Low Power CMOS ASIC 0.3m 3V/2V TC222C Series Cell-Based IC PRODUCT GUIDE Overview features help to substantially reduce your chip's power while maximizing the critical path speed. Power Comparison (e.g., 100k gates, 70k-bit SRAM, 20MHz) Core : 3V Core : 2V, I/Os : Single 3V 300 250 200 (mW) Toshiba's TC222C cell-based ASIC series provides silicon solutions to meet your design goals for highperformance and low-power systems. Fabricated on an advanced 0.3-micron double/triple metal CMOS process, the TC222C Series offers a choice of many different array sizes ranging from 59,000 to 2,077,000 usable gates. The TC222C Series is optimized for low 2.0V operation with dual 2.0/3.0V I/O options. The special cell architecture led to an extremely low power dissipation rating of 0.09 W/MHz/gate (with a fanout of 1). For a wide variety of applications, three or more variations of macrocells are available allowing the optimum tuning of performance and power. The placement-and-routing run can be power-driven to ensure that the result is the lowest power implementation that meets timing constraints. All these 150 100 50 0 TC200C TC222C TC222C after power optimization Product Specifications Process Technology 2-input NAND, High drive, F/O = 1 Gate Delay 2-input NAND, High drive, F/O = 2 + estimated wire load 2-input NAND, Low drive, F/O = 1 Power Consumption 2-input NAND, Low drive, F/O = 4 Power Supply Recommended Operating Voltage Range 0.3 m HC2MOS Si-gate double-/triple-layer metal 0.10 ns 0.21 ns 0.09 W/MHz/gate 0.18 W/MHz/gate [Core] 2.0 V [I/O] 3.0 V / 2.0 V [Core] 2.0 V 0.2 V [I/O] 3.0 V 0.3 V / 2.0 V 0.2 V Loaded with low-power cell(s) Product Lines Double-layer Metal Ref. Part Number Gird Equivalent Ref. No Complexity Gates No 04 TC222C040 118,000 59,000 54 06 TC222C060 166,000 83,000 56 08 TC222C080 226,000 113,000 58 10 TC222C100 274,000 137,000 60 12 TC222C120 334,000 167,000 62 14 TC222C140 400,000 200,000 64 16 TC222C160 448,000 224,000 66 18 TC222C180 520,000 260,000 68 20 TC222C200 598,000 299,000 70 22 TC222C220 682,000 341,000 72 24 TC222C240 770,000 385,000 74 26 TC222C260 864,000 432,000 76 28 TC222C280 962,000 481,000 78 30 TC222C300 1,068,000 534,000 80 32 TC222C320 1,178,000 589,000 82 34 TC222C340 1,270,000 635,000 84 36 TC222C360 1,446,000 723,000 86 38 TC222C380 1,634,000 817,000 88 40 TC222C400 1,832,000 916,000 90 42 TC222C420 2,576,000 1,288,000 92 Triple-layer Metal Gird Part Number Complexity TC222C540 196,000 TC222C560 274,000 TC222C580 372,000 TC222C600 450,000 TC222C620 546,000 TC222C640 654,000 TC222C660 720,000 TC222C680 836,000 TC222C700 962,000 TC222C720 1,094,000 TC222C740 1,236,000 TC222C760 1,388,000 TC222C780 1,546,000 TC222C800 1,714,000 TC222C820 1,890,000 TC222C840 2,048,000 TC222C860 2,332,000 TC222C880 2,634,000 TC222C900 2,954,000 TC222C920 4,154,000 Equivalent Gates 98,000 137,000 186,000 225,000 273,000 327,000 360,000 418,000 481,000 547,000 618,000 694,000 773,000 857,000 945,000 1,024,000 1,166,000 1,317,000 1,477,000 2,077,000 Maximum I/O Pads Wire TCP/TBGA PQFP[TAB] Bonding /TBGA 96 148 200 120 184 248 136 212 288 152 236 316 168 260 348 184 284 380 200 312 420 216 336 452 232 360 484 248 384 516 264 408 548 280 432 296 456 312 480 328 504 352 540 376 576 400 612 424 648 504 768 System Application Example -Digital CamcorderBecause customers buying ultraportable devices rank portability and long battery life at the top of their feature preferences, the TC222C Series are ideal for these products. The high-density and low-power features of the TC222C Series were essential to successfully implement complex designs for the DVC. In the application example depicted below, the TC222C Series turned a five- or seven-piece chip set for the digital signal processing portion of digital camcorders into a two- or three-chip set. The TC222C chips additionally incorporated DRAM chips. After the VHS-H and 8-mm Betacam models have long been the mainstay of consumer-use camcorders, digital video cameras (DVC) are now coming on the market. The DVC, expected to become the core equipment in the multimedia era, combines superior video quality with the ability to transmit video to a personal computer and to the Internet. The rewards for designing with the TC222C Series are obvious. The new DVCs are light and easy to carry while the previous models were nearly as large as the early analog camcorders that were hoisted onto the shoulder. In addition, the TC222C implementation helped to dramatically extend battery life. Digital Signal Processing TC222C Series Audio IC Audio Modulation/ Demodulation TC222C Series Shuffling Video Video Compression/ Decompression ErrorCorrection Head Amplifier Equalizer DAC, ADC DRAM DRAM for Shuffling Chip Layout Integration allows high-performance specialized blocks for video compression, etc. to be consolidated onto the same chip. Operating at 2V, the TC222C Series reduces power dissipation in large, densely populated chips. The TC222C operates with a 2V core and offers both 3V and 2V I/Os. The 2V core reduces the power consumption of your design, while the 3V and 2V I/O compatibility offers you flexibility with your system interface design. Compiled SRAM The megacell compiler software can generate a wide range of high-density SRAMs and ROMs in low-power models. DRAM Core The embedded DRAM core is based on our world-leading 64-Mbit DRAM process technology. User-defined Logic DAC/ADC OVERSEAS SUBSIDIARIES AND AFFILIATES Toshiba America Electronic Components, Inc. Headquarters-Irvine, CA 9775 Toledo Way, Irvine, CA 92718, U.S.A. Tel: (714)455-2000 Fax: (714)859-3963 Altamonte Springs, FL(Orland) 600 S, North Lake Blvd., Suite 250, Altamonte Springs, FL 32701, U.S.A. Tel: (407)332-0966 Fax: (407)339-3777 Deerfield, IL(Chicago) One Pkwy., North, Suite 500, Deerfield, IL 60015-2547, U.S.A. Tel: (847)945-1500 Fax: (847)945-1044 Denver, CO 8400 E, Prentice Englewood, CO 80111, U.S.A. Tel: (303)220-9848 Fax: (303)220-9856 Edison, NJ 2035 Lincoln Hwy. Ste. #3000, Edison NJ 08817, U.S.A. Tel: (908)248-8070 Fax: (908)248-8030 Irvine, CA 2 Venture Plaza, Suite 500, Irvine, CA 92718, U.S.A. Tel: (714)453-0224 Fax: (714)453-0125 Microelectronics Center-Sunnyvale, CA 1220 Midas Way, Sunnyvale, CA 94088-3509, U.S.A. Tel: (408)739-0560 Fax: (408)746-0577 Norcross, GA(Atlanta) 655 Engineering Dr. #160, Norcross, GA 30092, U.S.A. Tel: (404)368-0203 Fax: (404)368-0075 Munchen Office Penang Office Buro Munchen Hofmannstrasse 52, D-81378, Munchen, Germany Tel: (089)748595-0 Fax: (089)748595-42 Suite 13-1, 13th Floor, Menard Penang Garden, 42-A, Jalan Sultan Ahmad Shah, 100 50 Penang, Malaysia Tel: 4-226-8523 Fax: 4-226-8515 Berlin Office Buro Berlin, Alt-Moabit 96B, D-10559, Berlin, Germany Tel: (030)-3999000 Fax: (030)-3999017 Toshiba Electronics France SARL Immeuble Robert Schumann 3 Rue de Rome, F-93561, Rosny-Sous-Bois, Cedex, France Tel: (1)48-12-48-12 Fax: (1)48-94-51-15 Toshiba Electronics Italiana S.R.L. Centro Direzionale Colleoni Palazzo Perseo Ingr. 2-Piano 6, Via Paracelso n.12, 1-20041 Agrate Brianza Milan, Italy Tel: (039)68701 Fax:(039)6870205 Toshiba Electronics Espana, S.A. Parque Empresarial San Fernando Edificio Europa, a 1 Planta, ES-28831 Madrid, Spain Tel: (91)660-6700 Fax:(91)660-6799 Toshiba Electronics(UK) Limited Riverside Way, Camberley Surrey, GU15 3YA, U.K. Tel: (01276)69-4600 Fax: (01276)69-4800 Wakefield, MA(Boston) 401 Edgewater Place, Suite #360, Wakefield, Essex, MA 01880-6229, U.S.A. Tel: (617)224-0074 Fax:(617)224-1095 San Jose Engineering Center, CA 1060 Rincon Circle, San Jose, CA 95131, U.S.A. Tel: (408)456-8900 Fax: (408)456-8910 Toshiba Electronics Europe GmbH Dusseldorf Head Office Hansaallee 181, D-40549 Dusseldorf Germany Tel: (0211)5296-0 Fax: (0211)5296-400 Toshiba Electronics Asia, Ltd. Hong Kong Head Office Level 11, Top Glory Insurance Building, Grand Century Place, No.193, Prince Edward Road West, Mong Kok, Kowloon, Hong Kong Tel: 2375-6111 Fax: 2375-0969 Seoul Branch 14/F, KEC B/D, 257-7 Yangjae-dong, Seocho-ku, Seoul, Korea Tel: (02)589-4334 Fax: (02)589-4302 Seoul Branch, Gumi Office 6/F, Ssangyong Investment Securities B/D, 56 Songjung-Dong, Gumi City Kyeongbuk, Korea Tel: (0645)456-7613-6 Fax: (0546)456-7617 Shenzhen Office Rm 3010-3012, Shun Hing Square, Di Wang Commercial Centre, 333 Shennan Road East, Shenzhen, China, 518008 Tel: (0755)246-1582 Fax: (0755)246-1581 Shanghai Office Toshiba Electronics Scandinavia AB Gustavslundsvagen 12, 2nd Floor S-161 15 Bromma, Sweden Tel: (08)704-0900 Fax: (08)80-8459 RM2612 26F, Rui Jin Bldg., 205 Mao Ming South Rd., Shanghai, China Tel: (021)64723077 Fax:(021)64727028 Tsurong Xiamen Xiangyu Trading Co., Ltd. 8N, Xiamen Sez Bonded Goods Market Building, Xiamen, Fujian, China Tel: (0592)562-3798 Fax:(0592)562-3799 Richardson, TX(Dallas) 777 East Campbell Rd., Suite 650, Richardson, TX 75081, U.S.A. Tel: (214)480-0470 Fax: (214)235-4114 971006(A) Toshiba Electronics Asia (Singapore) Pte. Ltd. Singapore Head Office 460 Alexandra Rd., #21-00 PSA Bldg., Singapore 0511 Tel: (278)5252 Fax: (271)5155, (270)6056 Bangkok Office 135 Moo 5 Bangkadi Industrial Park, Tivanon Rd., Bangkadi Amphur Muang Pathumthani 12000, Thailand Tel: (2)501-1635 Fax: (2)501-1638 Toshiba Electronics Trading (Malaysia)Sdn. Bhd. Kuala Lumpur Head Office Suite W1203, Wisma Consplant, No.2, Jalan SS 16/4, Subang Jaya, 47500 Petaling Jaya, Selangor Darul Ehsan, Malaysia Tel: (3)731-6311 Fax: (3)731-6307 Stuttgart Office Buro Stuttgart, Eltinger Str. 61, D-71229 Leonberg, Germany Tel: (07152)6045-0 Fax: (07152)6045-45 Beijing Office Rm 714, Beijing Fortune Building, No.5 Dong San Huan Bei-Lu, Chao Yang District, Beijing, China, 10004 Tel:(010)6595-8795 Fax: (010)6591-9346 Toshiba Electronics Taiwan Corporation Taipei Head Office 17F, Union Enterprise Plaza Bldg. 109 Min Sheng East Rd., Section 3, 0446 Taipei, Taiwan R.O.C. Tel: (02)514-9988 Fax: (02)514-7892 Kaohsiung Office 16F-A, Chung-Cheng Bldg., Chung-Cheng 3Rd., 80027, Kaohsiung, Taiwan R.O.C. Tel: (07)222-0826 Fax: (07)223-0046 Toshiba Display Devices (Thailand) Co., Ltd. 142 Moo 5, Bangkadi Industrial Park, Tivanon Rd., Pathumthani 12000, Thailand Tel: (2)501-1200 Fax: (2)501-1209 The information contained herein is subject to change without notice. The information contained herein is presented only as a guide for the applications of our products. No responsibility is assumed by TOSHIBA for any infringements of patents or other rights of the third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of TOSHIBA or others. TOSHIBA is continually working to improve the quality and the reliability of its products. Nevertheless, semiconductor devices in general can malfunction or fail due to their inherent electrical sensitivity and vulnerability to physical stress. It is the responsibility of the buyer, when utilizing TOSHIBA products, to observe standards of safety, and to avoid situations in which a malfunction or failure of a TOSHIBA product could cause loss of human life, bodily injury or damage to property. In developing your designs, please ensure that TOSHIBA products are used within specified operating ranges as set forth in the most recent products specifications. Also, please keep in mind the precautions and conditions set forth in the TOSHIBA Semiconductor Reliability Handbook. International Operations-Electronic Components 1-1, Shibaura 1-chome, Minato-ku, Tokyo, 105-01, Japan Tel:(03)3457-3495 Fax: (03)5444-9431 The products described in this document are subject to foreign exchange and foreign trade control laws. (c)1997 TOSHIBA CORPORATION Printed in Japan