage
Z
T = 25°C
J
V = 1V
R
V = 2V
R
V = 1V
R
V = 2V
R
C , TOTAL CAPACITANCE (pF)
T
1
10
100
100
10 V , NOMINAL ZENER VOLTAGE (V)
Fig. 6 Typical Total Capacitance vs. Nominal Zener Voltage
Z
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 33 - 2
4 of 5
www.diodes.com
February 2018
© Diodes Incorporated
BZX84C2V4 - BZX84C51
Package Outline Dimensions
Please see http://www.diodes.com/package-outlines.html for the latest version.
J
K1 K
L1
GAUGE PLANE
0.25
H
L
M
All 7°
A
CB
D
G
F
a
Suggested Pad Layout
Please see http://www.diodes.com/package-outlines.html for the latest version.
X
Y
Y1 C
X1
SOT23
Dim
Min
Max
Typ
A
0.37
0.51
0.40
B
1.20
1.40
1.30
C
2.30
2.50
2.40
D
0.89
1.03
0.915
F
0.45
0.60
0.535
G
1.78
2.05
1.83
H
2.80
3.00
2.90
J
0.013
0.10
0.05
K
0.890
1.00
0.975
K1
0.903
1.10
1.025
L
0.45
0.61
0.55
L1
0.25
0.55
0.40
M
0.085
0.150
0.110
a
0°
8°
--
All Dimensions in mm
Dimensions
Value (in mm)
C
2.0
X
0.8
X1
1.35
Y
0.9
Y1
2.9
BZX84C2V4 - BZX84C51
Document number: DS18001 Rev. 33 - 2
5 of 5
www.diodes.com
February 2018
© Diodes Incorporated
BZX84C2V4 - BZX84C51
IMPORTANT NOTICE
DIODES INCORPORATED MAKES NO WARRANTY OF ANY KIND, EXPRESS OR IMPLIED, WITH REGARDS TO THIS DOCUMENT,
INCLUDING, BUT NOT LIMITED TO, THE IMPLIED WARRANTIES OF MERCHANTABILITY AND FITNESS FOR A PARTICULAR PURPOSE
(AND THEIR EQUIVALENTS UNDER THE LAWS OF ANY JURISDICTION).
Diodes Incorporated and its subsidiaries reserve the right to make modifications, enhancements, improvements, corrections or other changes
without further notice to this document and any product described herein. Diodes Incorporated does not assume any liability arising out of the
application or use of this document or any product described herein; neither does Diodes Incorporated convey any license under its patent or
trademark rights, nor the rights of others. Any Customer or user of this document or products described herein in such applications shall assume
all risks of such use and will agree to hold Diodes Incorporated and all the companies whose products are represented on Diodes Incorporated
website, harmless against all damages.
Diodes Incorporated does not warrant or accept any liability whatsoever in respect of any products purchased through unauthorized sales channel.
Should Customers purchase or use Diodes Incorporated products for any unintended or unauthorized application, Customers shall indemnify and
hold Diodes Incorporated and its representatives harmless against all claims, damages, expenses, and attorney fees arising out of, directly or
indirectly, any claim of personal injury or death associated with such unintended or unauthorized application.
Products described herein may be covered by one or more United States, international or foreign patents pending. Product names and markings
noted herein may also be covered by one or more United States, international or foreign trademarks.
This document is written in English but may be translated into multiple languages for reference. Only the English version of this document is the
final and determinative format released by Diodes Incorporated.
LIFE SUPPORT
Diodes Incorporated products are specifically not authorized for use as critical components in life support devices or systems without the express
written approval of the Chief Executive Officer of Diodes Incorporated. As used herein:
A. Life support devices or systems are devices or systems which:
1. are intended to implant into the body, or
2. support or sustain life and whose failure to perform when properly used in accordance with instructions for use provided in the
labeling can be reasonably expected to result in significant injury to the user.
B. A critical component is any component in a life support device or system whose failure to perform can be reasonably expected to cause the
failure of the life support device or to affect its safety or effectiveness.
Customers represent that they have all necessary expertise in the safety and regulatory ramifications of their life support devices or systems, and
acknowledge and agree that they are solely responsible for all legal, regulatory and safety-related requirements concerning their products and any
use of Diodes Incorporated products in such safety-critical, life support devices or systems, notwithstanding any devices- or systems-related
information or support that may be provided by Diodes Incorporated. Further, Customers must fully indemnify Diodes Incorporated and its
representatives against any damages arising out of the use of Diodes Incorporated products in such safety-critical, life support devices or systems.
Copyright © 2018, Diodes Incorporated
www.diodes.com